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WO/2000/073020A1 |
An apparatus (20) and method for abrasively processing an article(24) involves the use of an abrasive product (30) provided with a machine discernable pattern representative of information of varying types. The pattern is read while the ...
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WO2000059681B1 |
According to an example embodiment, the present invention comprises a CMP pad conditioner arrangement. An inlet (130) is configured and arranged for receiving treatment elements. A distribution surface (140) is coupled to the inlet (130)...
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WO/2000/066327A1 |
The invention describes an abrasive system comprising a fiber-backed abrasive disc (1) and a backup pad (11) in which the backup pad (11) has spaced portions (12) removed from the circumference such that the disc (1) overlaps in the area...
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WO/2000/059680A1 |
A hard polishing pad made of a nonfoaming material and used for a CMP machine. In the surface of the polishing pad, a spiral groove or concentric grooves and grid grooves are combinedly made. The angles at which the grooves intersect are...
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WO/2000/053372A1 |
The invention relates to a device (1) to which a tool (3) which is driven in a rotatory manner, especially a polishing or grinding instrument, can be detachably fastened. According to the invention, the device (1) can be optionally faste...
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WO/2000/048790A1 |
Reaction injection molding is utilized as a method for making an abrasive article (10) that includes supplying an effective amount of abrasive particles (26) to at least a portion of an abrasive article mold and supplying a binder precur...
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WO/2000/048788A1 |
A process for joining together a first polishing pad (20) with a second polishing pad (22) form a larger pad (10) for a machine that performs chemical-mechanical polishing of silicon wafers. The process includes laying a first polishing ...
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WO/2000/043159A1 |
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and are sufficiently thin to generally...
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WO/2000/044035A1 |
A gas phase planarization process for semiconductor wafers. The present invention comprises a system and method of dry planarization for a semiconductor wafer. For instance, the present invention includes a system adapted to effectively ...
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WO/2000/038884A1 |
The invention relates to a rotating disk for machining material surfaces, comprising a disk-shaped base part (2) having a central recess (4) for receiving the drive shaft of the rotating disk. Around the recess (4) the faces of said base...
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WO/2000/038883A1 |
The invention relates to a rotating disk (2) for machining material surfaces, comprising a disk-shaped base part (4) which has a central hole (6); a first machining coating (12) which is subjected to wear by abrasion, has a cutting edge ...
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WO/2000/035634A1 |
Abrasive discs with spaced portions removed from the circumference in the form of rounded and elongated V-shapes provide, when in use, complete vision of a workpiece being abraded with reduced tendency to snag on obstructions.
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WO/2000/032353A2 |
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...
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WO/2000/030806A1 |
The invention concerns a polishing or lapping device comprising a surface whereon parts to be polished are to be applied, with an interposed abrasive suspension and with a certain pressure. The invention is characterised in that said sur...
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WO/2000/030809A1 |
A fan-like grinding wheel consists of a support plate. Lamellae which overlap one another are arranged in a fan-like or roof tile-like manner on the outer area of said support plate. In order to improve the grinding performance of such a...
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WO/2000/027589A1 |
A polishing pad characterized by comprising a polishing layer having a micro-rubber A hardness of at least 80 degrees and a cushion layer having a bulk modulus of at least 40 Mpa and a tensile elastic modulus of at least 0.1 Mpa and up t...
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WO/2000/021453A1 |
The invention relates to a dental tool (11) for treating surfaces. Said tool is provided with a thin disk (12) which is covered with abrasive material. It also has a flange area (16) located on the disk (12). Coupling means (13) are prov...
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WO/2000/020171A1 |
The invention relates to a grinding tool which is driven about an axis of revolution (2) and which has radially outwardly projecting, blade-shaped grinding elements (3). Said grinding elements (3) have an abrasive surface and adjacent sl...
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WO/2000/018545A1 |
A brush roll and a brush device used for grinding, polishing, cleaning and other processing; wherein the brush device constitutes an assembly of ring-like discs having polishing bristles or washing filaments planted around the outer peri...
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WO/2000/013852A1 |
The present disclosure relates to a polishing pad (20) inlcuding a pad structure having at least first and second polishing regions (22, 24, 26) defined along a polishing surface (36) of the pad structure. The first polishing region of t...
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WO/2000/013850A1 |
The invention relates to a device for grinding the flats of a card, comprising elastic, flexible elements which penetrate between the clothing points, scan the lateral surfaces of said points and grind same in the process. Additional gri...
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WO/2000/012642A1 |
A polishing cloth includes: a polishing cloth substrate; a first pressure-sensitive adhesive layer formed on a back face of the polishing cloth substrate; a support formed on a back face of the first pressure-sensitive adhesive layer; a ...
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WO/2000/012262A1 |
A polishing pad, characterized by having a micro-rubber. A hardness number of 80 or larger, closed cells with an average cell diameter of not larger than 1000 $g(m)m and a density ranging from 0.4 to 1.1 and containing a polymer polymeri...
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WO/2000/010781A1 |
The invention relates to a method for producing adhesive blanks with internal openings (3), from an endless band (1) comprising a support layer (4), at least one adhesive layer (5) and optionally a matrix layer (6), as well as to a blank...
