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Patent Searching and Data


Matches 701 - 750 out of 18,097

Document Document Title
WO/2010/074513A3
The present invention relates to a method for cutting or drilling a brittle workpiece including stones such as marble and granite, brick, concrete and asphalt, using a frame gang saw, and has as its objective a reduction in the initial c...  
WO/2010/075592A3
Abrasive tip for abrasive tool and method for forming and replacing thereof are disclosed. The abrasive tip facilitates easy and quick attachment to an abrasive tool.  
WO/2010/074513A2
The present invention relates to a method for cutting or drilling a brittle workpiece including stones such as marble and granite, brick, concrete and asphalt, using a frame gang saw, and has as its objective a reduction in the initial c...  
WO/2010/071128A1
Provided is a splitting apparatus for a brittle material wherein a highly versatile CO2 laser source is used as a laser source, a cleavage rate is widely increased, and full body cleavage in a straight line is possible so that a cleavage...  
WO/2010/066519A1
A machine (1a, 1b) for cutting substantially slab-like articles, particularly made of ceramic, stone-like and similar materials, which comprises a frame (2) for supporting at least one cutting assembly (3), which can move alternately alo...  
WO/2010/068148A1
A portable water tank assembly for a dust emitting construction machine, such as a machine for cutting concrete, stone, ceramic materials and the like, said assembly comprising a water container (1) and an electric pump (2) powered by a ...  
WO/2010/063036A3
Dust collection for an abrasive tool is disclosed. In one embodiment, a first dust extraction component extracts dust from an upper part of material that is machined, while a second dust extraction component extracts dust from a lower pa...  
WO/2010/063036A2
Dust collection for an abrasive tool is disclosed. In one embodiment, a first dust extraction component extracts dust from an upper part of material that is machined, while a second dust extraction component extracts dust from a lower pa...  
WO/2010/057671A3
In a method for handling a wafer block cut into individual wafers while the block is being held by the carrier device, brushes having bristles as pressing means are moved up to the cut wafer block in horizontal position from both sides, ...  
WO/2010/059084A1
A drill stand (3) for a concrete drilling apparatus having a concrete drill (1) and a drilling device (2) for rotating the concrete drill (1), said drill stand (3) including a support device (4) having a base (4') adapted to be anchored ...  
WO/2010/058389A1
An apparatus for separating a front wafer from a stack of wafers with internal gaps between the wafers is disclosed. The apparatus includes a chuck for gripping the front wafer, coupled to a mechanical arm and a drive for moving the arm ...  
WO/2010/058009A3
In a method for rotating a wafer block which is sawed into individual wafers, the wafer block is held along at least one side by a support apparatus and sawed into individual wafers, wherein the individual wafers at this at least one sid...  
WO/2010/056209A3
A singulation system for dicing IC units from a substrate comprising; a block (30) for receiving said substrate (31), said block movable from a substrate receiving station to a dicing station; a first dicing saw (10) for dicing the subst...  
WO/2010/052827A1
Provided are an ingot cutting apparatus and a cutting method, wherein the ingot cutting apparatus comprising at least one coolant pocket storing a coolant to be supplied to a blade is characterized in that the abrasive grain portion of t...  
WO/2010/048890A1
A table saw (1) comprises a table (10), a workpiece abutting device (4), a first motor, a saw blade (33) and an electric planer (2). The table (10) has a working surface (11) on which a workpiece is placed. The workpiece abutting device ...  
WO/2010/050859A1
A device for moving a jet member in a first path over a layer to be treated by the jet has means configured to enable input of data relating to a geometrical shape of a surface of said layer to be treated by the jet member and means conf...  
WO/2010/043596A1
In a method for separating wafers from a support device (17), wherein the wafers are formed by sawing a wafer block (40) fastened to the support device (17) by way of adhesives, and wherein the wafers themselves are still adhering on one...  
WO/2010/041862A3
The present invention relates to an apparatus and to a method for cutting a concrete structure using a diamond wire saw. More particularly, the present invention relates to an environmentally-friendly cutting apparatus using a wire saw a...  
WO/2010/041862A2
The present invention relates to an apparatus and to a method for cutting a concrete structure using a diamond wire saw. More particularly, the present invention relates to an environmentally-friendly cutting apparatus using a wire saw a...  
WO/2010/038563A1
Provided is a scribing method, wherein abnormal destruction or generation of burs due to poor cutting phenomenon do not tend to occur. A scribing method of a substrate (10) of fragile material comprises forming, in the surface of the sub...  
WO/2010/034692A1
The invention relates to a method for making a heat exchanger system including at least one module (1) through which extends a row of channels, wherein the module is made as follows: forming an assembly (4) including, in parallel, a plur...  
WO/2010/032371A1
Disclosed are a band saw cutting device in which an ingot is horizontally mounted on a cutting table and a blade having the shape of an endless belt and consisting of an abrasive grain portion and a core is stretched between pulleys, and...  
WO/2010/033063A1
Saws (1) for cutting or sawing harder materials, such as concrete, concrete structures, brick and stone, have an endless cutting member (4) that is driven through a transmission assembly (11, 20) being supported in the saw and having a d...  
WO/2010/029468A1
The manufacture of conglomerate articles and more particularly a method for manufacturing slabs or blocks from a mix composed of a granulated stone material and/or sand and a polyester-resin based binder is described. In particular, a me...  
WO/2010/027333A1
