| Document |
Document Title |
|
WO/2000/064822A1 |
Abrasive components and clear fluids are separated from an aqueous chemical mechanical slurry used for planarization of semiconductor materials, to permit the reuse of the clear liquid effluent in non-process applications as well as for ...
|
|
WO/2000/060917A2 |
A method and apparatus for making and using slurries for planarizing microelectronic-device substrate assemblies (12) in mechanical and/or chemical-mechanical planarization processes. In one aspect of the invention, a bi-modal slurry is ...
|
|
WO/2000/060645A2 |
According to an example embodiment, the present invention is directed to a CMP polishing apparatus (100) having at least two conditioning arms (110+120) for use in conditioning a polishing pad (150). The CMP polishing apparatus includes ...
|
|
WO/2000/053371A1 |
The present invention provides a dual purpose workpiece handoff station (22) for intermediately staging a semiconductor wafer (21), or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical ...
|
|
WO/2000/049111A1 |
A lubricating composition which may contain up to 70 weight percent abrasive grit material for use with wire saw and slicing apparatus for cutting or slicing hard and brittle materials. The composition contains abrasive particles suspend...
|
|
WO/2000/040512A1 |
Waste slurry containing dissolved metal from CMP (11), e.g., is subjected to sludge-free processing. Embodiments include separating the waste slurry with a solids filter (13) into a solid-free dissolved metal-containing liquid filtrate p...
|
|
WO/2000/027591A1 |
A chemical-mechanical-polishing system [10] having a slurry distribution system [12], a polisher [16], a deionized water supply [18], and a drain [20], includes a slurry filtration system [14]. The filtration system [14] has two filters ...
|
|
WO/2000/018544A1 |
An apparatus for supplying a slurry to a polishing surface has a slurry source, a slurry supply line, and a slurry return line. The slurry supply line and slurry return line are configured so that slurry may be directed from the outlet o...
|
|
WO/2000/018543A1 |
The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one...
|
|
WO/2000/001519A1 |
A method of separating, recovering and reusing components of an exhausted slurry used in slicing silicon wafers from a silicon ingot. In the method, the viscosity of the exhausted slurry is reduced and the lubricating fluid component of ...
|
|
WO/1999/065592A1 |
A method of recovering liquid and abrasives from an aqueous slurry containing finely divided, suspended solids comprising at least one filtering step utilizing a sintered metal membrane and/or ceramic membrane in conjunction with a metho...
|
|
WO/1999/056189A1 |
The invention provides a process and system that utilizes conductivity measurements during mixing of chemical components to provide a slurry having a solids content within a qualification range. That is, by providing a reference conducti...
|
|
WO/1999/053121A1 |
A chemical delivery system for a liquid chemical having predetermined chemical constituents employs an analyser for determining the proportion of one of the predetermined chemical constituents in the liquid chemical to be delivered. Prec...
|
|
WO/1999/051398A1 |
A substrate and carrier head cleaning station (55b) is part of a chemical mechanical polishing apparatus. The cleaning station (55b) is positioned between two polishing stations to prevent slurry contamination therebetween. The cleaner m...
|
|
WO/1999/037441A1 |
A polishing apparatus (P) can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus (P) comprises: ...
|
|
WO/1999/034956A1 |
A chemical mechanical polishing system and a method for chemical mechanical polishing. In one embodiment, the present invention is comprised of a first receptacle adapted for containing a first chemical mechanical polishing slurry compon...
|
|
WO/1999/033612A1 |
A polishing device used for semiconductor wafer and the like, wherein an arm for supplying a polishing liquid can be moved to and held in a standby position on the radially outer side of the polishing surface in addition to a liquid supp...
|
|
WO/1999/029505A1 |
A polishing solution feeder capable of stably feeding a polishing solution having a predetermined abrasive grain size distribution to a polisher (22), including an ultrasonic oscillator (72) in at least a part of a polishing solution pas...
|
|
WO/1999/026760A1 |
A polisher (10) comprises a turn table (12) having first and second end surfaces which are substantially normal to an axis of the turn table (12). The first end surface defines a polishing surface (16) for polishing an article (W). A dri...
|
|
WO/1999/011432A1 |
The invention relates to a device for heating a liquid or semiliquid medium, especially a polishing agent for chemical mechanical polishing. Said device has a pipe and a heating device for the medium to be heated. The heating device is c...
|
|
WO/1998/058771A1 |
A fine abrasive grain-containing buffing material formed of polyvinyl acetal sponge as a main component, and having a compressive elastic modulus of not more than 2000 kg/cm?2¿, wherein fine abrasive grains are fixed to a buffing materi...
|
|
WO/1998/055266A1 |
The invention relates to a grinding tool, specially for hand-held oscillating devices, comprising a tool body attached to the oscillating device and to which abrasive paper (3) is fixed in a manner known per se in such a way that it can ...
|
|
WO/1998/055263A1 |
An apparatus for evenly polishing or planarizing the surfaces of workpieces includes a distributor (134) with a reservoir and a plurality of conduits (140) for uniformly guiding a fluid across a surface of a polishing material. The appar...
|
|
WO/1998/047661A1 |
A new chemicals supply system allows solid-containing suspensions, useful for example for polishing wafers or in the semiconductor manufacture, to be prepared directly at their utilisation site.
