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JP2002219645A |
To provide a grinding device to measure a grinding state of a substrate and grind it with high accuracy at a high yield without lowering a throughput of the grinding device.This grinding device is formed by a cassette index part 100, a c...
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JP3301701B2 |
To provide an on-line roll profile measuring device without being affected by errors based on the change of rolling conditions. A roll grinder unit 5 is situated facing a rolling roll 1a and composed of a rotary grindstone 20 for grindin...
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JP2002196808A |
To provide a control system for a machine, that can minimize the lowering of the producing efficiency of a machine when any abnormality is caused in any control shaft in the control system of a machine equipped with a plurality of contro...
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JP2002518195A |
A semi-conductor wafer (12) has its inclined edge flanks polished by a grooved wheel (16) of synthetic plastics material, while a jet (20) of polishing slurry, which may comprise colloidal silica, is fed downwards into the zone of contac...
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JP3292835B2 |
To provide a surface grinding method and device to high-precisely and reliably achieve the increase of flatness of a sheet work, such as semiconductor wafers. This grinding device comprises a surface grinding machine provided with a grin...
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JP3287981B2 |
To establish a high shape accuracy with a lesser number of processing runs, extract a genuine shape signal from the measuring data, and avoid dislocation likely when a work is to be set and removed. In this shape control method, a work i...
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JP2002154049A |
To provide a polishing method capable of polishing a work with an approximately constant load.In this polishing method, a work 25 is clamped between a lower surface plate 12 and an upper surface plate 14 which is placed to face the lower...
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JP3276828B2 |
To compactly and inexpensively compose a machining inspection device for a crankshaft journal of a vehicle engine, for example, and to prevent defective parts from escaping. A positioning device 1 for matching a pre-machined crankshaft W...
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JP2002103222A |
To provide a method and device for roughening a metal plate for a lithographic printing plate that can reduce loss of the metal plate that occurs when a junction passes during the continuous roughening of the metal plate for the lithogra...
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JP3265543B2 |
To obtain a semiconductor wafer mirror-processed every precisely without drying it during and after the polishing process. An automatic polishing machine that comprises a semiconductor wafer W delivering means 1, a temporary table before...
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JP2002066918A |
To provide a good surface property and to carry out a profile correction grinding with a high accuracy.A roll shape is measured on a roll grinding machine and roll shape measurement values at a large number of measurement positions in a ...
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JP2002504440A |
A multi-pass grinding method for fabricating an endodontic instrument. A tapered rod (10) is sucessively advanced past a rotating grinding wheel (12) to remove layers (14, 16, 18, 20) of material from the rod (10) until attaining a desir...
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JP3231661B2 |
To easily set machining conditions by displaying machining conditions found from known machining logic as reference machining conditions on a display screen and accepting the input of the machining conditions in such a style that the ref...
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JP2001522314A |
A method and apparatus for grinding crankshafts or similar devices in which one of the crankpins of the crankshaft is machined and subsequent to this machine step, the actual dimension of the crankpin is measured. This measured value is ...
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JP2001522139A |
A predicted in-situ reflectivity measurement (ISRM) trace is calculated for a substrate undergoing a chemical mechanical polishing. This predicted ISRM trace is an estimate of the measured reflectivity of the substrate as a function of t...
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JP2001277112A |
To provide a work device hardly generating a vibration due to a resonance phenomenon and having a plurality of work means. A speed control means shifting a rotational speed of each work means to a rotational speed deviated by prescribed ...
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JP2001260021A |
To provide a numerical control system for a roll grinding machine, capable of automatically and efficiently performing grinding until flaws are eliminated by automating a series of processes from detecting of the flaws of the roll to gri...
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JP3200869B2 |
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JP2001219347A |
To surely remove burrs near a depth point CP of an inner corner C while preventing a surface of a sheet metal work W from being damaged.When a burring tool 41 approaches a depth point CP of an inner corner C, an interval between a center...
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JP3190972B2 |
PCT No. PCT/NO95/00101 Sec. 371 Date Feb. 7, 1996 Sec. 102(e) Date Feb. 7, 1996 PCT Filed Jun. 14, 1995 PCT Pub. No. WO95/34802 PCT Pub. Date Dec. 21, 1995Equipment for the grinding of material samples includes a console and a frame stru...
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JP3183589B2 |
PURPOSE: To realize the uniformity of the grinding condition of a metal plate and the laber saving by controlling the mechanisms of the vertical movement, the holding, the reversing, and the feeding of the metal plate, so as to grind all...
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JP3182928B2 |
PURPOSE: To improve the grinding accuracy in the initial position of cylindrical surface grinding, in a numerically controlled grinder for continuously step- grinding a workpiece for its end face and cylindrical surface. CONSTITUTION: In...
