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Patent Searching and Data


Matches 401 - 450 out of 7,243

Document Document Title
WO/2005/042873A1
This invention provides a large-scale wall polishing dresser which has functions of dust absorption and orientation, and which can produce a pressure only by a man operating the dresser so as to polish and burnish the wall, and this inve...  
WO2004103644A3
Embodiments of a hand manipulated tool includes an elongate handle and a tool support. The tool support has a center, rotationally fixed to the elongate handle. The tool support has a periphery with at least five points equidistant from ...  
WO/2005/032763A1
In a system and a method, according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to control a CMP system to compensate for a change in the condition...  
WO/2005/032766A1
A dressing method capable of dressing the grinding stone of a vertical duplex-head surface grinding machine without incorporating a special dressing device therein. The vertical duplex-head surface grinding machine comprises a pair of up...  
WO2005000543A3
Apparatus for cutting an industrial-size roll of paper or other sheet material into two or more rolls. The apparatus includes a circular saw with a radius large enough to cut through such a roll in a single cut, leaving press-ready rolls...  
WO/2005/031276A2
A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and...  
WO/2005/028156A1
The invention relates to an improved sander comprising a structure (61) which is equipped with a roof element (2), a coating (3), a control panel (4), screens (5) at the part inlet and outlet, a PVC roller (6), a front-end protective fra...  
WO/2005/025398A1
The invention relates to a wall-polishing and -brightening device. The inventive device comprises a cable (6) which is used to suspend the machine (1) at an adjustable height, said cable being associated with a weight regulator (5) which...  
WO2003097297A3
A spindle for tool heads used in calibrating, smoothing or polishing natural stone slabs and/or ceramic tiles, comprising: a tubular housing (3) in which the spindle body (12) is movable, the spindle body (12) including a shaft (31) carr...  
WO2004091856A3
A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perfo...  
WO/2005/018873A2
A manual sharpener for sharpening either right or left-handed blades of scissors or shears comprises a support structure (34) with an attached hand holding arrangement (25). A magnetic device (31) holds at least one adhesive pad (29) on ...  
WO2004108351A3
The invention concerns a device for abrading a wall of stone or concrete material. The invention comprises a shell (2) with which is operationally connected an abrading head (1), and a carriage intended to move at least along the surface...  
WO2004078441B1
A block texture-modifying apparatus (128) for modifying the surface texture of blocks. The apparatus (128) comprises a block support (12'), a block-texture-modifying assembly (130) and a translational movement assembly (132). The block s...  
WO2004108352A3
The invention concerns a carrier plate (2) holding an abrading element, for detachable mounting on a rotatably mounted abrading plate (1) driven during use, for abrading stone or concrete floors, which carrier plate (2) has sides (2a, 2b...  
WO/2005/001847A1
Machine tool to shave a surface over a predefined depth, by drawing in rotation against this surface, a cylinder (21) equipped with segments of shaving material (31). Each segment (31) extends longitudinally over the outer surface (29) o...  
WO/2005/000527A2
The invention is directed to a multi-layer polishing pad (10) for chemical-mechanical polishing comprising a polishing layer (12) and a bottom layer (14), wherein the polishing layer and bottom layer are joined together without the use o...  
WO/2005/000543A2
Apparatus for cutting an industrial-size roll of paper or other sheet material into two or more rolls. The apparatus includes a circular saw with a radius large enough to cut through such a roll in a single cut, leaving press-ready rolls...  
WO/2004/108352A2
The invention concerns a carrier plate (2) holding an abrading element, for detachable mounting on a rotatably mounted abrading plate (1) driven during use, for abrading stone or concrete floors, which carrier plate (2) has sides (2a, 2b...  
WO/2004/108351A2
The invention concerns a device for abrading a wall of stone or concrete material. The invention comprises a shell (2) with which is operationally connected an abrading head (1), and a carriage intended to move at least along the surface...  
WO/2004/107423A1
A method of producing a film-thinning circuit board, comprising the steps of (a) grooving a candidate penetration portion in the surface of a circuit board to at least a depth as much as the thickness of a final product, (b) attaching a ...  
WO/2004/107428A1
A production method for a semiconductor wafer capable of reducing fine surface undulations produced by wire-saw slicing or double-disc grinding by semi-fixed abrasive-grain grinding using free abrasive grains, and simplifying a conventio...  
WO/2004/105998A1
The invention relates to a floor sanding machine, comprising a frame and height-adjustable sanding plate, mounted on the above, beneath the same, for retaining a sanding disc, driven by a motor together with a vacuum turbine, with an ann...  
WO/2004/103644A2
Embodiments of a hand manipulated tool includes an elongate handle and a tool support. The tool support has a center, rotationally fixed to the elongate handle. The tool support has a periphery with at least five points equidistant from ...  
WO2004078441A3
A block texture-modifying apparatus (128) for modifying the surface texture of blocks. The apparatus (128) comprises a block support (12'), a block-texture-modifying assembly (130) and a translational movement assembly (132). The block s...  
WO/2004/098831A1
