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JP7179984B2 |
A device for producing a curved lateral surface on a rolling element for a rolling bearing includes a grinding apparatus for grinding the curved lateral surface and a retaining apparatus having a control wheel with a convexly profiled pe...
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JP2022174532A |
To provide a dresser board which enables proper dressing of a cutting blade.A dresser board is used to correct a shape of a cutting blade and includes: a first layer including first abrasive grains and a first binder for fixing the first...
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JP2022548497A |
The present invention relates to a dressing tool comprising profiled elements (11.1, 11.2, 11.1, 11.2, 12.1, 12.2, 12.3, 12.4) and has working surfaces (13, 14) provided with hard material particles. The profiled elements (11.1, 11.2, 12...
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JP7172636B2 |
To provide a maintenance support device for machine tool which can acquire surface roughness with high accuracy even in the case where a measurement result by an in-machine measurement device is used and which supports maintenance of a t...
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JP2022547970A |
The present invention is a machine tool 1 for machining gears, comprising a work spindle 16 for rotating a work 18 around a work axis C1, and a tool spindle 11 for rotating a tool 12 around a tool axis B. Regarding machine tools. An axia...
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JP7169769B2 |
An object of the invention is to prevent cleaning liquid and sludge and the like from splashing onto the surroundings when cleaning and dressing a polishing member that polishes the rear surface of a substrate. A dressing device 200 inco...
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JP7167430B2 |
To obtain a screwed grinding wheel which suppresses a truing amount and has a high lifetime, and to provide a truing device and a truing method for a screwed grinding wheel capable of shortening working time in truing.In a truing device ...
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JP7168113B1 |
Kind Code: A1 A method for polishing both sides of a wafer is provided in which a polishing cloth is dressed by an approach other than a conventional dressing method, edge flatness is maintained, and a wafer with a high degree of flatnes...
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JP7166714B2 |
To provide a cutting blade that can suppress occurrence of poor processing.The cutting blade has a cutting blade part 5 including abrasive grain 13 and a bond material 11 that bonds the abrasive grain. On a surface of the bond material i...
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JP2022168720A |
To provide a processing method which can suppress formation of a level difference on a polishing surface of a polishing pad due to polishing of a surface to be polished of work-piece, so as to maintain a shape of the polishing pad which ...
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JP7160725B2 |
A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing a...
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JP7157990B1 |
Provided are an electrolytic dressing device and an electrolytic dressing method suitable for cylindrical grinding of steel rolls. Equipped with a conductive grinding wheel used for grinding a steel roll for rolling, an electrode facing ...
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JP7154690B2 |
The present invention provides a method for dressing grinding stone, which can reduce the number of sheets of dummy wafer used for dressing work and can efficiently dress grinding stone. The method for dressing grinding stone uses a grin...
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JP7152937B2 |
To make it possible for ground chips to be appropriately removed continuously from a grinding surface of a grinding stone while preventing deformation of the jetting port of a nozzle, when removing the ground chips by spraying a mixture ...
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JP7152279B2 |
A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and ...
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JP7150400B2 |
To provide a dressing method for a cutting blade, by which the cutting blade can appropriately be shaped.A dressing method for a cutting blade, in which dressing of the cutting blade is carried out using a dresser board having a first dr...
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JP2022147687A |
To provide a processing state estimation method and a processing state estimation system that can accurately estimate a processing state.A processing state estimation system 1 includes an observation device 20 and an estimation arithmeti...
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JP2022147691A |
To provide a processing state estimation method and a processing state estimation system that can accurately estimate a processing state of a workpiece.A processing state estimation system 1 includes an observation device 20 and an estim...
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JP2022148902A |
To facilitate a device configuration of a processing device having a blade exchange mechanism and reduce footprint.A processing device comprises: cutting tables 2A, 2B on which a sealed substrate W is processed by a cutting mechanism 4; ...
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JP7146206B2 |
To provide a method for polishing semiconductor wafers, capable of improving processing efficiency.In a method for polishing semiconductor wafers, a semiconductor wafer W is polished by being brought into sliding contact with a polishing...
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JP7146355B2 |
To provide a condition check method for a grinding wheel, whereby dressing state of a grinding stone can be checked.A condition check method for a grinding wheel comprises: a holding step in which a workpiece is held by a holding table o...
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JP2022145008A |
To enable obtaining of a grind stone for processing that can perform highly accurate processing.A grinding stone for processing 101 is disposed on a correction surface 110 of a grinding stone for correction 100 such that an axial line β...
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JP2022144190A |
To provide a grinding wheel modifying device and method capable of suppressing the occurrence of chatter shape on a circumferential face of a grinding wheel.A grinding wheel modifying device 10 includes a modification tool T which is sup...
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JP2022142022A |
To provide a grinding device, which dresses a grinding stone while suppressing work efficiency from deteriorating, in creep feed grinding.A grinding device, which applies creep feed grinding to a workpiece, comprises: a chuck table havin...
