Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 401 - 450 out of 7,040

Document Document Title
WO/2003/097297A2
A spindle for tool heads used in calibrating, smoothing or polishing natural stone slabs and/or ceramic tiles, comprising: a tubular housing (3) in which the spindle body (12) is movable, the spindle body (12) including a shaft (31) carr...  
WO/2003/092956A1
A sanding machine (1; 300) comprising a support structure (2; 302) for the piece (3) to be processed and a sanding unit (4) for the piece (3) itself. The sanding unit (4) comprises a frame (40) that supports a winding element (8) coopera...  
WO/2003/090973A1
A workpiece surface machining head (5) comprises at least one machining tool (6), which comes into contact with the surface (2) to be machined and whose longitudinal axis (7) is oriented so that it essentially perpendicular to the surfac...  
WO/2003/089190A1
The wall polishing machine is suited for various room, outer wall and ceiling. The wall polishing machine has two kind modes, wherein large wall polishing machine has the functions of dust absorption and positioning. This machine can be ...  
WO/2003/085714A1
A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having an individual circuit. By interposing an adhesive sheet whose adhesive force is lowered by stimulation between th...  
WO/2003/085595A1
The invention provides an abrasive article (22, 122), and methods for the use and the manufacture of the article. The abrasive article comprises an abrasive surface (224); and a performance index associated with the abrasive article, the...  
WO/2003/076134A1
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces.One embodiment of an electrochemical processing apparatus (100) in accordance with the invention comprises a workpiece holder (120) configure...  
WO/2003/076131A1
The present invention relates to an arrangement in a mobile machine (1) for grinding floor surfaces, comprising a housing (1a), which is supported partly by two wheels (4, 5) and partly by a number of rotatably supported grinding disks (...  
WO/2003/075734A1
The invention relates to a device in a circular disk-shaped cleaning element intended for cleaning by means of a cleaning machine. The element is designed with a number of recesses (3) distributed over the active cleaning surface (2a) th...  
WO/2003/076132A1
A system for grinding a glass plate (1) comprising a grinding wheel (2), means (3) for rotating the grinding wheel (2), means (7) for jetting cooling liquid (6) from a part (P1) on the outer circumferential surface (5) of the grinding wh...  
WO/2003/072304A1
An automatic processing unit comprising a conveyor (1) extending through the automated processing unit and having a longitudinal direction and a transversal direction; and at least one working station located above the conveyor (1) for p...  
WO/2003/071592A1
A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid wh...  
WO/2003/070426A1
The invention relates to a device and a method for width-sanding sheet-type floor coverings and rubber printing bands that are uncoiled from cylinders and recoiled onto cylinders upon sanding. The material is repeatedly guided across a d...  
WO/2003/071593A1
A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid wh...  
WO/2003/065430A1
A method of processing, to a specified thickness, a semiconductor wafer having respective circuits formed in a plurality of areas obtained by partitioning the surface thereof by a plurality of streets, and having a coating layer formed o...  
WO/2003/059571A1
A planarization method includes providing a Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a fixed abrasive article in the presence of a planarization composition, wher...  
WO/2003/059576A1
An abrasive grain burying device (22), comprising pads (43) supported on a surface plate through flat surfaces (44) harder than the surface plate, wherein the pads (43) are supported on a support member (41) so that the attitudes thereof...  
WO/2003/060974A1
A grinder composed of at least a chuck table (17) having a suction region (1) and a frame (2) and grinding means (30) for grinding a semiconductor wafer (W) held on the chuck table (17) is used. When a semiconductor wafer (W) having an o...  
WO/2003/055642A1
A method of truing a grinding wheel capable of accurately truing the wheel surface of the grinding wheel in a short time in a grinding device having the conductive grinding wheel, comprising the steps of, when the flat annular grinding w...  
WO/2003/049900A1
A dry method of concrete floor or concrete surface restoration uses the process of grinding a concrete surface to be resurfaced while extracting and retaining dust during the grinding process. The grinding process is repeated each time u...  
WO/2003/048712A2
Surface abrader apparatus (10) includes casing (12), motor (20) mounted on casing (12), working tools (16), and operating mechanism (18) mounted to casing (12) and supporting working tools (16) outside of casing (12). Operating mechanism...  
WO/2003/046893A1
A system and method for treating (e.g. polishing to remove defects) the surface of a medium, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a ...  
WO/2003/043076A2
Disclosed herein is a surface protective sheet for semiconductor wafer, used in wafer back grinding during a process comprising providing a wafer of predetermined thickness having a surface furnished with circuits and a back, forming gro...  
WO/2003/041391A2
A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157).Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231) in a m...  
WO/2003/041126A2
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution...  
WO/2003/038882A1
A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of a...  
WO/2003/032799A1
Apparatus for treating a floor surface has a drive motor with a drive shaft rotatable on a rotation axis, and a drive assembly drivingly connected to the drive shaft for conjoint rotation therewith. A floor surface treatment device is re...  
