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WO/2004/064965A1 |
A wireless control transmitter that produces and transmits a control signal to control the running direction of a running toy comprises a support having a bearing part whose top portion is spherically recessed&semi a lower case having an...
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WO/2004/060609A1 |
Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP mo...
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WO/2004/058450A1 |
A glass substrate for information recording mediums is produced by polishing the surface of a rough glass plate. The polishing of the rough glass plate has two steps, namely a primary polishing step for lapping the surface of the rough g...
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WO/2004/056532A1 |
A polishing system for polishing optical connectors includes at least one polishing station having a region of polishing film overlying a substrate block, and a polishing fixture (200). The polishing fixture has connector mounting holes ...
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WO/2004/037937A1 |
The present invention provides a slurry for chemical mechanical polishing (CMP) a metal surface of a semiconductor substrate with a polyurethane-free thermoplastic foam polishing body. The slurry includes an abrasive particle stabilizer ...
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WO2003022519A9 |
A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110)...
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WO/2004/030860A2 |
A flow control system (100) includes a substantially rigid vessel (110) with a process fluid reservoir (112) situated in the rigid vessel (110) is in fluid communication with an outlet (116). A movable member (120) and/or a working fluid...
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WO/2004/030865A1 |
A linear chemical mechanical planarization (CMP) system includes a belt pad (102), a slurry bar (120) having a plurality of nozzles, and a heating module (130) for heating slurry. The heating module (130) has a plurality of heating eleme...
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WO/2004/024391A1 |
A polishing pad (for example, polishing pad (305)) for use in planarization of a semiconductor wafer (for example, semiconductor wafer (420)), the polishing pad (305) featuring a plurality of different polishing surfaces, depending upon ...
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WO2002053320A9 |
The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support (118) operatively coupled to the edge support...
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WO/2004/014607A1 |
The invention relates to a method of polishing a wafer of material, the method implementing at least one step of polishing with an abrasive based on diamond particles in suspension in a solution, wherein the abrasive mixture used impleme...
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WO/2004/003986A1 |
A semiconductor processing system is provided. The system includes a sensor configured to detect a signal representing a thickness of a film disposed on a surface of a substrate. A first nozzle configured to apply a first fluid to a surf...
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WO/2004/003987A1 |
A contamination remover for removing contamination adhered to the peripheral portion of the back or front surface and the edge of a semiconductor wafer, comprising a holding means having a rotary table for holding a semiconductor wafer a...
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WO/2003/107408A1 |
A polisher (10) for polishing the surface of a semiconductor wafer (W) has at least a polishing pad (11) containing abrasive grains. A polishing solution supply unit (14) is composed of a first storage tank (17) where a first liquid is s...
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WO2002018101A9 |
Chemical Mechanical Polishing/Planarization (CMP) apparatus, method, and substrate produced thereby. Polishing surface with non-uniform recesses therein. CMP head and method having integral slurry dispensing mechanism. CMP apparatus and ...
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WO/2003/084715A1 |
A conditioning tool (20; 34; 64) is useful for treating the polishing surface of a polishing pad (9): The tool (20; 34; 64) has a base (5; 37) for supporting conditioning materials. The base (5; 37) has an abrasive section (3; 21; 22; 31...
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WO2003061904B1 |
A polishing apparatus is provided for removing material from a surface of a substrate. The apparatus includes a polishing head for positioning a surface of a substrate against polishing surface of the apparatus. The polishing head includ...
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WO/2003/082523A1 |
A fluid mixing device (30) used for processing using processing fluid, comprising a first fluid feed passage (34) for feeding first fluid, a second fluid feed passage (43) for feeding second fluid, and a mixing part (41) for generating m...
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WO/2003/081647A1 |
In a small scaled plant intended for flexible manufacturing, a pure water supply system is provided at a low cost without reducing a production efficiency. A pure water system produces a plurality of grades of pure water which are suppli...
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WO/2003/078103A1 |
Polishing equipment, comprising a polishing head (30) having an opened hollow mixing tank (32) on the opposite side of the side thereof where a polishing pad (36) is installed, a slurry feed mechanism (50) for feeding slurry into the mix...
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WO2002060643A9 |
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...
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WO/2003/071369A1 |
A chemical mechanical planarization system includes a point of use chemical mixing system (210), a first and a second pump (214), a first and a second flow sensor (216, 236), a mixer (220) and a controller (240). The first pump (214) has...
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WO/2003/068405A2 |
A granular material recovery system for use with a slurry having non-recyclable particles and recyclable particles, the system including a first separator for selectively separating the recyclable particles from the non-recyclable partic...
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WO/2003/064108A1 |
A polishing head (61) comprising a disc−like carrier (16) for holding at the lower surface thereof one surface of a wafer (W), and an annular retainer ring (17) disposed concentrically with, and on the outer periphery of, the carrier (...
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WO/2003/051577A1 |
An abrasive article (12) is described. The article (12) is suitable for the deposition and mechanical polishing of a conductive material, and comprises: a polishing layer having a textured surface (102) comprising a binder and a second s...
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WO/2003/034804A2 |
A method and system for separating impurities, such as large abrasive particles and foreign matter from an abrasive polishing slurry stored in tank (14) prior to a Chemical Mechanical Polishing (CMP) procedure (22) performed on a surface...
