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Patent Searching and Data


Matches 401 - 450 out of 7,915

Document Document Title
WO/2007/030347A3
A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungr...  
WO/2007/030348A2
A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/...  
WO/2007/030779A2
An apparatus and method for polishing objects, such as semiconductor wafers, uses at least one object cleaner, which may be a movable object cleaner. The movable object cleaner allows access to different parts of the apparatus for mainte...  
WO/2007/030347A2
A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungr...  
WO/2007/027486A3
The present invention provides a method of conditioning processing pads for use in processes such as electrochemical mechanical polishing. A processing pad is provided to perform the polishing, and a conditioning disc is provided to cond...  
WO/2007/025226A1
A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a ...  
WO/2007/021191A2
A floor treating machine, comprising a frame (20), a housing (8) which is attached to the frame in such a manner that said housing is rotatable about a substantially vertical axis, at least three heads (10) attached to the housing in suc...  
WO/2007/021191A3
A floor treating machine, comprising a frame (20), a housing (8) which is attached to the frame in such a manner that said housing is rotatable about a substantially vertical axis, at least three heads (10) attached to the housing in suc...  
WO/2007/015163A1
A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is performed while appropriately adjusting t...  
WO/2007/015322A1
A device (1) for processing braking surfaces of a brake disk has a rotation drive device (11) for rotating the brake disk (2), a processing section (12) for processing braking surfaces (4, 5) of the brake disk (2), and pressing rollers (...  
WO/2007/014732A2
The invention relates to improved glass substrates, particularly for manufacturing TFT displays. To this end, the invention provides a method for subsequently treating sheet glass substrates, particularly sheet glass substrates for manuf...  
WO/2007/014732A3
The invention relates to improved glass substrates, particularly for manufacturing TFT displays. To this end, the invention provides a method for subsequently treating sheet glass substrates, particularly sheet glass substrates for manuf...  
WO/2007/011289A1
The invention relates to a device (1) for the detachable fastening of a number of holding plates for carrying grinding elements on a rotatably driven grinding plate (4) for floors or similar surfaces. According to the invention, radial (...  
WO/2007/005326A3
A system for abrading skin to remove outer portions thereof includes an apparatus having a skin abrading head with a head portion and a skin abrading brush. The outer head portion has a rim for placement in contact with the skin along wi...  
WO2006053138A3
A chamfering tool (20) adapted to mount on a handheld grinder(l O), the grinder having a guard (14) and the grinder having a grinding face (12). The chamfering tool includes a fixed mount (44), to be attached to the guard on the handheld...  
WO/2006/124608A2
A sharpening apparatus (100) for razors includes a blade sharpener rotatably supported within a housing (1) and driven by mechanical activation or a motor (20). An opening in the housing provides access to the blade sharpener for a blade...  
WO/2006/124792A3
A cutting device (10) comprises a base (12) having a working side (14) that is oriented to face a workpiece (19) from which material is to be removed. A plurality of individual cutting elements (16) are arranged on the working side of th...  
WO/2006/124563A3
A platform is designed to support thin flat substrates, such as semiconductor wafers, during observation of characteristics of the substrates . The platform includes a rigid base having a top surface. A resilient pad is supported on the ...  
WO/2006/119518A1
A floor sanding machine (1) has a frame (1) which carries on its underside a motor-driven, vertically adjustable sanding plate (4) with a sanding disk, an annular dust suction nozzle (11) which surrounds the sanding plate, and two front ...  
WO2006097141B1
A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on ...  
WO/2006/115924A1
The invention is directed to a multi-layer polishing pad (10) for chemical- mechanical polishing comprising a porous polishing layer (12) and a porous bottom layer (14) , wherein the bottom layer (14) is substantially coextensive with th...  
WO/2006/112610A1
A dry remover for removing a neutralization layer and a coating layer on a surface of a concrete structure includes a housing, a motor provided in the housing, a transmission unit for transmitting a driving force of the motor, and a cutt...  
WO/2006/110224A2
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrol...  
WO/2006/110224A3
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrol...  
WO/2006/107111A1
A precision machining method capable of accurately performing grinding. The method comprises a first step for manufacturing an intermediate ground body by roughly grinding a ground body (a) with a diamond grinding wheel (b) and a second ...  
