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WO/2023/085116A1 |
In a processing machine 1, a Z-axis electric motor 39 moves a main shaft 37 in the Z direction. A Z-axis position sensor 69 detects the position of the main shaft 37 in the Z direction. A rotation sensor 71 detects rotation of the main s...
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WO/2023/078471A1 |
Disclosed in the present invention are a heat dissipation device, a brushless electric motor rotor structure and a heat dissipation controller. The heat dissipation device comprises a machine base and a cooling fan, wherein the machine b...
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WO/2023/070152A1 |
Disclosed herein is an apparatus for continuous removal of particles from a mixture of air and particles, the apparatus comprising: a separating means being configured to remove particles from the mixture of air and particles and to disc...
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WO/2023/068848A1 |
A surface inspection device for a steel plate is disclosed. The surface inspection device for a steel plate, according to an embodiment of the present invention, may be provided to comprises: a grinding unit which includes a grindstone f...
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WO/2023/063166A1 |
Provided is a grinding device whereby the position of a workpiece surface to be processed can be efficiently and precisely measured without advance preparation such as NC program creation.　The present invention has a workpiece table (1...
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WO/2023/053476A1 |
The purpose of the present invention is to provide a method and apparatus for producing a semiconductor crystal wafer, the method and apparatus being capable of easily and reliably producing a semiconductor crystal wafer of high quality....
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WO/2023/051960A1 |
The invention relates to a machine for machining sheet metal parts, comprising a brush unit (70) having at least one horizontally rotating polishing brush (71) for brushing the surface of the sheet metal parts to be machined. In order to...
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WO/2023/047682A1 |
The present invention relates to a polishing device, a substrate processing apparatus, and a polishing method. This polishing device comprises a polishing unit 22. The polishing unit 22 comprises: a holding and rotating unit 35 that rota...
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WO/2023/047683A1 |
The present invention relates to a polishing method, and a substrate processing apparatus. This polishing method comprises: a rotation step for rotating a substrate W in a horizontal posture; an etching step for supplying an etching liqu...
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WO/2023/047731A1 |
Provided is a simple method for manufacturing an adhesive-layer-attached optical laminate that prevents floating of a release liner. A method for manufacturing an adhesive-layer-attached optical laminate according to an embodiment of the...
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WO/2023/047684A1 |
A substrate processing apparatus 1 comprises: an indexer robot that takes a substrate W into and out of a carrier; a polishing unit 22 that polishes a back surface of the substrate while heating the substrate W; and a substrate transport...
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WO/2023/047690A1 |
Dust generated on a reverse face of a substrate by grinding with a grinder 96 is pushed out also toward the outer periphery of the grinder 96 by a centrifugal force. There, nitrogen gas is injected from an injection outlet 235. The dust ...
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WO/2023/035810A1 |
A vertical wall construction method and a construction robot. The method comprises: a construction module (130) constructing an indoor vertical wall surface (S1); detecting an obstacle in the direction of construction, and acquiring posi...
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WO/2023/030774A1 |
A method for grinding a semiconductor wafer, wherein the semiconductor wafer is machined in a material-removing manner by means of a grinding tool containing grinding teeth having a height h while supplying a cooling medium into a contac...
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WO/2023/026948A1 |
Provided are: a surface processing method for a GaN substrate, which is capable of performing surface processing on the GaN substrate in a short period of time; and a manufacturing method for a GaN substrate. This surface processing meth...
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WO/2023/020837A1 |
The present invention relates to a grinder having a motor, wherein the grinder can be connected to a grinding disc. The grinder is designed to make possible, in addition to a grinding motion in a flat plane, a wobbling motion of the grin...
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WO/2023/021534A1 |
Finishing tool (10) for surface machining slab-like elements. The finishing tool (10) comprises a reusable base (12) and an abrasive component (14) releasably connected to said base (12) in order to be selectively replaced, wherein said ...
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WO/2023/012042A1 |
The invention relates to a power tool apparatus which is provided to perform an abrasion work operation on a workpiece, said apparatus including at least one spindle which is driven to rotate and a plurality of abrasion components which ...
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WO/2023/004960A1 |
Disclosed are robotic automatic assembling machine (4) for a graphite electrode and a joint, comprising an industrial robot (4-1), a joint conveying workbench (4-2), a joint temporary storage table (4-3), a scanning system (4-4), a torqu...
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WO/2023/004961A1 |
An automatic numerical control graphite electrode and joint precision machining detection assembly and packaging line, which is composed of an automatic graphite electrode machining line (1), an automatic truss conveying type graphite jo...
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WO/2023/001324A1 |
The invention relates to a production system (11) for grinding a first end face (7) of a tapered roller (1) for a rolling element bearing (2), comprising at least one tapered-roller carrier (3) and a grinding tool (12), wherein the at le...
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WO/2023/282832A1 |
The present disclosure relates to a grinding apparatus (1) for grinding a concrete surface comprising a base unit (2) comprising a chassi (3) and at least one rotating means (4) at least partially enclosed by said chassi (3). The at leas...
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WO/2023/283582A1 |
Techniques for polishing and repairing a device's surface are disclosed. An applicator is coated with a paste using a CNC machine. The applicator is attached to a candle bit of the CNC machine, and a device is disposed on a staging area ...
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WO/2023/278703A1 |
A vacuum sander includes a head assembly. A handle attachment is rotatable coupled to a drive to allow selective rotation of the handle attachment relative to the drive and a debris shroud about a first axis. The drive is rotatable relat...
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WO/2023/277103A1 |
A production method according to the present disclosure comprises: a grinding step in which a group 13 element nitride crystal is contained in an opening of a plate-like carrier, and at least one main surface of the crystal is ground; an...
