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Patent Searching and Data


Matches 401 - 450 out of 7,644

Document Document Title
WO2006061172A3
The invention relates to a device for polishing hard surfaces, especially glass surfaces, said device comprising a polishing system (5) provided with a replaceable polishing disk (6). Said polishing system (5) can be displaced in a two-d...  
WO2005067663A3
A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of th...  
WO/2006/071651A2
Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a...  
WO/2006/071651A3
Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a...  
WO/2006/065498A1
A face grinder assembly is disclosed for removing irregularities from tire. The face grinder assembly includes an outer frame and a slide frame slidably attached to the outer frame. The slide frame is capable of vertical movement relativ...  
WO/2006/061910A1
A method for setting the initial position of a whetstone before starting grinding in a vertical duplex surface grinding machine for surface grinding the upper and lower grinding surfaces of a work simultaneously by rotation-driving a pai...  
WO/2006/061172A2
The invention relates to a device for polishing hard surfaces, especially glass surfaces, said device comprising a polishing system (5) provided with a replaceable polishing disk (6). Said polishing system (5) can be displaced in a two-d...  
WO2006041530A3
A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work...  
WO2005072338A3
An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slu...  
WO/2006/053057A1
An autocollimator is relied upon to orient an electronic die such that its frontside is parallel to a polishing surface. The polishing device is configured such that a beam of light that is projected by the autocollimator is able to refl...  
WO/2006/053138A2
A chamfering tool (20) adapted to mount on a handheld grinder(l O), the grinder having a guard (14) and the grinder having a grinding face (12). The chamfering tool includes a fixed mount (44), to be attached to the guard on the handheld...  
WO2005113198A3
A cleaning element (36) for a cement floor surface mounted to a housing (32). Each cleaning element has a flat flexible abrasive surface (39) that is transversely positioned to the direction of motion to provide flex during cleaning of a...  
WO/2006/043605A1
A grinding apparatus and a manufacturing method for a power transmission chain pin, wherein a peripheral groove (5a) is formed in a disk-like grinding wheel (5), and its both side walls are formed in grinding surfaces (5b), and a load pi...  
WO/2006/043928A1
A conditioner disk (200) for use on a polishing pad (32) in chemical mechanical polishing process includes a base structure (210), a plurality of blades (220) supported by the base structure (210). The blades (220) radiate radially and t...  
WO/2006/041530A2
A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work...  
WO/2006/040636A1
An edge sanding apparatus for sanding a supporting surface in accordance with the present invention includes an elongated frame including a handle-mounting shaft and a carriage portion. The shaft is operatively, pivotally connected to th...  
WO/2006/031475A1
An abrasive article (1) for use on a rotary cleaning machine having, on one side, a first abrasive face (2) having a first abrasive nature and, on the other side, a second abrasive face having a second abrasive nature different from the ...  
WO/2006/026625A3
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the...  
WO/2006/009222A1
A detector for detecting the cracking sound of plate glass under polishing while discriminating it from the cracking sound of other plate glass. More specifically, sounds are collected by a microphone (30) and high frequency sounds are e...  
WO/2006/007554A2
The present invention incorporates at least one thermoplastic or elastomeric polymer in abrasive flow machining media either as the sole or as one of the polymeric constituents. The presence of thermoplastic polymer imparts a greater ela...  
WO/2005/120776A1
A material removal optimizing system for a wood surface treating apparatus with a plurality of individual work stations (15, 16, 17,18) arranged serially along an endless conveyor. Each station includes a working abrasive head (27, 28, 2...  
WO/2005/117665A1
A granite tile for forming an inside corner of a countertop is provided, comprising a first surface adapted to act as part of a counter top; a second surface for securing to a base; a front edge, said front edge sized to extend past and ...  
WO/2005/118111A1
The invention relates to a device for collecting particles by means of a first filter arrangement (2, 2') comprising a cyclone device (10) with a coarse filter unit (12) and a microfilter unit (24). The cyclone device (10) has a first va...  
WO2004085114A8
A work tool comprising: a principle drive shaft (1) with a sun gear (2) attached thereto; at least two planetary gears (3) distributed about the circumference of the sun gear (2) at substantially equal angular separations; and a carriage...  
WO/2005/113198A2
A cleaning element (36) for a cement floor surface mounted to a housing (32). Each cleaning element has a flat flexible abrasive surface (39) that is transversely positioned to the direction of motion to provide flex during cleaning of a...  
WO/2005/110677A1
Machine (10) for finishing an object (11) comprising feed members (20, 120, 220, 320, 420) to feed the object (11) along a reference plane (P1), and at least a work station (13, 15) provided with a tool (17) which contacts the object (11...  
