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Patent Searching and Data


Matches 401 - 450 out of 8,061

Document Document Title
WO/2007/081886A3
Methods and systems for marring fiber optic substrates may include rollers with abrasive surfaces that press lengths of the substrates against elongated supports, which may be tapered, during relative lengthwise movement between the roll...  
WO/2007/078736A3
An apparatus for edge processing of a glass sheet, the apparatus including a shroud, a finishing member and a wiping device. The finishing member is substantially enclosed by the shroud. The apparatus uses pressurized air emitted by at l...  
WO/2007/078046A1
A grinding head for a stone grinding machine is disclosed. The grinding head includes a motor installed to a movable frame; a revolving rotary shaft connected to the motor; a gear box fixed to the revolving rotary shaft so that the gear ...  
WO/2007/072273A2
The invention relates to a grinding tool for natural stone floors, artificial stone floors and industrial soils, said grinding tool permitting a greatest possible adaptation to the unevennesses of worn natural and artificial stone floors...  
WO/2007/072273A3
The invention relates to a grinding tool for natural stone floors, artificial stone floors and industrial soils, said grinding tool permitting a greatest possible adaptation to the unevennesses of worn natural and artificial stone floors...  
WO/2007/069476A1
A method for reusing a used card incorporating a recording medium. A card treating apparatus (1) principally has a conveyor (2) having at the upstream end a section (3) for containing cards to be treated and the conveyor (2) also having ...  
WO/2007/066457A1
In a double side grinding machine for semiconductor wafers, static pressure pads contactlessly support a source wafer at both surfaces of the source wafer by the static pressure of a fluid supplied to both surfaces of the source wafer. T...  
WO/2007/054125A1
A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser a...  
WO/2007/044343A3
A planetary drive head for treating floors having a hub that rotates in one direction and attached media gears that rotate in the opposite direction.  
WO/2007/041191A3
A modified truncated cone-shaped disk is molded onto a plastic hub which is mounted on a motor driven shaft. The hub has an axial bore of a size to fit with very close clearance on the shaft while still permitting the disk to freely slid...  
WO/2007/040556A1
A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main rad...  
WO/2007/041191A2
A modified truncated cone-shaped disk is molded onto a plastic hub which is mounted on a motor driven shaft. The hub has an axial bore of a size to fit with very close clearance on the shaft while still permitting the disk to freely slid...  
WO/2007/038647A2
In a first aspect, an apparatus is provided for coupling a semiconductor device manufacturing tool to facilities. The apparatus includes (1) a docking station adapted to mount to a raised floor and having a thickness approximately equal ...  
WO/2007/036845A1
The present invention finds application in the processing of stones and the like and particularly relates to a machine tool for surface processing of slabs or products having a flat surface of stone material or the like, which machine co...  
WO/2007/030347A3
A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungr...  
WO/2007/030348A2
A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/...  
WO/2007/030779A2
An apparatus and method for polishing objects, such as semiconductor wafers, uses at least one object cleaner, which may be a movable object cleaner. The movable object cleaner allows access to different parts of the apparatus for mainte...  
WO/2007/030347A2
A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungr...  
WO/2007/027486A3
The present invention provides a method of conditioning processing pads for use in processes such as electrochemical mechanical polishing. A processing pad is provided to perform the polishing, and a conditioning disc is provided to cond...  
WO/2007/025226A1
A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a ...  
WO/2007/021191A2
A floor treating machine, comprising a frame (20), a housing (8) which is attached to the frame in such a manner that said housing is rotatable about a substantially vertical axis, at least three heads (10) attached to the housing in suc...  
WO/2007/021191A3
A floor treating machine, comprising a frame (20), a housing (8) which is attached to the frame in such a manner that said housing is rotatable about a substantially vertical axis, at least three heads (10) attached to the housing in suc...  
WO/2007/015163A1
A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is performed while appropriately adjusting t...  
WO/2007/015322A1
A device (1) for processing braking surfaces of a brake disk has a rotation drive device (11) for rotating the brake disk (2), a processing section (12) for processing braking surfaces (4, 5) of the brake disk (2), and pressing rollers (...  
WO/2007/014732A2
The invention relates to improved glass substrates, particularly for manufacturing TFT displays. To this end, the invention provides a method for subsequently treating sheet glass substrates, particularly sheet glass substrates for manuf...  
WO/2007/014732A3
The invention relates to improved glass substrates, particularly for manufacturing TFT displays. To this end, the invention provides a method for subsequently treating sheet glass substrates, particularly sheet glass substrates for manuf...  
