Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 701 - 750 out of 18,625

Document Document Title
WO/2011/014395A3
An interchangeable concrete cutting chainsaw cutting assembly (500) adapted for installation upon a drive assembly (112) in exchange for a removed, different type cutting head assembly. The chainsaw cutting assembly (500) includes a hous...  
WO/2011/009927A1
A device for cleaning substrates on a carrier which has longitudinal channels running parallel to one another in its interior, these channels being connected to the outside on the underside of the carrier by means of openings, has a plur...  
WO/2011/009587A1
The present invention relates to methods for the shaping of a silicon crystal, in which at least on the contact face worked by a shaping device, the silicon crystal is brought into contact with an alkaline liquid, and also to the use of ...  
WO/2011/006195A1
A method for cutting a slab of material including cutting the slab with a cutting tool vibrating at a preselected frequency when the material is in a semi-set state.  
WO/2011/006194A1
A method for producing a cementitious slab including mixing together cement with other materials with the combined mixture of materials having physical particle sizes sufficiently small to allow the material to be cut with a vibrating cu...  
WO/2011/004189A1
An apparatus and method for aligning a gemstone such as diamond (106) with a predetermined vertical axis (108) is described. The apparatus includes an upwardly extending nozzle (105) aligned with the vertical axis (108) and sized to allo...  
WO/2011/005153A8
The invention relates to a diamond tool comprising a tool body (1, 2, 3) provided with diamond segments (4) manufactured by sintering and each segment comprising at least one diamond part (5) and a base part (6), or base (6), which base ...  
WO/2011/005153A1
The invention relates to a diamond tool comprising a tool body (1, 2, 3) provided with diamond segments (4) manufactured by sintering and each segment comprising at least one diamond part (5) and a base part (6), or base (6), which base ...  
WO/2011/003782A1
The invention relates to a method for preparing a suspension from a separation process, wherein the suspension is made of a particulate abrasive and a liquid slurrying agent. The method comprises the steps: a) thinning the suspension in ...  
WO/2011/002089A1
Provided are a cutting method and a cutting device for a brittle material substrate, by which the brittle material substrate can be cut without making the device complicated and the quality of a cut surface can be increased, as well as a...  
WO/2010/150460A1
Provided are a silicon ingot cutting method and a cutting system. The method comprises: performing a primary and secondary centrifugal separations on waste slurry produced when a silicon ingot is cut by a wire saw and separating the wast...  
WO/2010/149379A1
The invention relates to a wear-resistant insert for a cutting or breaking tool having a metal main body and a coating applied to the metal main body, wherein the coating is a powder metallurgical coating having embedded hard phases, app...  
WO/2010/146434A1
A tensioning device of a flexible member wound on pulleys in a sawing machine for material in block form, comprising a shaft (15) to support one or more pulleys (18), on each whereof there is partially wound a respective cutting wire fle...  
WO/2010/143354A1
In a cutting method for a workpiece wherein a cylindrical workpiece is pressed against rows of wire which are formed by winding a wire spirally between a plurality of wire guides and the workpiece is cut into wafers by moving the wire wh...  
WO/2010/139199A1
A stone backing material and an inlaid decorative stone formed by the same are provided. The inlaid decorative stone comprises a stone body (1) formed by the stone backing material, and inlaid parts (3) are arranged on the surface of the...  
WO/2010/136568A1
The invention relates to a device for stacking a plurality of silicon wafers, comprising an upright machine carrier for accommodating a plurality of the silicon wafers, wherein the silicon wafers are provided in the machine carrier in a ...  
WO/2010/135949A1
A proton beam assisted ultraprecise processing method for processing single-crystal fragile material includes the following steps: a) utilizing a simulation software to simulate processing parameters according to a cutting depth, a surfa...  
WO/2010/136057A1
A method and a plant are described for calibrating surfaces of stone materials, suitable for working at least one slab (1) composed of an entry side and an exit side and of two parallel side edges; the slab (1) is pushed along the side e...  
WO/2010/137228A1
Provided is a method for cutting a silicon ingot, with which the waste slurry generated when a silicon ingot is cut by a wire saw is subjected to primary centrifugation and separated into a primary separated liquid and a solid component,...  
WO/2010/137778A1
The present invention relates to a concrete structure wrecker and a destruction method using the same. More specifically, first and second windings adjacent to a spring element which is electrodeposited with diamond segments are plastic ...  
WO/2010/135616A3
A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material...  
WO/2010/133682A1
The invention relates to a carrier (11) for a silicon block (15), which is rigidly connected to the carrier (11) and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier compri...  
WO/2010/135616A2
A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material...  
WO/2010/133683A1
The invention relates to a carrier for a silicon block, which is rigidly connected to the carrier and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier is made of plastic, p...  
WO/2010/132637A3
Methods for cutting a fragile material are provided. The methods comprise the step of heating the fragile material along a separation path to separate the fragile material into a first portion and a second portion. At least the first por...  
