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WO/2020/233770A1 |
The invention relates to a method for installing a double-sided surface grinding machine (10) having: - two mutually spaced grinding discs (12, 14) which delimit a working area (20) arranged between the grinding discs, - at least one gri...
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WO/2020/227495A1 |
A surface-treating tool is configured for coupling to an extension pole with opposed proximal and distal pole ends. The tool comprises a tool head including a rigid tool support having mutually opposed tool-support upper and lower surfac...
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WO/2020/225214A1 |
The invention relates to a method for producing a decorative surface, according to which a manipulation element applied to the surface is removed from said surface mechanically and/or without contact . The invention also relates to a dev...
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WO/2020/225210A2 |
The invention relates to a method for producing a structure on a surface of a workpiece (1), comprising the following steps: - applying a liquid base layer (2) to the surface of the workpiece (1); - spraying at least one droplet (3) into...
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WO/2020/216833A1 |
The invention relates to a glass or glass ceramic panel (1) with a first top surface (2) lying on the xy plane in an orthogonal xyz coordinate system, a second top surface (3), a peripheral lower edge (100), a peripheral upper edge (110)...
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WO/2020/216829A1 |
The invention relates to a glass or glass ceramic panel (1) with a first top surface (2) lying on the xy plane in an orthogonal xyz coordinate system, a second top surface (3), a peripheral lower edge (100), a peripheral upper edge (110)...
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WO/2020/212869A1 |
The present invention relates to a head for treatment, in particular for polishing or lapping of slab shaped elements comprising a main frame (3) having a first part (4) and a second part (5) mounted swivelling at or on the first part (4...
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WO/2020/213452A1 |
Provided is an apparatus 1 for manufacturing a glass plate provided with a position detection device 2 that detects the position of a glass plate G. The position detection device 2 is provided with: a contact 21 that is movable to be in ...
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WO/2020/203098A1 |
A glass plate end face processing device (1) that processes an end face E of a glass plate G with a grindstone (2) is provided with: a swingable arm member (4) that supports the grindstone (2); a servomotor (5) that generates a driving f...
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WO/2020/193627A1 |
The invention relates to a method for operating a machine, in particular a grinding machine, comprising the steps of: sensing a workpiece to be machined and setting a plurality of setting values of the machine; machining a workpiece; sen...
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WO/2020/178793A1 |
A multi-tool machine (1 ) for surface processing of slabs (L) of stone material or the like, comprising a substantially horizontal support surface (2), which is able to move along a longitudinal axis (X), a portal structure (3) defining ...
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WO/2020/175364A1 |
Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sh...
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WO/2020/175363A1 |
Provided is an adhesive sheet for backgrinding which enables sufficient backgrinding while protecting protrusions provided on a semiconductor wafer. The present invention provides an adhesive sheet for the backgrinding of a semiconduct...
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WO/2020/171185A1 |
Provided are a method for grinding a steel billet, a method for manufacturing steel bar, and a method for manufacturing wire rod, with which surface defects can be reduced further while suppressing a deterioration in productivity. This m...
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WO/2020/170120A1 |
Described is a device (1) for calibrating the position of sheet-like elements on a conveyor comprising a supporting frame (10) which can be connected to a machine for grinding sheet-like elements and having one or more transversal guides...
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WO/2020/170950A1 |
An oxide sintered body which has a surface having surface roughness Rz of less than 2.0 μm.
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WO/2020/165759A1 |
An abrasive article includes a plurality of abrasive features disposed on one or more abrasive elements. Each of the one or more abrasive elements includes a base having a first major surface from which the plurality of abrasive features...
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WO/2020/161869A1 |
An annular rotary grindstone 10 having an offset base section 11 that is axially offset, said rotary grindstone being provided with: an outer circumferential grinding section 42 which extends in the shape of an annulus along the outer ci...
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WO/2020/158376A1 |
The present invention is a method for producing a silicon wafer, the method including a step for chamfering a silicon wafer that has a notch, a step for lapping the main surface or cutting both surfaces, an etching step, and a mirror sur...
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WO/2020/150932A1 |
Disclosed are a method and device for ground grinding, a robot (13) and a computer readable storage medium. The method comprises: obtaining information of an area to be ground; generating, according to the information of the area to be g...
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WO/2020/150931A1 |
A floor grinding robot comprises a grinding device (30), an elevation control device, and a movement control device. The elevation control device comprises an elevation information acquisition device (10) for acquiring elevation informat...
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WO/2020/149468A1 |
The present invention relates to a method for processing a sink top formed from an engineered stone material. A method for processing a top plate formed from an engineered stone material comprises (a) a step of polishing a sink top forme...
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WO/2020/149470A1 |
The present invention pertains to a method for processing an MMA artificial marble top plate, the method comprising: (a) a step for polishing the MMA artificial marble top plate with a polish; (b) a step for coating the MMA artificial ma...
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WO/2020/137187A1 |
This double grinding method comprises: a first grinding step in which grinding is performed until the thickness of a first wafer reaches a prescribed thickness while a grinding fluid is supplied in a prescribed amount to first and second...
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WO/2020/136087A1 |
The invention relates to a hand-held power tool, in particular a grinder (10), for simultaneously driving multiple grinding discs (12, 14, 16), in particular tiltable grinding discs (12, 14, 16) which are rotatably and/or oscillatingly d...
