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WO/2008/064256A2 |
A deglazing tool for use on motorcycle and ATV disc brake rotors. The tool is handheld and has abrasive pads that engage the rotor braking surface. The abrasive pads cut through the glaze on the braking surface of the rotor. Grip pressur...
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WO/2008/049458A1 |
The invention provides an electric hand-held machine tool for carrying out grinding work, in particular an orbital sander, which has a drive plate (16), which can be driven by an electric motor to perform the grinding movement, and a gri...
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WO/2008/049459A1 |
The present tool holder (1) has at least two tool spindles (2) arranged in the tool holder (1) for the accommodation of grinding tools (40), wherein the tool spindles (2) are arranged such that they rotate around the axis (H) thereof, dr...
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WO/2008/041449A1 |
End face grinding apparatus (1) for glass substrate including grindstone (4) for grinding an end face of glass substrate (3) by making relative movement to the glass substrate (3) and including grinding fluid supply means (6) for feeding...
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WO/2008/032127A1 |
Portable electromotorised smoothers are wide known as equipment smoothing surfaces. They are distincted in two types: Rotary and pulsive smoothers. Power is provided by an electric motor to the head under it is located the glass-paper. T...
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WO/2008/033377A2 |
A sanding tool includes a handle assembly and a head assembly having a sanding member. The sanding tool also includes at least one pivot member that pivotably couples the handle assembly and the head assembly such that the head assembly ...
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WO/2008/024721A2 |
Embodiments of a retaining ring for use with a chemical mechanical polishing process with a body including a polyethylene terephthalate polymer or polymer including ethylene terephthalate monomers are disclosed.
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WO/2008/023782A1 |
A surface polishing method for enhancing crystal orientation on the surface of a tapelike metal substrate in order to enhance the critical current of a superconducting thin film. In an oxide superconductor comprising a tapelike substrate...
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WO/2008/017900A1 |
Automatic sanding device for use with a sanding list, conceived in particular for surface finishing interventions on the hulls of boats in boatyards comprising twin oscillating arms (3) connected to the sanding list (4) to form with the ...
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WO/2008/016073A1 |
Provided is a surface polishing method for improving crystalline orientation of the surface of a tape-shaped metal base material so as to improve the critical current of a superconducting thin film. An oxide superconductor is composed of...
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WO/2008/008593A1 |
A polishing pad including a window can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. The window of the polishi...
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WO/2008/004601A1 |
Provided are a system and a method for uniformly polishing a surface of a tape-like metal base material in a unit of several hundred meters, at a high speed and a high efficiency. The polishing system for continuously polishing the surfa...
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WO/2007/147214A1 |
A method and apparatus for polishing a diamond material is disclosed. The method comprises the steps of positioning a sample of the diamond material in relation to a movable metallic surface, and bringing the diamond material sample into...
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WO/2007/145576A2 |
The present document discloses a method for providing an improved roadway (30). The method comprises forming a wearing coat (32) of the roadway (30) by treating the roadway with a grinding and/or cutting tool.
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WO/2007/141320A1 |
The invention concerns the treatment of a surface, notably sanding of a ceiling and where applicable, of a wall or the junction between a wall and a ceiling. The robot includes a moving socket (4), an articulated manipulator arm (9), whi...
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WO/2007/120224A2 |
The present invention provides for a mold that can position and hold abrasive particles, which are to be electrolytically attached to an electrically conductive substrate during an electrolytic process. The mold can include an insulating...
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WO/2007/114153A1 |
A brake disk mounting surface is ground by engaging it against an annular grind stone while an inner ring having the brake disk mounting surface is rotated about the center axis of the inner ring. During the grinding, the grinding surfac...
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WO/2007/111766A1 |
A plug (300) for a grinding machine (1) includes one or more holes extending through to the plug for use as dust collection ports. A grinding machine includes a housing (200), a drive mechanism including a shaft (150) extending through t...
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WO/2007/103863A2 |
A self-propelled mobile marking removal system which comprises a mobile vehicle assembly including a chassis, a high pressure liquid pump in fluid connection with a liquid reservoir contained within said chassis, said high pressure liqui...
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WO/2007/103703A2 |
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depr...
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WO/2007/099653A1 |
A vertical-type double-head surface grinding machine for machining a brake disk, the surface grinding machine being capable of grinding both surfaces of various disk-like workpieces without changing work holders. The surface grinding mac...
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WO/2007/093874A1 |
A sanding disc includes a generally circular plate having a mounting surface. A plurality of independent abrasive elements are removably mount able on the mounting surface of the plate. The independent abrasive elements may be blades hav...
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WO/2007/093345A1 |
To grind bar-shaped workpieces which have a non-circular cross section and flat end faces running parallel to one another, two partial operations are carried out one after the other. First of all the bar-shaped workpiece is rough- and fi...
