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Patent Searching and Data


Matches 401 - 450 out of 4,003

Document Document Title
WO/2003/041391
A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157).Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231) in a m...  
WO/2003/041126
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution...  
WO/2003/038882
A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of a...  
WO/2003/032799
Apparatus for treating a floor surface has a drive motor with a drive shaft rotatable on a rotation axis, and a drive assembly drivingly connected to the drive shaft for conjoint rotation therewith. A floor surface treatment device is re...  
WO/2003/028519
The invention concerns a method for sanitation of elastic floors covered with crosslinked polymeric systems, by treating the floors with an abrasive cleaning pad, with a solvent and a surfactant. The invention also concerns the agents an...  
WO/2003/028968
The facing machine for hard−fired ceramic tiles (1) comprises: a structure (23, 15) for supporting, and setting (17) the cutting depth of, at least one pair of rotary rollers at a grooving station (16), the axis of said rollers lying t...  
WO/2003/022522
A polishing device for polishing the flat surface part of a polished material (W) by a polishing tape (T), comprising a polishing device body having a tubular rotary drum (3) having a precisely finished outer peripheral surface, a tape r...  
WO/2003/013788
An apparatus for improving performance of a wafer polishing apparatus (10) is described. The apparatus includes a platen in a support assembly (28) having a plurality of fluid channels (34) and at least one region of altered topography (...  
WO/2003/011517
A wafer carrier (10) for use in polishing disks. The carrier (10) includes a main body (38) and an integral visual inspection wear indicator (40). The main body (38) has at least one opening (12) formed therein adapted to receive a disk....  
WO/2002/098591
A tool for the removal of paint and putty includes a semi-circular assembly (30) including a semi-circular rigid collar (22). The tool also includes a disk-like abrading assembly (16) rotatably and co-axially mounted within the semi-circ...  
WO/2002/094059
Methods and devices are provided for end rounding filaments for use on brushes. The devices include an air driven planetary gear system rotating a sanding wheel (202)through a varied elliptical path that attacks the filaments from all si...  
WO/2002/091433
The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer. The invention also relates to foils having said gradually polymerizable...  
WO/2002/089238
In a method of manufacturing a fluid diffusion layer for a solid polymer electrolyte fuel cell, a surface of the fluid diffusion layer is abraded so that the topography of the fluid diffusion layer surface is rendered more uniform. The f...  
WO/2002/089237
The present methods make fluid diffusion layers having reduced surface roughness. The methods used for adhering the loading material to the substrate surface can reduce the average surface roughness of the fluid diffusion layers, thereby...  
WO/2002/080639
A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring fil...  
WO/2002/072311
A reliable, inexpensive 'back side' thinning process, capable of globally thinning an integrated circuit die (4) to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the...  
WO/2002/070199
A device for repairing by polishing an optical disk, which can provide a proper, uniform pressure necessary for polishing, correct the planar parallelism precision of the rotation surfaces of an optical disk and a polishing sheet, elimin...  
WO/2002/070196
A method and an apparatus for machining the joint face of a work in which a joint face exhibiting high airtightness is provided by eliminating leakage due to streaks caused by abrasive grains. At the time of machining the joint face (15)...  
WO/2002/070194
Disclosed is a reel-to-reel single-pass mechanical polishing system (100) suitable for polishing long lengths of metal substrate tape (124) used in the manufacture of high-temperature superconductor (HTS) coated tape, including multiple ...  
WO/2002/062715
The present invention relates to methods and apparatus for removing coatings from generally opposed first and second major surfaces of a substrate. The method includes providing a table having a surface for slidable receipt of the substr...  
WO/2002/062524
The invention relates to an arrangement in a mobile machine for screeding floor surfaces. This comprises a housing with a planet disk (3), which is rotatably supported in the bottom of the said housing and driven by a drive motor (1). Th...  
WO/2002/062716
The invention provides a substrate (e.g., a glass pane) having generally opposed first and second major surfaces. At least one of these major surfaces bears a functional coating and has a peripheral region that is substantially free of t...  
WO/2002/053490
This colloidal silica soot is a byproduct of chemical vapor deposition processing of fused silica or ultra low expansion glasses. The colloidal silica byproduct is referred to as 'soot'. Retaining the same physical properties as the pare...  
WO/2002/054471
An apparatus and a method for abrading the outer circumferential part or the notched part of a semiconductor wafer with high accuracy. The apparatus A for abrading a semiconductor wafer comprises a mechanism for mounting a stack of semic...  
WO/2002/041392
An integrated circuit and manufacturing method therefor is provided having a semiconductor substrate with a semiconductor device. A device dielectric layer [216] is formed on the semiconductor substrate. A channel dielectric layer [208,2...  
WO/2002/022308
A polishing pad and method, wherein surface dressing is made unnecessary, no deformation occurs with the lapse of working time, there is no clogging otherwise caused by abrasive grains or abraded chips, and the surface of a polish-object...  