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WO/2003/031119A1 |
The present invention provides apparatus and methods for detecting removal of a material in a chemical mechanical polishing process that uses a solution (110) and operates upon a top layer (16) made of a material that is disposed over an...
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WO/2003/030233A1 |
A preparation device (4) and a polishing device (1), the preparation device (4) wherein a target polishing amount distribution is provided based on the film thickness of a wafer (2) measured by a measuring device (3), a control program f...
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WO/2003/025996A1 |
A chemical mechanical polishing (CMP) apparatus (100) and method for sequentially polishing multiple semiconductor wafers on a single polishing pad utilizes multiple slurry delivery lines to supply one or more types of polishing solution...
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WO/2003/018256A1 |
A system and method are provided that uses a high pressure, high pH rinse to clear the slurry particles from a semiconductor polishing pad. While the high pressure spray is removing the slurry from the pad, a low downforce is applied to ...
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WO/2003/018258A1 |
A short CMP polish process (600) is provided which removes minimal amounts of oxide and reduces defectivity at the surface of the wafer during short periods of rework by maintaining a high pH at the wafer surface in the presence of a hig...
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WO/2003/013689A1 |
A fluid separation assembly allows the filter (12) within to be changed out quickly and easily while minimizing or eliminating leakage. The filter housing includes an inlet and an outlet end (90, 100), each having a respective coupling (...
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WO/2003/011523A1 |
A method and system for delivering a polishing fluid to a chemical mechanical polishing surface (104) is provided. In one embodiment, the system includes an arm (104) having a delivery portion disposed at least partially over the polishi...
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WO/2003/002302A1 |
A fluid delivery system is provided for delivering a fluid to a polishing surface (904) of a chemical mechanical polishing tool. The system includes a platen (906,908), manifold (919) and slurry delivery conduit (920). The platen has a p...
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WO/2003/000460A1 |
The invention relates to optical fluoride crystals, and particularly to optical fluoride crystals (20) such as calcium fluoride, which have high transmission levels to below 200nm light, such as produced by excimer lasers. In particular ...
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WO/2002/102919A1 |
A novel polishing slurry for use in texturing the surface of a glass substrate, which comprises agglomerated polycrystalline diamond particles having an agglomerated particle diameter of 0.5 μm or less comprised of polycrystalline diamo...
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WO2001074537A9 |
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path (26). An electrostatic patterning device (58) ...
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WO/2002/096611A1 |
A method of separating, recovering and reusing components of an exhausted slurry used in slicing silicon wafers from a silicon ingot. In the method, the solid particles and lubricating fluid of the exhausted slurry are separated without ...
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WO/2002/094503A1 |
A magnetorheological fluid delivery system includes a mixing and tempering vesse, (52). Fluid, 11, is amitted to the vessel via a plurality of tangential ports, (55), created a mixing of the fluid in the vessel and promoting homogeneity....
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WO/2002/089951A1 |
The present invention provides devices and processes that filter slurries and regenerate the filters so they can be reused.
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WO/2002/071445A2 |
Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object (115) comprising a shaft (260) having a shaft axis (270) and being connected with a polishing head (250) which ...
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WO/2002/068151A1 |
An abrasion tool that is selectively configurable for spin or random-orbit without the need for a reversible motor. The tool uses two collars, each having half of the desired offset and half of the counterweight. In spin mode, the collar...
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WO2001041973A9 |
The present invention provides a method for chemically-mechanically polishing a substrate comprising tantalum and a conductive metal (other than tantalum). The method comprises (a) applying to the substrate a conductive metal-selective p...
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WO/2002/058885A1 |
Apparatus and processes are presented to contact a dry, preferably high purity inert gas with a chemical composition in a pressure vessel, or a wetting composition, to form a wet inert gas, which is then used to pressurize the chemical c...
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WO/2002/056356A1 |
A wafer (30) is polished by relatively moving a polishing body and the wafer (30) while applying a load between the polishing body and the wafer (30), with a polishing agent interposed between the polishing body and the wafer (30). A fir...
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WO/2002/053490A2 |
This colloidal silica soot is a byproduct of chemical vapor deposition processing of fused silica or ultra low expansion glasses. The colloidal silica byproduct is referred to as 'soot'. Retaining the same physical properties as the pare...
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WO/2002/053273A2 |
On-site blending and distribution of oxide abrasives with other constituents as used in semiconductor applications. Constituent blending is accomplished through weighing components individually into a blending tank. Some components may b...
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WO/2002/051955A1 |
A Ta barrier slurry for Chemical-Mechanical Polishing (CMP) during copper metallization contains an organic additive which suppresses formation of precipitates and copper staining. The organic additive is chosen from a class of compounds...
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WO/2002/051589A1 |
The invention relates to an arrangement of a chemical-mechanical polishing tool for chemical-mechanical polishing a surface on a wafer, comprising a polishing pad (4), a drive unit (9), pressing means (6), a wafer holder (5), first dispe...
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WO/2002/043923A1 |
A cleaning device for cleaning a polishing pad (12) has a first cleaning system (5) with an abrasive disk (50) and a second cleaning system (2) with a distributor device (20) for discharging a gas-water mixture at high pressure. The poli...
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