| Document |
Document Title |
|
JP2022176057A |
To provide a chemical liquid supply apparatus which is capable of highly quantitatively supplying a chemical liquid and has high safety.A chemical liquid supply apparatus 10 of the invention includes: a resin drum 11 for storing a chemic...
|
|
JP2022172678A |
To provide a method for preparing regenerated polishing agent slurry in which a polishing speed hardly decreases and damage and burning hardly occur, and polishing agent slurry.A method for preparing regenerated polishing agent slurry ac...
|
|
JP2022170226A |
To provide a flow measurement jig capable of measuring the amount of fluid supplied by a fluid supply member having a plurality of fluid supply ports.A flow measurement jig 56 can measure the amount of polishing liquid supplied by a poli...
|
|
JP7166817B2 |
To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a...
|
|
JP7165832B2 |
During polishing of main surfaces of a substrate, an opening of a through hole through which a polishing liquid is supplied does not constitute an obstacle, and precision polishing of the substrate is realized. A method for producing a s...
|
|
JP7163928B2 |
Fluid synthesis system and corresponding method for synthesis of slurry containing abrasive particles. The system and method are configured to substantially segregate the abrasive particles passing through the filter, used at the filteri...
|
|
JP7157624B2 |
To improve efficiency of hollowing out a wafer.A first grind stone 742 fixed to a lower end of a cylindrical base 741 included in a core drill 74 descends while rotating with rotation of a spindle 70, and cuts a large-diameter wafer W wi...
|
|
JP7157605B2 |
To enable silicon powder containing liquid to be dried without using a heater.An apparatus 1 for recovering silicon powder comprises: means 3 for extracting silicon powder P containing liquid from effluent L in a liquid tank 2; a belt 51...
|
|
JP2022157350A |
To provide a work management system, an imaging system, a work management method and a program which can easily manage quality of the work including a repetition operation in which a worker repeatedly moves workpiece.A work management sy...
|
|
JP2022152195A |
To provide a substrate polishing device which can measure a film thickness of a substrate with high accuracy without deteriorating light transmissivity when the film thickness of the substrate is measured during polishing.A substrate pol...
|
|
JP7152279B2 |
A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and ...
|
|
JP2022147269A |
To provide a cutting device capable of preventing a metal from mixing into a working liquid.A cutting device cutting a workpiece comprises: a chuck table holding the workpiece; a cutting unit equipped with a cutting blade cutting the wor...
|
|
JP2022142926A |
To solve such a problem that in the case of dry polishing, a brown burn occurred due to frictional heat and it was difficult to reduce a surface roughness of a polished surface, and polishing quality and productivity could not be simulta...
|
|
JP7139051B2 |
To provide a processing device which can remove mist-like liquid remaining in a processing chamber with a simple mechanism.A processing device includes: a processing chamber which houses a chuck table and a processing unit; a processing ...
|
|
JP7136904B2 |
Methods and apparatus for monitoring and controlling relative concentrations of polishing fluid additives and, or, the distribution of a polishing fluid and, or, polishing fluid additives across the surface of a polishing pad during chem...
|
|
JP7134101B2 |
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The...
|
|
JP7133518B2 |
To supply a polishing liquid having uniform concentration of a slurry to a CMP polishing device.A preparation flow channel 40 is arranged just before a liquid delivery port 79 leading to a CMP polishing device 8. The preparation flow cha...
|
|
JP2022121169A |
To provide a polishing device and a polishing method which enable polishing at the maximum working and removal rate and at the minimum slurry supply quantity.A polishing device continuously polishing a polishing object is provided, inclu...
|
|
JP7116371B2 |
An abrasive supply device is provided with: a slurry supply passage 40 having a plurality of slurry drop holes 400; an upper surface plate 10 having a plurality of slurry supply holes 100; and a slurry guide unit 50 having a plurality of...
|
|
JP7108450B2 |
A polishing apparatus includes a holding table having a holding surface that holds a wafer, a polishing unit in which a polishing pad having an opening at the center of a polishing surface that polishes the wafer is mounted to a spindle ...
|
|
JP7102600B1 |
To provide a liquid injection and extraction device capable of automatically inserting a rod-shaped body such as a conduit into an opening of a container. The liquid injection and extraction device 100 of the present invention automatica...
|
|
JP7099688B2 |
To provide a membrane filter adapter suppressing slurry turbulence at an end surface of a membrane filter and CMP (Chemical Mechanical Polishing) slurry regeneration equipment, to which the adapter is fitted, having operation efficiency ...
|
|
JP2022093324A |
To provide systems, apparatus and methods relating to smoothing interior surfaces using cavitation abrasive surface finishing.A method includes immersing a workpiece 136 in slurry 126 that is a mixture of a liquid and an abrasive 150, in...
|
|
JP7083722B2 |
There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including a polishing table for supporting the polishing pad, the polishing table being configured to b...
|
|
JP7083213B2 |
To provide an abrasive material mixed liquid polishing device which has a high durability and is industrially practicable, and a polishing method with use thereof.One of a pair of storage tanks 3, which are connected to one opening 2a an...
