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Patent Searching and Data


Matches 551 - 600 out of 5,073

Document Document Title
WO/2003/101669A1
An article and method are provided for polishing a substrate surface. In one aspect, the invention provides polishing articles including a linear strip of backing material and a fibrous polishing material disposed on the backing material...  
WO/2003/099517A1
A nonwoven composite cleaning pad (10) is disclosed. The cleaning pad includes a first nonwoven layer (12) having an absorbent surface. A second (20) nonwoven layer is laminated to the first layer, and a plurality of abrasive polymer for...  
WO/2003/099518A1
The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of 50 μm or less, wherein 75% or more of the...  
WO/2003/099519A1
A top layer comprises a flexible support (804) and a plurality of hard elements (808) anchored in a binder (806) over the flexible support, and a method of forming the same is provided. In one embodiment, certain ones of the hard element...  
WO/2003/097298A1
A polishing pad made of a non-foamed material has surface roughness Ra in the range of 0.1-10 micrometers, or preferably 0.5-1.5 micrometers and variations in thickness less than 50 micrometers, or preferably less than 30 micrometers. It...  
WO2003018252A3
The present invention provides a process and liquid composition for selectively removing a metal film from a patterned substrate. The process, which is useful in the manufacture of semiconductor devices and circuits, comprises chemically...  
WO/2003/089194A1
Coated abrasive articles comprise a backing and an abrasive layer, and optionally at least one of a backsize layer, tie layer, supersize layer, presize layer, or saturant. The coated abrasive article comprises a reaction product of compo...  
WO/2003/087256A1
An abrasive is give a top coat layer consisting essentially of an inorganic, anti-loading agent selected from the group consisting of metal silicates, silicas, metal carbonates, and metal sulfates. The metal silicates can be selected fro...  
WO2003037565A3
Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mec...  
WO2001074535A9
A belt (402) for polishing a workpiece such as a semiconductor wafer in a linear chemical mechanical polishing system includes a fixed abrasive material (401) attached to a polymeric layer (405) forming an endless loop. The belt is made ...  
WO/2003/085595A1
The invention provides an abrasive article (22, 122), and methods for the use and the manufacture of the article. The abrasive article comprises an abrasive surface (224); and a performance index associated with the abrasive article, the...  
WO/2003/080295A1
The invention relates to a device for producing jumbo rolls during the production of abrasives on a support. The aim of the invention is to provide a device by which means jumbo rolls can be produced during the production of abrasives on...  
WO/2003/080294A1
Coated abrasive articles comprise a backing (2) and an abrasive layer (3), wherein at the abrasive layer (3) comprises a reaction product (5, 6) of components comprising polyfunctional acrylate, alicyclic polyepoxide, and aromatic polyep...  
WO2002074492A3
The present invention provides discrete particles (306) and methods of preparing the discrete particles (306), and abrasive articles (300) having projections attached to a major surface thereof and methods of making such articles (300). ...  
WO/2003/078859A2
A processing belt (150, 160, 170) for use in chemical mechanical planarization (CMP), is provided. The processing belt is reinforced with one of a mesh belt (154) and a woven fabric (164). The processing belt includes a polymeric materia...  
WO/2003/076136A1
The present invention is directed to an abrasive article and methods of making the abrasive article. An abrasive coating on the abrasive article comprises at least 20% by weight of a superabrasive particle. The abrasive coating is derive...  
WO/2003/074227A2
A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. ...  
WO/2003/064110A1
A method of modifying abrasive stock (10), being an open porous lofty web of undulated filaments with a multitude of abrasive particles dispersed within the web and bonded to the filaments, is disclosed. The modified abrasive stock of th...  
WO/2003/061909A1
A process for coating a surface which comprises applying a composition comprising an amine aldehyde resin, a reactant bearing carboxylic acid groups or derivatives thereof and a Lewis acid, followed by thermal curing. The process is of v...  
WO1999046077A3
A wire saw has a small diameter metal wire and a layer of abrasive grains firmly affixed to the wire surface by a brazed or soldered active metal bond. Preferably, the grains are present in a single layer. The grains are disposed on the ...  
WO/2003/059571A1
A planarization method includes providing a Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a fixed abrasive article in the presence of a planarization composition, wher...  
WO/2003/057409A1
The invention provides a flexible abrasive product comprising a flexible sheet-like substrate comprising a multiplicity of separated resilient bodies connected to each other in a generally planar array in a pattern which provides open sp...  
WO/2003/057410A1
The invention provides a method of making an embossed abrasive article comprising providing a sheet-like foam backing having a first surface and an opposite second surface; providing an abrasive coating comprising abrasive particles and ...  
WO/2003/058698A1
A polishing pad for polishing the surface of a wafer for semiconductor integrated-circuit formation thereon, which has a high polishing rate, attains evenness of polishing, and has a long life. Preferably, the polishing pad comprises a n...  
WO/2003/057411A1
