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Patent Searching and Data


Matches 701 - 750 out of 5,100

Document Document Title
WO2000074896A8
A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first pha...  
WO/2001/015863A1
A belt (12) for polishing a workpiece (11) such as a semiconductor wafer in a chemical mechanical polishing system (10) includes an endless belt. The belt (12) has an aperture (40). The aperture is unobstructed, such as using no window. ...  
WO/2001/015867A1
A belt (102) for polishing a workpiece such as a semiconductor wafer (116) in a chemical mechanical polishing system (100) includes a polymeric layer forming an endless loop and having a polishing surface (140) on one side of the endless...  
WO/2001/015856A1
Polishing pads (140), planarizing machines (100) and methods for mechanical and/or chemical-mechanical planarization of semiconductor wafers (12), or microelectronic substrate assemblies. A web-format machine comprising a planarizing tab...  
WO/2001/015855A1
A method and apparatus for planarizing a microelectronic substrate (112). In one embodiment, the apparatus (100) can include a fixed abrasive polishing pad (141) having metal abrasive elements (115) selected to be a compound of metal in ...  
WO/2001/012741A1
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising: i) a liquid carrier, ii) at least one oxidizing agent, iii) at least one polishi...  
WO/2001/012740A1
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polis...  
WO/2001/010598A1
The invention concerns a hand-held grinding machine (10) comprising a housing (11) wherein are housed means for driving the abrasive strip (24) which is guided, in a rotating motion, by a driving roller (23), preferably also by a deflect...  
WO/2001/010974A1
Abrasive grain with increased projectability in an UP deposition process is provided with a first conductive coating and a second coating comprising a silicon-containing compound.  
WO/2001/004227A2
An abrasive article (40) is provided comprising a rigid backing (42) having a first major surface (44) and a second major surface (46); a plurality of ceramic abrasive composites (50) each comprising a plurality of abrasive particles (51...  
WO/2001/003888A2
The invention relates to a band (1), especially an abrasive and/or polishing band, for machining materials, in addition to a method for the production thereof. The inventive band (1) is provided with a detachable and re-closeable positiv...  
WO/2000/074896A1
A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface (47) of an abrasive article (40), the abrasive article comprising a phase separated polymer (44) having a first pha...  
WO/2000/073020A1
An apparatus (20) and method for abrasively processing an article(24) involves the use of an abrasive product (30) provided with a machine discernable pattern representative of information of varying types. The pattern is read while the ...  
WO/2000/071297A1
A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections (12) in a serially linked manner, where the polishing pad sections (12) are characterized by at least two different materi...  
WO2000047366A3
Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate memb...  
WO/2000/064631A1
A method of grinding a glass or other workpiece is described comprising the steps of: contacting a grinding layer (22) of a flexible abrasive article (10) with the surface of a glass workpiece, the grinding layer comprising abrasive grit...  
WO/2000/064326A1
An article for removing stains, including stubborn oil stains, comprising a cleaning sheet (10) having an abrasive coated oil absorbing sheet (1) joined to a backing as a water-absorbing sheet (2) to provide a convenient, simple product ...  
WO/2000/059685A1
The invention provides a substantially flat coated abrasive article (10) having a fabric reinforced backing (11) which may include engaging elements such as hooks (19) for releasable attachment to the surface of an abrading apparatus and...  
WO/2000/051788A1
This invention provides an abrasive article (50) comprising abrasive agglomerate particles (14) and a bond system. The agglomerate particles (14) comprise a plurality of abrasive grains (15) bonded together by means of a first binder (16...  
WO/2000/048788A1
A process for joining together a first polishing pad (20) with a second polishing pad (22) form a larger pad (10) for a machine that performs chemical-mechanical polishing of silicon wafers. The process includes laying a first polishing ...  
WO/2000/047366A2
Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate memb...  
WO2000032353A3
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...  
WO2000015905A3
A curl-resistant, antislip abrasive backing which includes a polymer-reinforced paper having a first surface and a second surface; a synthetic polymeric layer bonded to the first surface; and an amorphous, rubbery polymer film layer bond...  
WO/2000/043159A1
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and are sufficiently thin to generally...  
WO/2000/041850A1
The present invention provides an improved nonwoven abrasive product (30). The improved abrasive product has a porous, lofty web of multiple layers (41, 42, 43, 44) of coiled, autogenously bonded thermoplastic filaments (45), binder resi...  
WO/2000/038885A1
A system and method for attaching an abrasive article to a backing pad is provided. The system (10) includes a backing pad (20) including loop-textile material (24) applied to an attachment surface (26) thereof and an abrasive article (3...  
WO/2000/038886A1
A tearable abrasive article is provided which includes a backing comprising a polymer film having a scrim partially embedded therein and an abrasive coating comprising a plurality of abrasive articles and a binder bonded to at least one ...  