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WO/2022/262059A1 |
The present invention relates to the technical field of slender machining processing. Disclosed are a grinding machine for the surface of a slender object and a grinding method of the grinding machine. The slender object is conveyed betw...
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WO/2022/257234A1 |
A cylinder grinding device and method, and a recording medium, relating to the technical field of grinding devices. The cylinder grinding device comprises a conveying disc and a conveying mechanism. The conveying disc is disposed in a gr...
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WO/2022/240330A1 |
A floor grinder (100) for processing a concrete surface (101), the floor grinder comprising one or more rotatable abrasive tool holders (150) arranged in a plane (P) to hold respective abrasive tools (210, 510), at least one power source...
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WO/2022/234469A1 |
A manufacturing system (1) and a method for manufacturing articles made of compacted ceramic powder (MCP), the system (1) comprising: a supply assembly (3) to supply ceramic powder (CP); a compaction device (5) to obtain a layer of compa...
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WO/2022/234609A1 |
The invention concerns a tool for surface finishing containing a body (20) to which there is attached a surface finishing element (30) which in turn includes at least one abrasive member (31) equipped with a respective abrasive surface (...
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WO/2022/224974A1 |
[Problem] To provide: a magnetostrictive member having a high magnetostrictive constant and parallel magnetostriction, with little variation in the magnetostrictive constant and parallel magnetostriction between members; and a method for...
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WO/2022/215370A1 |
The present invention is a wafer processing method characterized by surface-grinding a front surface of a wafer and a back surface opposite the front surface, with a grindstone with a grit number of 10000 or more, and double-side polishi...
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WO/2022/215628A1 |
The present invention suppresses a decrease in dimensional accuracy. This method for manufacturing a glass substrate supports a semiconductor device, and generates a glass mother plate, measures the thickness, thickness deviation, and wa...
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WO/2022/210721A1 |
The present invention provides a machining apparatus and a machining method that make it possible to perform machining on a to-be-machined object at a high machining rate, with a rigidity equivalent to that of a conventional apparatus. T...
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WO/2022/210216A1 |
Provided is an adhesive tape processing method capable of easily separating a base material and an adhesive constituting an adhesive tape, at low cost. Also provided is an adhesive tape processing device for use with such an adhesive tap...
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WO/2022/201650A1 |
[Problem] To provide a processing system that can process a workpiece with good precision. [Solution] A processing system 1 is configured so as to comprise: a tilting device that can tilt a rotational axis 3a of a chuck 3 retaining a wor...
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WO/2022/201649A1 |
[Problem] To provide a processing apparatus that flattens a workpiece so as to have a desired thickness. [Solution] A processing apparatus 1 flattens a non-circular shape workpiece W with a grinding stone 21 and is provided with: a sucti...
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WO/2022/201213A1 |
Abrasive module (10) made of composite material comprising a base membrane (11) from which a plurality of abrasive heads (12) project.
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WO/2022/201648A1 |
[Problem] To provide a workpiece holding device with which it is possible to precisely process a workpiece. [Solution] A holding unit 3 in a processing apparatus 1 is a workpiece holding device that rotatably holds a workpiece W being pr...
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WO/2022/196132A1 |
The present invention provides a method for manufacturing a semiconductor device equipped with a semiconductor substrate, the method comprising: an attachment step for attaching a protective tape on a first surface of a semiconductor sub...
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WO/2022/196318A1 |
Provided are a production method for a textured plated steel sheet and a production device for a textured plated steel sheet that make it possible to suppress product defects resulting from the film thickness deficiency and poor appearan...
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WO/2021/213174A9 |
Disclosed in some embodiments of the present application are a polishing head management system and method. In the present application, the polishing head management system comprises a storage device, a pick-and-place device, and a data ...
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WO/2022/192344A1 |
A polishing apparatus (31; 301) is provided. Another aspect pertains to a self-leveling polishing apparatus for smoothing diamonds (33). Yet another aspect of the present system uses a ball and swivel joint (107; 109) in a diamond polish...
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WO/2022/183225A1 |
The invention relates to an apparatus for machining the running edges (12) of a sporting device (9), more particularly a ski or a snowboard, comprising a transport apparatus (6), which can be temporarily connected to the sporting device ...
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WO/2022/158485A1 |
The present invention addresses the problem of providing a rear surface grinding method for a wafer, in which the rear surface of a wafer is ground such that the impact of recesses and protrusions on the front surface of the wafer can be...
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WO/2022/154731A1 |
A concrete surface processing system (100), comprising a mobile perimeter access control arrangement (110, 111, 120, 130) and a concrete surface processing machine (140) arranged for autonomous or remote controlled processing of a concre...
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WO/2022/148802A1 |
The invention relates to an apparatus (1) for processing surfaces, in particular floors, comprising a tool mechanism (4) having at least two tools (5a, 5b) movable relative to the tool mechanism (4), a tool motor (3) for driving the tool...
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WO/2022/142670A1 |
The present invention relates to a dust suction device and a floor grinding robot. The dust suction device comprises: a machine frame; a dust suction barrel which is movably mounted on the machine frame, and the bottom of the dust suctio...
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WO/2022/137894A1 |
A plate glass processing device 1 is provided with a servo mechanism 3 that moves a processing tool B in a direction for pressing the processing tool B against an end surface of plate glass A. The servo mechanism 3 is provided with a cor...
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WO/2022/132019A1 |
A concrete surface processing machine (100) for processing a concrete surface, wherein the concrete surface processing machine is arranged to be supported on the concrete surface by one or more support elements (150) extending in a base ...
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