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WO/2004/069476A1 |
The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises ...
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WO/2004/065063A2 |
An improved rotary sanding tool (10) is provided. The rotary sanding tool includes a top disc (20), a bottom disc (30) coupled to the top disc, a shaft (40) and a plurality of blade assemblies (60). Each of the blade assemblies includes ...
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WO/2004/062849A1 |
The present invention is directed to an abrasive article comprising a fixed abrasive layer and a subpad. The fixed abrasive element is co-extensive with the subpad. The subpad comprises a resilient element. The resilient element has a Sh...
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WO/2004/062853A1 |
The present invention is directed to a method of modifying a wafer surface comprising providing a first abrasive article (6) comprising a first three-dimensional fixed abrasive element (16) and a first subpad (10) generally coextensive w...
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WO/2004/059715A1 |
The present invention relates to a polishing pad for performing effective polishing and conditioning in a 5 chemical mechanical polishing (hereinafter referred to as &grave CMP'), a conditioner suitable for the polishing pad, and a CMP p...
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WO/2004/058453A1 |
A polishing pad of the invention enables the polished quantity of a wafer to be monitored rapidly and precisely in Chemical Mechanical Polishing. A plurality of transparent windows are introduced enabling the polished quantity of the waf...
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WO/2004/056167A1 |
The invention relates to mechanical engineering, in particular to devices for grinding and polishing metal, wooden and stone articles. Said invention makes it possible to increase the reliability, extend the range of treated surfaces, re...
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WO/2004/054779A1 |
A method for producing a closed cell cellular material having an average cell diameter of 0.1 to 100 μm, which comprises a step (A) of incorporating a blowing agent into a molten resin under a pressure of more than 10 MPa of an atmosphe...
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WO/2004/050306A1 |
A polishing grindstone for polishing a gravure platemaking copper-plated roll, wherein eliminating the occurrence of a streaky spiral pattern (feed mark) due to feeding the grindstone to the platemaking roll surface lightens the burden o...
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WO/2004/049417A1 |
A polishing pad enabling a highly precise optical endpoint sensing during the polishing process and thus having excellent polishing characteristics (such as surface uniformity and in-plain uniformity) is disclosed. A polishing pad enabli...
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WO/2004/048033A1 |
A grinding method for grinding the peripheral surface of a rotating work (10) by a grinding wheel (22) rotated by a grinding wheel spindle (21), comprising the steps of mounting a rotating brush (40) rotated together with the rotating gr...
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WO/2004/048473A1 |
A curable emulsion comprises: an oil phase comprising blocked polyisocyanate and curative; and an aqueous phase comprising at least partially neutralized crosslinked copolymer of monomers comprising at least one free-radically polymeriza...
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WO/2004/046216A1 |
To provide a method of fabricating a polyurethane foam with micro pores, and a polishing pad therefrom, the method including steps of: (a) adding a nonionic surfactant into at least one of a first ingredient including an isocyanate group...
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WO/2004/045805A1 |
A first member (1) has a base plate (11) and an abrasive sheet installation portion (12) where an abrasive sheet (14) is fixed. The base plate (11) or the abrasive sheet installation portion (12) is provided with an air-introducing porti...
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WO/2004/043648A1 |
A polishing apparatus, comprising a polished object holding mechanism for holding a polished object and a table having a polishing surface, wherein the polished object held by the polished object holding mechanism is pressed against the ...
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WO/2004/028745A1 |
The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present i...
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WO/2004/028744A1 |
A polishing pad is described having a window. The polishing pad comprises a first layer and a second layer. The first layer having an opening can function as the work surface or polishing layer of the pad. At least a portion of said seco...
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WO/2004/024392A1 |
The present invention provides a system and method for measuring the surface properties of polishing pads using non-contact ultrasonic reflectance. An ultrasonic probe (15) is located over the polishing surface (120) and configured to bo...
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WO/2004/024393A1 |
The present invention provides, polishing pad (230) with improved polishing properties and longevity. The pad is comprised of a thermoplastic foam substrate (240) having a surface (242) comprised of concave cells (244). A polishing agent...
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WO/2004/024391A1 |
A polishing pad (for example, polishing pad (305)) for use in planarization of a semiconductor wafer (for example, semiconductor wafer (420)), the polishing pad (305) featuring a plurality of different polishing surfaces, depending upon ...
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WO/2004/022283A1 |
An optical disk polishing device comprising a flange (24) for holding a polishing body (20), e.g. a sand paper, a backup material (21) interposed between the polishing body (20) and the flange (24), a rotary table (12) for holding a body...
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WO/2004/021426A1 |
A windowed polishing pad used for forming a flat surface on a glass, a semiconductor, a dielectric/metal composite, an integrated circuit and so on, wherein less scratches are given to the surface of a substrate and the polishing conditi...
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WO/2004/019395A1 |
A polishing pad (10) and a polishing method capable of stably polishing the notch of a wafer for a long time without generating dust and without damaging the notch during the polishing, the polishing pad (10) comprising a disk-like pad (...
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WO/2004/015751A1 |
A method of machining a semiconductor wafer-use polishing pad, capable forming grooves, recesses and through holes having an inner surface roughness as small as up to 20 μm, a high dimension accuracy, and a uniform sectional shape; and ...