The invention provides a backing (125) for an abrasive article comprising a sheet-like polymeric substrate having a first major surface (126) including a pattern of non-abrasive raised areas and depressed areas and an opposite second maj...  
WO/2003/054097A1
A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked...  
WO/2003/051577A1
An abrasive article (12) is described. The article (12) is suitable for the deposition and mechanical polishing of a conductive material, and comprises: a polishing layer having a textured surface (102) comprising a binder and a second s...  
WO/2003/049904A1
Method for removing gasket material (30) from a surface (32) using nonwoven, three dimensional fibrous web (2) articles employ phenolic particles (6).  
WO2002100593A3
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion ...  
WO/2003/041899A1
The present invention relates to a sawing wire, comprising an abrasive mixture (2), which contains a bonding resin and an abrasive material, as well as a multifilament core made of fibres (1) which are resistant to breaking. Said fibres ...  
WO/2003/041911A1
Abrasive materials having a sheet-form mesh substrate, a metal film plated on a surface of the substrate, a binder applied on a surface of the metal film, and abrasive grains bonded to the substrate by the binder are reported.  
WO/2003/037131A1
A method for capping a stem web including passing the stem web through a first nip against a first heated nip roll (110) so as to partially cap the stems; cooling the web; and passing the stem web through a second nip against a second he...  
WO/2003/038862A2
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads are substantially porous and substantially hard for improved polishing and plana...  
WO/2003/037565A2
Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mec...  
WO/2003/033212A1
Provided is a treated substrate (12) comprising a backing material coated with a resin derived from a curable precursor resin, which comprises an energy-curable component comprising a cyanate ester resin and a curing agent. Also provided...  
WO/2003/033251A1
A process to produce a novel substrate for adherence to a product such as an abrasive belt (10) which encompasses the use of a woven product (12) in the greige state that has open-end, staple cellulosic yarn which has been pre-wet slashe...  
WO/2003/032379A1
In CMP technology for planarizing an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or the like, in the production process of a semiconductor element, irregularities of a matter being polished, ...  
WO2002045908A8
Abrasive grinding wheels having an irregular (i.e., gapped) perimeter shape and/or holes extending therethrough permit one to view the surface of a workpiece being ground in conventional surface finishing, snagging and/or weld blending o...  
WO/2003/026849A1
A coated abrasive having an abrasive surface comprising a plurality of individual abrasive structures wherein the structures comprise a cured binder resin in an amount that is from 58 to 75 % by volume of the volume of binder plus solid ...  
WO/2003/022899A1
A binder for abrasive products, coated abrasive articles and a method of making the same comprising a urea formaldehyde resin precursor cured in the presence of a sole catalyst which consists essentially of at least one salt of an acid w...  
WO2002074839A3
The present invention provides abrasive articles and methods of making abrasive articles. The abrasive articles have a polymeric material that includes (1) a reaction product of components that include (a) an epoxy-functional material, (...  
WO/2003/020474A1
A sheet-form abrasive material having a substrate (11), a binder (12) coated on a surface of the substrate, and abrasive grains bonded to the substrate by the binder, wherein the abrasive material has a plurality of dimples or perforatio...  
WO/2003/018252A2
The present invention provides a process and liquid composition for selectively removing a metal film from a patterned substrate. The process, which is useful in the manufacture of semiconductor devices and circuits, comprises chemically...  
WO/2003/011520A1
Disclosed is a method for forming micro-holes, perforated holes, or grooves on a chemical mechanical polishing pad by a laser. This method involves the steps of determining a pattern of micro-holes, grooves, or perforated holes to be for...  
WO/2003/011522A1
Disclosed is a method for forming micro-holes, perforated holes, and/or grooves on a polishing pad using a laser beam and a mask. This method involves the steps of determining a pattern of micro-holes, grooves, and/or perforated holes to...  
WO/2003/011479A1
The present invention provides a process for forming inlaid patterns of metal into specified areas of a patterned substrate. The process, which is useful in the manufacture of semiconductor devices and circuits, comprises selectively rem...  
WO2002064317A8
The invention concerns a self-adhering support (A) for an applied abrasive product, comprising a support for abrasive (1) secured to a self-adhesive sheet (1a). The invention is characterised in that said self-adhering support (A) has a ...  
WO/2003/008151A1
Described are fixed abrasive articles including wear indicators. Exemplary abrasive article (2) comprising abrasive composite elements (4) in the form of posts. The abrasive composite elements (4) include a binder and abrasive particles ...  
WO/2003/000976A1
There is disclosed a nonwoven fabric in which a substantial proportion of the fibres are fibres with a length of from 0.1 to 12 mm composed of homogenous or heterogeneous, or mixed waste materials of small particle size and the proportio...  
WO2001074537A9
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path (26). An electrostatic patterning device (58) ...  

Matches 551 - 600 out of 5,073