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Patent Searching and Data


Matches 1 - 50 out of 7,914

Document Document Title
WO/2017/207723A1
The present disclosure relates to a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a machine comprises a machine frame, a grinding head 2, supported by and being rotatable relative to the machine...  
WO/2017/207721A2
The present disclosure provides a floor grinding machine (1) for grinding floor surfaces of stone or stone-like material. The machine comprises a machine frame (2), a grinding head (3), supported by the machine frame (2), a motor (4), su...  
WO/2017/207722A1
The present disclosure relates to a grinding head (1) for a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a grinding head (1) comprises a lower casing member (3), comprising a lower support (31)...  
WO/2017/204759A1
The invention is related to a grinding system which allows the grinding of the side faces of inner and outer rings of roller bearings, having the same width, together. The grinding system provided in order to reach the object of this inv...  
WO/2017/193152A1
The invention relates to a method for processing an endless belt (1) having a belt body (2) of metal, wherein the endless belt (1) has an inner belt face (3), an outer belt face (4), and side edges (5) that connect the inner belt face (3...  
WO/2017/191088A1
The system makes it possible to grind or polish hard surfaces, preferably glass panes by successive grinding passes, in an easy manner for the operator, notably at the start and end of passes. The grinding device is mounted in a sliding ...  
WO/2017/178411A1
The invention relates to a hand-held machine tool, in particular a sanding machine, comprising a handle element (12) for the user to grip and a processing head (11) which has an electric drive motor (100) for driving a tool holder (19) p...  
WO/2017/178409A1
The invention relates to a hand-held machine tool (10) having a, in particular rod-shaped, handle element (12) for an operator to grasp and having a machining head (11), which is movably mounted on the handle element (12) by means of a j...  
WO/2017/169921A1
A coil spring end processing device according to the present disclosure is provided with: a first grindstone; a second grindstone; a first spring holder; a second spring holder; a first retainer for grinding; a second retainer for grindi...  
WO/2017/171052A1
[Problem] To provide a carrier which makes it possible to obtain a high-quality substrate at a higher yield than conventional ones and a substrate manufacturing method using this carrier. [Solution] A carrier 104 according to the present...  
WO/2017/168366A1
A cooling and suction system for polishing heads (5) for polishing, for example by smoothing, lapping or the like, ceramic manufactured items (8) or natural stones, comprises at least one polishing head (5), provided with a plurality of ...  
WO/2017/157193A1
An intelligent wall polishing device, comprising a polishing head (1) and a range-of-motion control mechanism (2). An acting end of the range-of-motion control mechanism (2) is connected to a robotic arm (3). The polishing head (1) is mo...  
WO/2017/138355A1
According to an embodiment of the present invention, a grinding apparatus is provided with a stage, and a plurality of grinding heads. The stage holds a substrate. The grinding heads are selectively pressed to a substrate surface to be g...  
WO/2017/134616A1
An orbital polishing machine (1) for slabs (S) made of stone materials or materials having an equivalent hardness, comprising a stationary basement (2) designed to be secured to the ground, a movable support surface (3) associated with t...  
WO/2017/134925A1
Included are a resin layer forming step for forming a resin layer (R) on one surface (W1) of a wafer (W); a first surface grinding step in which the one surface (W1) is held and another surface (W2) is subjected to surface grinding with ...  
WO/2017/129021A1
Disclosed are a multi-head planetary grinding machine and an operating method therefor. The grinding machine comprises a machine frame (1). A motor (11) is arranged on the front portion of the machine frame (1), a control box (12) is arr...  
WO/2017/126107A1
Provided is a grinding apparatus capable of performing high precision double-headed flat grinding. A grinding apparatus for double-headed grinding of a cylinder and piston for configuring a rotary compressor is provided with: a pair of r...  
WO/2017/101059A1
Polishing tools and methods of polishing a glass substrate are disclosed. A polishing tool (200) includes a stem (220) and a polishing material (210) bonded to the stem (220). The polishing material (210) includes, in volume concentratio...  
WO/2017/106186A1
An aqueous polishing slurry having enhanced wettability comprises a detergent blend which includes an anionic alkyl sulfate-based detergent and an alkylbenzene sulfonate detergent together with particulate polishing abrasive.  
WO/2017/094462A1
A plate glass manufacturing method comprises a transportation step of transporting plate glass (G) in a prescribed transport direction. In the transportation step, a portion of a transport belt (6) is raised by a lifting and lowering dev...  
WO/2017/094646A1
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding st...  
WO/2017/081617A1
The head (1) for polishing of ceramic or natural stone articles comprising a main body (2), at least one support element (3) attached to the main body (2) and supporting at least one tool (4), and means of air cooling (5, 6, 7) said tool...  
WO/2017/076905A1
The invention relates to a method for the production of a metal strip (1), in which the metal strip (1) is ground in a plurality of passes at least on one side on substantially the entire surface. During a final grinding passage, the met...  
WO/2017/072726A1
Device (1) for working ceramic objects provided with at least one tool (2) operating in rotation to cut at least one ceramic article (4) positioned on a worktop (5), and comprising: at least one cooling element (6) adapted to send compre...  
WO/2017/068945A1
