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Patent Searching and Data


Matches 701 - 750 out of 5,073

Document Document Title
WO/2000/071297A1
A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections (12) in a serially linked manner, where the polishing pad sections (12) are characterized by at least two different materi...  
WO2000047366A3
Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate memb...  
WO/2000/064631A1
A method of grinding a glass or other workpiece is described comprising the steps of: contacting a grinding layer (22) of a flexible abrasive article (10) with the surface of a glass workpiece, the grinding layer comprising abrasive grit...  
WO/2000/064326A1
An article for removing stains, including stubborn oil stains, comprising a cleaning sheet (10) having an abrasive coated oil absorbing sheet (1) joined to a backing as a water-absorbing sheet (2) to provide a convenient, simple product ...  
WO/2000/059685A1
The invention provides a substantially flat coated abrasive article (10) having a fabric reinforced backing (11) which may include engaging elements such as hooks (19) for releasable attachment to the surface of an abrading apparatus and...  
WO/2000/051788A1
This invention provides an abrasive article (50) comprising abrasive agglomerate particles (14) and a bond system. The agglomerate particles (14) comprise a plurality of abrasive grains (15) bonded together by means of a first binder (16...  
WO/2000/048788A1
A process for joining together a first polishing pad (20) with a second polishing pad (22) form a larger pad (10) for a machine that performs chemical-mechanical polishing of silicon wafers. The process includes laying a first polishing ...  
WO/2000/047366A2
Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate memb...  
WO2000032353A3
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...  
WO2000015905A3
A curl-resistant, antislip abrasive backing which includes a polymer-reinforced paper having a first surface and a second surface; a synthetic polymeric layer bonded to the first surface; and an amorphous, rubbery polymer film layer bond...  
WO/2000/043159A1
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and are sufficiently thin to generally...  
WO/2000/041850A1
The present invention provides an improved nonwoven abrasive product (30). The improved abrasive product has a porous, lofty web of multiple layers (41, 42, 43, 44) of coiled, autogenously bonded thermoplastic filaments (45), binder resi...  
WO/2000/038885A1
A system and method for attaching an abrasive article to a backing pad is provided. The system (10) includes a backing pad (20) including loop-textile material (24) applied to an attachment surface (26) thereof and an abrasive article (3...  
WO/2000/038886A1
A tearable abrasive article is provided which includes a backing comprising a polymer film having a scrim partially embedded therein and an abrasive coating comprising a plurality of abrasive articles and a binder bonded to at least one ...  
WO/2000/037218A1
An abrasive article is provided having a rebulkable nonwoven web and a continuous sheet-like abrasive coating bonded to the first major surface of the nonwoven web. The abrasive coating comprising a plurality of abrasive particles disper...  
WO/2000/037561A1
The present invention provides a composition for use in coated abrasives. The curable composition comprises a mixture of: i) from about 30 to about 60 weight percent of an oligomeric aminoplast resin having on average at least one pendan...  
WO/2000/035633A1
Abrasive tools, such as coated abrasives, made using radiation curable resin binders can be given a greater depth of cure of the binder if they include bis(2,4,6-trimethylbenzoyl) phenylphosphine oxide photoinitiator.  
WO/2000/032353A2
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...  
WO2000015389A3
A curl-resistant backside layer for an abrasive paper which includes a surfactant-free, film-forming, carboxy group-containing latex polymer. The latex polymer may be ammonia- or amine-dispersed and the curl-resistant backside layer addi...  
WO/2000/024550A1
An improved belt for mechanical polishing of semiconductor wafers, which belt maintains a substantially flat surface in the span between its mounting surfaces. The belt has at least one polymer layer including a polishing layer, and at l...  
WO/2000/019419A1
Tape for polishing the substrate surface of a magnetic recording medium, wherein a thin-fineness filament obtained by dissolving a dissolving component in a dissolution-decomposing composite yarn consisting of a nylon component and the d...  
WO/2000/015905A2
A curl-resistant, antislip abrasive backing which includes a polymer-reinforced paper having a first surface and a second surface; a synthetic polymeric layer bonded to the first surface; and an amorphous, rubbery polymer film layer bond...  
WO/2000/015390A1
Seamless backings (10) and seamless coated abrasive articles are provided. The seamless backings (10) and seamless coated abrasive articles have a backing binder (20) formed from a backing binder precursor comprising an aromatic polysioc...  
WO/2000/015389A2
A curl-resistant backside layer for an abrasive paper which includes a surfactant-free, film-forming, carboxy group-containing latex polymer. The latex polymer may be ammonia- or amine-dispersed and the curl-resistant backside layer addi...  
WO/2000/013854A1
The present invention relates to a support (4-7) for temporary fixation of a self-sticking abrasive and/or polishing sheet (2) comprising an adhesive layer (3), said support (4-7) comprising a surface for receiving the sheet (2), where t...  
WO/2000/013853A1
An abrasive article is provided which comprises a backing; and at least one three-dimensional abrasive coating comprising diamond particles dispersed within a binder bonded to a surface of the backing, the binder comprising a cured binde...  
WO/2000/012642A1