WO/2010/132637A2
Methods for cutting a fragile material are provided. The methods comprise the step of heating the fragile material along a separation path to separate the fragile material into a first portion and a second portion. At least the first por...  
WO/2010/128011A1
In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a generally inorganic crystalline material, more particularly a semiconductor material, a cutting yoke (5) having at least two angularly offset saw wire ...  
WO/2010/128925A9
The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion ...  
WO/2010/128925A1
The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion ...  
WO/2010/128903A1
A wall saw has a rotary saw blade, a motor (3) for driving the saw blade, and a stand (4), along which the motor (3) and the saw blade are displaceable as the saw blade is cutting. To rebuild the wall saw to a wire saw, a saw wire drive ...  
WO/2010/126678A2
An abrasive saw having an associated cutting wheel is used for cutting objects. The saw includes a base, a cutting assembly operably mounted to the base and a controller. The cutting assembly includes a pivot shaft, a drive shaft operabl...  
WO/2010/125085A1
A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120...  
WO/2010/126678A3
An abrasive saw (10) having an associated cutting wheel (W) is used for cutting objects. The saw includes a base (12), a cutting assembly operably mounted to the base (12) and a controller. The cutting assembly includes a pivot shaft, a ...  
WO/2010/119118A1
The invention relates to a cutting wheel (2) for cutting brittle materials, for example ceramic and/or glass, having a cutting edge (4) extending along the circumference, wherein the cutting edge (4) has a structure in the form of radial...  
WO/2010/116421A1
A scribing device is equipped with: a horizontal table (3) to which a glass plate (2) is affixed by means of vacuum adsorption; a feed screw (5) and Y-axis control motor (6) for moving the table (3) along guide rails (4, 4) under numeric...  
WO/2010/114545A1
A concrete saw (10) has an electric motor (24) energized by a battery pack (34) to drive a pair of saw arbors (42) and a transmission (30) to rear wheels (16) that provide self propulsion of the saw in cooperation with front wheels (20)....  
WO/2010/112412A1
The invention relates to a component (1) comprising a laser track (2) as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component (1) into ind...  
WO/2010/114411A1
The invention relates to mining and construction engineering, in particular to apparatus for directionally splitting monolithic blocks. The apparatus comprises a fixed bed consisting of two bearing members (1) and a cross member (2), gui...  
WO/2010/108743A3
The invention relates to an ejector (20), in particular for a road milling machine, with which the maintenance effort is considerably simplified.  
WO/2010/110673A1
The invention provides apparatus for cutting a multiplicity of wafers from a block of generally square cross section (14), the apparatus comprising : - means (a supply reel - not shown) to supply one or more wires, - means (a collection ...  
WO/2010/108351A1
A method for double-driving force grooving and cutting wherein each driving force drives a cutting tool for grooving or cutting, and wherein the cutting tools rotate in opposing directions. A multifunction grooving machine made according...  
WO/2010/109141A1
The invention relates to a method for producing a semiconductor, of the photovoltaic cell type, or similar electronic components. According to the invention, at least one silicon wafer is cut from the cross-section of a silicon rod and, ...  
WO/2010/107425A1
A cutting machine (100) having a liquid lubrication delivery system includes: a work-piece platform (101) having an upper surface for supporting a work-piece (103) thereupon, a channel (105) establishing an open slot that receives a peri...  
WO/2010/107937A1
A cutting machine (109) having a liquid lubrication delivery system, said machine comprising: a work-piece platform (101) having an upper surface for supporting a work-piece (103) thereupon; a main channel (105) establishing an elongate ...  
WO/2010/103946A1
Provided are a method for manufacturing a solar cell and a grooving tool, wherein a worn or nicked cutting edge can be easily replaced with a new cutting edge without interchanging a grooving tool itself, and integrated thin film solar c...  
WO/2010/098186A1
The semiconductor element manufacturing method aims to divide wafers that include a substrate with high accuracy. The semiconductor element manufacturing method has a laser irradiation step in which a pulsed laser beam is focused inside ...  
WO/2010/098058A1
A small-sized brittle material substrate is scribed with excellent workability. A plurality of brittle material substrates (107a-107i) are respectively aligned and arranged on a table (106) with aligning pins (109). A recipe data table i...  
WO/2010/098306A1
Provided are a solar cell manufacturing method and a slotting tool that enable manufacture of integrated thin film solar cells with good yield. A slotting tool (8) is used wherein the shape of the bottom surface (83) of the cutting edge ...  
WO/2010/097223A1
The invention relates to a hollow drilling tool comprising an exchangeable drill bit for drilling hard materials, such as concrete, consisting of a support part (1) which has a tube body (12) and a drill bit part (2) that can be connecte...  
WO/2010/095137A1
Nibbling mechanism (100) for producing a plurality of indented surfaces within a cavity within a construction material (160) including a tube, a plurality of cutters and a cutter moving mechanism, each of the cutters (104) being coupled ...  

Matches 701 - 750 out of 18,625