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Patent Searching and Data


Matches 401 - 450 out of 7,395

Document Document Title
WO/2005/080476A1
The present invention belongs to the technical field of surface modifying of solid materiale. Specifically, it relates to a method of changing the surface wettability of polymer materials. Said method of changing the surface wettability ...  
WO/2005/077599A1
A finishing machine (1) for finishing a work surface (20) which consists of a floor of terrazzo, marble, stone, concrete or the like, comprises at least two finishing units (3a, 4a; 3b, 4b; 3c, 4c, 300) which are supported by the frame (...  
WO/2005/075147A1
A sanding apparatus for sanding a support surface includes an elongated frame having a handle end. and a work end. The handle end is arranged for operator control and the work end is adapted for connection to a working device. The sandin...  
WO/2005/070620A1
[PROBLEMS] A double-end surface grinding machine capable of further enhancing flatness of ground work surface by eliminating concentric undulations occurring on the work surface by grinding. [MEANS FOR SOLVING PROBLEMS] A pair of support...  
WO/2005/070619A1
A method of grinding the opposite surfaces of a wafer one surface at a time by using a cup-type grinding stone, the method characterized by comprising the steps of, when first one surface of the wafer is ground, allowing the grinding sto...  
WO/2005/063430A1
An improved sanding block (14) for sanding high and extended surfaces configured for use in combination with an attached pole (12). The sanding block (14) is round in shape and is rotationally mounted on a pole mount (16), that interface...  
WO/2005/060810A1
The present invention discloses a disposable scrubbing product for use in household cleaning or personal care applications. The scrubbing product (330) of the invention is a multi-layer laminate product and generally includes at least tw...  
WO/2005/061178A1
A method of polishing a surface (120) of an article, e.g., a semiconductor wafer (112, 212), using a polishing layer (108, 208) in the presence of a polishing medium such as a slurry (116). The method includes selecting the rotational ra...  
WO/2005/058544A1
The invention relates to a method for surface working of a body (2) having a first surface (2.1) to be worked and a second surface (2.2) to be worked. The method comprises, in a first step, providing a first tool (3.1) and a second tool ...  
WO/2005/056234A1
The present invention concerns a grinding apparatus (1) for processing a workpiece (20), including a support arrangement (4) for a number of grinding heads (6) that each includes a grinding element (2) and a grinding motor (3) driving an...  
WO/2005/053902A1
The present invention concerns a grinding apparatus (1) including a number of grinding units (3), a number of drive units (11) and a number of screen units (2), where a number of the grinding units (3) are enclosed by at least one of the...  
WO/2005/053017A1
Provided are a semiconductor surface protecting method and surface protecting sheet employing a material having adequate conformability for irregularities on semiconductor wafer circuit sides and sufficient rigidity as a support during g...  
WO/2005/051596A1
A grinding machine comprises a base, a wheelhead (10) with grinding wheel (12) and wheel drive mounted thereon, a workholder (22,23,36) and drive means for rotating a workpiece mounted therein about at least one axis (24), workholder dri...  
WO2005000527A3
The invention is directed to a multi-layer polishing pad (10) for chemical-mechanical polishing comprising a polishing layer (12) and a bottom layer (14), wherein the polishing layer and bottom layer are joined together without the use o...  
WO/2005/050895A2
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rins...  
WO2005031276A3
A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and...  
WO/2005/046872A1
A system (100) for processing a conductive surface on a wafer comprises an electrochemical mechanical processing (ECMPR) module (106) configured to form a substantially planarized conductive layer on the front surface of the wafer, a cha...  
WO/2005/042873A1
This invention provides a large-scale wall polishing dresser which has functions of dust absorption and orientation, and which can produce a pressure only by a man operating the dresser so as to polish and burnish the wall, and this inve...  
WO2004103644A3
Embodiments of a hand manipulated tool includes an elongate handle and a tool support. The tool support has a center, rotationally fixed to the elongate handle. The tool support has a periphery with at least five points equidistant from ...  
WO/2005/032763A1
In a system and a method, according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to control a CMP system to compensate for a change in the condition...  
WO/2005/032766A1
A dressing method capable of dressing the grinding stone of a vertical duplex-head surface grinding machine without incorporating a special dressing device therein. The vertical duplex-head surface grinding machine comprises a pair of up...  
WO2005000543A3
Apparatus for cutting an industrial-size roll of paper or other sheet material into two or more rolls. The apparatus includes a circular saw with a radius large enough to cut through such a roll in a single cut, leaving press-ready rolls...  
WO/2005/031276A2
A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and...  
WO/2005/028156A1
The invention relates to an improved sander comprising a structure (61) which is equipped with a roof element (2), a coating (3), a control panel (4), screens (5) at the part inlet and outlet, a PVC roller (6), a front-end protective fra...  
WO/2005/025398A1
