Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 701 - 750 out of 17,240

Document Document Title
WO/2008/140217A1
There is provided a wire saw connector that is used to cut stones or concrete structures and able to improve the bonding force between a wire rope and a connection shank, and simultaneously facilitate the connection of the wire rope, and...  
WO/2008/136239A1
A method for making a line for cutting a strip sheet glass well without generating cullet at the starting point cut line of a cutter. As a means for advancing/retracting a cutter for a strip sheet glass while imparting a pressing force t...  
WO/2008/135365A1
The milling head (1) which serves for the machining of the head (80) of a pile (8) consisting of a pile core (81), a pile shaft (82) and a metal reinforcement lying therebetween comprises a coupling device (13) that can be connected to a...  
WO/2008/132055A1
The invention relates to a method for the targeted introduction of cleavage lines and/or predetermined breaking lines in ceramic substrates for subsequent separation. According to said method, in a thermal treatment step or method step, ...  
WO/2008/133027A1
An electric tool (1) has a notification device (8) for performing notification to a worker and also has a control device (9) for controlling the amount of drive of a drive device (4) that rotationally drives a bit (10) and performing not...  
WO/2008/130305A1
The invention relates to a wire guiding device where the wire guiding device (6, 8, 10, 12) comprises a housing (22) and an to the housing (22) movably connected wire guiding unit (24), where the housing (22) is arranged as an elongated ...  
WO/2008/130304A1
The invention relates to a modular machining system comprising a fastening unit (4), a column (10), a feeder housing (12), and a drive unit (14), where the drive unit (14) is arranged to drive at least one machining device (16, 55, 62) a...  
WO/2008/129943A1
Provided are a novel scribing apparatus and a novel scribing method, by which a deep vertical crack can be formed without damaging a brittle material substrate (W) such as a hard glass substrate. The scribing apparatus is provided with a...  
WO/2008/130283A1
A dismountable joint for securing a first (1) and a second tubular track part (2) end to end to each other to form a track for a wall sawing device, for example, the dismountable joint comprising: - a hook (10) fixed exteriorly to one en...  
WO/2008/129330A1
A diamond wire saw for cutting volumes of rock from quarries consisting in a diamond wire saw carrying diamonddiferous pearls, whereby said pearls are allocated in at least two classes, a first class and a second class, whereby the secon...  
WO/2008/126742A1
[PROBLEMS] To provide a method for efficiently machining a work with a very short pulse. [MEANS FOR SOLVING PROBLEMS] The method is used for machining a work such as a board with a laser beam. The method is characterized in that a very s...  
WO/2008/126501A1
A scribing device which can attain deep penetration while suppressing damage on the surface of a work. The scribing device comprises a table (1) for securing at least a part on one of the sides sandwiching a portion of the work (W) where...  
WO/2008/125098A1
The invention relates to a method and an apparatus for producing thin disks or films (3) from semiconductor bodies (1). Advantageously, a laser is used as a cutting tool (2). The beam of said laser is focused using suitable optical means...  
WO/2008/126502A1
A scribe device that allows a cutter to accurately follow irregularities of a workpiece even if the workpiece has an uneven flatness. The scribe device has the cutter (6) coming into contact with a workpiece (W), a relative movement sect...  
WO/2008/126742A4
[PROBLEMS] To provide a method for efficiently machining a work with a very short pulse. [MEANS FOR SOLVING PROBLEMS] The method is used for machining a work such as a board with a laser beam. The method is characterized in that a very s...  
WO/2008/126880A1
An endless chipping belt 10 includes a woven fabric 14 as a core material. The woven fabric 14 is coated with a surface layer 16. At least one of the chipping surfaces 1OS that are formed of the surface layers 16, is mat-processed. There...  
WO/2008/119299A1
A braze-welding diamond tool improved structure, has diamond mill grain(2) and metallic basal body(l,3) comprising keywalls(12,31,34,35,14,15,16) setted in circumference. The diamond mill grain(2) is brazed in keywalls (12,31,34,35,14,15...  
