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WO/2019/149165A1 |
An efficient ultra-precise shear thickening and chemical synergy polishing method, comprising the following steps: 1) fixing workpieces (3) to a polishing and fixing disc (31) of implementation equipment; 2) preparing an efficient ultra-...
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WO/2019/131174A1 |
The present invention relates to a device for partially removing material constituting the surface of a substrate. In one embodiment, the substrate processing device comprises a holding mechanism unit (5) for holding the substrate (W), a...
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WO/2019/119816A1 |
A CMP polishing solution for polishing a GaAs wafer and a preparation method therefor. The CMP polishing solution comprises the following components in parts by weight: 0.1-50 parts of abrasive, 0.001-0.4 part of surfactant, 0.001-0.6 pa...
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WO/2019/108604A1 |
A grinding media handling system for a vertical grinding mill comprises: a reservoir; a pump, such as a sump pump or a horizontal pump, for pumping water and/or a slurry of material to be ground from the reservoir via an inlet in an uppe...
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WO/2019/093133A1 |
Provided is a dicing method with which it is possible to obtain a high yield even when a chip is cut with a narrow width. Provided is a method of dividing a substrate having a device formed thereon into individual chips. The methods incl...
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WO/2019/094227A1 |
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...
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WO/2019/032234A1 |
Some embodiments include an apparatus having a polishing mechanism configured to polish a surface of a wafer. The polishing mechanism converts fresh slurry to used slurry during a polishing process. At least one emitter is configured to ...
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WO/2018/216721A1 |
Provided is an abrasive particle recovery system for an ultrasonic processing system in which it is possible to recover abrasive particles from a suspension to be discarded and to reuse said abrasive particles. An abrasive particle recov...
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WO/2018/189239A1 |
The invention relates to a device (1) and a method for polishing a surface (2) of a strip (3) made of metal, in particular a continuous strip, the device (1) comprising at least one polishing head (4, 5) for polishing the surface (2), th...
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WO/2018/184658A1 |
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...
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WO/2018/184657A1 |
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...
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WO/2018/173376A1 |
A grinding fluid regeneration device that regenerates used grinding fluid containing grinding dust, said device comprising a storage tank that stores the used grinding fluid, and a membrane separation module that has a filtration membran...
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WO/2018/169536A1 |
Disclosed herein are chemical mechanical polishing (CMP) conditioning disks, and related systems and techniques. For example, in some embodiments, a CMP conditioning disk may include: a support; a first pedestal extending from the suppor...
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WO/2018/135878A1 |
Disclosed is a method for producing a polishing pad, the method comprising the steps of: providing a polishing layer; forming a first through-hole penetrating the polishing layer; providing a support layer facing the polishing layer; int...
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WO/2018/122500A1 |
A polishing pad (1) formed from a foam body (2), provided with an attachment surface (21) for being attached to the rotary plate of a polishing machine and having an active surface (22) wet by the polishing liquid and coming into contact...
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WO/2018/101583A1 |
A slurry composition for polishing an organic film of the present invention comprises an oxidant, an organic acid, a polishing accelerator comprising a repeating unit derived from maleic acid or maleic anhydride, and water, wherein the p...
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WO/2018/052816A1 |
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, a...
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WO/2018/045039A1 |
A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is...
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WO/2018/030675A1 |
The present invention comprises: a holding jig for supporting a processing object; a brush rotating/driving portion arranged on the holding jig so as to rotate a brush such that the processing object is polished; an X-axis direction driv...
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WO/2018/020975A1 |
The purpose of the present invention is to provide a recycled medium for barrel polishing and a method for manufacturing such a recycled medium for barrel polishing, said recycled medium utilizing media for barrel polishing which have be...
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WO/2018/014568A1 |
Provided is a new process for the copper polishing processing of a sapphire wafer, belonging to the field of LED substrate processing. Scratches caused in the previous procedure are removed gradually by selecting three different polishin...
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WO/2017/222999A1 |
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The...
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WO/2017/218921A1 |
In described examples, a chemical mechanical polishing (CMP) system (200) includes a platen (214), a conduit (202) having a heating segment (205) and a delivery outlet (212), and a heater (206) coupled to the heating segment (205) of the...
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WO/2017/179066A1 |
Disclosed herein is a handheld automatic multifunctional buffing device which comprises a dispenser assembly for dispensing polishing compound from a cartridge, a compressible compartment for storing the polishing compound, a battery ope...
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WO/2017/169124A1 |
Provided are a substrate polishing device, a method of cleaning the same, and a device for supplying liquid to a substrate polishing device, with which it is possible to suppress agglomeration of a polishing liquid in a pipe. Provided is...
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WO/2017/160129A2 |
The present invention relates to a laminated sheet polishing method and a laminated sheet polishing device for performing the same and, more particularly, to a polishing method for laminating sheets to be polished and polishing the same ...
