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WO/2007/050434 |
A method of creating a pigmented image on a monument stone substrate includes positioning the stone relative to a laser engraving apparatus, masking the stone substrate in an image area in which the image is to be created with a first ma...
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WO/2007/045343 |
In a device for fixing non-ferrous metal blocks intended for being sawn up, at least one fixing unit (3) is provided for the secure fixing and simple release of a non-ferrous metal block, said fixing unit (3) having at least three lockab...
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WO/2007/045960 |
An abrasive cutoff wheel comprising a central disk (2) and a plurality of sintered abrasive segments (6) that are undetachably affixed to the outer circumference (8, 30) of the central disk (2) and that bilaterally protrude beyond the ce...
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WO/2007/040002 |
A method for growing a semiconductor ingot by Czochralski method and producing a semiconductor wafer from the ingot comprises a step (S3) for taking operational data concerning the diameter and/or the pulling speed of the ingot along the...
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WO/2007/041606 |
A hardfacing composition (32) that includes a plurality of hard particles (54) wherein the hard particles (54) include a mode particle size distribution, one particle size distribution smaller than the mode particle size distribution, an...
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WO/2007/036784 |
The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs and each...
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WO/2007/036845 |
The present invention finds application in the processing of stones and the like and particularly relates to a machine tool for surface processing of slabs or products having a flat surface of stone material or the like, which machine co...
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WO/2007/037118 |
A laser cutting device for a brittle material capable of realizing the high quality and high speed cutting of a substrate formed of the brittle material to be cut irrespective of the size of the substrate to be cut. In the laser cutting ...
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WO/2007/037096 |
Provided is a method for manufacturing a (110) silicon wafer by slicing a silicon single crystal ingot having plane orientation (110) by using a wire saw. The method for manufacturing the (110) silicon wafer is characterized in that the ...
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WO/2007/035097 |
The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a...
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WO/2007/035097 |
The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a...
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WO/2007/032346 |
A cutter (51) is composed of a disc-shaped cutting blade (22) having a through hole (21) at the center; an annular piezoelectric vibrator (25), which is concentrically fixed with the blade (22), in a region inside an outer circumference ...
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WO/2007/032392 |
A laser processing method in which the sectional shape at a focusing point P of a laser beam L is such that a maximum length in a direction perpendicular to a scheduled cutting line (5) is shorter than a maximum length in a direction par...
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WO/2007/028359 |
The invention relates to a method and device for processing workpieces (1), which are made of glass or glass ceramics, with tools (4, 5) having a special geometric blade. To this end, the material of the workpiece (1) is first softened i...
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WO/2007/026512 |
Disclosed are a wire saw device; and a method of improving a nanotopography on the surface of a wafer formed by cutting an ingot by a wire saw device. The method improves the straightness of the feeding of a work feed table installed in ...
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WO/2007/020835 |
A system for brittle material cutting process is provided to perform high quality and high speed cutting process to a brittle material substrate to be processed, irrespective of sizes of the substrate to be processed. A substrate holder ...
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WO/2007/020822 |
A laser processing method in which particles are prevented from being generated from the cutting surface of a chip obtained by cutting a silicon wafer. Irradiation conditions of laser light (L) for forming modified regions (77-712) are a...
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WO/2007/021193 |
Method and system for controlling a wire tension system for a diamond wire saw in a diamond wire machine, comprising monitoring the cylinder extension (CE) as a measure of the wire extension and comparing the wire extension with the maxi...
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WO/2007/020414 |
An apparatus for splitting stones and blocks comprises means (5A, 6A) for supporting a stone or block while it is subject to a splitting operation, a unit which includes an upper blade (1) for engaging an upper surface of the stone or bl...
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WO/2007/017569 |
An ophthalmic lens milling and boring device comprising supporting means for clamping and rotating the lens about an axis of rotation, means for milling the lens in the supporting means, and means for boring the lens in the supporting me...
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WO/2007/017870 |
A machine for shaping blanks to create a lens, the machine comprising a pair of worktables, driven by a first motor, and supporting blanks to be shaped; a drill bit unit with a rotatable drill bit; an elevator, driven by a second motor, ...
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WO/2007/017870 |
A machine for shaping blanks to create a lens, the machine comprising a pair of worktables, driven by a first motor, and supporting blanks to be shaped; a drill bit unit with a rotatable drill bit; an elevator, driven by a second motor, ...
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WO/2007/012717 |
The inventive machine (11) comprises a lens support (19), a tool holding assembly (21) provided with a rotatable drilling tool (39) and means (25) for controlling the drilling tool (39) position with respect to the support (19) comprisin...
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WO/2007/010810 |
A laser processing apparatus (1001) is provided with a laser generating section (101) for generating a laser beam (301), and a driving section (105) for relatively shifting the laser beam (301) to a subject (106) to be processed and irra...
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WO/2007/009436 |
Thin natural stone slabs (1), which are glued to a support (2, 3), can be produced by sawing thick natural stone slabs with the aid of a splitting machine (4).
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WO/2007/010177 |
There is provided a cutting tool (100; 200; 300) which is capable of performing cutting operations on a variety of materials such as, for example, plasterboard, glass, wood, laminated wood, cardboard, Perspex (Trade Mark), tiles, plastic...
