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Patent Searching and Data


Matches 701 - 750 out of 5,161

Document Document Title
WO/2001/083166A1
The present invention is a fixed abrasive article (10) for grinding or polishing the surface of a glass workpiece. The abrasive article (10) for grinding glass has abrasive composites (11) containing agglomerates having diamond particles...  
WO/2001/083167A1
A belt (14) has a polishing pad (12) with one or more polishing pad sections (20) joined to the belt (14) by an adhesive layer (32). A seam joint (56) is reinforced with caulking material (58). Edge portions (38 and 40) of the seam joint...  
WO/2001/074537A1
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path (26). An electrostatic patterning device (58) ...  
WO/2001/074535A1
A belt (402) for polishing a workpiece such as a semiconductor wafer in a linear chemical mechanical polishing system includes a fixed abrasive material (401) attached to a polymeric layer (405) forming an endless loop. The belt is made ...  
WO/2001/064396A1
A polishing pad (18) is made by a piezoelectric delivery system (13), and a method of making the pad includes, building successive layers of droplets of material one layer on another layer by dispensing the material in fluid phase as dro...  
WO2001003888A3
The invention relates to a band (1), especially an abrasive and/or polishing band, for machining materials, in addition to a method for the production thereof. The inventive band (1) is provided with a detachable and re-closeable positiv...  
WO2001004227A3
An abrasive article (40) is provided comprising a rigid backing (42) having a first major surface (44) and a second major surface (46); a plurality of ceramic abrasive composites (50) each comprising a plurality of abrasive particles (51...  
WO/2001/062442A1
Described are abrasive articles comprising a nonwoven; a binder layer contacting the nonwoven and at least partially filling spaces between fibers of the nonwoven; first abrasive particles adhered to the binder layer; a slurry layer comp...  
WO/2001/053042A1
A multi-layered polishing pad (30) for modifying a surface of a workpiece, such as a semiconductor wafer. The polishing pad (30) includes a polishing layer (31), at least one sub-pad layer (36) adjacent the polishing layer (31), and an a...  
WO/2001/053040A1
A polishing pad includes a flexible substrate (5) and a polymeric polishing layer (11) that has a repeatable pattern of polymeric asperities that are manufactured by printing, according to a gravure printing process or a screen printing ...  
WO/2001/049457A1
Production of a finished fabric backing for use in the production of a coated abrasive is performed using a dual cure system comprising a radiation curable binder and a thermal initiator in which polymerization is initiated by the use of...  
WO/2001/049449A2
A polishing member for use in the chemical mechanical planarization of a semiconductor wafer has a first surface for contacting the semiconductor wafer, a second surface opposite the first surface oriented away from the wafer. A pluralit...  
WO/2001/045903A1
To provide an abrasive material which is excellent in loading resistance and durability, allows no attachments to attach to an abraded surface even when the end surface of the optical fiber is abraded, and is particularly suited for use ...  
WO/2001/045899A1
A polishing pad has a structure capable of supplying water to the plane of contact with a workpiece, especially a domain structure with an area of less 1 $m(x) 10?-6¿ m. The pad is suitable for semiconductor applications because it is u...  
WO/2001/045904A1
Coated abrasives comprising shaped structures deposited on a backing can be given increased versatility by varying the composition comprising the structure such that different characteristics are revealed as the structure is eroded durin...  
WO/2001/043919A1
The present invention relates to abrasive articles having an abrasive coating comprised of a binder, abrasive particles having a Mohs' hardness of 7 or greater and non-abrasive particles having a Mohs' hardness less than about 6, wherein...  
WO/2001/043918A2
A method for making an abrasive material comprising a plurality of hard particles (75) providing the abrasive quality distributed in a retaining matrix for holding the particles in place, the method comprising the steps of placing a mask...  
WO/2001/043920A1
Manufacture of a polishing pad (300) for polishing a semiconductor substrate, involves, transporting a backing layer (302) to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing lay...  
WO/2001/041975A1
A resilient flexible sanding sponge (20) including a foam backing layer (22) having a layer of abrasive particles (26) distributed along one of its major surfaces (24) that are adhered together and to the backing layer by a layer of flex...  
WO/2001/032364A1
The invention provides individually made abrasive discs with the primary abrasive surface around the periphery of the disc where the bulk of the abrading action occurs when the disc is in use. The invention also provides a process by whi...  
WO2000005034A8
A spliced abrasive web (10) spliced together with splicing medium (16) including a predetermined pattern (18). A preferred embodiment of the invention provides a non-woven abrasive web, in the form of a belt, spliced together with splici...  
WO/2001/028741A1
The present invention provides a flexible abrasive article comprising abrasive particles adhered to a foraminous substrate with at least one binder wherein the abrasive article comprises less than 300 ppb of selected extractable cation p...  
WO/2001/026862A1