An abrading machine is disclosed for abrasion of substantially plane items by use of rotating abrading discs (5, 5'), which are moved simultaneously forwards and backward transverse to the item and which preferably has downward extending...  
WO2004078410A3
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wh...  
WO/2004/091856A2
A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perfo...  
WO2004035263A3
Disclosed is a method for structuring the surface of profiles, floor coverings, and similar semifinished products by means of brushes. According to said method, brushes (1, 2, 9) are disposed next to and at a distance from each other per...  
WO2003038882A8
A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of a...  
WO/2004/085114A1
A work tool comprising: a principle drive shaft (1) with a sun gear (2) attached thereto; at least two planetary gears (3) distributed about the circumference of the sun gear (2) at substantially equal angular separations; and a carriage...  
WO/2004/078441A2
A block texture-modifying apparatus (128) for modifying the surface texture of blocks. The apparatus (128) comprises a block support (12’), a block-texture-modifying assembly (130) and a translational movement assembly (132). The block...  
WO/2004/078413A1
A method of machining mechanical workpieces, in particular of machining the braking surfaces (2,3) of a brake disc (1) for vehicles is described and comprises the steps of loading the workpiece onto a work station (8) and clamping the wo...  
WO/2004/078410A2
An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wh...  
WO/2004/073924A1
A plate-like work polishing apparatus for polishing a thin plate-like work such as a printed circuit board material by buff rollers, comprising a guide member guiding the plate-like work passed through a clearance between the buff roller...  
WO2002094059A8
Methods and devices are provided for end rounding filaments for use on brushes. The devices include an air driven planetary gear system rotating a sanding wheel (202)through a varied elliptical path that attacks the filaments from all si...  
WO2004013656A3
An improved method for producing a thin layer having highly uniform thickness, which layer may be pre-coated on an undulating surface of a substrate element. A working layer of the material is formed having a thickness greater than the f...  
WO2004024406A3
A wood floor edger (100) is disclosed herein. An embodiment of the edger comprises a housing (104) a and a motor (110). The housing comprises an opening and a rotatable abrasive disc located in the opening. The rotatable abrasive disc ma...  
WO/2004/043647A1
An apparatus (10) for wafer grinding includes sensors (38) and a spectral analyzer to perform a spectral analysis of light received by the sensors (38) during grinding of a semiconductor wafer (12). Based on the spectral analysis, the gr...  
WO/2004/035263A2
Disclosed is a method for structuring the surface of profiles, floor coverings, and similar semifinished products by means of brushes. According to said method, brushes (1, 2, 9) are disposed next to and at a distance from each other per...  
WO/2004/036642A1
A semiconductor wafer protective device which enables a semiconductor wafer to be handled as required without damaging it even when its back is ground to much reduce its thickness, and a semiconductor wafer treatment method using this se...  
WO/2004/035262A1
The invention relates to the structural design of face grinding machines used for grinding the surface of a timber and cork flooring. Said invention makes it possible to simplify the structural design of the grinding machine, increase th...  
WO/2004/033149A1
A glass pane machining device (1) capable of disposing suction cups at positions most suitable for suckingly fixing a glass pane according to the shape of the glass pane, comprising a grinding means (7) for grinding the peripheral edges ...  
WO/2004/033148A1
A both side grinding technology for obtaining a work exhibiting excellent parallelism and flatness by detecting disorder in the attitude of a grinding wheel from the amount of deformation of a ground work. When cutting of grinding wheels...  
WO/2004/030862A1
The present invention relates to a mobile floor levelling vehicle (1) for levelling an undulating floor surface, whereby the floor levelling vehicle comprises a vehicle body (2) with a front side (20), a back side (21 ), a left side (23)...  
WO/2004/028744A1
A polishing pad is described having a window. The polishing pad comprises a first layer and a second layer. The first layer having an opening can function as the work surface or polishing layer of the pad. At least a portion of said seco...  
WO/2004/024406A2
A wood floor edger (100) is disclosed herein. An embodiment of the edger comprises a housing (104) a and a motor (110). The housing comprises an opening and a rotatable abrasive disc located in the opening. The rotatable abrasive disc ma...  
WO/2004/022283A1
An optical disk polishing device comprising a flange (24) for holding a polishing body (20), e.g. a sand paper, a backup material (21) interposed between the polishing body (20) and the flange (24), a rotary table (12) for holding a body...  
WO/2004/020146A1
Disclosed is a grinding machine comprising oscillating driving means (3, 4) for setting grinding means (1) into an oscillating grinding motion and an actuation device (7) that is provided with a plurality of actuation areas (8) which can...  
WO/2004/020148A1
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus includes a support member configured to releasably carry a microelectronic ...  
WO/2004/019388A1
A supporting substrate (10) having a flat supporting face is integrated with a semiconductor wafer W while supporting the surface thereof on the supporting face of the supporting substrate (10). The semiconductor wafer W integrated with ...  

Matches 401 - 450 out of 7,243