|
|
JP7079635B2 |
To provide a polishing device that can measure a wafer thickness with high accuracy during polishing processing.A polishing device 1 that polishes an upper surface of a wafer W comprises: a polishing head 10 comprising a polishing pad 30...
|
|
JP2022075072A |
To provide a processing method for a wafer, using a grinding device that does not uselessly consume loose abrasive grains and does not deteriorate productivity.A processing method for a wafer comprises: a pseudo-grinding step of bringing...
|
|
JP7067878B2 |
To provide a grinding device that easily discharges grinding water out of annularly arranged grind stones.A grinder 1 comprises grinding-water supply means 30. The grinding-water supply means 30 comprises: a through-passage 31 passing th...
|
|
JP7064979B2 |
A method of checking a leakage of fluid from a fluid line includes connecting a leakage checking line to the fluid line between a supply valve and a return valve, regulating a pressure regulator disposed in the leakage checking line such...
|
|
JP2022049411A |
To provide a polishing liquid supply device which can supply a plurality of different polishing liquids to containers corresponding to the respective polishing liquids without mistakes.A polishing liquid supply device can selectively sup...
|
|
JP7020286B2 |
A method for slicing an ingot, including: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction; and pressing an ingot against the wire row while supplying a contact...
|
|
JP7019184B2 |
Provided in the present invention is a treatment liquid conversion device, which can prevent a rotating motion of a drainpipe from being deterred, and can prevent the surroundings of the device from being contaminated by a treatment liqu...
|
|
JP7003897B2 |
By suppressing the deterioration in processing quality that results from the quality of reuse slurry for slice processing by means of a wire saw, a wafer manufacturing method that is capable of stabilizing and improving wafer flatness is...
|
|
JP2022017674A |
To remove shavings which occur due to polishing of a workpiece and adhere to an outer periphery part of a chuck table.A polishing device polishes a workpiece and includes: a chuck table 20 which has a holding surface 20a and suctions and...
|
|
JP7003986B2 |
A grinding fluid regeneration device that regenerates used grinding fluid containing grinding dust, said device comprising a storage tank that stores the used grinding fluid, and a membrane separation module that has a filtration membran...
|
|
JP2022014017A |
To provide a nozzle-type machining head system EEM machining method that can obtain a workpiece surface with few defects by suppressing the occurrence of cavitation when a high-pressure machining fluid is ejected from a nozzle, and remov...
|
|
JP2022014055A |
To provide a liquid supply device capable of reducing the positional deviation of a dropping position of slurry required for polishing a wafer.A liquid supply device comprises: a swing arm that can swing horizontally above a polishing ta...
|
|
JP2022012737A |
To provide a polishing liquid capable of improving the polishing rate as compared with a case in which an aqueous solution in which only an inorganic salt showing alkalinity is dissolved by hydrolysis is used as a polishing liquid.There ...
|
|
JP6994363B2 |
To cause a liquid containing an organic acid and an oxidant to sufficiently enter a cut groove while cutting a work-piece.Cutting means 6 comprises a spindle 62, a first flange 63, and a second flange 64. The first flange 63 comprises: a...
|
|
JP6971676B2 |
A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a...
|
|
JP2021178370A |
To reduce a polishing liquid used amount and/or suppress deterioration of polishing quality.A polishing device includes: a polishing table which is for supporting and rotating a polishing pad; a holding body which holds an object so as t...
|
|
JP6951152B2 |
A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, t...
|
|
JP6948868B2 |
A polishing apparatus which can measure a film thickness with high accuracy without affecting a polishing rate of a wafer is disclosed. The polishing apparatus includes: a polishing head configured to press a wafer against a polishing pa...
|
|
JP6949424B2 |
The present invention provides a polishing pad. The polishing pad is configured to properly supply polishing liquid between the polishing pad and a processed object. The polishing pad is a polishing pad in a circular plate shape installe...
|
|
JP2021154477A |
To provide a polishing device which can adjust a surface temperature of a polishing pad without generating a defect such as a scratch and contamination on a substrate.A polishing device includes: a polishing table 2 which supports a poli...
|
|
JP6946166B2 |
To provide a polishing device achieving reduction of a use amount of a CMP polishing slurry.A polishing device 100 for continuous polish of a metal on a surface of a sheet-like article to be polished 101 having a metal on a surface while...
|
|
JP2021146498A |
To provide a polishing liquid supply device that stably supplies a slurry, can reduce the amount of polishing liquid used, and can suppress or prevent the influence of used polishing liquid and by-products on the quality and/or polishing...
|
|
JP2021146496A |
To provide a grinding liquid supply device in which the clogging of a whetstone is improved in the processing of a metal product by whetstone grinding, the continuous processing continuation becomes possible even if a whetstone cut amoun...
|
|
JP2021137927A |
To maintain a rate at which a substrate is polished and reduce amounts used of polishing liquid.A polishing device 1 includes a polishing table 20 for supporting a polishing pad 100, a polishing head 30 for holding a substrate WF, and a ...
|
|
JP6934580B1 |
To provide a method for regenerating a water-soluble coolant which changes a used coolant into a state in which it can be easily separated into an oil phase, an aqueous phase and a solid substance. A coolant in which water particles have...
|
