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JP7430984B2 |
Method for the grinding of a gear wheel workpiece using a dressable worm grinding wheel, wherein the worm grinding wheel is rotationally driven about a tool axis of rotation and the gear wheel workpiece is rotationally driven about a wor...
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JP7430450B2 |
The present invention provides a dresser board capable of preventing scattering of particles. The dresser board for dressing a cutting blade of the present invention comprises: a dressing layer comprising abrasive grains fixed by a bindi...
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JP7430452B2 |
A cutting apparatus cuts a workpiece by a cutting blade. The cutting apparatus includes a mount flange on which the cutting blade is mounted and a replacement apparatus that replaces the cutting blade mounted on the mount flange with the...
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JP2024016543A |
An object of the present invention is to reduce the amount of burrs that are formed to protrude from the side surface of a workpiece. [Solution] A rotating cutting blade is relatively moved in a predetermined direction from one end of a ...
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JP2024014560A |
The present invention proposes a polishing pad dressing method that can dress a polishing pad more uniformly even when the surface of a rotating surface plate is curved. [Solution] Dressing the polishing pad 100 by pressing a grindstone ...
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JP2024014487A |
The present invention provides a polishing pad surface quality determination method and surface quality determination system that can appropriately determine the surface quality of a polishing pad. [Solution] In the surface texture deter...
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JP2024503978A |
Provided herein are advanced substrate polishing methods that use machine learning artificial intelligence (AI) algorithms or software applications generated using AI to control one or more aspects of a polishing process. . An AI algorit...
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JP7423139B2 |
A method and a system are provided for automatically dressing a grinding wheel used to grind workpieces. A workpiece is scanned to determine dimensions of the workpiece. A computer-readable dimensions datafile is generated containing the...
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JP7422424B2 |
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JP2024011312A |
[Problem] To suppress wear on the grinding wheel while maintaining machining quality. [Solution] Based on the load current value of a spindle motor 73, the load value of a grinding wheel such as a grinding wheel 77 or a chamfering wheel,...
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JP2024010709A |
An object of the present invention is to provide a dressing method capable of dressing a plurality of grinding wheels in just the right amount. [Solution] A dressing step for dressing a plurality of grinding wheels is performed while mea...
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JP7421460B2 |
The present invention relates to a technique of determining a time to replace a polishing pad used in a polishing apparatus for polishing a workpiece, such as wafer, substrate, or panel. A polishing apparatus (1) includes: a polishing ta...
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JP7420530B2 |
To provide a dressing surface evaluation apparatus, a dressing device, and a grinding device that can quantitatively evaluate the dressing surface state of a grinding wheel.An evaluation value representing a dressing surface state calcul...
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JP7417988B2 |
To provide a grindstone that can increase grinding amounts while suppressing deterioration of grinding capability, a grindstone unit, and a machine tool.A grindstone 10 for grinding a work-piece W comprises a plurality of pillar parts 42...
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JP2024008991A |
The present invention provides a grinding device that accurately measures the dressing amount of a grinding wheel. [Solution] A grinding device 1 includes a grinding wheel spindle 22 that is provided with a grinding wheel 21 and rotates ...
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JP7413110B2 |
To provide a truing completion verification device that can perform truing by which a service life of a grinding stone is not spoiled as much as possible.A truing completion verification device is provided with a truing completion verifi...
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JP2024002285A |
The present invention provides a surface texture estimating device that improves surface texture estimation accuracy by alleviating the influence of noise due to an unstable gain frequency band of natural vibration characteristics. [Solu...
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JP2024001517A |
[Problem] In addition to reducing the time and cost required to create trueers and making the quality uniform, it is possible to improve the transfer rate of trueing, workability, and the accuracy of the grooves formed on trueing, and in...
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JP2024001803A |
An object of the present invention is to suppress deterioration in processing quality of a workpiece. [Solution] A cutting device 1 includes a holding table 10 that holds a workpiece 200, a cutting unit 20 having a spindle 23 on which a ...
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JP2023181618A |
To provide a dressing method that can efficiently execute dressing while avoiding a cutting blade from being damaged, in flatly forming an end face of an outer periphery of the cutting blade.A dressing method, which uses a cutting device...
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JP2023552716A |
In a method of machining a workpiece in a tooth grinding machine having a grinding tool 320 with ceramic bonded abrasive grains made of superabrasive material, the grinding tool is first dressed. The dressed grinding tool is then conditi...
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JP7398946B2 |
To provide a polishing device which can recover a larger amount of powder dust (polishing waste) accumulating around a dress part.A polishing device 1 includes: a chuck table 13; a polishing mechanism 2 having a polishing tool 23, a spin...
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JP7398096B2 |
To perform dressing with a device which can perform truing.There is provided a grinding surface correction method for a rotary grind stone for correcting a grinding surface of a rotary grind stone whose peripheral surface is the grinding...
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JP2023178295A |
To provide a polishing apparatus for consumable part monitoring.A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with the polishing pad at the polishing station, a ...
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JP7394712B2 |
A cutting device is equipped with a spindle part, a control part, and a measuring device. The spindle part can adjust the height position, and the blade is installed therein. The measuring device is configured to measure the height posit...
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JP2023170074A |
To provide a vertical rotation type ELID processing device and the like which can properly perform dressing of a blade with an electrolyte even in a case where the rotational speed of the blade is fast.An ELID processing device comprises...
