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Matches 1 - 50 out of 7,761

Document Document Title
WO/2017/101059A1
Polishing tools and methods of polishing a glass substrate are disclosed. A polishing tool (200) includes a stem (220) and a polishing material (210) bonded to the stem (220). The polishing material (210) includes, in volume concentratio...  
WO/2017/106186A1
An aqueous polishing slurry having enhanced wettability comprises a detergent blend which includes an anionic alkyl sulfate-based detergent and an alkylbenzene sulfonate detergent together with particulate polishing abrasive.  
WO/2017/094462A1
A plate glass manufacturing method comprises a transportation step of transporting plate glass (G) in a prescribed transport direction. In the transportation step, a portion of a transport belt (6) is raised by a lifting and lowering dev...  
WO/2017/094646A1
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding st...  
WO/2017/081617A1
The head (1) for polishing of ceramic or natural stone articles comprising a main body (2), at least one support element (3) attached to the main body (2) and supporting at least one tool (4), and means of air cooling (5, 6, 7) said tool...  
WO/2017/076905A1
The invention relates to a method for the production of a metal strip (1), in which the metal strip (1) is ground in a plurality of passes at least on one side on substantially the entire surface. During a final grinding passage, the met...  
WO/2017/072726A1
Device (1) for working ceramic objects provided with at least one tool (2) operating in rotation to cut at least one ceramic article (4) positioned on a worktop (5), and comprising: at least one cooling element (6) adapted to send compre...  
WO/2017/068945A1
Disclosed is a semiconductor wafer processing method wherein, firstly, a thin disc-like wafer is manufactured by slicing a semiconductor single crystal ingot (slicing step), then, a planarized coating layer is formed by applying a curabl...  
WO/2017/063932A1
The present invention relates to a stoning or honing device for automatically applying an essentially constant and uniform pressure of an abrasive hard component onto a continuously moving metal strip (6) surface, for the purpose of defe...  
WO/2017/061486A1
This duplex grinding device is equipped with: a disc-like carrier ring (2) which has a supporting hole (241) capable of supporting a silicon wafer (W); a rotating mechanism which causes the carrier ring (2) to rotate with the center (C1)...  
WO/2017/057548A1
Provided is a grinding machine in which brittle-mode grinding is suppressed so as to achieve stable grinding of a wafer. This grinding machine (1) is provided with: a rotatable spindle (23) that has a grind stone (21) attached to a lower...  
WO/2017/053737A1
A floor polishing or grinding pad assembly (10) is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad (12), a reinforcement layer or ring (14; 114), and multiple floor-contacting disks (16; 16a; 16b; 16c;...  
WO/2017/044403A1
An abrasive rotary tool includes a tool shank a flexible planar section positioned opposite the tool shank. The flexible planar section forms a first abrasive external surface on a first side of the flexible planar section and a second a...  
WO/2017/033462A1
A glass plate processing device 1 comprises: a scribe line forming device 5; glass plate breaking devices 15A, 15B; glass plate peripheral edge grinding devices 19A, 19B; and a glass plate conveying device 20 that carries glass plates 2 ...  
WO/2017/030867A3
In a deterministic setting for finishing the support surface of a chuck such as a wafer chuck, the treatment tool may have a contacting surface shaped as a ring, annulus, or toroid, or at least such will be the form of contact when the t...  
WO/2017/025303A1
The invention relates to a grinding disc (10, 110, 210) for a grinding machine (90), wherein the grinding disc has a machine side (11) associated with the grinding machine (90) and a processing surface (12, 112, 212) associated with a pr...  
WO/2017/018219A1
A substrate processing method according to one mode of the embodiment includes a grinding step, a measurement step, a condition determination step, and a damaged layer removal step. At the grinding step, the surface (W1) of a substrate (...  
WO/2017/018420A1
A glass plate 12 equipped with a light-incident-side beveled surface 40 that is positioned in a manner such that a line segment L1 connecting a first intersecting point P1 at which the light-incident-side beveled surface 40 and a light-e...  
WO/2017/009524A1
The claimed invention relates to an apparatus for grinding a concrete floor surface. The invention solves the problem of coupling a detachably cohesible diamond grinding arrangement (2) to an apparatus with concrete grinding means (1 ). ...  
WO/2017/007111A1
The present invention relates to a brake pad friction material continuous processing apparatus, which is capable of facilitating a chamfering process, regardless of the standard of a brake pad, at the time of manufacturing a friction mat...  
WO/2017/006447A1
The purpose of the present invention is to provide a wafer having a step, said wafer making it possible not to leave a resist after development, and to provide a method for manufacturing the wafer. This wafer having a step is a wafer tha...  
WO/2016/207814A1
The machine (1) for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, comprises a base framework (2), means (3) for advancing at least one sheet-like element (4) on a m...  
WO/2016/185374A1
Machine for polishing/ flattening slabs of natural stone or marble or granite or the like, provided with a mechanism for controlling the position of the spindle, such a machine comprising a base on which the slabs are positioned, a bridg...  
WO/2016/181751A1
The purpose of the present invention is to provide a polishing pad, which has high planarization precision and for which the polishing rate is not susceptible to decrease over a relatively long period. This polishing pad is provided with...  
WO/2016/183126A1
A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and...  
