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WO/2011/160142 |
A grinding tool carrier (1) with substantially circular grinding discs (2) arranged thereupon, an abrasive covering detachably secured on said discs and chip-removing cutters (4) arranged on the grinding tool carrier and between the grin...
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WO/2011/152045 |
Disclosed is a semiconductor wafer surface protection sheet which has excellent adherence to the irregularities on the circuit formation surface of a semiconductor wafer, and has excellent detachability after being ground. Specifically, ...
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WO/2011/144624 |
Methods and apparatuses are used for optically measuring by interferometry the thickness (T) of an object (2) such as a slice of semiconductor material. Readings of the object thickness by optical interferometry are carried out, rough th...
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WO/2011/138304 |
The invention relates to a method for simultaneous double-side grinding of at least one semiconductor wafer, wherein the one or a plurality of semiconductor wafers lie(s) in freely movable fashion in a cutout in a guide plate fixed in a ...
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WO/2011/126028 |
Disclosed is a method for manufacturing glass plates. The method comprises the following steps: a forming step for forming sheet glass from molten glass; a cutting step for cutting the sheet glass into glass plates having a predetermined...
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WO/2011/122454 |
Disclosed is a glass substrate holding film body such that、in terms of configuration, a self-adsorption type sheet (32) is bonded to a back plate with a double-faced adhesive sheet (34) therebetween, and that a glass substrate is held ...
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WO/2011/117792 |
Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the g...
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WO/2011/110907 |
The machine (1) for grinding plate-shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-shaped element (4) havi...
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WO/2011/107872 |
The machine (1) for the mechanical machining of plate- shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-sha...
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WO/2011/105181 |
Disclosed is a method for surface treatment of a magnesium alloy plate, said method being able to cause blemishes and discoloration to not be prominent on the plate surface in the case where wet polishing has been performed to smooth the...
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WO/2011/105302 |
Disclosed is a method that is for polishing a magnesium alloy plate and that can cause a stripe pattern to not be prominent and grinding burn to be difficult to arise on the surface of a magnesium alloy plate when wet polishing the surfa...
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WO/2011/101464 |
The present invention is directed to a floor-treating machine, comprising: a frame (70), a housing (62) attached to the frame (70) and rotatable about a substantially vertical axis, one or more heads (64) mounted in the housing (62) and ...
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WO/2011/096366 |
Provided is a glass substrate polishing method such that even if a plurality of batches are polished, reduction in the polishing processing rate can be restricted. Also provided is a glass substrate manufacturing method such that glass s...
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WO/2011/093215 |
Provided is a method for manufacturing a roller, which improves the efficiency of grinding performed on a roller end surface of a work piece for a tapered roller or a convex roller, and expands the range of work pieces that can be proces...
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WO/2011/089979 |
Disclosed is a method for producing a semiconductor wafer, which involves: placing a wafer (10), which is provided with a substrate (11) and a semiconductor layer (20) formed on the substrate (11), on a carrier plate (fixed plate) (31) o...
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WO/2011/090483 |
A surface grinding machine (10) generally consisting of a drive means (11) provided with an output shaft; a planetary disk (13) mounted on the shaft; and at least two grinding head units (14) mounted on the planetary disk (13), each incl...
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WO/2011/085950 |
The invention relates to a device (10) and method for determining the position of a working surface (16, 18) of a working disc (12, 14) of a double-sided machine tool, wherein the device comprises an optical measurement device (24) havin...
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WO/2011/074773 |
The present invention relates to a grinding wheel assembly comprising a polishing machine for finishing concrete, asphalt, and a surface or floor of a structure, and more particularly, to a grinding wheel assembly for facilitating the at...
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WO/2011/074615 |
Disclosed is a polishing method having improved operation efficiency in a polishing step without being affected by generation state of surface defects (17) on a glass plate (G) surface to be polished. The distribution state of the surfac...
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WO/2011/074773 |
The present invention relates to a grinding wheel assembly comprising a polishing machine for finishing concrete, asphalt, and a surface or floor of a structure, and more particularly, to a grinding wheel assembly for facilitating the at...
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WO/2011/069319 |
A grinding machine for grinding a wall surface comprises a handle (11). The handle comprises at least two longitudinally-arranged poles, in each of which is provided one dust guiding pipe. In two adjacent poles, the dust guiding pipe (3)...
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WO/2011/064706 |
A machine for smoothing or polishing slabs of stone material, such as natural and agglomerated stone, ceramic and glass, comprises a longitudinal bench (12) over which the slabs to be machined move, at least one pair of opposite bridge s...
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WO/2011/066338 |
A multi-station polish system and process for polishing thin, flat (planar) and rigid workpieces. Workpieces are conveyed through multiple polishing stations that include a bulk material removal belt polishing station and (100) finishing...
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WO/2011/061765 |
A smoothing-polishing machine is described, for slab-type products (100) made of stone material, such as marble, granite, agglomerate and the like, which comprises at least two operating heads (1) with vertical axis, assembled and radial...
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WO/2011/061665 |
The present invention relates to a tool for stone material finishing working comprising a support component or base (2) for anchoring to a machine tool, at least one abrasive work component (3), at least one housing seat (SA) delimited b...
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WO/2011/061104 |
The invention relates to a disc grinder, for example, the grinding disc thereof being supported on a drive shaft and driven by a motor. During the grinding process, the grinding disc encounters uneven areas on the grinding surfaces, lead...
