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WO/2004/038698A2 |
Method and apparatus are presented for electrically coupling a slider (201) to ground. In one embodiment, a bonding pad (227) is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This sep...
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WO/2004/030867A1 |
An apparatus (200) and method for forming an endless spiral wound abrasive article (215) and the resulting article. The apparatus includes first and second spaced-apart hubs (220), configured so that a portion of first and second webs pa...
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WO/2004/028746A2 |
Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles (20) are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The...
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WO/2004/029310A2 |
A superabrasive particle (10) coated with a solidified coating of a molten braze alloy (15) that is chemically bonded to the superabrasive particle is disclosed and described. In one aspect, the reactive metal alloy may be chemically bon...
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WO/2004/015751A1 |
A method of machining a semiconductor wafer-use polishing pad, capable forming grooves, recesses and through holes having an inner surface roughness as small as up to 20 μm, a high dimension accuracy, and a uniform sectional shape; and ...
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WO/2004/013399A1 |
Process for the formation of an abrasive coating on operative rollers (110) in plants for continuous lapping of fabrics by application to said rollers of metal laminar elements (85) having an abrasive surface, and by means to assist form...
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WO/2004/012905A1 |
Multi-layer band, comprising a metal band, a self-adhesive layer on the inner face and a protective strip over the self-adhesive layer, is spirally wound onto a roller (50) given a coating of abrasive granules by electrodeposition. On co...
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WO/2004/009293A1 |
Before the production of a brush-like grind stone (3), embedding holes (310) are formed in positions spaced apart from each other on a grind material holding face (311) of a holder (31). First, plural filiform grind materials (32) that a...
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WO/2003/104544A1 |
A consumer scrubbing wipe article including a nonwoven substrate and a texture layer. The nonwoven substrate has a dry basis weight of less than about 300 g/m2, and thus promotes easy, comfortable handling by a user. The texture layer is...
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WO/2003/099519A1 |
A top layer comprises a flexible support (804) and a plurality of hard elements (808) anchored in a binder (806) over the flexible support, and a method of forming the same is provided. In one embodiment, certain ones of the hard element...
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WO/2003/095518A1 |
A production method comprising the step of charging prepolymer, a foaming agent and an active hydrogen−containing compound in specified amounts into a tank and foaming&sol mixing them for a specified time by a mixer, and the subsequent...
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WO/2003/086703A1 |
Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mecha...
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WO/2003/086702A1 |
Grinding of mill rolls is carried out with chatter resistant abrasive grinding wheels having relatively low elastic modulus values and relatively hight burst speed values. Grinding operations may be carried out at high efficiency with co...
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WO/2003/086704A1 |
A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 a...
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WO/2003/086971A1 |
The invention relates to the production of superhard materials including the synthesis of diamonds and cubic boron nitride, polycrystalline and composite materials based thereon, to the production of powders and tools containing such mat...
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WO/2003/078535A1 |
The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-m...
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WO/2003/059576A1 |
An abrasive grain burying device (22), comprising pads (43) supported on a surface plate through flat surfaces (44) harder than the surface plate, wherein the pads (43) are supported on a support member (41) so that the attitudes thereof...
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WO/2003/057411A1 |
The invention provides a backing (125) for an abrasive article comprising a sheet-like polymeric substrate having a first major surface (126) including a pattern of non-abrasive raised areas and depressed areas and an opposite second maj...
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WO/2003/049903A1 |
A grind stone (1) comprising a mounting dish (2), and an abrasive-grain layer (9) provided on the mounting dish (2). The abrasive-grain layer (9) is a plating film containing abrasive grains (4b). An intermediate layer (7) different in p...
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WO/2003/047822A2 |
The invention relates to a cutting or grinding or drilling tool having low-height cutting or grinding layers, comprised of a driven base body with an abrasive layer containing hard material grains or with segments, teeth or the like all ...
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WO/2003/035326A1 |
The invention relates to an abrasive element, especially for the bits of hollow drills, comprising a sintered metal matrix (4) in which cutting material (6) is integrated or incorporated. In order to provide an abrasive element which exh...
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WO/2003/032379A1 |
In CMP technology for planarizing an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or the like, in the production process of a semiconductor element, irregularities of a matter being polished, ...
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WO/2003/020474A1 |
A sheet-form abrasive material having a substrate (11), a binder (12) coated on a surface of the substrate, and abrasive grains bonded to the substrate by the binder, wherein the abrasive material has a plurality of dimples or perforatio...
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WO/2003/020473A1 |
An abrasive article (10) for a grinder (12) having a motor-driven, externally-threaded spindle (14). The abrasive article includes a molded abrasive disk (18) with an integrally molded fastener (22). The molded abrasive disk (18) include...
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WO/2003/000943A2 |
The invention relates to a tool for machine tools, comprising a base (10) and a cutting coating (12) that comprises a binder material (14) in which abrasive cutting bodies (16), especially diamonds, are firmly incorporated by means of a ...
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WO2001074537A9 |
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path (26). An electrostatic patterning device (58) ...