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WO/2000/010761A2 |
An apparatus (10) and process for separating, transporting and cleaning the edges of panels (28) are disclosed. The apparatus consists of a shuttle (22) that receives pannels (28) from a stack (16) of pannels. The pannels are held by cla...
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WO/2000/002708A1 |
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capill...
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WO/2000/002707A1 |
A polishing pad for polishing a semiconductor wafer which includes an open-celled porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capilla...
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WO/1999/065650A1 |
A dispenser and method for attaching abrasive sheets to a backup pad. The dispenser conveniently centers on the backup pad and abrasive sheet that is larger than the backup pad. In a preferred embodiment, the dispenser comprises: a holde...
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WO/1999/055491A1 |
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads (110). Then the substrate is polished with a standard polishing pad (100) to remove scratch defects created by the fixed-abrasive ...
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WO/1999/048413A1 |
An abrasive cleaning apparatus (10) has an integral drum (D) formed of inner (26) and outer (36) layers of resilient materials and a rigid layer in between. Holes are formed through drum (D) in a spiral pattern around the drum. A wire (W...
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WO/1999/048647A1 |
The invention relates to a plated grinding tool which is symmetrically configured around an axis (1) of rotation. Said plated grinding tool comprises a plurality of grinding plates (2) arranged on the periphery and/or on the faces, and c...
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WO/1999/046080A1 |
A method and apparatus for repairing optical discs (30), wherein the apparatus includes an improved buffing wheel (10) capable of applying a uniform buffing action across the readable surface (38) of an optical disc (30), and wherein the...
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WO/1999/033615A1 |
A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polis...
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WO/1999/028089A1 |
A polymeric foam finishing pad (10) is made by attaching a dense array of individual foam members (11) to a suitable support substrate (14). The member (11) may be individually attached to the substrate (14) or attached to the substrate ...
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WO/1999/028083A1 |
A segmented polishing pad for use in the chemical-mechanical polishing of workpieces is presented which preferably comprises a plurality of pie-shaped segments (159). The plurality of individual pie-shaped segments (158) may also have ch...
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WO/1999/024222A1 |
A backup pad for engaging and supporting abrasive sheets, the backup pad being mounted securely to a drive shaft to prevent relative rotation thereto, and to allow easy mounting and dismounting of the backup pad to the mounting shaft wit...
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WO/1999/024221A1 |
A surface treating article including a quick release fastener. The fastener includes a first end opposite the article, a second end adjacent the article, a tapered portion increasing in cross-sectional area in the direction from the firs...
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WO/1999/024218A1 |
Method of manufacturing a memory disk or a semiconductor device using a polishing apparatus (100) having a substrate and a fixed abrasive pad (6), the fixed abrasive pad (6) having a three-dimensional fixed abrasive polishing layer havin...
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WO/1999/022905A1 |
With sanding or sanding machines with rotating sanding tools comprising sanding segments which are rotated in mutually opposite directions, according to the invention a more uniform sanding result and uniform wear on the tools is achieve...
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WO/1999/021682A1 |
The apparatus has a frame (1) and a work-holding spindle (4) mounted to said frame. A drive assembly for moving a polishing spindle mounting element with respect to said frame is secured to the frame. A polishing spindle (57) is mounted ...
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WO/1999/018600A1 |
A method and apparatus for cleaning a semiconductor wafer. The apparatus preferably includes a brush holder that may include a base and a connection stud extending from the base. The base preferably includes a first plurality of openings...
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WO/1999/016583A1 |
The invention concerns an abrasive disk comprising a support perforated in its centre for being mounted, and whereof the working zone comprises at least an 'active' zone provided with abrasive means and at least a continuous 'inactive' z...
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WO/1999/007518A1 |
A polishing pad system is provided comprising two or more layers, a means of adherence of the layers, and a means to vary the pad morphology during polishing or planarization with minimal process interruption. A preferred means is that o...
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WO/1999/007515A1 |
Polishing pads are provided having a polishing surface formed from a hydrophilic material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate th...
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WO/1999/006180A1 |
A method of treating a cutting edge of a tool to reduce deterioration of the cutting edge during a subsequent machining operation. A brush having a plurality of bristles is rotated about an axis of rotation and positioned relative to the...
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WO/1999/003643A1 |
A rotary bristle tool having a backing with a plurality of bristles extending therefrom. The bristles have a cross section and preferential orientation to control deflection during rotation of the tool. One embodiment is well suited for ...
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WO/1999/001257A1 |
An applicator pad comprising a generally cylindrical backing section (20) of a first type of foam and a generally cylindrical contact section (22) of a second type of foam. The foam of the backing section (20) has a different flexibility...
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WO/1999/000217A1 |
An abrasive grinding or finishing device mounting assembly which includes a hub cap (18) which is retained upon the threaded spindle (14) of a power tool (10). A hub (26) is permanently affixed to the abrasive device without the use of a...
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WO/1998/058771A1 |
A fine abrasive grain-containing buffing material formed of polyvinyl acetal sponge as a main component, and having a compressive elastic modulus of not more than 2000 kg/cm?2¿, wherein fine abrasive grains are fixed to a buffing materi...
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WO/1998/055266A1 |
The invention relates to a grinding tool, specially for hand-held oscillating devices, comprising a tool body attached to the oscillating device and to which abrasive paper (3) is fixed in a manner known per se in such a way that it can ...
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