WO/2000/037218A1
An abrasive article is provided having a rebulkable nonwoven web and a continuous sheet-like abrasive coating bonded to the first major surface of the nonwoven web. The abrasive coating comprising a plurality of abrasive particles disper...  
WO/2000/037561A1
The present invention provides a composition for use in coated abrasives. The curable composition comprises a mixture of: i) from about 30 to about 60 weight percent of an oligomeric aminoplast resin having on average at least one pendan...  
WO/2000/035633A1
Abrasive tools, such as coated abrasives, made using radiation curable resin binders can be given a greater depth of cure of the binder if they include bis(2,4,6-trimethylbenzoyl) phenylphosphine oxide photoinitiator.  
WO/2000/032353A2
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...  
WO2000015389A3
A curl-resistant backside layer for an abrasive paper which includes a surfactant-free, film-forming, carboxy group-containing latex polymer. The latex polymer may be ammonia- or amine-dispersed and the curl-resistant backside layer addi...  
WO/2000/024550A1
An improved belt for mechanical polishing of semiconductor wafers, which belt maintains a substantially flat surface in the span between its mounting surfaces. The belt has at least one polymer layer including a polishing layer, and at l...  
WO/2000/019419A1
Tape for polishing the substrate surface of a magnetic recording medium, wherein a thin-fineness filament obtained by dissolving a dissolving component in a dissolution-decomposing composite yarn consisting of a nylon component and the d...  
WO/2000/015905A2
A curl-resistant, antislip abrasive backing which includes a polymer-reinforced paper having a first surface and a second surface; a synthetic polymeric layer bonded to the first surface; and an amorphous, rubbery polymer film layer bond...  
WO/2000/015390A1
Seamless backings (10) and seamless coated abrasive articles are provided. The seamless backings (10) and seamless coated abrasive articles have a backing binder (20) formed from a backing binder precursor comprising an aromatic polysioc...  
WO/2000/015389A2
A curl-resistant backside layer for an abrasive paper which includes a surfactant-free, film-forming, carboxy group-containing latex polymer. The latex polymer may be ammonia- or amine-dispersed and the curl-resistant backside layer addi...  
WO/2000/013854A1
The present invention relates to a support (4-7) for temporary fixation of a self-sticking abrasive and/or polishing sheet (2) comprising an adhesive layer (3), said support (4-7) comprising a surface for receiving the sheet (2), where t...  
WO/2000/013853A1
An abrasive article is provided which comprises a backing; and at least one three-dimensional abrasive coating comprising diamond particles dispersed within a binder bonded to a surface of the backing, the binder comprising a cured binde...  
WO/2000/012642A1
A polishing cloth includes: a polishing cloth substrate; a first pressure-sensitive adhesive layer formed on a back face of the polishing cloth substrate; a support formed on a back face of the first pressure-sensitive adhesive layer; a ...  
WO/2000/007776A1
An abrasive article including: (i) an embossed isolation layer (20) defining inversely contoured first and second surfaces with a plurality of peaks on the first surface producing a plurality of pockets on the second surface; (ii) grindi...  
WO/2000/007775A1
An abrasive article including (i) a first backing (20), (ii) a plurality of protrusions (30) attached to the first surface (21) of the first backing (20) and including a grinding aid, wherein the first surface (21) of the first backing (...  
WO/2000/007774A1
An abrasive article (10) including (i) a backing (90), (ii) a plurality of grinding aid-containing protrusions (30) integrally molded on the first surface (91) of the backing (90), wherein the first surface (91) of the backing (90) is co...  
WO/2000/008255A1
Apparatus and method for grinding levelling of paper, cardboard or a similar continuous web manufactured from vegetative based fibrous raw-material, said apparatus comprising a plurality of grinding means such as rolls or belts preferabl...  
WO/2000/006341A1
A dispenser package comprises a box-shaped dispenser (12) containing a longitudinally-extending web (6) of lofty, non-woven, abrasive material comprising fibres having a tenacity of at least 7.0 g/dtex., which is partially cut, at interv...  
WO/2000/005034A1
A spliced abrasive web (10) spliced together with splicing medium (16) including a predetermined pattern (18). A preferred embodiment of the invention provides a non-woven abrasive web, in the form of a belt, spliced together with splici...  
WO/2000/003840A1
A resilient abrasive article includes a resilient elongatable substrate, abrasive particles adhesively bonded to the substrate with a flexible make coat, and a hard size coat applied over the abrasive particles and flexible make coat. Th...  
WO/2000/002707A1
A polishing pad for polishing a semiconductor wafer which includes an open-celled porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capilla...  
WO/1999/065352A1
A loop material suitable for use with a hook-and-loop fastening system, wherein the loop material includes a first fibrous nonwoven web having a first surface and a second suface and includes carded sheath-core bicomponent staple fibers ...  
WO/1999/062673A1
A polishing pad or belt or other device with increased resistance to moisture absorption for improved planarizing effectiveness and consistency. The relatively moisture resistant polishing pad contains additives to improve wetting of the...  

Matches 701 - 750 out of 5,100