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Patent Searching and Data


Matches 651 - 700 out of 5,123

Document Document Title
WO/2002/045908A1
Abrasive grinding wheels having an irregular (i.e., gapped) perimeter shape and/or holes extending therethrough permit one to view the surface of a workpiece being ground in conventional surface finishing, snagging and/or weld blending o...  
WO/2002/043536A2
A bi-functional nonwoven fabric wipe (10) embodying the principles of the present invention comprises a hydroentangled, composite fibrous matrix having first and second, opposite expansive surfaces. The first expansive surface of the wip...  
WO/2002/043925A1
A process for planarizing, polishing, or providing other modification of a wafer surface (22) or other workpiece. The process includes using an abrasive article (140) having a textured abrasive coating affixed (146) to a backing. The abr...  
WO2001026862A8
A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner comprises a substrate having formed with a plurality of geometrical protrusions of a uniformed height on at least one of its sides, an...  
WO/2002/043921A1
A polishing pad capable of stably performing, with a high polishing speed, the flattening processing of the materials requiring a high degree of surface flatness such as silicon wafers for semiconductor devices, magnetic disks, and optic...  
WO/2002/042034A1
The invention provides an abrasive product having a sheet-like backing (11) including a plurality of concavoconvex portions, the backing (1) also having a first major surface including convex portions and an opposite second major surface...  
WO2001043918A9
A method for making an abrasive material comprising a plurality of hard particles (75) providing the abrasive quality distributed in a retaining matrix for holding the particles in place, the method comprising the steps of placing a mask...  
WO/2002/038338A2
The present application discloses an agglomerate. The agglomerate comprises a crystalline matrix. The agglomerate may additionally comprise abrasive particles. The agglomerate has a normalized bulk density of less than about 0.38. The pr...  
WO/2002/032832A1
A method for making abrasive agglomerate particles from a composition (12) comprising at least a radiation curable binder and solid particulates. The method comprises the steps of forcing the composition through a perforated substrate (5...  
WO/2002/033019A1
Methods for making ceramic aggregate particles (80) comprising forming a plurality of ceramic aggregate precursor particles (20) from a composition (12) by forcing the composition through at least one orifice (21) in a substrate (22), at...  
WO/2002/033020A1
A method for making agglomerate particles from a composition comprising at least a radiation curable binder and solid particulates. The method comprises the steps of forcing the composition through a perforated substrate to form agglomer...  
WO/2002/032626A1
The invention provides coated abrasive products (10) having as a backing material a barrier-coated tear-resistant laminate (11) of fabric (12) and paper (15) overcoated on the barrier coating (17) with an abrasive coating. The coated abr...  
WO/2002/032625A2
The invention provides abrasive articles (30) comprising: a backing (32) having a first major surface and a second major surface; and an abrasive coating (37) consisting essentially of: a hardened binder coating having a first surface ad...  
WO/2002/031874A1
An abrasive cloth having an abrasive layer containing a polymer material which is hydrolyzed by an aqueous medium. The abrasive cloth is capable of exhibiting stable polishing performance for a relatively long period of time with no dres...  
WO2002002274A3
The invention is directed to a base-pad (2) for placement under a polishing pad (1) for use with a polishing fluid during a polishing operation, the base-pad (2) having a layer (7) with vertical elongated pores that absorb polishing flui...  
WO2001043918A3
A method for making an abrasive material comprising a plurality of hard particles (75) providing the abrasive quality distributed in a retaining matrix for holding the particles in place, the method comprising the steps of placing a mask...  
WO/2002/024414A1
The invention relates to an abrasive body (1) for an electric grinding tool, especially a delta, eccentric or vibrating grinder, comprising a support plate (2) on which an abrasive grit (3) that can be connected to a base plate of the gr...  
WO/2002/022308A1
A polishing pad and method, wherein surface dressing is made unnecessary, no deformation occurs with the lapse of working time, there is no clogging otherwise caused by abrasive grains or abraded chips, and the surface of a polish-object...  
WO/2002/020218A2
The present invention provides an abrasive article formed of a binder, abrasive particles associated with the binder, and a lubricating particulate additive comprising polytetrafluoroethylene associated with the binder. The abrasive arti...  
WO2002002278A8
A surface treating article (10) including a surface treating member (40) and a fastener (12) including a fiducial (18). The present invention also provides a preferred method of making a surface treating article that includes to a method...  
WO/2002/006009A1
The invention concerns a cleaning tool, whereof the structure comprises a substrate to at least at one surface of which fibres have been secured by flocking, said fibres covering, at least partly, said surface and having mainly at their ...  
WO/2002/002274A2
The invention is directed to a base-pad (2) for placement under a polishing pad (1) for use with a polishing fluid during a polishing operation, the base-pad (2) having a layer (7) with vertical elongated pores that absorb polishing flui...  
WO/2002/002278A1
A surface treating article (10) including a surface treating member (40) and a fastener (12) including a fiducial (18). The present invention also provides a preferred method of making a surface treating article that includes to a method...  
WO/2001/098027A1
The invention relates to grinding/polishing sheet, which comprises 2 or more annular grinding/polishing zones (1-5) separated by intermediate annular distancing zones (6). One or more of the grinding polishing zones (1-5) comprises one o...  
WO/2001/098032A1