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WO/2017/139079A1 |
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...
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WO/2017/098986A1 |
The present invention addresses the problem of providing a method for regenerating an abrasive slurry whereby an abrasive slurry showing a high abrasion speed can be efficiently regenerated. The method according to the present invention ...
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WO/2017/033409A1 |
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abr...
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WO/2017/011451A1 |
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.
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WO/2016/190128A1 |
Provided is a polishing method which achieves an excellent polishing result even when a polishing composition which has been used in polishing an object to be polished is collected and reused. The polishing method according to the presen...
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WO/2016/171018A1 |
[Problem] To provide a method for producing fine silicon powder which allows for collection of high-purity flaky fine silicon powder from silicon cutting scraps generated during slicing of a silicon ingot, without using a mechanical pulv...
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WO/2016/147968A1 |
Provided is a recovery method for an abrasive, with which it is possible to recover a highly pure abrasive from a recovery slurry that contains a used abrasive, by a simple method. This recovery method for an abrasive for recovering an a...
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WO/2016/140634A1 |
Present invention is a board surface (7) polishing application system (1) for wood-based panel furniture materials such as melamine-coated particleboard, MDF, plywood, parquet, fiberboard etc., wherein it contains at least one polishing ...
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WO/2016/103854A1 |
A method for evaluating abrasive grains used in a slurry for cutting ingots, wherein there are performed an evaluation-solution-preparation step (S1) for causing abrasive grains containing polishing abrasive grains and impurities to diss...
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WO/2016/098286A1 |
The present invention is a silicon wafer polishing method wherein a used slurry that contains abrasive polishing grains and that has been supplied to a silicon wafer and used for polishing is recovered and the recovered used slurry is ci...
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WO/2016/059142A1 |
The invention relates to a method for discharging solid pastes for surface working onto a working tool (16), comprising the steps of providing a solid paste (46) for the surface working, which contains abrasives, in particular a solid pa...
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WO/2015/198461A1 |
[Problem] The present invention provides a centrifuge for separating particles with differences in specific gravity such as when particles with a small specific gravity and particles with a large specific gravity, such as Si hydrates and...
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WO/2015/151408A1 |
Provided is a workpiece cutting method for cutting a workpiece by forming a wire column with a wire that travels in the axial direction and that is wound in a helical shape between a plurality of wire guides, and supplying a working flui...
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WO/2015/133516A1 |
The present invention relates to a substrate processing system and a substrate processing method that are capable of flushing the processing liquid supply line. The substrate processing system is provided with a substrate processing appa...
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WO/2015/115652A1 |
Provided is a regenerating method for used polishing slurry that can sufficiently crush solid content generated by way of centrifugal separation of used polishing slurry, and can thereby suppress damage from occurring to a glass substrat...
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WO/2015/107826A1 |
This coolant regenerating device (1) is provided with: a first tank unit (11A) at which a subject liquid containing a sludge (S2) is retained and at which a region having more sludge (S2) and a region having less sludge (S2) are formed i...
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WO/2015/097989A1 |
The present invention provides a slicing method wherein a wire saw is used; and a coolant is supplied to a wire wound around multiple wire guides, and a silicon ingot is pressed against the wire to cut the silicon ingot while the wire is...
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WO/2015/086544A1 |
A method of processing a super-hard material product (100) having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product (100) with a surface of the super-hard material product (10...
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WO/2015/081461A1 |
A minimal quantity lubrication grinding device capable of controllably transporting a nanoparticle jet flow under a magnetically enhanced electric field. The charge quantity of liquid drops is increased through the addition of a magnetic...
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WO/2015/072569A1 |
A method for manufacturing a glass substrate for a magnetic disk comprises polishing treatment for pressing main surfaces on both sides of a glass substrate by polishing pads, and relatively moving the main surfaces and the polishing pad...
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WO/2015/060265A1 |
Provided is a magnetic filter device for preventing the reduction in magnetic field strength at positions at a distance from the magnet unit. The magnetic filter device (1A, 1B) is provided with: a processing vessel (6) having a processi...
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WO/2015/004973A1 |
A scattering plate (4) for scattering a supplied solution supplied via a supply tubing is characterized by the following: being provided with a planar member (41) that can be disposed at a position facing an opening end of the supply tub...
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WO/2014/178280A1 |
The present invention addresses the problem of providing a diamond abrasive recovery method which enables a high-purity reclaimed polishing material to be obtained from a polishing material slurry which includes used diamond abrasives. T...
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WO/2014/177898A1 |
Method for brushing at least one metal tubular member (100), comprising the step of a) abrading the outer surface of said at least one metal tubular member and, simultaneously, the step of b) removing the metal powders produced during sa...
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