WO2005018873A3
A manual sharpener for sharpening either right or left-handed blades of scissors or shears comprises a support structure (34) with an attached hand holding arrangement (25). A magnetic device (31) holds at least one adhesive pad (29) on ...  
WO/2005/095054A1
A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for rece...  
WO/2005/087470A1
The facing machine for large plates of natural stone, e.g. granite and hard stone slabs, comprises: a pair of rollers driven rotatively about a transverse axis to the slab direction of advance and mounted at a work surface grooving stati...  
WO2005050895A3
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rins...  
WO/2005/082575A1
A rotary surface plate for lapping machines in which a plurality of strip-like grindstone pieces (12) in sector form adhesively joined to and carried by the surface of an annular carrier (14) are disposed two-dimensionally substantially ...  
WO/2005/080476A1
The present invention belongs to the technical field of surface modifying of solid materiale. Specifically, it relates to a method of changing the surface wettability of polymer materials. Said method of changing the surface wettability ...  
WO/2005/077599A1
A finishing machine (1) for finishing a work surface (20) which consists of a floor of terrazzo, marble, stone, concrete or the like, comprises at least two finishing units (3a, 4a; 3b, 4b; 3c, 4c, 300) which are supported by the frame (...  
WO/2005/075147A1
A sanding apparatus for sanding a support surface includes an elongated frame having a handle end. and a work end. The handle end is arranged for operator control and the work end is adapted for connection to a working device. The sandin...  
WO/2005/070620A1
[PROBLEMS] A double-end surface grinding machine capable of further enhancing flatness of ground work surface by eliminating concentric undulations occurring on the work surface by grinding. [MEANS FOR SOLVING PROBLEMS] A pair of support...  
WO/2005/070619A1
A method of grinding the opposite surfaces of a wafer one surface at a time by using a cup-type grinding stone, the method characterized by comprising the steps of, when first one surface of the wafer is ground, allowing the grinding sto...  
WO/2005/063430A1
An improved sanding block (14) for sanding high and extended surfaces configured for use in combination with an attached pole (12). The sanding block (14) is round in shape and is rotationally mounted on a pole mount (16), that interface...  
WO/2005/060810A1
The present invention discloses a disposable scrubbing product for use in household cleaning or personal care applications. The scrubbing product (330) of the invention is a multi-layer laminate product and generally includes at least tw...  
WO/2005/061178A1
A method of polishing a surface (120) of an article, e.g., a semiconductor wafer (112, 212), using a polishing layer (108, 208) in the presence of a polishing medium such as a slurry (116). The method includes selecting the rotational ra...  
WO/2005/058544A1
The invention relates to a method for surface working of a body (2) having a first surface (2.1) to be worked and a second surface (2.2) to be worked. The method comprises, in a first step, providing a first tool (3.1) and a second tool ...  
WO/2005/056234A1
The present invention concerns a grinding apparatus (1) for processing a workpiece (20), including a support arrangement (4) for a number of grinding heads (6) that each includes a grinding element (2) and a grinding motor (3) driving an...  
WO/2005/053902A1
The present invention concerns a grinding apparatus (1) including a number of grinding units (3), a number of drive units (11) and a number of screen units (2), where a number of the grinding units (3) are enclosed by at least one of the...  
WO/2005/053017A1
Provided are a semiconductor surface protecting method and surface protecting sheet employing a material having adequate conformability for irregularities on semiconductor wafer circuit sides and sufficient rigidity as a support during g...  
WO/2005/051596A1
A grinding machine comprises a base, a wheelhead (10) with grinding wheel (12) and wheel drive mounted thereon, a workholder (22,23,36) and drive means for rotating a workpiece mounted therein about at least one axis (24), workholder dri...  
WO2005000527A3
The invention is directed to a multi-layer polishing pad (10) for chemical-mechanical polishing comprising a polishing layer (12) and a bottom layer (14), wherein the polishing layer and bottom layer are joined together without the use o...  
WO/2005/050895A2
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rins...  
WO2005031276A3
A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and...  
WO/2005/046872A1
A system (100) for processing a conductive surface on a wafer comprises an electrochemical mechanical processing (ECMPR) module (106) configured to form a substantially planarized conductive layer on the front surface of the wafer, a cha...  
WO/2005/042873A1
This invention provides a large-scale wall polishing dresser which has functions of dust absorption and orientation, and which can produce a pressure only by a man operating the dresser so as to polish and burnish the wall, and this inve...  
WO2004103644A3
Embodiments of a hand manipulated tool includes an elongate handle and a tool support. The tool support has a center, rotationally fixed to the elongate handle. The tool support has a periphery with at least five points equidistant from ...  

Matches 401 - 450 out of 7,644