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Patent Searching and Data


Matches 401 - 450 out of 7,116

Document Document Title
WO/2004/098831A1
An abrading machine is disclosed for abrasion of substantially plane items by use of rotating abrading discs (5, 5'), which are moved simultaneously forwards and backward transverse to the item and which preferably has downward extending...  
WO2004078410A3
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wh...  
WO/2004/091856A2
A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perfo...  
WO2004035263A3
Disclosed is a method for structuring the surface of profiles, floor coverings, and similar semifinished products by means of brushes. According to said method, brushes (1, 2, 9) are disposed next to and at a distance from each other per...  
WO2003038882A8
A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of a...  
WO/2004/085114A1
A work tool comprising: a principle drive shaft (1) with a sun gear (2) attached thereto; at least two planetary gears (3) distributed about the circumference of the sun gear (2) at substantially equal angular separations; and a carriage...  
WO/2004/078441A2
A block texture-modifying apparatus (128) for modifying the surface texture of blocks. The apparatus (128) comprises a block support (12’), a block-texture-modifying assembly (130) and a translational movement assembly (132). The block...  
WO/2004/078413A1
A method of machining mechanical workpieces, in particular of machining the braking surfaces (2,3) of a brake disc (1) for vehicles is described and comprises the steps of loading the workpiece onto a work station (8) and clamping the wo...  
WO/2004/078410A2
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wh...  
WO/2004/073924A1
A plate-like work polishing apparatus for polishing a thin plate-like work such as a printed circuit board material by buff rollers, comprising a guide member guiding the plate-like work passed through a clearance between the buff roller...  
WO2002094059A8
Methods and devices are provided for end rounding filaments for use on brushes. The devices include an air driven planetary gear system rotating a sanding wheel (202)through a varied elliptical path that attacks the filaments from all si...  
WO2004013656A3
An improved method for producing a thin layer having highly uniform thickness, which layer may be pre-coated on an undulating surface of a substrate element. A working layer of the material is formed having a thickness greater than the f...  
WO2004024406A3
A wood floor edger (100) is disclosed herein. An embodiment of the edger comprises a housing (104) a and a motor (110). The housing comprises an opening and a rotatable abrasive disc located in the opening. The rotatable abrasive disc ma...  
WO/2004/043647A1
An apparatus (10) for wafer grinding includes sensors (38) and a spectral analyzer to perform a spectral analysis of light received by the sensors (38) during grinding of a semiconductor wafer (12). Based on the spectral analysis, the gr...  
WO/2004/035263A2
Disclosed is a method for structuring the surface of profiles, floor coverings, and similar semifinished products by means of brushes. According to said method, brushes (1, 2, 9) are disposed next to and at a distance from each other per...  
WO/2004/036642A1
A semiconductor wafer protective device which enables a semiconductor wafer to be handled as required without damaging it even when its back is ground to much reduce its thickness, and a semiconductor wafer treatment method using this se...  
WO/2004/035262A1
The invention relates to the structural design of face grinding machines used for grinding the surface of a timber and cork flooring. Said invention makes it possible to simplify the structural design of the grinding machine, increase th...  
WO/2004/033149A1
A glass pane machining device (1) capable of disposing suction cups at positions most suitable for suckingly fixing a glass pane according to the shape of the glass pane, comprising a grinding means (7) for grinding the peripheral edges ...  
WO/2004/033148A1
A both side grinding technology for obtaining a work exhibiting excellent parallelism and flatness by detecting disorder in the attitude of a grinding wheel from the amount of deformation of a ground work. When cutting of grinding wheels...  
WO/2004/030862A1
The present invention relates to a mobile floor levelling vehicle (1) for levelling an undulating floor surface, whereby the floor levelling vehicle comprises a vehicle body (2) with a front side (20), a back side (21 ), a left side (23)...  
WO/2004/028744A1
A polishing pad is described having a window. The polishing pad comprises a first layer and a second layer. The first layer having an opening can function as the work surface or polishing layer of the pad. At least a portion of said seco...  
WO/2004/024406A2
A wood floor edger (100) is disclosed herein. An embodiment of the edger comprises a housing (104) a and a motor (110). The housing comprises an opening and a rotatable abrasive disc located in the opening. The rotatable abrasive disc ma...  
WO/2004/022283A1
An optical disk polishing device comprising a flange (24) for holding a polishing body (20), e.g. a sand paper, a backup material (21) interposed between the polishing body (20) and the flange (24), a rotary table (12) for holding a body...  
WO/2004/020146A1
Disclosed is a grinding machine comprising oscillating driving means (3, 4) for setting grinding means (1) into an oscillating grinding motion and an actuation device (7) that is provided with a plurality of actuation areas (8) which can...  
WO/2004/020148A1
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus includes a support member configured to releasably carry a microelectronic ...  
WO/2004/019388A1