WO/2003/028519A1
The invention concerns a method for sanitation of elastic floors covered with crosslinked polymeric systems, by treating the floors with an abrasive cleaning pad, with a solvent and a surfactant. The invention also concerns the agents an...  
WO/2003/028968A1
The facing machine for hard−fired ceramic tiles (1) comprises: a structure (23, 15) for supporting, and setting (17) the cutting depth of, at least one pair of rotary rollers at a grooving station (16), the axis of said rollers lying t...  
WO/2003/022522A1
A polishing device for polishing the flat surface part of a polished material (W) by a polishing tape (T), comprising a polishing device body having a tubular rotary drum (3) having a precisely finished outer peripheral surface, a tape r...  
WO/2003/013788A1
An apparatus for improving performance of a wafer polishing apparatus (10) is described. The apparatus includes a platen in a support assembly (28) having a plurality of fluid channels (34) and at least one region of altered topography (...  
WO/2003/011517A1
A wafer carrier (10) for use in polishing disks. The carrier (10) includes a main body (38) and an integral visual inspection wear indicator (40). The main body (38) has at least one opening (12) formed therein adapted to receive a disk....  
WO/2002/098591A2
A tool for the removal of paint and putty includes a semi-circular assembly (30) including a semi-circular rigid collar (22). The tool also includes a disk-like abrading assembly (16) rotatably and co-axially mounted within the semi-circ...  
WO/2002/094059A1
Methods and devices are provided for end rounding filaments for use on brushes. The devices include an air driven planetary gear system rotating a sanding wheel (202)through a varied elliptical path that attacks the filaments from all si...  
WO/2002/091433A2
The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer. The invention also relates to foils having said gradually polymerizable...  
WO/2002/089238A2
In a method of manufacturing a fluid diffusion layer for a solid polymer electrolyte fuel cell, a surface of the fluid diffusion layer is abraded so that the topography of the fluid diffusion layer surface is rendered more uniform. The f...  
WO/2002/089237A2
The present methods make fluid diffusion layers having reduced surface roughness. The methods used for adhering the loading material to the substrate surface can reduce the average surface roughness of the fluid diffusion layers, thereby...  
WO/2002/080639A1
A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring fil...  
WO/2002/072311A2
A reliable, inexpensive 'back side' thinning process, capable of globally thinning an integrated circuit die (4) to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the...  
WO/2002/070199A1
A device for repairing by polishing an optical disk, which can provide a proper, uniform pressure necessary for polishing, correct the planar parallelism precision of the rotation surfaces of an optical disk and a polishing sheet, elimin...  
WO/2002/070196A1
A method and an apparatus for machining the joint face of a work in which a joint face exhibiting high airtightness is provided by eliminating leakage due to streaks caused by abrasive grains. At the time of machining the joint face (15)...  
WO/2002/070194A1
Disclosed is a reel-to-reel single-pass mechanical polishing system (100) suitable for polishing long lengths of metal substrate tape (124) used in the manufacture of high-temperature superconductor (HTS) coated tape, including multiple ...  
WO/2002/062715A1
The present invention relates to methods and apparatus for removing coatings from generally opposed first and second major surfaces of a substrate. The method includes providing a table having a surface for slidable receipt of the substr...  
WO/2002/062524A1
The invention relates to an arrangement in a mobile machine for screeding floor surfaces. This comprises a housing with a planet disk (3), which is rotatably supported in the bottom of the said housing and driven by a drive motor (1). Th...  
WO/2002/062716A1
The invention provides a substrate (e.g., a glass pane) having generally opposed first and second major surfaces. At least one of these major surfaces bears a functional coating and has a peripheral region that is substantially free of t...  
WO/2002/053490A2
This colloidal silica soot is a byproduct of chemical vapor deposition processing of fused silica or ultra low expansion glasses. The colloidal silica byproduct is referred to as 'soot'. Retaining the same physical properties as the pare...  
WO/2002/054471A1
An apparatus and a method for abrading the outer circumferential part or the notched part of a semiconductor wafer with high accuracy. The apparatus A for abrading a semiconductor wafer comprises a mechanism for mounting a stack of semic...  
WO/2002/041392A2
An integrated circuit and manufacturing method therefor is provided having a semiconductor substrate with a semiconductor device. A device dielectric layer [216] is formed on the semiconductor substrate. A channel dielectric layer [208,2...  
WO/2002/032625A2
The invention provides abrasive articles (30) comprising: a backing (32) having a first major surface and a second major surface; and an abrasive coating (37) consisting essentially of: a hardened binder coating having a first surface ad...  
WO/2002/022308A1
A polishing pad and method, wherein surface dressing is made unnecessary, no deformation occurs with the lapse of working time, there is no clogging otherwise caused by abrasive grains or abraded chips, and the surface of a polish-object...  

Matches 401 - 450 out of 7,040