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JP2001071263A |
To improve accuracy in grinding work and to reduce the man-hour by setting the correction cutting amount to a surface of a material to be ground and grinding the surface again. When arbitrary points 1, 2 are taken on a surface 5 of a wor...
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JP3132468B2 |
To provide a semiconductor wafer grinding device capable of attaining improvement in remaining film controllability and productivity. When the semiconductor wafer absorbed by carriers 3a and 3b is located on a platen 1a by rotating an en...
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JP2000343380A |
To provide a method for efficiently determining the conditions of operating a machine tool to meet the specifications when newly set for machining results.Actual measurement data are collected for operation parameters showing the conditi...
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JP2000288927A |
To provide a polished work free from defect by detecting the change in surface reflectance of a work to be polished, recognizing the unpolished part of the work on the basis of the detection value, and automatically generating and feedin...
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JP3088944B2 |
To improve the precision of an ORG grinding and relax an rolling restraint in the shifting of rolling width by obtaining the ORG grinding efficiency to change a pushing force setting or a gain setting for the succeeding grinding and exec...
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JP2605925Y2 |
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JP2000153457A |
To expand a workable range, and to machine with higher accuracy by making the inside diameter center of a workpiece coincide with the rotational center of a rotary means by determining eccentricity of a distance difference between the in...
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JP2000133623A |
To obtain satisfactory planarizing characteristics. This planarizing method comprises a process for carrying out grind stone grinding treatment to a substrate surface to be treated on which protrusion and recession corresponding to a bas...
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JP2000127040A |
To provide a grinding condition setting device for a grinding machine allowing an unskilled worker to conduct the work satisfying machining precision and grinding efficiency and obtain the desired machined surface roughness without makin...
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JP2000127039A |
To efficiently apply grinding and honing to a work inner peripheral face. In this machining method, a ground work and an unground work are held in parallel by chucks 16, 15, a honing device 78 and an inner face grinding wheel head 82 are...
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JP2000107982A |
To reduce the working time of a work.The grinding wheels 74 and 76 on two wheel spindle stocks 54 and 62 work their charging working positions. When they finish the working in charge, it is decided whether the other side grinding wheel i...
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JP3024529B2 |
To prevent the feed mark caused by a grinding wheel and to reduce a lowering of yield by gradually enlarging the interval between a grinding wheel and a roll every pass of a wheel spindle stock, also executing grinding at the rising grad...
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JP3011526B2 |
An apparatus and a method for processing lens peripheries which allow lenses to be properly fitted in a frame, i.e., which processes lenses with high dimensional accuracy. For this purpose, the lens periphery processing apparatus and met...
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JP2000024904A |
To provide a straight type floating tool for preventing a slanted wear of a grinding wheel and for cutting easily and accurately welding beads and parting burr of a work piece that has a step and a free-form surface. A tool body 30 havin...
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JPH11320363A |
To enable an accurate wafer chamferring operation by moving a rotating wafer along an axis and/or a plane with respect to a grinding wheel rotating at a fixed position, and bringing the circumferential edge of wafer into contact with the...
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JP2974441B2 |
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JPH11254269A |
To work a groove and a stepped surface even by a worker incapable of forming an NC program. A memory device 11 provided with a plurality of kinds of work patterns displayed in a vertical and longitudinal, direction capable of assigning d...
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JP2941031B2 |
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JP2941030B2 |
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JP2941032B2 |
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JP2941029B2 |
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JP2939020B2 |
PURPOSE: To provide a work checking and machining method and device, capable of reducing the equipment cost, simplifying the installation and shortening the cycle time. CONSTITUTION: Each of first to third robots R1-R3, where a camera un...
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JP2935115B2 |
The computer uses signals describing vibration, grinding wheel parameters etc. as well as signals describing the surface of the workpiece. A variable signal window is used between trigger signals at the beginning and end of the workpiece...
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JPH11207616A |
To perform continuous grinding by making automatic replacement among plural kinds of grinding wheels by one surface grinder and switching a grinding program for automatically changing a grinding condition (a grinding wheel rotational spe...
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JP2908025B2 |
A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polis...
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JPH11129157A |
To provide a grinding system to reduce an initial cost and a running cost applied on equipment accompanied with other processing when other processing is needed after a grinding work and reduce an installation space for equipment. A grin...
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JP2892322B2 |
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JPH11123657A |
To provide a CAD/CAM device and a processing device considering power information which allow an automatic processing to emphasize the accuracy of surface roughness and the like, by considering the power information. The modeling of the ...
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