|
|
WO/1998/046395A1 |
A slurry distribution system (10) for distributing slurry to a polishing machine (90, 92, 94) that polishes a semiconductor wafer is disclosed. The slurry distribution system (10) includes a storage tank (24, 26) for storing the slurry, ...
|
|
WO/1998/045089A1 |
A method of manufacturing semiconductor devices involving the polishing step, which realizes a stable finishing removal rate and achieves a reduction of consumption of the polishing pad. In this method, a mixture of grains for scraping o...
|
|
WO/1998/014305A1 |
Methods and apparatus for measuring and controlling the flow rates of processing solutions to a CMP machine during the polishing and planarization process. The apparatus comprises a processing solution source, a processing solution dispe...
|
|
WO/1997/026087A1 |
A liquid applicator for use in applying wax to automobiles and floors and walls of a building or water washing the same in which wax in a liquid container or liquid supplied via a water hose is automatically supplied to a rotary applicat...
|
|
WO/1997/022443A1 |
The invention provides a process for recovering abrasive grains from vitreous bonded materials by boiling the material in an aqueous solution of an alkali metal base and then separating the grains.
|
|
WO/1997/010925A2 |
An automatic polishing machine (14) for polishing aircraft windows (12) uses pressurized air to create a suction to hold the polishing unit (20) on the aircraft (10), creates a suction to automatically pick up a polish pad (196), which i...
|
|
WO/1997/006922A1 |
A shape control method comprising the steps of applying a voltage between an electrically conductive grindstone (2) and an electrode (4) spaced from the grindstone (2) while allowing a conductive liquid (7) to flow between the grindstone...
|
|
WO/1996/013356A2 |
The improvements object of this contrivance consist of: a new system of container (8) that makes possible the containing and cooling of the wheels (24) at any angle included among zero and ninety degree without loss of cooling fluid and ...
|
|
WO/1996/002319A2 |
The present invention is an improved apparatus and method for mixing, storing, and delivering slurry chemicals for use in manufacturing operations. The present invention is particularly directed to the effective production and handling o...
|
|
WO/1995/035261A1 |
Owing to a primary filtration unit (12), the quantity of chips in a machining process waste liquor is reduced, and abrasive grains are recovered in the form of a suspension, whereby a regenerated machining process liquid is obtained. The...
|
|
WO/1995/029040A1 |
A blasting machine comprising two or more pressure tanks (1, 11) and a switching member (20) for selecting one out of the two or more pressure tanks that supplies grains to an injecting portion, whereby a continuous blasting operation is...
|
|
WO/1995/024990A1 |
A lapping compound mixing and supply system wherein lapping compound is recirculated to the mixing vessel when not supplied to the lapping chamber of a machine tool such as a gear lapping machine. Lapping compound is pumped at about a fi...
|
|
WO/1993/000973A1 |
An abrasive material supplying/recovering apparatus for supplying an abrasive material for polishing play media to a polishing device and for recovering the abrasive material therefrom, characterized by comprising: a supplying vessel hav...
|
|
WO/1989/010825A1 |
A device for sawing pieces into thin slices by means of a row of parallel wires (2) coated with a slip is characterized by the presence of one or more pieces (3) placed near the object (1) to be sawn so that their presence ensures a unif...
|
|
WO/1989/008505A1 |
A dosing gun (500) comprising a revolving valve element (518), arranged fixedly in a first casing (506) which is immovably connected with the gun housing (502). The first casing (506) has a second spring-loaded casing (544) linked to it ...
|
|
JP7466006B2 |
Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each c...
|
|
JP7464416B2 |
A waste liquid treating device includes a holding section that holds an adhesion plate, a vertically moving mechanism that moves the holding section vertically, and a peeling mechanism that peels off water-containing swarf from the adhes...
|
|
JP7464088B2 |
|
|
JP2024043555A |
[Problem] To propose a new technique for polishing without using conventionally used polishing liquid. [Solution] A holding table that holds a workpiece, a polishing head that is disposed above the holding table and has an acrylic plate ...
|
|
JP2024042397A |
An object of the present invention is to provide a method for regenerating a used abrasive slurry that improves the removal rate of constituent components of an object to be polished contained in the used abrasive slurry. [Solution] A me...
|
|
JP7440183B2 |
This disclosure features methods of forming chemical compositions. The method includes (1) mixing a plurality of continuous material flows in a mixing tank to form a chemical composition, each continuous material flow including at least ...
|
|
JP2024508561A |
Chemical mechanical planarization (CMP) systems, apparatus and methods comprising: providing a source of CMP slurry; and directing at least one source of mechanical or electromagnetic energy to the source of CMP slurry. modifying a sourc...
|
|
JP2024023654A |
The present invention provides a system for supplying fluid for a grinder/polisher, a grinder/polisher, and a method for controlling the fluid supply device. A method and apparatus for controlling a fluid supply device in a metallurgical...
|
|
JP2024016941A |
An object of the present invention is to provide a grinding device which is highly economical by reducing the displacement of an exhaust means. [Solution] A chuck table 6, a moving means 55 for moving the chuck table 6 between a loading/...
|
|
JP2024017196A |
[Problem] To adjust extremely humid air to an appropriate humidity and then discharge it. [Solution] An electrical component, an air cooling unit that supplies a first gas to the electrical component to cool the electrical component, and...
|
|
JP2024503978A |
Provided herein are advanced substrate polishing methods that use machine learning artificial intelligence (AI) algorithms or software applications generated using AI to control one or more aspects of a polishing process. . An AI algorit...
|