WO/2007/011289A1
The invention relates to a device (1) for the detachable fastening of a number of holding plates for carrying grinding elements on a rotatably driven grinding plate (4) for floors or similar surfaces. According to the invention, radial (...  
WO/2007/005326A3
A system for abrading skin to remove outer portions thereof includes an apparatus having a skin abrading head with a head portion and a skin abrading brush. The outer head portion has a rim for placement in contact with the skin along wi...  
WO2006053138A3
A chamfering tool (20) adapted to mount on a handheld grinder(l O), the grinder having a guard (14) and the grinder having a grinding face (12). The chamfering tool includes a fixed mount (44), to be attached to the guard on the handheld...  
WO/2006/124608A2
A sharpening apparatus (100) for razors includes a blade sharpener rotatably supported within a housing (1) and driven by mechanical activation or a motor (20). An opening in the housing provides access to the blade sharpener for a blade...  
WO/2006/124792A3
A cutting device (10) comprises a base (12) having a working side (14) that is oriented to face a workpiece (19) from which material is to be removed. A plurality of individual cutting elements (16) are arranged on the working side of th...  
WO/2006/124563A3
A platform is designed to support thin flat substrates, such as semiconductor wafers, during observation of characteristics of the substrates . The platform includes a rigid base having a top surface. A resilient pad is supported on the ...  
WO/2006/119518A1
A floor sanding machine (1) has a frame (1) which carries on its underside a motor-driven, vertically adjustable sanding plate (4) with a sanding disk, an annular dust suction nozzle (11) which surrounds the sanding plate, and two front ...  
WO2006097141B1
A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on ...  
WO/2006/115924A1
The invention is directed to a multi-layer polishing pad (10) for chemical- mechanical polishing comprising a porous polishing layer (12) and a porous bottom layer (14) , wherein the bottom layer (14) is substantially coextensive with th...  
WO/2006/112610A1
A dry remover for removing a neutralization layer and a coating layer on a surface of a concrete structure includes a housing, a motor provided in the housing, a transmission unit for transmitting a driving force of the motor, and a cutt...  
WO/2006/110224A2
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrol...  
WO/2006/110224A3
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrol...  
WO/2006/107111A1
A precision machining method capable of accurately performing grinding. The method comprises a first step for manufacturing an intermediate ground body by roughly grinding a ground body (a) with a diamond grinding wheel (b) and a second ...  
WO/2006/106710A1
In a bonded wafer manufacturing method, at least a bonded wafer is provided by bonding a base wafer to be a supporting substrate with a bond wafer composed of silicon single crystal through an insulating film or directly, the bond wafer ...  
WO/2006/101281A1
The present invention relates to a polishing apparatus for an optical fiber connector, and more particularly, to a polishing apparatus capable of revolving and rotating a polishing disk while constantly maintaining a ratio of revolution ...  
WO/2006/102133A3
A dressing device (10,90) for sharpening or conditioning of a blade (18) or the like includes one or more disk pairs (36-40,108), each having a pair of disks (52,54,110,112) respectively presenting a series of circumferentially spaced, p...  
WO2006007554A3
The present invention incorporates at least one thermoplastic or elastomeric polymer in abrasive flow machining media either as the sole or as one of the polymeric constituents. The presence of thermoplastic polymer imparts a greater ela...  
WO/2006/097141A1
A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on ...  
WO/2006/092568A1
A machining spindle comprising an inner shaft (3) arranged for carrying a first tool (32) for machining a workpiece and an outer shaft (2) arranged for carrying a second tool (22) for machining the workpiece, the shafts being mounted for...  
WO/2006/092138A1
The present invention concerns an apparatus (1), preferably for grinding a surface, including at least one grinding unit, a screen (2, 3) and a guide member (5), where the grinding unit is a rotatable and preferably horizontally arranged...  
WO/2006/090561A1
A glass substrate positioning apparatus is provided with a catching member (3) which can abut to one side (2a (2c)) of a glass substrate (2); and a pressing member (4) which can abut to other side (2b(2d)) parallel to the side (2a(2c)) a...  
WO/2006/084395A1
The invention relates to a wide-wheel grinding machine comprising a machine-tool bed (1) which is embodied in the form of a hybrid-bed and consists of profiled metal parts and a mineral cast, wherein said mineral cast fills at least part...  
WO/2006/081286A2
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing...  
WO/2006/081538A1
A tool that is designed to cut very hard material using a reciprocating saw. The tool is a rasp made of tungsten carbide that not only cuts into masonry work and other hard materials, but also is capable of not breaking or bending while ...  

Matches 401 - 450 out of 8,061