A spiral wound abrasive belt (215) is formed from an abrasive media (210) including a plurality of webs. The webs of the abrasive media may include coated abrasives joined by splicing media or other suitable joining material. Alternative...  
WO/2001/096434A1
A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprising an isocyanate compound with a second ingredient comprising a compound containing an active hydrogen group, characterized by comprising ad...  
WO/2001/094074A1
The present invention is an apparatus and method for manufacturing a window (700) into a polishing pad (100) used during a planarization process of a front surface of a wafer. A hole is created in the polishing pad at a location where a ...  
WO/2001/091975A1
An abrasive material which is especially excellent in the dispersion of abrasive grains even when the grains are contained in a large amount, and which has stable polishing properties and is effective in diminishing scratches. The abrasi...  
WO/2001/092620A1
A method of forming a nonwoven fabric suitable for metal-finishing buffing operations includes providing a precursor web comprising polyester, staple length fibers, with hydroentanglement of the web effected to impart desired physical ch...  
WO/2001/087543A2
A colored loop material suitable for use with a hook-and-loop fastening system, wherein the loop material includes a first fibrous nonwoven web having a first surface and a second surface and includes side by side bicomponent spunbond fi...  
WO/2001/085376A1
The invention relates to a saw wire consisting essentially of a steel wire, an intermediate layer and a metallic binding phase into which diamond grains with an average diameter of 10 to 50 micrometers are inserted, characterized in that...  
WO/2001/083166A1
The present invention is a fixed abrasive article (10) for grinding or polishing the surface of a glass workpiece. The abrasive article (10) for grinding glass has abrasive composites (11) containing agglomerates having diamond particles...  
WO/2001/083167A1
A belt (14) has a polishing pad (12) with one or more polishing pad sections (20) joined to the belt (14) by an adhesive layer (32). A seam joint (56) is reinforced with caulking material (58). Edge portions (38 and 40) of the seam joint...  
WO/2001/074537A1
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path (26). An electrostatic patterning device (58) ...  
WO/2001/074535A1
A belt (402) for polishing a workpiece such as a semiconductor wafer in a linear chemical mechanical polishing system includes a fixed abrasive material (401) attached to a polymeric layer (405) forming an endless loop. The belt is made ...  
WO/2001/064396A1
A polishing pad (18) is made by a piezoelectric delivery system (13), and a method of making the pad includes, building successive layers of droplets of material one layer on another layer by dispensing the material in fluid phase as dro...  
WO2001003888A3
The invention relates to a band (1), especially an abrasive and/or polishing band, for machining materials, in addition to a method for the production thereof. The inventive band (1) is provided with a detachable and re-closeable positiv...  
WO2001004227A3
An abrasive article (40) is provided comprising a rigid backing (42) having a first major surface (44) and a second major surface (46); a plurality of ceramic abrasive composites (50) each comprising a plurality of abrasive particles (51...  
WO/2001/062442A1
Described are abrasive articles comprising a nonwoven; a binder layer contacting the nonwoven and at least partially filling spaces between fibers of the nonwoven; first abrasive particles adhered to the binder layer; a slurry layer comp...  
WO/2001/053042A1
A multi-layered polishing pad (30) for modifying a surface of a workpiece, such as a semiconductor wafer. The polishing pad (30) includes a polishing layer (31), at least one sub-pad layer (36) adjacent the polishing layer (31), and an a...  
WO/2001/053040A1
A polishing pad includes a flexible substrate (5) and a polymeric polishing layer (11) that has a repeatable pattern of polymeric asperities that are manufactured by printing, according to a gravure printing process or a screen printing ...  
WO/2001/049457A1
Production of a finished fabric backing for use in the production of a coated abrasive is performed using a dual cure system comprising a radiation curable binder and a thermal initiator in which polymerization is initiated by the use of...  
WO/2001/049449A2
A polishing member for use in the chemical mechanical planarization of a semiconductor wafer has a first surface for contacting the semiconductor wafer, a second surface opposite the first surface oriented away from the wafer. A pluralit...  
WO/2001/045903A1
To provide an abrasive material which is excellent in loading resistance and durability, allows no attachments to attach to an abraded surface even when the end surface of the optical fiber is abraded, and is particularly suited for use ...  
WO/2001/045899A1
A polishing pad has a structure capable of supplying water to the plane of contact with a workpiece, especially a domain structure with an area of less 1 $m(x) 10?-6¿ m. The pad is suitable for semiconductor applications because it is u...  
WO/2001/045904A1
Coated abrasives comprising shaped structures deposited on a backing can be given increased versatility by varying the composition comprising the structure such that different characteristics are revealed as the structure is eroded durin...  
WO/2001/043919A1
The present invention relates to abrasive articles having an abrasive coating comprised of a binder, abrasive particles having a Mohs' hardness of 7 or greater and non-abrasive particles having a Mohs' hardness less than about 6, wherein...  
WO/2001/043918A2
A method for making an abrasive material comprising a plurality of hard particles (75) providing the abrasive quality distributed in a retaining matrix for holding the particles in place, the method comprising the steps of placing a mask...  
WO/2001/043920A1
Manufacture of a polishing pad (300) for polishing a semiconductor substrate, involves, transporting a backing layer (302) to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing lay...  
WO/2001/041975A1
A resilient flexible sanding sponge (20) including a foam backing layer (22) having a layer of abrasive particles (26) distributed along one of its major surfaces (24) that are adhered together and to the backing layer by a layer of flex...  

Matches 651 - 700 out of 5,123