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WO/2007/088241A1 |
The invention relates to a method for profiling in CD-direction the surface qualities of a fibrous web to be manufactured/treated in a paper/board machine or in a finishing machine, said method comprising passing a fibrous web through a ...
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WO/2007/084372A2 |
A bimodal tile saw includes a tray supported on a base extending in a first direction and a water-cooled saw unit suspended from a telescoping arm. Both the tray and the saw unit move relative to the base along the first direction. In a ...
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WO/2007/083438A1 |
A method and a device for polishing a plate-like body, with which a large-sized plate-like body can be accurately polished. In the method, the plate-like body is, while being moved in a predetermined direction, continuously polished by c...
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WO/2007/081886A2 |
Methods and systems for marring fiber optic substrates may include rollers with abrasive surfaces that press lengths of the substrates against elongated supports, which may be tapered, during relative lengthwise movement between the roll...
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WO/2007/079978A1 |
A device for processing wafers (18) is proposed in which a multiplicity of processing steps can be carried out without re-clamping the wafer (18).
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WO/2007/078046A1 |
A grinding head for a stone grinding machine is disclosed. The grinding head includes a motor installed to a movable frame; a revolving rotary shaft connected to the motor; a gear box fixed to the revolving rotary shaft so that the gear ...
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WO/2007/072273A2 |
The invention relates to a grinding tool for natural stone floors, artificial stone floors and industrial soils, said grinding tool permitting a greatest possible adaptation to the unevennesses of worn natural and artificial stone floors...
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WO/2007/069476A1 |
A method for reusing a used card incorporating a recording medium. A card treating apparatus (1) principally has a conveyor (2) having at the upstream end a section (3) for containing cards to be treated and the conveyor (2) also having ...
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WO/2007/066457A1 |
In a double side grinding machine for semiconductor wafers, static pressure pads contactlessly support a source wafer at both surfaces of the source wafer by the static pressure of a fluid supplied to both surfaces of the source wafer. T...
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WO/2007/054125A1 |
A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser a...
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WO/2007/040556A1 |
A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main rad...
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WO/2007/041191A2 |
A modified truncated cone-shaped disk is molded onto a plastic hub which is mounted on a motor driven shaft. The hub has an axial bore of a size to fit with very close clearance on the shaft while still permitting the disk to freely slid...
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WO/2007/038647A2 |
In a first aspect, an apparatus is provided for coupling a semiconductor device manufacturing tool to facilities. The apparatus includes (1) a docking station adapted to mount to a raised floor and having a thickness approximately equal ...
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WO/2007/036845A1 |
The present invention finds application in the processing of stones and the like and particularly relates to a machine tool for surface processing of slabs or products having a flat surface of stone material or the like, which machine co...
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WO/2007/030348A2 |
A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/...
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WO/2007/030779A2 |
An apparatus and method for polishing objects, such as semiconductor wafers, uses at least one object cleaner, which may be a movable object cleaner. The movable object cleaner allows access to different parts of the apparatus for mainte...
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WO/2007/030347A2 |
A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungr...
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WO/2007/025226A1 |
A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a ...
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WO/2007/021191A2 |
A floor treating machine, comprising a frame (20), a housing (8) which is attached to the frame in such a manner that said housing is rotatable about a substantially vertical axis, at least three heads (10) attached to the housing in suc...
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WO/2007/015163A1 |
A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is performed while appropriately adjusting t...
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WO/2007/015322A1 |
A device (1) for processing braking surfaces of a brake disk has a rotation drive device (11) for rotating the brake disk (2), a processing section (12) for processing braking surfaces (4, 5) of the brake disk (2), and pressing rollers (...
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WO/2007/014732A2 |
The invention relates to improved glass substrates, particularly for manufacturing TFT displays. To this end, the invention provides a method for subsequently treating sheet glass substrates, particularly sheet glass substrates for manuf...
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WO/2007/011289A1 |
The invention relates to a device (1) for the detachable fastening of a number of holding plates for carrying grinding elements on a rotatably driven grinding plate (4) for floors or similar surfaces. According to the invention, radial (...
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WO/2006/124608A2 |
A sharpening apparatus (100) for razors includes a blade sharpener rotatably supported within a housing (1) and driven by mechanical activation or a motor (20). An opening in the housing provides access to the blade sharpener for a blade...
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WO/2006/119518A1 |
A floor sanding machine (1) has a frame (1) which carries on its underside a motor-driven, vertically adjustable sanding plate (4) with a sanding disk, an annular dust suction nozzle (11) which surrounds the sanding plate, and two front ...
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WO2006097141B1 |
A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on ...
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WO/2006/115924A1 |
The invention is directed to a multi-layer polishing pad (10) for chemical- mechanical polishing comprising a porous polishing layer (12) and a porous bottom layer (14) , wherein the bottom layer (14) is substantially coextensive with th...
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