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WO/2007/005823 |
The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs appro...
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WO/2007/004527 |
A dust collection cover (1) capable of efficiently collecting cutting chips and residues generated as a result of cutting a workpiece (3). A cutter (2) includes a motor and a rotary blade (4) driven by the motor, and the dust collection ...
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WO/2007/004890 |
The present invention is related to a method for reducing attraction forces between wafers (4). This method is characterized in that it comprises the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (...
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WO/2007/004700 |
A scribing wheel is composed of an outer circumference end section wherein a circumference ridge line is formed by having crossed bottom sections of two truncated cones which are sharing a rotating shaft, and a plurality of notches and p...
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WO/2007/002745 |
Methods and apparatus for making and using tools, for example concrete cutting blades, may use laminations. They may also include inserts, such as structural inserts, damping inserts and fluid flow elements. Fluid flow elements may inclu...
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WO/2006/136235 |
A device for artificially aging stones (1), particularly concrete stones, clinker bricks and natural stones comprises a support (2) on which the stones can be placed so that their surfaces (1a) to be treated and the adjoining edges (1b) ...
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WO/2006/136017 |
A block impact splitter (10) is comprised of a support frame (11') connected on a swivel (50) to a stationary frame (11). A hammer (15) is provided with a hammer head (16) and secured to a pivotal arm (17) pivotally connected to the supp...
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WO/2006/136235 |
A device for artificially aging stones (1), particularly concrete stones, clinker bricks and natural stones comprises a support (2) on which the stones can be placed so that their surfaces (1a) to be treated and the adjoining edges (1b) ...
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WO/2006/134532 |
The present invention relates to a tool for stretching the foil (2) of a foil carrier (1), the foil being connected to a frame (3), which tool comprises a circular inner body (6) and a circular outer body (7), the foil being stretched by...
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WO/2006/134532 |
The present invention relates to a tool for stretching the foil (2) of a foil carrier (1), the foil being connected to a frame (3), which tool comprises a circular inner body (6) and a circular outer body (7), the foil being stretched by...
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WO/2006/133798 |
Disclosed is a device (10) for positioning and blocking thin silicon wafers (14) after wire-sawing a silicon wafer block (13). Said device (10) comprises a cassette (17) that accommodates the wafer block (13) and is provided with two con...
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WO/2006/133565 |
The invention relates to apparatuses, combinations and methods for exposing corners of artificial stones to an ageing device. The corner-exposing apparatus includes a platform for supporting the stone and exposing the same to the abrasiv...
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WO/2006/129798 |
A compact cutting device capable of scribing and cutting a plate material such as large-sized and thin plate glasses in a short time without lowering quality. The cutting device comprises a belt conveyor (2) supporting the lower ends of ...
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WO/2006/129563 |
A method and a device for cutting off a substrate of fragile material which can prevent the substrate of fragile material from being damaged or contaminated through contact by preventing contact of divided surfaces in a break process for...
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WO/2006/128433 |
The invention relates to a device for lapping or grinding with a cutting wire or with a cutting strip, or similar, comprising an oscillating device for a workpiece (8), by means of which the workpiece is positioned such as to be able to ...
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WO/2006/126302 |
A cutting tool (20) capable of cutting or grooving at high accuracy an object independent of the thickness of a disk-like cutting blade used. The cutting tool (20) has the disk-like cutting blade (22) having a through-hole (21) at the ce...
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WO/2006/126298 |
A cutting device (20) having a bearing (21), a rotating shaft (22) rotatably supported by the bearing (21), a cutting tool (26) composed of a disk-like cutting blade (24) mounted around the rotating shaft (22) and having a through-hole a...
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WO/2006/125559 |
The invention relates to a device for separation of damp silicon wafers (2) from a wafer stack (1), whereby the damp wafers (2) may be removed individually from the stack (1), transferred to a subsequent conveyor device (7) and the damp ...
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WO/2006/122532 |
The invention relates to a thread milling device which comprises an adjusting ring-feeding mechanism for, for example, milling the edges of masonry and/or metal. Said device comprises a base frame (1) which is similar to two rectangular ...
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WO/2006/123481 |
A cutting device whose degree of freedom is increased to expand its range of work. The cutting device has a base (11) pivotally supported at the forward end of an arm, a movement section (12) formed at the upper part of the base (11), a ...
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WO/2006/123950 |
A breaking apparatus (1) including a movable mass (3) for impacting on a striker pin (4), a housing (2) and a striker pin (4) configured to partially protrude through the housing (2), the apparatus (1) characterised in that the striker p...
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WO/2006/120736 |
The purpose is to provide a silicon block which can be processed into a thin silicon wafer having reduced breakage of a substrate during the manufacture of a solar battery. A method for producing a silicon block by cutting a silicon ingo...
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WO/2006/117935 |
A drilling method of a stratum capable of drilling a stratum such as an underground resource endowment layer in liquid by laser irradiation in liquid. A laser beam transmitted by a laser transmission means (20) is applied, as a laser bea...
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WO/2006/117936 |
A technology for working, e.g. exfoliating, crashing or boring, a rock or concrete by means of laser while preventing deposition of dross (glassy deposit). That technology is a device (1) for working a rock or concrete with a laser beam ...
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