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WO/2006/110224 |
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrol...
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WO/2006/110224 |
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrol...
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WO/2006/107111 |
A precision machining method capable of accurately performing grinding. The method comprises a first step for manufacturing an intermediate ground body by roughly grinding a ground body (a) with a diamond grinding wheel (b) and a second ...
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WO/2006/106710 |
In a bonded wafer manufacturing method, at least a bonded wafer is provided by bonding a base wafer to be a supporting substrate with a bond wafer composed of silicon single crystal through an insulating film or directly, the bond wafer ...
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WO/2006/101281 |
The present invention relates to a polishing apparatus for an optical fiber connector, and more particularly, to a polishing apparatus capable of revolving and rotating a polishing disk while constantly maintaining a ratio of revolution ...
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WO/2006/102133 |
A dressing device (10,90) for sharpening or conditioning of a blade (18) or the like includes one or more disk pairs (36-40,108), each having a pair of disks (52,54,110,112) respectively presenting a series of circumferentially spaced, p...
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WO/2006/097141 |
A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on ...
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WO/2006/092568 |
A machining spindle comprising an inner shaft (3) arranged for carrying a first tool (32) for machining a workpiece and an outer shaft (2) arranged for carrying a second tool (22) for machining the workpiece, the shafts being mounted for...
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WO/2006/092138 |
The present invention concerns an apparatus (1), preferably for grinding a surface, including at least one grinding unit, a screen (2, 3) and a guide member (5), where the grinding unit is a rotatable and preferably horizontally arranged...
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WO/2006/090561 |
A glass substrate positioning apparatus is provided with a catching member (3) which can abut to one side (2a (2c)) of a glass substrate (2); and a pressing member (4) which can abut to other side (2b(2d)) parallel to the side (2a(2c)) a...
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WO/2006/084395 |
The invention relates to a wide-wheel grinding machine comprising a machine-tool bed (1) which is embodied in the form of a hybrid-bed and consists of profiled metal parts and a mineral cast, wherein said mineral cast fills at least part...
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WO/2006/081286 |
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing...
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WO/2006/081286 |
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing...
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WO/2006/081538 |
A tool that is designed to cut very hard material using a reciprocating saw. The tool is a rasp made of tungsten carbide that not only cuts into masonry work and other hard materials, but also is capable of not breaking or bending while ...
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WO/2006/076766 |
A polishing pick (10) having a cylindrical shank (11) for receipt within a bore (33) of a polishing apparatus (30) and platform (12) for supporting a polishing substrate (13) the end of the shank. A securing means (14, 15, 16) associate ...
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WO/2006/076765 |
Polishing picks (10) and polishing apparatus (20) using the picks that is suitable for polishing concrete and other hard surfaces. The picks have a cylindrical shank (11), for receipt within a bore (23) of the polishing apparatus and a p...
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WO/2006/078582 |
A simple attachment for a reciprocating tool that will effectuate the ability to do a flush cut in an inexpensive and simple manner which is neither too rigid nor not rigid enough. This is effectuated by providing an insert (25), which f...
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WO/2006/075305 |
An apparatus (10) for providing access to data recorded on a data carrier (20), said access being intentionally limited to a substantially predetermined number of access sessions. The apparatus (10) comprises: (a) an optical reading head...
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WO/2006/071651 |
Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a...
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WO/2006/071651 |
Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a...
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WO/2006/065498 |
A face grinder assembly is disclosed for removing irregularities from tire. The face grinder assembly includes an outer frame and a slide frame slidably attached to the outer frame. The slide frame is capable of vertical movement relativ...
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WO/2006/061172 |
The invention relates to a device for polishing hard surfaces, especially glass surfaces, said device comprising a polishing system (5) provided with a replaceable polishing disk (6). Said polishing system (5) can be displaced in a two-d...
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WO/2006/061910 |
A method for setting the initial position of a whetstone before starting grinding in a vertical duplex surface grinding machine for surface grinding the upper and lower grinding surfaces of a work simultaneously by rotation-driving a pai...
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WO/2006/053057 |
An autocollimator is relied upon to orient an electronic die such that its frontside is parallel to a polishing surface. The polishing device is configured such that a beam of light that is projected by the autocollimator is able to refl...
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WO/2006/053138 |
A chamfering tool (20) adapted to mount on a handheld grinder(l O), the grinder having a guard (14) and the grinder having a grinding face (12). The chamfering tool includes a fixed mount (44), to be attached to the guard on the handheld...
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WO/2006/043928 |
A conditioner disk (200) for use on a polishing pad (32) in chemical mechanical polishing process includes a base structure (210), a plurality of blades (220) supported by the base structure (210). The blades (220) radiate radially and t...