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WO/2004/009293A1 |
Before the production of a brush-like grind stone (3), embedding holes (310) are formed in positions spaced apart from each other on a grind material holding face (311) of a holder (31). First, plural filiform grind materials (32) that a...
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WO/2004/009291A1 |
A polishing pad has a polishing layer (22) with a polishing surface (24) and a back surface. A plurality of grooves (28b) are formed on the polishing surface, and an indentation (52) is formed in the back surface of the polishing layer. ...
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WO/2004/001829A1 |
A polishing body (4) installed on a base material (5), comprising a polishing pad (6), a hard elastic member (7), and a soft member (8) stacked in this order from a polishing surface side, wherein, for example, a Rodel-nitta Co., Ltd.-ma...
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WO2003082519B1 |
Pad conditioners (15) and methods of conditioning pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided.
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WO/2003/103959A1 |
Provided is a seamless polishing pad comprising a seamless polishing layer (14) having a substantially uniform depth of penetration into a porous subpad (3). In one embodiment, the polishing pad comprises a polishing layer produced by ap...
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WO/2003/105191A2 |
Provided are encapsulated belts and encapsulated pads (1) for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts a...
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WO/2003/101670A1 |
A rotary polishing tool capable of finishing a polishing subject surface to a desired degree of surface roughness. A plurality of substantially circular polishing cloth sheets (7) are superposed to form a substantially cylindrical polish...
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WO/2003/099518A1 |
The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of 50 μm or less, wherein 75% or more of the...
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WO/2003/099496A2 |
A rotary foam sanding tool for use with a powered rotary hand tool has a shaft (110) connected to a hub or mandrel (115), an abrasive surface contacting layer (135), a compressive foam layer (130) intermediate the abrasive surface contac...
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WO/2003/097298A1 |
A polishing pad made of a non-foamed material has surface roughness Ra in the range of 0.1-10 micrometers, or preferably 0.5-1.5 micrometers and variations in thickness less than 50 micrometers, or preferably less than 30 micrometers. It...
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WO/2003/097300A1 |
A polishing pad (3) having an optical assembly (25) that does not cause excess wear on wafer workpiece. The optical assembly (25) is disposed within the pad (3) such that it may move in response to forces applied to the optical assembly ...
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WO/2003/095518A1 |
A production method comprising the step of charging prepolymer, a foaming agent and an active hydrogen−containing compound in specified amounts into a tank and foaming&sol mixing them for a specified time by a mixer, and the subsequent...
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WO/2003/095148A1 |
The invention concerns a cylindrical drum (1) for a sanding/polishing tool which in its drum surface (2) is provided with a number of undercut axial grooves (5) for mounting one or more axially displaceable sanding elements (4), where an...
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WO2002018101A9 |
Chemical Mechanical Polishing/Planarization (CMP) apparatus, method, and substrate produced thereby. Polishing surface with non-uniform recesses therein. CMP head and method having integral slurry dispensing mechanism. CMP apparatus and ...
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WO/2003/086710A1 |
A CYLINDRIC DRUM PROVIDED AT ITS CIRCUMFERENTIAL EDGE WITH A NUMBER OF RECESSES THAT EACH ARE ADAPTED FOR ACCOMODATING A REPLACEABLE GRINDING ELEMENT INCLUDING A RETAINER MEANS IN WHICH IS MOUNTED A SANDPAPER, SUPPORT BRUSHES AND/OR RETA...
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WO/2003/082524A1 |
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.
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WO/2003/079922A2 |
A dental polishing tip (10b) is adapted to be coupled to a dental drive apparatus (19). The apparatus (19) rotates the tip (10b), thereby polishing the teeth. The tip (10b) includes: (I) a post (16) having a proximal end and an opposing ...
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WO/2003/078535A1 |
The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-m...
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WO/2003/076135A1 |
The connecting device is characterized by that, a fixing nest (5) serving as a fixing for a grinding wheel (8) is formed in the bottom of the grinding head (4) provided with a threaded connection (3) on the upper part of the grinding hea...
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WO/2003/072304A1 |
An automatic processing unit comprising a conveyor (1) extending through the automated processing unit and having a longitudinal direction and a transversal direction; and at least one working station located above the conveyor (1) for p...
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WO/2003/066284A1 |
A polishing system (20) can have a rotatable platen (24), a polishing pad (30) secured to the platen, a carrier head (10) to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagne...
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WO/2003/059573A1 |
A polishing method particularly suitable for mirror-polishing the concave surface of a lens and a polishing device, the method characterized by comprising the step of polishing polished objects (50a, 50b) while allowing parts of the dome...
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WO/2003/058698A1 |
A polishing pad for polishing the surface of a wafer for semiconductor integrated-circuit formation thereon, which has a high polishing rate, attains evenness of polishing, and has a long life. Preferably, the polishing pad comprises a n...
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WO/2003/054097A1 |
A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked...
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WO/2003/045631A1 |
The invention provides a polishing pad comprising composite particles that comprise a solid core encapsulated by a polymeric shell material, wherein the solid core comprises a material that differs from the polymeric shell material, as w...
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WO/2003/039812A1 |
A method of fabricating a polishing pad (10; 16) in which a pad material (50) includes a polishing layer (24) overlying a substantially optical transparent backing layer (26) is subjected to a process in which an optical window (12; 18) ...
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