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JP2012143822 |
To provide a polishing apparatus which relaxes a polishing trace generated by the transfer of grooves of a polishing pad to the polishing surface of a polished object.The polishing apparatus 10, makes a polishing pad 16 revolve (and/or r...
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JP2012146871 |
To set up pressing means in a predetermined position without including a position sensor and reduce the cost for the entire apparatus.A workpiece holding apparatus according to an embodiment changes a distance between a holding part (hol...
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JP2012135841 |
To facilitate a grinding device to grow in size by canceling loads acting from grinding tools on members to be ground to reduce a vibration of a device.The problem is solved by providing the continuous grinding device of glass plate, whi...
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JP2012135854 |
To provide a method for grinding lithium tantalate that prevents the occurrence of deterioration of working quality, working failure, and breakage of a wafer.The grinding method of the lithium tantalate has a holding step holding the lit...
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JP2012135853 |
To provide a grinding device that can automatically set up an original position.The grinding device includes: a height position detector including a holding surface height position detection part for detecting a height position of a hold...
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JP2012132079 |
To provide a production method producible of a high tensile strength steel sheet excellent in chemical conversion treatment property by efficiently removing oxides in a surface layer of the steel sheet.In a method for producing a steel s...
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JP2012125870 |
To easily and promptly input workpieces in pockets and to highly efficiently grind the workpieces so as to enable shortening of a cycle time.When carrier through-grinding of both end faces of the workpieces W held in the pockets 4 of a c...
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JP2012125778 |
To provide a method and an apparatus for manufacturing a pin for a power transmission chain capable of performing quantitative management of a pin holding state and thereby stabilizing working accuracy and facilitating management.A holdi...
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JP2012121082 |
To provide a compound chamfering apparatus which includes a slicing device for tearing four side surfaces of a cylindrical ingot and a grinding/chamfering device for four round corner portions and four side surfaces of a square ingot, ar...
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JP2012121118 |
To provide a grinding device capable of washing away abrasive grains dropped from or stuck in a grinding wheel by increasing the flowability of grinding water supplied to a grinding part using a grinding wheel.The grinding device include...
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JP2012121085 |
To shorten the time required for moving a work to a next machining position to restart machining, by preventing a partitioning plate from interfering with a thickness detecting means, without causing the thickness detecting means of non-...
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JP2012121120 |
To provide a manufacturing method of a wafer holder having a spherical curvature, capable of manufacturing it more easily and more precisely than ever before.A support body 1 has a convex surface 5 in a spherical shape. In a substrate fi...
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JP2012115911 |
To provide a substrate grinding method by which a substrate is ground easily.The substrate grinding method includes the process of placing a substrate 100 on one main surface of an substrate holding part 800 of elastic tabular form conta...
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JP2012111001 |
To provide a work carrier which can improve yield in glass board manufacturing.The work carrier for polishing glass holds a sheet of glass board W which is held and polished between an upper surface plate and a lower surface plate that a...
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JP2012110938 |
To provide a surface conditioning method with excellent productivity, which can secure surface quality of a product even without removal work of a grinding burr in conditioning a surface of a stainless steel slab by a grinder.In the meth...
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JP2012111000 |
To provide a color filter substrate polishing machine and a polishing method which can reduce variation of a film thickness (chromaticity) in a polishing process by locally changing a load applied on a processing substrate when in-plane ...
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JP2012106305 |
To provide a single-sided grinding technology capable of uniformly processing a work height of a longitudinally long work and grinding one flat surface of the work in a central convex shape.A bottom surface Wb of the work is ground at a ...
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JP2012109019 |
To provide a glass substrate excellent in parallelism for a magnetic recording medium.A glass substrate for a magnetic recording medium, in which the parallelism of both main planes at least in a recording and reproduction area of the gl...
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JP2012106300 |
To prevent erasure of memory about positions of respective axes in a transfer robot due to depletion of a remaining capacity of a battery of the transfer robot for a grinding apparatus.A battery part 55 includes an auxiliary battery 55b ...
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JP2012106319 |
To stably supply a polishing liquid on an entire surface of a polishing pad.The polishing liquid supply device 100 includes: a liquid storage part 110 for storing the polishing liquid; a liquid replenishing part 120 for replenishing the ...
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JP2012109358 |
To provide a cutting method and a cutting device of a semiconductor substrate capable of efficiently acquiring a chip with stable quality.A cutting method of a semiconductor substrate comprises a step (step S10) of forming a preliminary ...
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JP2012109357 |
To provide a cutting method and a cutting device of a semiconductor substrate capable of efficiently providing a chip with stable quality.A cutting method of a semiconductor substrate comprises: a step (step S10) of forming a modified re...
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JP2012101346 |
To modify a flat glass surface to a different degree of opacity.A glass surface is cooled with water and the glass surface is tarnished with synthetic diamond abrasive grains located in a mass of plastic fibers of a rotating brush while ...
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JP2012096319 |
To extend a maintenance interval of a polishing device, and to reduce a burden on a maintenance worker without enlarging the device.The polishing device includes a workpiece feed table 20 disposed at one side of a longitudinal direction ...
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JP2012091952 |
To provide a method for efficiently polishing glass containing an alkaline earth metal, and a method for producing an optical element utilizing the polishing method.The surface of glass containing alkaline earths is modified by sulfate i...