A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner comprises a substrate having formed with a plurality of geometrical protrusions of a uniformed height on at least one of its sides, an...  
WO/2001/024970A1
An abrasive material comprises an integral mass of discrete lengths, not bonded to each other, of abrasive-coated non-woven synthetic fibres. In particular, the entanglement force between the said lengths is great enough to maintain a wa...  
WO/2001/024971A1
This invention encompasses abrasive articles that have a coating, typically made of at least a binder and abrasive particles, selectively removed from a portion of an exposed abrading surface of the article in order to inscribe a detecta...  
WO2000074896A8
A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first pha...  
WO/2001/015863A1
A belt (12) for polishing a workpiece (11) such as a semiconductor wafer in a chemical mechanical polishing system (10) includes an endless belt. The belt (12) has an aperture (40). The aperture is unobstructed, such as using no window. ...  
WO/2001/015867A1
A belt (102) for polishing a workpiece such as a semiconductor wafer (116) in a chemical mechanical polishing system (100) includes a polymeric layer forming an endless loop and having a polishing surface (140) on one side of the endless...  
WO/2001/015856A1
Polishing pads (140), planarizing machines (100) and methods for mechanical and/or chemical-mechanical planarization of semiconductor wafers (12), or microelectronic substrate assemblies. A web-format machine comprising a planarizing tab...  
WO/2001/015855A1
A method and apparatus for planarizing a microelectronic substrate (112). In one embodiment, the apparatus (100) can include a fixed abrasive polishing pad (141) having metal abrasive elements (115) selected to be a compound of metal in ...  
WO/2001/012741A1
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising: i) a liquid carrier, ii) at least one oxidizing agent, iii) at least one polishi...  
WO/2001/012740A1
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polis...  
WO/2001/010598A1
The invention concerns a hand-held grinding machine (10) comprising a housing (11) wherein are housed means for driving the abrasive strip (24) which is guided, in a rotating motion, by a driving roller (23), preferably also by a deflect...  
WO/2001/010974A1
Abrasive grain with increased projectability in an UP deposition process is provided with a first conductive coating and a second coating comprising a silicon-containing compound.  
WO/2001/004227A2
An abrasive article (40) is provided comprising a rigid backing (42) having a first major surface (44) and a second major surface (46); a plurality of ceramic abrasive composites (50) each comprising a plurality of abrasive particles (51...  
WO/2001/003888A2
The invention relates to a band (1), especially an abrasive and/or polishing band, for machining materials, in addition to a method for the production thereof. The inventive band (1) is provided with a detachable and re-closeable positiv...  
WO/2000/074896A1
A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first pha...  
WO/2000/073020A1
An apparatus (20) and method for abrasively processing an article(24) involves the use of an abrasive product (30) provided with a machine discernable pattern representative of information of varying types. The pattern is read while the ...  
WO/2000/071297A1
A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections (12) in a serially linked manner, where the polishing pad sections (12) are characterized by at least two different materi...  
WO2000047366A3
Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate memb...  
WO/2000/064631A1
A method of grinding a glass or other workpiece is described comprising the steps of: contacting a grinding layer (22) of a flexible abrasive article (10) with the surface of a glass workpiece, the grinding layer comprising abrasive grit...  
WO/2000/064326A1
An article for removing stains, including stubborn oil stains, comprising a cleaning sheet (10) having an abrasive coated oil absorbing sheet (1) joined to a backing as a water-absorbing sheet (2) to provide a convenient, simple product ...  
WO/2000/059685A1
The invention provides a substantially flat coated abrasive article (10) having a fabric reinforced backing (11) which may include engaging elements such as hooks (19) for releasable attachment to the surface of an abrading apparatus and...  
WO/2000/051788A1
This invention provides an abrasive article (50) comprising abrasive agglomerate particles (14) and a bond system. The agglomerate particles (14) comprise a plurality of abrasive grains (15) bonded together by means of a first binder (16...  
WO/2000/048788A1
A process for joining together a first polishing pad (20) with a second polishing pad (22) form a larger pad (10) for a machine that performs chemical-mechanical polishing of silicon wafers. The process includes laying a first polishing ...  
WO/2000/047366A2
Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate memb...  
WO2000032353A3
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...  
WO2000015905A3
A curl-resistant, antislip abrasive backing which includes a polymer-reinforced paper having a first surface and a second surface; a synthetic polymeric layer bonded to the first surface; and an amorphous, rubbery polymer film layer bond...  
WO/2000/043159A1
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and are sufficiently thin to generally...  
WO/2000/041850A1
The present invention provides an improved nonwoven abrasive product (30). The improved abrasive product has a porous, lofty web of multiple layers (41, 42, 43, 44) of coiled, autogenously bonded thermoplastic filaments (45), binder resi...  

Matches 701 - 750 out of 5,161