A supporting substrate (10) having a flat supporting face is integrated with a semiconductor wafer W while supporting the surface thereof on the supporting face of the supporting substrate (10). The semiconductor wafer W integrated with ...  
WO/2004/014810A1
A glass pane processing device (1), comprising a cut line forming head (4) for forming cut lines (3) in a glass pane (2), a breaking means (5) for breaking the glass pane (2) with the cut lines (3) by bending along the cut lines (3), a g...  
WO/2004/013656A2
An improved method for producing a thin layer having highly uniform thickness, which layer may be pre-coated on an undulating surface of a substrate element. A working layer of the material is formed having a thickness greater than the f...  
WO/2004/010504A1
A method for processing an SOI substrate that has a back surface layer composed of a semiconductor substrate, an insulating layer disposed on the upper surface of the back surface layer, a semiconductor thin film layer disposed on the up...  
WO/2004/007147A1
A grinding wheel (11) is adapted to be mounted on a grinding apparatus for grinding a workpiece. The wheel comprises a plate (13) adapted for rotation about a rotation axis, a supply port extending through the plate for supplying a grind...  
WO/2004/003987A1
A contamination remover for removing contamination adhered to the peripheral portion of the back or front surface and the edge of a semiconductor wafer, comprising a holding means having a rotary table for holding a semiconductor wafer a...  
WO/2003/106107A1
A resurfacing pad (50) that adheres to a normal brake pad (40) of a braking assembly to resurface a braking surface (28) of a brake member (26), and then automatically permits continued functioning of the normal brake pad (40). The resur...  
WO/2003/106128A1
The invention relates to a method for the production of a precise concrete prefabricated part, especially the form of a sleeper or a plate (1) for a fixed track for rail-guided vehicles, wherein the concrete prefabricated part undergoes ...  
WO/2003/099461A1
Apparatus (10) and method for painting objects (11) equipped with a painting head (35) to paint the objects (11), and a movement member (12) to move the objects (11) through the painting head (35). The apparatus (10) comprises working me...  
WO/2003/097297A2
A spindle for tool heads used in calibrating, smoothing or polishing natural stone slabs and/or ceramic tiles, comprising: a tubular housing (3) in which the spindle body (12) is movable, the spindle body (12) including a shaft (31) carr...  
WO/2003/092956A1
A sanding machine (1; 300) comprising a support structure (2; 302) for the piece (3) to be processed and a sanding unit (4) for the piece (3) itself. The sanding unit (4) comprises a frame (40) that supports a winding element (8) coopera...  
WO2003041126A3
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution...  
WO/2003/090973A1
A workpiece surface machining head (5) comprises at least one machining tool (6), which comes into contact with the surface (2) to be machined and whose longitudinal axis (7) is oriented so that it essentially perpendicular to the surfac...  
WO/2003/089190A1
The wall polishing machine is suited for various room, outer wall and ceiling. The wall polishing machine has two kind modes, wherein large wall polishing machine has the functions of dust absorption and positioning. This machine can be ...  
WO2003041391A3
A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157).Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231) in a m...  
WO2003043076A3
Disclosed herein is a surface protective sheet for semiconductor wafer, used in wafer back grinding during a process comprising providing a wafer of predetermined thickness having a surface furnished with circuits and a back, forming gro...  
WO2002091433A3
The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer. The invention also relates to foils having said gradually polymerizable...  
WO/2003/085714A1
A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having an individual circuit. By interposing an adhesive sheet whose adhesive force is lowered by stimulation between th...  
WO/2003/085595A1
The invention provides an abrasive article (22, 122), and methods for the use and the manufacture of the article. The abrasive article comprises an abrasive surface (224); and a performance index associated with the abrasive article, the...  
WO/2003/076134A1
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces.One embodiment of an electrochemical processing apparatus (100) in accordance with the invention comprises a workpiece holder (120) configure...  
WO/2003/076131A1
The present invention relates to an arrangement in a mobile machine (1) for grinding floor surfaces, comprising a housing (1a), which is supported partly by two wheels (4, 5) and partly by a number of rotatably supported grinding disks (...  
WO/2003/075734A1
The invention relates to a device in a circular disk-shaped cleaning element intended for cleaning by means of a cleaning machine. The element is designed with a number of recesses (3) distributed over the active cleaning surface (2a) th...  
WO2003048712A3
Surface abrader apparatus (10) includes casing (12), motor (20) mounted on casing (12), working tools (16), and operating mechanism (18) mounted to casing (12) and supporting working tools (16) outside of casing (12). Operating mechanism...  
WO/2003/076132A1
A system for grinding a glass plate (1) comprising a grinding wheel (2), means (3) for rotating the grinding wheel (2), means (7) for jetting cooling liquid (6) from a part (P1) on the outer circumferential surface (5) of the grinding wh...  
WO/2003/072304A1
An automatic processing unit comprising a conveyor (1) extending through the automated processing unit and having a longitudinal direction and a transversal direction; and at least one working station located above the conveyor (1) for p...  

Matches 401 - 450 out of 7,116