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JP2012091245 |
To provide a grinding apparatus that can stop grinding before a sapphire substrate or the like is damaged.The grinding apparatus includes a chuck table for holding a workpiece and a grinding means where a grinding wheel provided with a g...
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JP2012081553 |
To provide a polishing device that prevents glass substrates from being finished in various sizes.The polishing device includes an upper surface plate 40 as a polishing means for polishing the glass substrate in accordance with the same ...
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JP2012081556 |
To provide a processing apparatus that can be reduced in size having four processing units.The processing apparatus includes: four processing units 7a, 7b, 7c, 7d individually arranged in four processing unit supporting mechanisms 6a, 6b...
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JP2012076171 |
To provide a processing apparatus that can prevent spray from being scattered in adjoining machining areas, the spray being generated when a plurality of processing means arranged in a plurality of processiong areas carry out processing....
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JP2012076198 |
To provide a processing apparatus, with which a processing apparatus with four processing devices can be configured in a small size.The processing apparatus includes: a turntable disposed rotatably while having an opening in a center par...
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JP2012080042 |
To provide a surface machining device for efficiently grinding and polishing a work to be machined.In a load unit 30 of a surface machining device 20, a work W is adsorbed by a transfer chuck 10. The work W fixed to the transfer chuck is...
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JP2012071410 |
To provide the grinding method of a wafer made of lithium tantalate or lithium niobate, for suppressing breakage of the wafer.The grinding method of grinding the wafer made of the lithium niobate or lithium tantalate, the wafer having a ...
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JP2012071408 |
To provide a plate-like glass material before grinding and a method for manufacturing a glass substrate for an information recording medium that can make the grinding amounts of first and second faces roughly coincide with each other whe...
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JP2012064735 |
To provide a method for grinding a wafer, capable of reducing a grinding processing time and the risk of damage to a wafer during handling thereof.A method for grinding a wafer, in which a back surface of the wafer is ground to form a ci...
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JP2012056828 |
To provide a method for manufacturing glass suppressed in the generation of flaws on a surface compared with conventional arts.The method for manufacturing the glass includes a polishing process of polishing the surface of a glass substr...
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JP2012051069 |
To provide a grinding method capable of shortening a processing time even when a workpiece is made of a hard material.A fragile layer 102a is formed on the reverse surface 101 side of non-reaching to a grinding finish thickness T of the ...
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JP2012051039 |
To provide a manufacturing method of a glass thin sheet capable of manufacturing the glass thin sheet excellent in flatness and parallelism without reducing production efficiency.This manufacturing method of the glass thin sheet includes...
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JP2012040618 |
To prevent a grinding means mounted on a moving base from driving at a breakneck speed due the come-off of an origin position detection sensor and the like when detecting the origin position of the grinding means mounted on the moving ba...
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JP2012040620 |
To provide a grinding machine which can grind a substrate with high accuracy even when the substrate is formed from a hard-to-grind material and which has high rigidity.The grinding machine (10) includes: at least three linear guides (31...
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JP2012043824 |
To provide a wafer processing method which inhibits deterioration in processing quality of a wafer though bumps are formed and enables planarization.The processing method of cutting or polishing a rear face of a wafer whose front face ha...
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JP2012040653 |
To provide a method of grinding a workpiece capable of more reducing the thickness of the workpiece which is formed by gathering electronic component elements easy to be broken in a certain direction by in-feed grinding, and capable of p...
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JP2012040648 |
To provide a parallelism confirmation implement which makes it possible to easily confirm whether parallelism between a suction surface of a suction holding pad and the holding surface of a chuck table is within a permissible range.The p...
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JP2012035403 |
To achieve small workpiece conveyance demanded for a workpiece 4 in a deburring device and a deburring method by which a burr and a sharp edge generated on the workpiece 4 are removed after working of pressing and the like.A conveyance m...
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JP2012038801 |
To provide a cutting method which can prevent the processing quality from deteriorating and can allow planarization even in a wafer with a bump formed on it.A cutting method for cutting a reverse face of a wafer which has, on the surface...
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JP2012038840 |
To provide a semiconductor manufacturing apparatus and a manufacturing method of a semiconductor device for manufacturing a semiconductor device with a good yield.A semiconductor device comprises: a frame body 102 having an area on which...
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JP2012039039 |
To provide a processing method which can process a work piece of any shape by directly sucking and holding the work piece to a holding table.A work piece 1 is placed on an adhesive sheet 5 glued to a holding surface 73 of a holding table...
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JP2012035346 |
To provide a device and a method for grinding a pin for a power transmission chain, capable of further reducing the curvature radii (R2) of the end surfaces of the pin without reducing a diameter of a carrier.The pin is ground using a gr...
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JP2012035355 |
To provide a spring grinding device and a spring grinding method which converge a coil length of a compression coil spring on a fixed value more easily than before.In the spring grinding device 10, when a detected coil length H is shorte...
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JP2012030291 |
To provide a spring grinding device and a spring grinding method capable of grinding the workpiece of a small lot smaller than a workpiece holding capacity.According to the coil grinding device 10 and the spring grinding method, when a w...
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JP2012033788 |
To provide a fixing method of a wafer which ensures stable machining of a planar article to be ground such as a wafer with no cracking or chipping when it is made thin by grinding or polishing.In the method of reducing the thickness of a...
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