The invention relates to a wall-polishing and -brightening device. The inventive device comprises a cable (6) which is used to suspend the machine (1) at an adjustable height, said cable being associated with a weight regulator (5) which...  
WO2003097297A3
A spindle for tool heads used in calibrating, smoothing or polishing natural stone slabs and/or ceramic tiles, comprising: a tubular housing (3) in which the spindle body (12) is movable, the spindle body (12) including a shaft (31) carr...  
WO/2005/018873A2
A manual sharpener for sharpening either right or left-handed blades of scissors or shears comprises a support structure (34) with an attached hand holding arrangement (25). A magnetic device (31) holds at least one adhesive pad (29) on ...  
WO2004091856A3
A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perfo...  
WO2004108352A3
The invention concerns a carrier plate (2) holding an abrading element, for detachable mounting on a rotatably mounted abrading plate (1) driven during use, for abrading stone or concrete floors, which carrier plate (2) has sides (2a, 2b...  
WO2004108351A3
The invention concerns a device for abrading a wall of stone or concrete material. The invention comprises a shell (2) with which is operationally connected an abrading head (1), and a carriage intended to move at least along the surface...  
WO2004078441B1
A block texture-modifying apparatus (128) for modifying the surface texture of blocks. The apparatus (128) comprises a block support (12'), a block-texture-modifying assembly (130) and a translational movement assembly (132). The block s...  
WO/2005/000527A2
The invention is directed to a multi-layer polishing pad (10) for chemical-mechanical polishing comprising a polishing layer (12) and a bottom layer (14), wherein the polishing layer and bottom layer are joined together without the use o...  
WO/2005/001847A1
Machine tool to shave a surface over a predefined depth, by drawing in rotation against this surface, a cylinder (21) equipped with segments of shaving material (31). Each segment (31) extends longitudinally over the outer surface (29) o...  
WO/2005/000543A2
Apparatus for cutting an industrial-size roll of paper or other sheet material into two or more rolls. The apparatus includes a circular saw with a radius large enough to cut through such a roll in a single cut, leaving press-ready rolls...  
WO/2004/108352A2
The invention concerns a carrier plate (2) holding an abrading element, for detachable mounting on a rotatably mounted abrading plate (1) driven during use, for abrading stone or concrete floors, which carrier plate (2) has sides (2a, 2b...  
WO/2004/108351A2
The invention concerns a device for abrading a wall of stone or concrete material. The invention comprises a shell (2) with which is operationally connected an abrading head (1), and a carriage intended to move at least along the surface...  
WO/2004/107423A1
A method of producing a film-thinning circuit board, comprising the steps of (a) grooving a candidate penetration portion in the surface of a circuit board to at least a depth as much as the thickness of a final product, (b) attaching a ...  
WO/2004/107428A1
A production method for a semiconductor wafer capable of reducing fine surface undulations produced by wire-saw slicing or double-disc grinding by semi-fixed abrasive-grain grinding using free abrasive grains, and simplifying a conventio...  
WO/2004/105998A1
The invention relates to a floor sanding machine, comprising a frame and height-adjustable sanding plate, mounted on the above, beneath the same, for retaining a sanding disc, driven by a motor together with a vacuum turbine, with an ann...  
WO/2004/103644A2
Embodiments of a hand manipulated tool includes an elongate handle and a tool support. The tool support has a center, rotationally fixed to the elongate handle. The tool support has a periphery with at least five points equidistant from ...  
WO2004078441A3
A block texture-modifying apparatus (128) for modifying the surface texture of blocks. The apparatus (128) comprises a block support (12'), a block-texture-modifying assembly (130) and a translational movement assembly (132). The block s...  
WO/2004/098831A1
An abrading machine is disclosed for abrasion of substantially plane items by use of rotating abrading discs (5, 5'), which are moved simultaneously forwards and backward transverse to the item and which preferably has downward extending...  
WO2004078410A3
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wh...  
WO/2004/091856A2
A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perfo...  
WO2004035263A3
Disclosed is a method for structuring the surface of profiles, floor coverings, and similar semifinished products by means of brushes. According to said method, brushes (1, 2, 9) are disposed next to and at a distance from each other per...  
WO2003038882A8
A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of a...  
WO/2004/085114A1
A work tool comprising: a principle drive shaft (1) with a sun gear (2) attached thereto; at least two planetary gears (3) distributed about the circumference of the sun gear (2) at substantially equal angular separations; and a carriage...  
WO/2004/078441A2
A block texture-modifying apparatus (128) for modifying the surface texture of blocks. The apparatus (128) comprises a block support (12’), a block-texture-modifying assembly (130) and a translational movement assembly (132). The block...  
WO/2004/078413A1
A method of machining mechanical workpieces, in particular of machining the braking surfaces (2,3) of a brake disc (1) for vehicles is described and comprises the steps of loading the workpiece onto a work station (8) and clamping the wo...  
WO/2004/078410A2
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wh...  

Matches 401 - 450 out of 7,395