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WO/2011/057638 |
There is disclosed an apparatus (1) for grinding/polishing a surface, including a handle (8) and a grinding unit (2) with a number of grinding members (3), a motor attachment (22, 25), a motor (7) and a screen (23), where the handle is m...
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WO/2011/057637 |
There is described an apparatus for grinding/polishing or cleaning a surface, including at least one grinding unit (2), a motor (3), a screen (4) and a handle (5). The grinding unit is a rotatable and preferably horizontally arranged gri...
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WO/2011/052529 |
Disclosed is a highly flat glass substrate for a display, wherein sufficient strength is ensured by reducing generation of a recessed shape of the polished surface. Also disclosed is a method for manufacturing such glass substrate. The g...
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WO/2011/039393 |
The piece according to the invention considerably optimizes both polishing quality and cost. The upper part of the piece is designed to be attached to heads (2) arranged radially inside a rotary disc (9), while the lower part thereof rec...
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WO/2011/036104 |
An abrasive disc for a multiple disc grinding machine is described, comprising a disc-shaped support (Ia) having a circumferential rim (4) on which the abrasive material is placed and an opposing central hole (7) for fitting on to a driv...
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WO/2011/023297 |
The invention relates to a method for producing a semiconductor wafer, comprising in the following order: (a) removing material from both sides of the semiconductor wafer separated from a monocrystal; (b) chamfering the edge of the semic...
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WO/2011/024086 |
The present invention relates to a method of obtaining a block tool (4), particularly for working stone materials, a block tool (4) for working both natural and artificial stone materials, and a support or base element (7) for a block to...
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WO/2011/020566 |
The invention relates to a method and an apparatus for handling slabs (2a, 2b), produced in particular by continuous casting, the surfaces of which are ground before they are rolled in a rolling train, wherein the slab, lying on a revers...
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WO/2011/019547 |
An inlaid stone composite broadly includes a stone body and a stone inlay assembly secured to the stone body. The inlaid stone composite is constructed by forming a groove in the stone body, with the groove extending inwardly from an edg...
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WO/2011/019547 |
An inlaid stone composite broadly includes a stone body and a stone inlay assembly secured to the stone body. The inlaid stone composite is constructed by forming a groove in the stone body, with the groove extending inwardly from an edg...
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WO/2011/016118 |
Disclosed is a grinding device which can perform high-precision end surface grinding with a good work efficiency by a simple constitution. The grinding device can perform fixed-quantity processing (S102-S112) when a control unit (301) an...
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WO/2011/004473 |
An optical disc polishing apparatus (10) is provided with: an optical disc turntable (15), which is rotary-driven by being horizontally disposed and has an optical disc (14) placed on an upper section thereof; and polishing material turn...
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WO/2011/004764 |
A grinding device for plate-like bodies is provided with back pads which are configured in such a way as to adsorb and hold first surfaces of the principal surfaces of the plate-like bodies and with grinding pads which are configured in ...
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WO/2010/140684 |
A fixed-abrasive-grain machining apparatus, a fixed-abrasive—grain machining method, and a semiconductor-wafer manufacturing method to be used in manufacturing wafers, wherein the fixed-abrasive-machining apparatus (1) is provided with...
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WO/2010/140595 |
A method for grinding a plate-like body by means of a rotating grinding tool while moving the plate-like body in a predetermined direction, wherein the direction of rotation of the grinding tool is reversed with a predetermined timing.
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WO/2010/136057 |
A method and a plant are described for calibrating surfaces of stone materials, suitable for working at least one slab (1) composed of an entry side and an exit side and of two parallel side edges; the slab (1) is pushed along the side e...
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WO/2010/133683 |
The invention relates to a carrier for a silicon block, which is rigidly connected to the carrier and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier is made of plastic, p...
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WO/2010/132342 |
The present invention is directed to a process for resurfacing a damaged surface of plastic lenses, such as vehicle headlights and taillights to restore the plastic lens surface to its original clarity and transparency. During process, a...
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WO/2010/132342 |
The present invention is directed to a process for resurfacing a damaged surface of plastic lenses, such as vehicle headlights and taillights to restore the plastic lens surface to its original clarity and transparency. During process, a...
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WO/2010/131581 |
Provided is a substrate washing method in which the process time necessary to remove foreign matter on a substrate surface can be reduced and the surface can be prevented from being irregularly ground. The substrate washing method for wa...
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WO/2010/119466 |
Machine for working the surface of ceramic products and relevant work head, wherein the head (7) exhibits a support frame (10) having a substantially box-like shape/ at least one work tool (11) is associated with said frame (10) and proj...
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WO/2010/116911 |
Provided are a work feeder for a roller end face working machine capable of feeding rollers to the working machine in a stable position, a roller end face working machine with a high and constant working precision as well as rollers for ...
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WO/2010/112225 |
The invention relates to a method for the grinding or polishing machining of very flat work pieces (38) that are releaseably fastened on flat carriers (28). The work pieces (38) are inserted together with the carriers (28) into the reces...
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WO/2010/105839 |
The invention relates to a method for grinding a continuous casting product (1), in particular a slab, wherein the continuous casting product has in cross-section a rectangular contour with two opposing long sides (2, 3) and two opposing...
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