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WO/2006/043605 |
A grinding apparatus and a manufacturing method for a power transmission chain pin, wherein a peripheral groove (5a) is formed in a disk-like grinding wheel (5), and its both side walls are formed in grinding surfaces (5b), and a load pi...
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WO/2006/040636 |
An edge sanding apparatus for sanding a supporting surface in accordance with the present invention includes an elongated frame including a handle-mounting shaft and a carriage portion. The shaft is operatively, pivotally connected to th...
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WO/2006/041530 |
A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work...
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WO/2006/031475 |
An abrasive article (1) for use on a rotary cleaning machine having, on one side, a first abrasive face (2) having a first abrasive nature and, on the other side, a second abrasive face having a second abrasive nature different from the ...
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WO/2006/026625 |
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the...
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WO/2006/009222 |
A detector for detecting the cracking sound of plate glass under polishing while discriminating it from the cracking sound of other plate glass. More specifically, sounds are collected by a microphone (30) and high frequency sounds are e...
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WO/2006/007554 |
The present invention incorporates at least one thermoplastic or elastomeric polymer in abrasive flow machining media either as the sole or as one of the polymeric constituents. The presence of thermoplastic polymer imparts a greater ela...
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WO/2005/120776 |
A material removal optimizing system for a wood surface treating apparatus with a plurality of individual work stations (15, 16, 17,18) arranged serially along an endless conveyor. Each station includes a working abrasive head (27, 28, 2...
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WO/2005/118111 |
The invention relates to a device for collecting particles by means of a first filter arrangement (2, 2') comprising a cyclone device (10) with a coarse filter unit (12) and a microfilter unit (24). The cyclone device (10) has a first va...
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WO/2005/117665 |
A granite tile for forming an inside corner of a countertop is provided, comprising a first surface adapted to act as part of a counter top; a second surface for securing to a base; a front edge, said front edge sized to extend past and ...
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WO/2005/113198 |
A cleaning element (36) for a cement floor surface mounted to a housing (32). Each cleaning element has a flat flexible abrasive surface (39) that is transversely positioned to the direction of motion to provide flex during cleaning of a...
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WO/2005/110677 |
Machine (10) for finishing an object (11) comprising feed members (20, 120, 220, 320, 420) to feed the object (11) along a reference plane (P1), and at least a work station (13, 15) provided with a tool (17) which contacts the object (11...
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WO/2005/095054 |
A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for rece...
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WO/2005/087470 |
The facing machine for large plates of natural stone, e.g. granite and hard stone slabs, comprises: a pair of rollers driven rotatively about a transverse axis to the slab direction of advance and mounted at a work surface grooving stati...
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WO/2005/082575 |
A rotary surface plate for lapping machines in which a plurality of strip-like grindstone pieces (12) in sector form adhesively joined to and carried by the surface of an annular carrier (14) are disposed two-dimensionally substantially ...
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WO/2005/080476 |
The present invention belongs to the technical field of surface modifying of solid materiale. Specifically, it relates to a method of changing the surface wettability of polymer materials. Said method of changing the surface wettability ...
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WO/2005/077599 |
A finishing machine (1) for finishing a work surface (20) which consists of a floor of terrazzo, marble, stone, concrete or the like, comprises at least two finishing units (3a, 4a; 3b, 4b; 3c, 4c, 300) which are supported by the frame (...
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WO/2005/075147 |
A sanding apparatus for sanding a support surface includes an elongated frame having a handle end. and a work end. The handle end is arranged for operator control and the work end is adapted for connection to a working device. The sandin...
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WO/2005/070620 |
[PROBLEMS] A double-end surface grinding machine capable of further enhancing flatness of ground work surface by eliminating concentric undulations occurring on the work surface by grinding. [MEANS FOR SOLVING PROBLEMS] A pair of support...
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WO/2005/070619 |
A method of grinding the opposite surfaces of a wafer one surface at a time by using a cup-type grinding stone, the method characterized by comprising the steps of, when first one surface of the wafer is ground, allowing the grinding sto...
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WO/2005/063430 |
An improved sanding block (14) for sanding high and extended surfaces configured for use in combination with an attached pole (12). The sanding block (14) is round in shape and is rotationally mounted on a pole mount (16), that interface...
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WO/2005/060810 |
The present invention discloses a disposable scrubbing product for use in household cleaning or personal care applications. The scrubbing product (330) of the invention is a multi-layer laminate product and generally includes at least tw...
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WO/2005/061178 |
A method of polishing a surface (120) of an article, e.g., a semiconductor wafer (112, 212), using a polishing layer (108, 208) in the presence of a polishing medium such as a slurry (116). The method includes selecting the rotational ra...
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WO/2005/058544 |
The invention relates to a method for surface working of a body (2) having a first surface (2.1) to be worked and a second surface (2.2) to be worked. The method comprises, in a first step, providing a first tool (3.1) and a second tool ...
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