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WO/2020/136086A1 |
The invention relates to a hand-held power tool, in particular a grinder (10), for simultaneously driving a plurality of, preferably three, grinding plates (12, 14, 16), which in particular can be tilted and/or are driven rotationally an...
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WO/2020/129714A1 |
Provided is a substrate processing apparatus comprising: a rotary table that delivers a plurality of respective substrate chucks, in the following order, to a loading position where a substrate is loaded, a processing position where the ...
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WO/2020/129757A1 |
This substrate processing device is provided with a polishing unit including: a polishing head (75) for polishing the main surface of a wafer W; a rotation drive part (82) for rotating the polishing head (75) around an axial line Ax1; an...
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WO/2020/119779A1 |
Disclosed are a semiconductor wafer photoelectrochemical mechanical polishing processing device and a processing method therefor. A wafer (4) is adhered and fixed to a polishing head (3) by means of a conductive adhesive, and the wafer (...
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WO/2020/107639A1 |
Disclosed is a linear polishing machine. The linear polishing machine comprises a conveying device (100), a roll-polishing device (200), a disc-polishing device (300) and a cleaning device (400), wherein the conveying device (100) is con...
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WO/2020/109650A1 |
A method in dry shake coating of a concrete floor, whereby an applied floor concrete mass (B) is first of all subjected to early after-care, most preferably by spraying its surface with an early aftercare agent, in which connection, if n...
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WO/2020/104079A1 |
A tool driver for a power trowel, the tool driver comprising a combination of a magnetic fastening arrangement and a friction based fastening arrangement for releasably holding an abrasive tool to the tool driver, wherein the magnetic fa...
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WO/2020/097110A1 |
A glass polishing device has a casing adapted for operative engagement with the exterior surface of a powered drill motor. The casing includes a handle extending from a second side opposite an opening in an opposite first side thereof fr...
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WO/2020/088378A1 |
A ceramics bottom grinding machine comprises a base frame (1), a clamp support (2), a reciprocating control mechanism (3), a lifting clamp (4), a transmission wheel (5), a toggle switch (6), and a grinder (7). The base frame (1) comprise...
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WO/2020/084394A1 |
A gemstone machining center includes a set-up station adapted to deliver onwards loaded-dops each comprising a dop holder and a gemstone bonded to the dop holder, a bruting/cutting station for receiving loaded-dops from the set-up statio...
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WO/2020/078769A2 |
Disclosed is a pane composite (10) and a method for producing and/or providing a pane composite (10) formed of a total of at least three panes, at least one first pane (12), at least one second pane (14), at least one third pane (16), an...
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WO/2020/074634A1 |
The present invention provides an apparatus for working oppositely arranged first and second surfaces of a pressing section. The apparatus comprises an upper working unit forming a top wall and an upper sidewall extending downwardly from...
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WO/2020/071455A1 |
An examination device is provided with: a stage which supports a wafer in which a plurality of columns of modification region are formed in a semiconductor substrate; a light source which outputs light transmitted through the semiconduct...
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WO/2020/071450A1 |
This inspecting device is provided with: a stage supporting a wafer in which a plurality of modified regions have been formed inside a semiconductor substrate; a light source for outputting light that is transparent with respect to the s...
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WO/2020/071458A1 |
An examination device is provided with: a stage which supports a wafer in which a plurality of columns of modification region are formed in a semiconductor substrate; a light source which outputs light transmitted through the semiconduct...
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WO/2020/068629A1 |
A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or cerami...
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WO/2020/055538A1 |
Embodiments described herein relate to rotary unions for use in wafer cleaning processes. The rotary union includes a process media and a supporting media that interact in a gap between a nozzle and rotary element. By regulating the supp...
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WO/2020/039802A1 |
This substrate processing system is equipped with: a first principal surface grinding device which holds a substrate from below in a manner such that the first principal surface of the substrate is oriented upward, and grinds the first p...
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WO/2020/039803A1 |
This substrate processing system is equipped with a processing device for processing a substrate and a first transport device for transporting the substrate into and from the processing device, wherein the processing device is equipped w...
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WO/2020/038258A1 |
Disclosed in the present application is a fully-automatic spring loading mechanism, comprising a machine body, a high-precision synchronous following positioning mechanism and a multi-channel feeding clamp assembly; a sealed box is arran...
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WO/2020/012951A1 |
This processing device comprises: a holding unit which holds a substrate therein; a grinding unit which grinds a processing surface of the substrate held in the holding unit; a conveyance unit which conveys the substrate to the holding u...
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WO/2019/245875A1 |
A method of chemical mechanical polishing includes bringing a substrate having a conductive layer disposed over a semiconductor wafer into contact with a polishing pad, generating relative motion between the substrate and the polishing p...
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WO/2019/239801A1 |
A substrate processing system comprising: a thickness-reducing device that reduces the thickness of a substrate to be processed; a segmenting device that segments the reduced-thickness substrate to be processed into a plurality of chips;...
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WO/2019/239013A1 |
The disclosed solution comprises a method of abrading the surface of a workpiece. The method comprises providing a workpiece (3), an abrading apparatus (14) with a backing pad (10) configured to receive an abrading plate (2), an abrading...
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WO/2019/240951A1 |
A portable apparatus and method for cutting linear trenches in a concrete ground surface includes two bars extending in parallel spaced relation along the concrete with an elongated track removably fastened and extending orthogonally the...
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