WO/2016/169688A1
The invention relates to a device (10) and a method for processing brake linings (44) which are mounted on lining supports (46), comprising a conveying device (16) for the continuous and automated displacement of brake linings (44) to be...  
WO/2016/170898A1
This plate glass processing device (1) is provided with: a synchronous motor (2) that drives and rotates a processing tool (B); an arm member (3) that supports the processing tool (B) so as to be rotatable; a support shaft member (4) tha...  
WO/2016/161945A1
A polishing method comprises: conveying a workpiece by using a transmission mechanism with a to-be-processed surface of the workpiece facing down; and polishing the to-be-processed surface under the to-be-processed surface by using a pol...  
WO/2016/158102A1
Provided is a structural body production method that is provided with: a formation step wherein a resin material is impregnated with carbon fibers and a carbon fiber composite material (10) is formed by curing the resin material; a polis...  
WO/2016/151121A3
Disclosed is a machining unit for machining an end face of a workpiece. The machining unit has a work table which rotates or is clocked during the machining process.  
WO/2016/151424A1
A tool (U) for polishing and/or lapping stone material surfaces, comprising a member (1) made of abrasive material, a support member (2) for handling said tool (U), a cushioning layer (3) arranged between said abrasive member (1) and sai...  
WO/2016/151561A1
The head (4) for polishing ceramic manufactured articles or natural stones comprises a main body (5) and at least one work tool (6) associated with the body (5) for polishing ceramic manufactured articles or natural stones, and air cooli...  
WO/2016/151121A4
Disclosed is a machining unit for machining an end face of a workpiece. The machining unit has a work table which rotates or is clocked during the machining process.  
WO/2016/151121A2
Disclosed is a machining unit for machining an end face of a workpiece. The machining unit has a work table which rotates or is clocked during the machining process.  
WO/2016/152932A1
The purpose of the present invention is to provide a method for manufacturing a glass substrate which is capable of efficiently improving the cleanliness of the surfaces of the glass substrate. This method for manufacturing a glass subst...  
WO/2016/142762A1
The invention relates to a system for the polishing treatment of inner walls of aquatic enclosures (1), comprising at least one tank (21) of abrasive mixture and at least one surface treatment head (30) which communicates fluidically wit...  
WO/2016/140176A1
This adhesive tape for protecting a semiconductor wafer surface comprises an adhesive layer on a base material film. The adhesive strength at 23°C when adhered to stainless steel is 0.3-10 N/25mm, the adhesive strength when heated to 50...  
WO/2016/140634A1
Present invention is a board surface (7) polishing application system (1) for wood-based panel furniture materials such as melamine-coated particleboard, MDF, plywood, parquet, fiberboard etc., wherein it contains at least one polishing ...  
WO/2016/125973A1
A grinding tool according to the present invention comprises: a plate; a plurality of holders formed on the plate and having sliding grooves formed thereon; shoes coupled to the sliding grooves of the holders; and grinding tips arranged ...  
WO/2016/120714A1
The invention relates to a mobile floor grinding machine (1) having at least two horizontally arranged rotatingly driven grinding tool holding devices (21, 22), in particular in the form of plates, on which grinding tools (23) can be arr...  
WO/2016/120715A1
The invention relates to a sanding dust suction device for a movable floor sanding machine (1) with at least two horizontal sanding tool retaining devices (21, 22), in particular in the shape of discs, which are driven in a rotating mann...  
WO/2016/120714A4
The invention relates to a mobile floor grinding machine (1) having at least two horizontally arranged rotatingly driven grinding tool holding devices (21, 22), in particular in the form of plates, on which grinding tools (23) can be arr...  
WO/2016/116452A1
The present disclosure provides a carrier disk (1, 1', 1'') for holding at least one cutting, grinding or polishing element (23) in a floor grinding machine. The carrier disk (1, 1', 1'') comprises a carrier body (11, 12) having a downwa...  
WO/2016/117327A1
A processing apparatus includes: a tool in which a processing surface includes a catalyst material including a transition metal that assists hydrolysis of a surface to be processed of an object to be processed that is immersed in water; ...  
WO/2016/077272A2
A sample grinder includes a base having a bowl and a rotating drive plate to operably support a grinding wheel. A head is configured to support a specimen holder and has a first drive for rotational drive of the specimen holder and a sec...  
WO/2016/077272A3
A sample grinder includes a base having a bowl and a rotating drive plate to operably support a grinding wheel. A head is configured to support a specimen holder and has a first drive for rotational drive of the specimen holder and a sec...  
WO/2016/071188A1
The invention relates to a device comprising a turning unit (14) for turning a workpiece. According to the invention, the turning unit (14) comprises a driveable movable turning body which has contact means (18) which can move with the m...  
WO/2016/064333A1
The invention concerns a way of providing efficient and cost-saving grinding of floors or of other similar surfaces by a grinding machine (2) having replaceable grinding tools (3). According to the invention, it is allowed to select, on ...  
WO/2016/062548A1
The present invention concerns the field of sanding tools in particular but not exclusively intended for boat construction. More specifically, it regards a new improved suction sanding tool having an elongated structure and preferably fl...  
WO/2016/060346A1
The present invention relates to a smart phone liquid crystal polishing device and, more specifically, to a smart phone liquid crystal polishing device for polishing the exterior of tempered glass in a simple and uniform manner when it i...  

Matches 1 - 50 out of 7,761