A polishing cloth includes: a polishing cloth substrate; a first pressure-sensitive adhesive layer formed on a back face of the polishing cloth substrate; a support formed on a back face of the first pressure-sensitive adhesive layer; a ...  
WO/2000/007776A1
An abrasive article including: (i) an embossed isolation layer (20) defining inversely contoured first and second surfaces with a plurality of peaks on the first surface producing a plurality of pockets on the second surface; (ii) grindi...  
WO/2000/007775A1
An abrasive article including (i) a first backing (20), (ii) a plurality of protrusions (30) attached to the first surface (21) of the first backing (20) and including a grinding aid, wherein the first surface (21) of the first backing (...  
WO/2000/007774A1
An abrasive article (10) including (i) a backing (90), (ii) a plurality of grinding aid-containing protrusions (30) integrally molded on the first surface (91) of the backing (90), wherein the first surface (91) of the backing (90) is co...  
WO/2000/008255A1
Apparatus and method for grinding levelling of paper, cardboard or a similar continuous web manufactured from vegetative based fibrous raw-material, said apparatus comprising a plurality of grinding means such as rolls or belts preferabl...  
WO/2000/006341A1
A dispenser package comprises a box-shaped dispenser (12) containing a longitudinally-extending web (6) of lofty, non-woven, abrasive material comprising fibres having a tenacity of at least 7.0 g/dtex., which is partially cut, at interv...  
WO/2000/005034A1
A spliced abrasive web (10) spliced together with splicing medium (16) including a predetermined pattern (18). A preferred embodiment of the invention provides a non-woven abrasive web, in the form of a belt, spliced together with splici...  
WO/2000/003840A1
A resilient abrasive article includes a resilient elongatable substrate, abrasive particles adhesively bonded to the substrate with a flexible make coat, and a hard size coat applied over the abrasive particles and flexible make coat. Th...  
WO/2000/002707A1
A polishing pad for polishing a semiconductor wafer which includes an open-celled porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capilla...  
WO/1999/065352A1
A loop material suitable for use with a hook-and-loop fastening system, wherein the loop material includes a first fibrous nonwoven web having a first surface and a second suface and includes carded sheath-core bicomponent staple fibers ...  
WO/1999/062673A1
A polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency. The relatively moisture resistant polishing pad contains additives to improve wetting of the...  
WO/1999/059778A1
An abrasive article is formed having a barrier coating coextensive with and interposed between a backing and an abrasive coating. The hardened barrier coating essentially eliminates penetration of the abrasive coating into the backing, e...  
WO/1999/058299A1
A bonded-abrasive tool includes a matrix of an organic bond, abrasive grains dispersed in the organic bond and a grinding aid in the form of either an inorganic nonhalogenated filler or a hydrated filler. The inorganic nonhalogenated fil...  
WO/1999/056914A1
The present invention involves the use of powder coating methods to form coated abrasives. In one embodiment, the powder is in the form of a multiplicity of binder precursor particles comprising a radiation curable component. In other em...  
WO/1999/056913A1
A coated abrasive article comprises a backing, a first binder on the backing, and a plurality of abrasive particles in the first binder. The first binder precursor is an energy-curable, preferably melt-processable resing containing an ep...  
WO/1999/054424A1
Alumina-based abrasive material having at least an internal layer is provided. Preferably, the abrasive material results from co-extrusion of at least two different sols. In some preferred processing, steps to provide multiple internal l...  
WO/1999/052676A1
An abrasive article is provided that includes a tie coat which improves adhesion between an abrasive layer and a backing in the abrasive article. The tie coat is preferably formed from a tie coat precursor comprising a sulfopoly(ester-ur...  
WO/1999/046077A2
A wire saw has a small diameter metal wire and a layer of abrasive grains firmly affixed to the wire surface by a brazed or soldered active metal bond. Preferably, the grains are present in a single layer. The grains are disposed on the ...  
WO/1999/043491A1
The present invention provides an abrasive material (50) comprising a base surface having a plurality of pyramidal shapes protruding therefrom the base surface and the protrusions (52) being formed of the same material, each protrusion (...  
WO/1999/043466A1
The present invention relates to an abrasive article. The abrasive article of the present invention contains an abrasive layer, a polyurethane structure bonded to the abrasive layer and a substrate bonded to the polyurethane structure. T...  
WO/1999/041039A1
An end effector (11a, 11b) is provided for conditioning pads used to polish semiconductor wafers. The end effector (11a, 11b) has a substrate (13) with a matrix (15) (preferably a polymer) disposed thereon. Abrasive particles such as dia...  
WO1998012021A8
A coated abrasive article comprises a backing, a first binder (i.e., a make coat) on the backing, and a plurality of abrasive particles in the first binder. The first binder precursor is an energy-curable melt-processable resin containin...  
WO/1999/024223A1
Abrasive foam articles and a method of manufacture of such articles are described. The articles of the invention comprise a flexible and resilient foam substrate having first and second major substrate surfaces, at least one of the surfa...  
WO/1999/022912A1
An abrasive article (10) is provided which includes a peripheral surface formed comprising a grinding aid. The grinding aid is formed from a mixture including an acid and at least one of an inorganic metal phosphate salt or an inorganic ...  

Matches 701 - 750 out of 5,073