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JP7386636B2 |
One objective of the present invention is to provide a dress method capable of suppressing time required for a flat dress. The dress method includes: a position detection step (ST4) of photographing a dress board held on a holding table ...
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JP2023167965A |
To provide an improved device capable of shortening a time for stopping polishing operation of a polishing device for exchanging polishing pads and of improving productivity of the polishing device.A processing system includes: a polishi...
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JP7385985B2 |
To provide a blade processing device that can stably and highly accurately perform cutting process even for a work constituted of a brittle material in a ductile mode without generating a crack or breakage, and to provide a blade process...
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JP7380119B2 |
To provide a chatter evaluation system that evaluates amounts of chatter of a surface of a work-piece with good accuracy, in an in-process of grinding.A chatter evaluation system 1 comprises: an axial directional movement calculation dev...
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JP7380107B2 |
To provide a quality prediction system that is superb in versatility.A quality prediction system 1 includes a model production unit 73 that regards as an explanatory variable a feature quantity of condition data detected by a first detec...
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JP7378944B2 |
To provide a grinding device capable of measuring accurately a dress amount of a grinding wheel.A grinding device 1 includes a whetstone spindle 22 provided with a grinding wheel 21 on a lower end, for rotating the grinding wheel 21 by d...
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JP7378890B2 |
The purpose of the present invention is to provide a dressing board, which is capable of restraining generation of a processing defect. The dressing board for dressing of a cutting blade by enabling a cutting blade cutting a workpiece to...
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JP2023164098A |
To provide a dressing device configured so that flatness of a polishing pad can be improved and cut amounts of the polishing pad can be made uniform during dressing.A dressing device 1 is provided with a dresser 3 that performs dressing ...
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JP2023162110A |
To provide a surface quality measurement system which can accurately measure the surface quality of a polishing pad without damaging the polishing pad and reducing the throughput of the entire polishing processing.A surface quality measu...
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JP7374542B1 |
An electrolytic dressing device and an electrolytic dressing method suitable for cylindrical grinding of steel rolls are provided. A grinding wheel used for cylindrical grinding of a steel roll for rolling, an electrode facing the grindi...
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JP7374793B2 |
To provide a dressing board and a dressing method which enable a cutting device that cuts a work-piece under a dry-type environment to execute wet-type dressing, while maintaining the dry-type environment.A dressing method, which is perf...
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JP7374126B2 |
Described are abrasive surfaces and pad conditioners that contain high precision shaped surfaces, including pad conditioners useful for conditioning a chemical-mechanical processing (CMP) pad, and related methods.
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JP2023160532A |
To provide a cleaning tool that can efficiently and reliably clean a polishing pad which is fitted to a polishing device for a CMP, in which at least one of the groove and hole is formed and to which a residue such as a slurry aggregate ...
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JP2023160318A |
To provide a dressing tool which dispenses with an adhesive tape, and causes less adhesion of cutting chips.A dressing tool includes a support substrate containing a thermoplastic resin layer, and a dressing member which is supported on ...
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JP2023159885A |
To provide a conditioner capable of restoring a polishing pad with reduced polishing performance to be reusable.The invention includes a conditioner and a method of controlling the same. In particular, according to one embodiment of the ...
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JP2023158692A |
To provide a grinding method for a workpiece, the grinding method enabling reduction of consumption amount of a grinding stone.A grinding method for a workpiece is provided, for grinding a workpiece by using a grinding device. The grindi...
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JP7370584B2 |
To enable a dress timing to be set during grinding processing.In a grinding machine 11, a state of a grinding surface 19a of a rotary grindstone 19 is photographed with a camera 38 during grinding processing by the rotary grindstone 19. ...
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JP7368492B2 |
A pad conditioner and chemical mechanical planarization (CMP) pad conditioner assembly for a CMP assembly are disclosed. The pad conditioner includes a substrate having a first surface and a second surface opposite the first surface. A p...
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JP7368204B2 |
To make it possible to simultaneously perform a dressing process for two different kinds of blades.A dress unit 70 is prepared such that to a surface of a tape 76 stuck to cover an opening of an annular frame 78, a first dress board 71 f...
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JP2023155541A |
To provide a cutting device which is configured to cut a cut object and enables automatic exchange of a dress board, and to provide a manufacturing method of a cut product.A cutting device includes a cutting table, a cutting mechanism, a...
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JP2023155151A |
To provide a substrate treatment system capable of supplying a treatment liquid including highly concentrated microbubbles to a substrate to be treated without generating large bubbles on the way to a supply line of the treatment liquid....
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JP7364430B2 |
To measure a dress grindstone height of a dresser board and shorten a dress time.A height of a top face 61a of a dress grindstone 61 is measured by performing the following processes: a holding process in which a dresser board 6 is held ...
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JP2023153782A |
To provide: abrasive surfaces and pad conditioners that contain high-precision shaped surfaces, including pad conditioners useful for conditioning a chemical-mechanical processing (CMP) pad; and related methods.A pad conditioner useful f...
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JP2023148227A |
To provide a polishing method that can suppress polishing liquid such as slurry from influencing accuracy in measuring a film thickness of a work-piece, so as to enable the film-thickness to be measured accurately.In a polishing method, ...
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