The present invention describes electro formed thin-wall nickel cutting saws or blades (20) and core drills that are impregnated with diamond abrasives. The thin-wall saws and core drills are formed with a plurality of raised portions (2...  
WO/2010/022531A1
A device (20) for holding a workpiece (3), more particularly a columnar silicon ingot, comprises two opposed retaining heads (22, 24) that are provided with at least two clamping elements (28) each. By pressing the clamping elements (28)...  
WO/2010/021826A1
A rock cutting and trimming device comprising a C-clamp, a hydraulic cylinder, a sleeve, a shaft, a top tooth, and a bottom tooth. The hydraulic cylinder is coupled to the shaft, the shaft fits inside of the sleeve, the sleeve is coupled...  
WO/2010/016237A1
A dust collection adapter (1) for a rotary cutter, wherein the dust collection adapter (1) exhibits excellent dust collecting ability without being connected to a dust collector and is conveniently used in work sites at high places and c...  
WO/2010/015577A1
A consaw (100) with integrated pressurised water feed is described. By including means (115,120) for providing a pressurised water supply to the point of cutting, it is possible to reduce dust levels during use of the consaw (100).  
WO/2010/015321A1
The invention relates to hole saw (1), comprising a base body (2) having a cylindrical contour and hard particles (3) arranged in a circular ring shape on the front of the base body. In order to increase the utility value of such a hole ...  
WO/2010/010657A1
Disclosed is a method for resuming the operation of a wire saw characterized in that a work is cut while the axial displacement of a grooved roller and the temperature of the work during cutting are measured and recorded, the axial displ...  
WO/2010/009881A1
The present invention relates to a multi-wire cutting device (1) with a revolving workpiece mount (2) and a method for cutting solid substrates, for example, for use as wafers in the semiconductor, photovoltaics, optical, ceramics, elect...  
WO/2010/005307A1
The invention relates to a device for separating electronic components (2), provided with: sawing means (A) and positioning means (B), wherein between the positioning means (B) and the sawing means (A) at least one transfer position (5) ...  
WO/2010/005352A1
A rig for a core-drilling device for core drilling a concrete wall (1) includes a base structure (10) adapted to be anchored to a floor, ground, or other bed when the device is ready for operation, and a vertical column (3) having a top ...  
WO/2010/006148A3
A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques ...  
WO/2010/006148A2
A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques ...  
WO/2010/000169A1
A device for cutting wafers by wire and its method, which grinds wafers by a steel wire web (2) formed by one steel wire guided multiple times around a wire guiding rolls (1) provided with grooves. Based on the principle that the diamete...  
WO/2010/001529A1
Provided is a method for cutting a work into the shape of a wafer by pressing a cylindrical work held by a work holder against a wire array formed of wires wound spirally between a plurality of wire guides and then running the wires whil...  
WO/2010/001961A1
A method of regenerating a coolant is provided with which a regenerated slurry can be inhibited from having an increased viscosity. The method of coolant regeneration comprises subjecting a spent slurry discharged after the cutting of a ...  
WO/2009/157757A1
The invention relates to a device and method for manufacturing decorative elements from glass and/or ceramic marbles (35), wherein the method comprises steps for: - providing at least one marble (35); - fixing the marble in a fixing memb...  
WO/2009/157757A8
The invention relates to a device and method for manufacturing decorative elements from glass and/or ceramic marbles (35), wherein the method comprises steps for: - providing at least one marble (35); - fixing the marble in a fixing memb...  
WO/2009/157440A1
Provided is a scribing apparatus (1000), which can form scribing lines on two parts at the same time, on the front surface and the rear surface of a bonded substrate formed by bonding brittle substrates, and thus, can shorten a machining...  
WO/2009/153877A1
[PROBLEMS] In cutting an ingot by using a multi-wire saw, to improve material use efficiency by reducing variations in thickness among wafers to be obtained to thereby reduce material loss in cutting and improve working efficiency by sho...  
WO/2009/154022A1
Provided is a substrate processing system wherein a unit display panel arranged on a mother board in prescribed layout can be taken out without damaging a terminal region. The substrate processing system is provided with a scribe apparat...  
WO/2009/153887A1
[PROBLEMS] In cutting an ingot by using a multi-wire saw, to improve material use efficiency by reducing variations in thickness among wafers to be obtained to thereby reduce material loss in cutting and improve working efficiency by sho...  
WO/2009/154012A1
Provided is a method for processing a substrate wherein occurrence of a defective article due to adhesion of an end material region to the side of terminal cut surface is eliminated. In a method for processing the substrate of a mother b...  
WO/2009/150520A1
An apparatus comprises a conveying device (2) arranged for advancing a ceramic product (1) along an advancing direction (F) and fracture promoting means arranged for fracturing said ceramic product (1), said fracture promoting means comp...  
WO/2009/149784A1
In a method of processing plaster elements, a laying unit comprising a number of plaster elements (12) and a corresponding joint pattern (14) is placed on a substantially smooth support (10) such that the plaster elements (12) are locate...  
WO/2009/147074A1
The method relates to the manufacture of a reinforced diamond-coated cable for cutting structures and materials of steel, concrete, steel and concrete, stone materials or the like, in which such diamond-coated cable comprises a plurality...  
WO/2009/146940A1
In order to fasten a silicon block (13) on a support (16) for improved further handling, fibre material (22) which is impregnated with adhesive (23) and consists of glass fibres is introduced into an adhesive join (20) between the silico...  

Matches 701 - 750 out of 18,097