Disclosed is a semiconductor wafer processing method wherein, firstly, a thin disc-like wafer is manufactured by slicing a semiconductor single crystal ingot (slicing step), then, a planarized coating layer is formed by applying a curabl...  
WO/2017/063932A1
The present invention relates to a stoning or honing device for automatically applying an essentially constant and uniform pressure of an abrasive hard component onto a continuously moving metal strip (6) surface, for the purpose of defe...  
WO/2017/061486A1
This duplex grinding device is equipped with: a disc-like carrier ring (2) which has a supporting hole (241) capable of supporting a silicon wafer (W); a rotating mechanism which causes the carrier ring (2) to rotate with the center (C1)...  
WO/2017/057548A1
Provided is a grinding machine in which brittle-mode grinding is suppressed so as to achieve stable grinding of a wafer. This grinding machine (1) is provided with: a rotatable spindle (23) that has a grind stone (21) attached to a lower...  
WO/2017/053737A1
A floor polishing or grinding pad assembly (10) is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad (12), a reinforcement layer or ring (14; 114), and multiple floor-contacting disks (16; 16a; 16b; 16c;...  
WO/2017/044403A1
An abrasive rotary tool includes a tool shank a flexible planar section positioned opposite the tool shank. The flexible planar section forms a first abrasive external surface on a first side of the flexible planar section and a second a...  
WO/2017/033462A1
A glass plate processing device 1 comprises: a scribe line forming device 5; glass plate breaking devices 15A, 15B; glass plate peripheral edge grinding devices 19A, 19B; and a glass plate conveying device 20 that carries glass plates 2 ...  
WO/2017/030867A3
In a deterministic setting for finishing the support surface of a chuck such as a wafer chuck, the treatment tool may have a contacting surface shaped as a ring, annulus, or toroid, or at least such will be the form of contact when the t...  
WO/2017/025303A1
The invention relates to a grinding disc (10, 110, 210) for a grinding machine (90), wherein the grinding disc has a machine side (11) associated with the grinding machine (90) and a processing surface (12, 112, 212) associated with a pr...  
WO/2017/018219A1
A substrate processing method according to one mode of the embodiment includes a grinding step, a measurement step, a condition determination step, and a damaged layer removal step. At the grinding step, the surface (W1) of a substrate (...  
WO/2017/018420A1
A glass plate 12 equipped with a light-incident-side beveled surface 40 that is positioned in a manner such that a line segment L1 connecting a first intersecting point P1 at which the light-incident-side beveled surface 40 and a light-e...  
WO2017009524A1
The claimed invention relates to an apparatus for grinding a concrete floor surface. The invention solves the problem of coupling a detachably cohesible diamond grinding arrangement (2) to an apparatus with concrete grinding means (1 ). ...  
WO/2017/007111A1
The present invention relates to a brake pad friction material continuous processing apparatus, which is capable of facilitating a chamfering process, regardless of the standard of a brake pad, at the time of manufacturing a friction mat...  
WO/2017/006447A1
The purpose of the present invention is to provide a wafer having a step, said wafer making it possible not to leave a resist after development, and to provide a method for manufacturing the wafer. This wafer having a step is a wafer tha...  
WO/2016/207814A1
The machine (1) for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, comprises a base framework (2), means (3) for advancing at least one sheet-like element (4) on a m...  
WO/2016/185374A1
Machine for polishing/ flattening slabs of natural stone or marble or granite or the like, provided with a mechanism for controlling the position of the spindle, such a machine comprising a base on which the slabs are positioned, a bridg...  
WO/2016/181751A1
The purpose of the present invention is to provide a polishing pad, which has high planarization precision and for which the polishing rate is not susceptible to decrease over a relatively long period. This polishing pad is provided with...  
WO/2016/183126A1
A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and...  
WO/2016/169688A1
The invention relates to a device (10) and a method for processing brake linings (44) which are mounted on lining supports (46), comprising a conveying device (16) for the continuous and automated displacement of brake linings (44) to be...  
WO/2016/170898A1
This plate glass processing device (1) is provided with: a synchronous motor (2) that drives and rotates a processing tool (B); an arm member (3) that supports the processing tool (B) so as to be rotatable; a support shaft member (4) tha...  
WO/2016/161945A1
A polishing method comprises: conveying a workpiece by using a transmission mechanism with a to-be-processed surface of the workpiece facing down; and polishing the to-be-processed surface under the to-be-processed surface by using a pol...  
WO/2016/158102A1
Provided is a structural body production method that is provided with: a formation step wherein a resin material is impregnated with carbon fibers and a carbon fiber composite material (10) is formed by curing the resin material; a polis...  
WO/2016/151121A3
Disclosed is a machining unit for machining an end face of a workpiece. The machining unit has a work table which rotates or is clocked during the machining process.  
WO/2016/151424A1
A tool (U) for polishing and/or lapping stone material surfaces, comprising a member (1) made of abrasive material, a support member (2) for handling said tool (U), a cushioning layer (3) arranged between said abrasive member (1) and sai...  
WO/2016/151561A1
The head (4) for polishing ceramic manufactured articles or natural stones comprises a main body (5) and at least one work tool (6) associated with the body (5) for polishing ceramic manufactured articles or natural stones, and air cooli...  
WO/2016/151121A4
Disclosed is a machining unit for machining an end face of a workpiece. The machining unit has a work table which rotates or is clocked during the machining process.  

Matches 1 - 50 out of 7,914