WO/2002/004170
An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding ...  
WO/2002/002272
A chemical mechanical polishing (CMP) apparatus (200) is provided. A first roller (212a) is situated at a first point and a second roller (212b) situated at a second point, such that the first point is separate from the second point. A p...  
WO/2001/094072
An apparatus (10) for grinding and/or polishing a surface of a wall element includes a first elongate guide device (30) oriented substantially parallel to the surface of the wall element. A second elongate guide device (36) is movably co...  
WO/2001/089766
The invention relates to a method for grinding metallic workpieces containing, in particular, nickel, whereby a rotationally driven grinding wheel (2) is continuously dressed by a rotationally driven dressing wheel (3) during the grindin...  
WO/2001/088970
A method for thinning a semiconductor wafer having a semiconductor element (2) on its surface, by polishing the back thereof. This method comprises bonding the surface of the semiconductor wafer (1) to a support (4) through an adhesive l...  
WO/2001/087540
A floor-treating machine comprises a frame (2) with actuating means (10), a housing (3), which is attached to the frame in such a manner that it can rotate about a substantially vertical axis and in which at least three heads (7), which ...  
WO/2001/085392
A two-step chemical mechanical polishing (CMP) process is provided to minimize (reduce) dishing of metal lines (17) in trenches in an insulation (oxide) layer (12) of each of a plurality of semiconductor wafers during fabrication thereof...  
WO/2001/083165
The present invention relates to an apparatus (1) for mechanically treating a surface, in particular milling, scouring, grinding and/or polishing the same, using a treatment device (3-9) which rotates about a horizontal axis, which treat...  
WO/2001/083163
A method of polishing and cleaning a glass surface with a single abrasive article (13, 13'). The abrasive article (13, 13') includes ceria abrasive particles dispersed in binder, the abrasive article having a textured, three-dimensional ...  
WO/2001/083166
The present invention is a fixed abrasive article (10) for grinding or polishing the surface of a glass workpiece. The abrasive article (10) for grinding glass has abrasive composites (11) containing agglomerates having diamond particles...  
WO/2001/082356
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the microelectronic substrate is engaged with a planarizing medium that includes a planarizing pad and a planarizing liquid, at least one of which inc...  
WO/2001/076820
The invention relates to a device for machining workpieces, in particular for finishing metal or ceramic mass-produced parts comprising small components and for machining, using micro-tools. Said device comprises a housing (1), a drive b...  
WO/2001/072472
A carrier head (100) for a chemical mechanical polishing apparatus includes a flexible membrane (150) that applies a load to a substrate. The substrate backing assembly (112) includes an internal membrane (150), an external membrane (152...  
WO/2001/070457
The present invention provides exemplary cluster tool systems and methods for processing wafers, including exemplary double side polishing (DSP) and grind polishing systems and methods. One DSP system includes a first plate (710) having ...  
WO/2001/070458
A machine for surface working flat ceramic products comprises an operating head comprising tool means (10) suitable for working an external surface of said products (6), cooling conduit means (38, 40, 41, 42, 44, 46) arranged for cooling...  
WO/2001/071730
The present invention provides systems and methods for grinding wafers for use in manufacturing semiconductor devices. The methods include grinding a semiconductor wafer (318) such that the grind pattern on the wafer is less than ten mic...  
WO/2001/070454
The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing a wafer having initial thickness variations between two wafer surfaces. Thw wafe...  
WO/2001/068320
The polishing machine for stone materials comprises: a conveyor belt (2) for the slabs or strips to be polished, a beam (7) made to oscillate on at least two transverse, fixed frames (4, 5) above the said conveyor, at least one oscillati...  
WO/2001/066303
The inventive method is carried out by means of a software-controlled machine tool (1) and a tool whose surface (6) is provided with cutting grains projected from a binding material of the same height. The inventive method makes it possi...  
WO/2001/040138
A porous silicon carbide sintered compact which comprises a structure being composed of silicon carbide crystals (21, 22) and having open pores (23) present therein, wherein the carbide crystals have an average particle diameter of 20 $g...  
WO/2001/036153
A method for the precision two-side machining of flat articles consists of the following: A working displacement 'S' of a workpiece (3) into a machining area takes place between the cutting parts of two rotating abrasive diamond tools (1...  
WO/2001/036152
A machine tool for polishing flat articles comprises a bed (1) with two vertical columns (C2) and a table (3) arranged between (C2) has a rotating faceplate (P4) that is provided with a plate (5) with vacuum holders (6). The machine tool...  
WO/2001/036154
A method for precision two-sided machining of flat articles consisting in the following: a workpiece which is based at least on three points is introduced into a machining area between oppositely situated cutting elements of diamond tool...  
WO/2001/022484
A method of efficiently manufacturing a semiconductor wafer having high planarity from a wafer which has passed a surface-grinding process. Low planarity at the center, its vicinity, and the outer periphery of a surface-ground wafer is s...  

Matches 401 - 450 out of 4,003