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WO/2002/098609A1 |
A pad conditioner having abrasive particles with contact point uniformly along respective contact planes (17) or (27 and 23), and a process for fabricating a pad conditioner by, distributing abrasive particles (10) or (10 and 10') or (22...
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WO/2002/094508A1 |
A contactor cleaning sheet (10) capable of concurrently cleaning the tip and side faces of a contactor (22) by using one sheet of the cleaning sheet (10), comprising a base sheet (11), a first polishing layer (12) formed on the surface o...
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WO/2002/094736A1 |
The present invention relates to a method for producing cubic boron nitride abrasive grains used for producing a grinding wheel, etc., and to cubic boron nitride abrasive grains. The method comprises maintaining a mixture containing hexa...
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WO/2002/092287A1 |
Granular molding materials for fabricating abrasive articles, such as, for example, grinding wheels, are produced by mixing heated abrasive grains with a resin blend including two phenol-novolac resins. Preferably, the resin blend is add...
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WO/2002/090054A2 |
A contactor cleaning sheet capable of concurrently cleaning the tip and side faces of a contactor, a contactor cleaning sheet manufacturing method, and a contact cleaning method; the cleaning sheet (10), comprising a base sheet (11), an ...
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WO/2002/078909A1 |
An electrostatic abrasive grain deposition process can be adapted to produce a patterned abrasive surface by controlling the local intensity of the field by which the grain (5) is projected on to a substrate (3).
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WO/2002/051587A1 |
As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad (156) where the polishing pad (15...
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WO/2002/049807A1 |
A CMP conditioner for suppressing microscratches on the surface of a semiconductor substrate and for obtaining stable CMP conditioner characteristics. The CMP conditioner by a first mode comprises a support member and rigid grains provid...
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WO/2002/043922A1 |
The present invention is directed, in general, to a method of polishing a surface on substrates, such as semiconductor wafers and, more specifically, to a polishing pad suitable for this purpose. The polishing pad comprises a polishing b...
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WO/2002/043940A1 |
The present invention is directed, in general, to an improved material and method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polymers, preferably thermoplastic foam...
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WO/2002/042034A1 |
The invention provides an abrasive product having a sheet-like backing (11) including a plurality of concavoconvex portions, the backing (1) also having a first major surface including convex portions and an opposite second major surface...
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WO/2002/038339A1 |
The invention concerns a method for making a tool comprising at least a machining tip (1) consisting of one or several materials, in particular diamond-based, and a support (3) for the tip(s), the method comprising for the tip or each ti...
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WO/2002/038696A1 |
Spray drying methods for making agglomerate abrasive grains. The agglomerate abrasive grains are useful for making abrasive articles.
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WO/2002/034468A1 |
A method of regenerating a vitrified grinding wheel comprising a metal core and an outer peripheral wheel part connected thereto and capable of effectively utilizing abrasive grains and the other resources, comprising a wheel stripping p...
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WO/2002/032627A1 |
A rotary surface finishing tool (10) includes a generally circular body (13) of a finishing material, such as polymeric foam, the peripheral edge of which is wrapped around the outer edge of a circular cup-shaped backing plate. The plate...
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WO/2002/031078A2 |
A method is provided for producing a plurality of polycrystalline ultra-hard abrasive grit. The method includes the steps of providing a mass of ultra-hard abrasive particles or a mass of a combination of a precursor for such particles a...
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WO/2002/028802A2 |
Ceramic aggregate particles comprising a plurality of solid particulates bonded together by ceramic binding material and methods of providing a plurality of such particles having substantially uniform cross-sectional shape are provided. ...
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WO/2002/028980A2 |
Agglomerate abrasive grain is disclosed. The agglomerate abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes. A method of making agglomerate abra...
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WO/2002/022298A1 |
A platy tool body (10) of laminated structure formed by partially connecting two to five sheets of plates to each other to fixedly laminate the plates to each other to form a laminated body, wherein liquid material is penetrated into min...
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WO/2002/022311A1 |
A method of producing tool insert which includes the steps of: (a) providing a substrate (10) having a plurality of recesses (12) therein; (b) placing in each recess (12) an ultra-hard abrasive body (14) of substantially the same size an...
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WO/2002/011876A2 |
A method of producing an abrasive product comprises providing a mixture of a mass of discrete carbide particles and a mass of diamond particles, the diamond particles being present in the mixture in an amount such that the diamond conten...
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WO/2002/007901A1 |
A flexible file (10) and its associated method for manufacture are presented. The flexible file (10) provides a frictional or scraping surface for abrading metals, plastics, wood, or almost any other substance and is particularly well su...
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WO/2002/007933A1 |
The invention relates to a ceramically bound porous grinding tool in which the artificial porosity required for optimizing grinding performance is realized by adding mineral, preferably glass-like rigid foam bodies (2). According to the ...
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WO/2002/006553A2 |
The invention relates to a method for the production of cutting bodies with a base body and a hard material comprising a cutting layer, coated on the base body by means of laser beam deposition, whereby a base body blank is formed with r...
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