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JP2022139255A |
To provide a semiconductor device manufacturing method and manufacturing apparatus which can obtain a trimming shape stably and can process a high functional wafer of a semiconductor device at high yield.The semiconductor device manufact...
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JP2022136373A |
To provide a grinding method of workpiece which enables reduction of a probability that grinding marks are formed at workpiece even if creep-feed grinding is performed to the workpiece after dressing of grinding wheels.In a grinding meth...
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JP2022133198A |
To provide a polishing method which is a dry polishing method without use of slurry, but can prevent decrease in a polishing speed due to "glazing" or "clogging" without dressing, and enables improvement of processing efficiency and redu...
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JP7133683B2 |
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The poli...
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JP7133684B2 |
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The poli...
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JP2022129701A |
To provide a double-side polishing device capable of dressing the entire polishing cloth with a uniform load by dressing using a conditioning head, and a dressing method capable of dressing the entire polishing cloth with a uniform load ...
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JP2022128744A |
To obtain a division method of a semiconductor wafer which enables reuse of a dressing member and isotropic stretching of a dicing tape.When a blade 28 is dressed for the purpose of sharpening the blade 28, the blade 28 passes over a dre...
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JP7128635B2 |
To provide a grinding machine which grinds a wafer with a high degree of accuracy in consideration of wear of a grinding stone.A grinding machine 1 comprises: a rotatable spindle 23 to a lower end of which a grinding stone 21 is fitted; ...
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JP7127994B2 |
To perform dressing of a grindstone so that a surface to be ground is not roughened even if a product wafer is ground with the grindstone in a state immediately after being dressed, in dressing a grinding surface of the grindstone using ...
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JP2022125752A |
To provide a workpiece grinding method and an automatic grinding device which can achieve workpiece automatic grinding with a simple configuration.An automatic grinding device has a grindstone for grinding workpiece W supported on a tabl...
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JP7121846B1 |
A cutting device capable of efficiently detecting a dressable region of a dress board and a method for manufacturing a cut product using the cutting device are provided. A cutting device is configured to cut an object to be cut with a bl...
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JP7120958B2 |
An optimal timing to perform dressing on a grindstone is detected easily. A machine learning device includes: an input data acquisition unit that acquires input data including an arbitrary grinding condition for an arbitrary work materia...
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JP7115850B2 |
A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means i...
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JP2022115616A |
To provide a cutting device that eliminates the need to manually remove a cutting blade from a blade case.A cutting device comprises: a cutting unit including a spindle serving as a rotation shaft, and a mount flange which is fixed to a ...
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JP7114169B2 |
To provide a cutting blade forming method that can save a dresser board.The cutting blade forming method for forming a slope on a side of a tip part of a cutting blade comprises: a first cutting step in which the cutting blade is positio...
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JP7113742B2 |
To adjust movement speed of a dresser that performs dressing of a polishing member in a polishing device that polishes a substrate with the polishing member.A dressing method for a polishing member comprises: a step in which a surface he...
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JP7113756B2 |
The invention relates to a method for producing a removal of material on a tooth end edge of a workpiece toothing with a rotationally driven chamfering tool in a machining operation brought about by controlled axial machine movements bet...
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JP7113737B2 |
To adjust moving speed of a dresser for dressing a polishing member in a polishing device for polishing a substrate by the polishing member.A dresser has oscillation speed adjustable in a plurality of scan areas set on a polishing member...
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JP7113119B2 |
To provide a grinding device that facilitates a setting operation for dressing.A grinding device 1 comprises: a dress board 51 that dresses a grind stone 21; first measuring means 8 that measures the height of the dress board 51; and sec...
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JP7112142B2 |
A rocker polishing apparatus for full-aperture deterministic polishing of a planar part includes a control system, a substrate, a lifting plate, a polishing module and a measuring module. The polishing module and the measuring module are...
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JP2022112502A |
To provide improved formulations for making CMP pads, and improved polishing performance.The invention provides CMP polishing pads or layers made of a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic i...
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JP2022534563A |
An apparatus for steaming a carrier head or substrate in a chemical mechanical polishing system is a load cup, a pedestal within a cavity defined by the load cup, for receiving substrates from or supplying substrates to the carrier head....
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JP2022112194A |
To provide a polishing pad surface property measurement apparatus which can improve measurement accuracy of a surface property of a polishing pad.A surface property measurement apparatus includes a projection part 32 capable of irradiati...
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JP2022112501A |
To provide a more flexible formulation window for making chemical mechanical polishing layers or pads that retain good removal rate and planarization efficiency (PE) performance without an undesirable increase in defectivity and hardness...
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JP7111492B2 |
To provide a polishing composition having high processing ability, and achieving in an early stage, smoothing of a surface of a polishing pad.In polishing of a magnetic disk substrate, a polishing composition is supplied to a space betwe...
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JP2022111075A |
To solve the problems that a diamond dresser has a problem that a use life of a polishing pad becomes short because it grinds and removes the surface of the polishing pad, and a method for removing a clogging substance from a fine hole o...
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