WO/2006/106710A1
In a bonded wafer manufacturing method, at least a bonded wafer is provided by bonding a base wafer to be a supporting substrate with a bond wafer composed of silicon single crystal through an insulating film or directly, the bond wafer ...  
WO/2006/101281A1
The present invention relates to a polishing apparatus for an optical fiber connector, and more particularly, to a polishing apparatus capable of revolving and rotating a polishing disk while constantly maintaining a ratio of revolution ...  
WO/2006/102133A3
A dressing device (10,90) for sharpening or conditioning of a blade (18) or the like includes one or more disk pairs (36-40,108), each having a pair of disks (52,54,110,112) respectively presenting a series of circumferentially spaced, p...  
WO2006007554A3
The present invention incorporates at least one thermoplastic or elastomeric polymer in abrasive flow machining media either as the sole or as one of the polymeric constituents. The presence of thermoplastic polymer imparts a greater ela...  
WO/2006/097141A1
A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on ...  
WO/2006/092568A1
A machining spindle comprising an inner shaft (3) arranged for carrying a first tool (32) for machining a workpiece and an outer shaft (2) arranged for carrying a second tool (22) for machining the workpiece, the shafts being mounted for...  
WO/2006/092138A1
The present invention concerns an apparatus (1), preferably for grinding a surface, including at least one grinding unit, a screen (2, 3) and a guide member (5), where the grinding unit is a rotatable and preferably horizontally arranged...  
WO/2006/090561A1
A glass substrate positioning apparatus is provided with a catching member (3) which can abut to one side (2a (2c)) of a glass substrate (2); and a pressing member (4) which can abut to other side (2b(2d)) parallel to the side (2a(2c)) a...  
WO/2006/084395A1
The invention relates to a wide-wheel grinding machine comprising a machine-tool bed (1) which is embodied in the form of a hybrid-bed and consists of profiled metal parts and a mineral cast, wherein said mineral cast fills at least part...  
WO/2006/081286A2
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing...  
WO/2006/081538A1
A tool that is designed to cut very hard material using a reciprocating saw. The tool is a rasp made of tungsten carbide that not only cuts into masonry work and other hard materials, but also is capable of not breaking or bending while ...  
WO/2006/081286A3
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing...  
WO/2006/076765A1
Polishing picks (10) and polishing apparatus (20) using the picks that is suitable for polishing concrete and other hard surfaces. The picks have a cylindrical shank (11), for receipt within a bore (23) of the polishing apparatus and a p...  
WO/2006/076766A1
A polishing pick (10) having a cylindrical shank (11) for receipt within a bore (33) of a polishing apparatus (30) and platform (12) for supporting a polishing substrate (13) the end of the shank. A securing means (14, 15, 16) associate ...  
WO/2006/078582A3
A simple attachment for a reciprocating tool that will effectuate the ability to do a flush cut in an inexpensive and simple manner which is neither too rigid nor not rigid enough. This is effectuated by providing an insert (25), which f...  
WO/2006/075305A1
An apparatus (10) for providing access to data recorded on a data carrier (20), said access being intentionally limited to a substantially predetermined number of access sessions. The apparatus (10) comprises: (a) an optical reading head...  
WO2006061172A3
The invention relates to a device for polishing hard surfaces, especially glass surfaces, said device comprising a polishing system (5) provided with a replaceable polishing disk (6). Said polishing system (5) can be displaced in a two-d...  
WO2005067663A3
A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of th...  
WO/2006/071651A2
Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a...  
WO/2006/071651A3
Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a...  
WO/2006/065498A1
A face grinder assembly is disclosed for removing irregularities from tire. The face grinder assembly includes an outer frame and a slide frame slidably attached to the outer frame. The slide frame is capable of vertical movement relativ...  
WO/2006/061910A1
A method for setting the initial position of a whetstone before starting grinding in a vertical duplex surface grinding machine for surface grinding the upper and lower grinding surfaces of a work simultaneously by rotation-driving a pai...  
WO/2006/061172A2
The invention relates to a device for polishing hard surfaces, especially glass surfaces, said device comprising a polishing system (5) provided with a replaceable polishing disk (6). Said polishing system (5) can be displaced in a two-d...  
WO2006041530A3
A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work...  
WO2005072338A3
An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slu...  

Matches 401 - 450 out of 7,915