WO/2008/121001A1
The invention describes an apparatus in the wafer sawing operation for clean and controlled on-line addition upstream to the cutting wire of cutting liquid with abrasives and controlled removal downstream to recycle back to the upstream ...  
WO/2008/119298A1
A brazing-sintering diamond tool segment is composed of binding agent (1,11,12,13,14) and mixture of diamond mill grain and solder. The mixture of diamond mill grain and solder is formed into at least one vertical diamond mill grain stic...  
WO2008059313A8
Sawing machine, such as band saw or the like, for cutting stone, marble, wood, glass and other kinds of material with a cutting plane adjustable into different positions thereof, adapted to cut such materials along rectilinear horizontal...  
WO/2008/117316A1
A method for manufacturing rigid or flexible mosaic-like tiles or sheets foresees that a tile or sheet, advantageously made from stone material, agglomerate or similar, is subjected to the following processing stages: in a first stage a ...  
WO/2008/113709A1
What is described is a tool for cutting stone materials, porcellaneous stoneware, glass and the like, comprising a support (2) having a transverse thickness (4) with respect to the direction of cutting, abrasive segments (8, 9) made from...  
WO/2008/116214A2
A peelable thermoplastic coating (36) applied to one face of an architectural piece (14) such as brick, concrete paver and veneer, and tile. A spray applicator (10) automatically applies the coating substantially edge-to-edge of the face...  
WO/2008/116214A3
A peelable thermoplastic coating (36) applied to one face of an architectural piece (14) such as brick, concrete paver and veneer, and tile. A spray applicator (10) automatically applies the coating substantially edge-to-edge of the face...  
WO/2008/110518A1
Cutting tool comprising a structural member (1, 1') provided with means (301, 401 ) for engagement with operating means, and a plurality of cutting edges (201, 201') connected to said structural member (1, 1'), intended to follow a given...  
WO/2008/108848A1
A stone cutter (10) for quickly and efficiently producing stone cuts and shapes is provided. The stone cutter 10) utilizes a hydraulic cylinder (44) to force a pair of dies (18, 19) about a stone work piece. Each die includes a correspon...  
WO/2008/108051A1
Provided is a cutting method for cutting an ingot into wafer shapes by wrapping a wire on a roller having grooves, and by pushing the wire being run onto the ingot, while feeding the grooved roller with cutting slurry. The cutting method...  
WO/2008/108848A9
A stone cutter (10) for quickly and efficiently producing stone cuts and shapes is provided. The stone cutter 10) utilizes a hydraulic cylinder (44) to force a pair of dies (18, 19) about a stone work piece. Each die includes a correspon...  
WO/2008/102938A1
The present invention relates to a method for manufacturing silicon articles for a plasma processing apparatus. The present invention provides a method for manufacturing silicon articles, comprising: preparing a silicon ingot; forming a ...  
WO2008060244A8
The present invention relates to a net block assembly in a system for positioning singulated integrated circuits, having a net block surface partially covered by a two dimensional array of first (12) and second elements (14), each first ...  
WO2008054332A8
The invention discloses a unit lifter assembly for lifting singulated integrated circuits singulated from a semiconductor substrate including a plurality of rows of unit lifters and a plurality of actuating means, each operatively engage...  
WO/2008/098635A1
A cut-off wheel for machine tools, in particular for handheld power grinders, has a blade body (8), on the outer edge of which at least two cutting segments (9) are mounted. Seen in the circumferential direction, the outer edge of the bl...  
WO/2008/099349A1
The invention provides a segment including a working portion comprising a bonding matrix including at least two regions which differ from each other in abrasive particle content, size, type or distribution wherein the regions are derived...  
WO/2008/099663A1
Scribe crack resulting from growth of scribe line cannot be formed to a desirable depth through sequentially forming of a heating region, cooling region and reheating region. Accordingly, there is provided a method comprising, sequential...  
WO/2008/095716A2
The invention relates to a rock drill comprising a drill head. At least two blades (3, 4) are arranged on the drill head, said blades being oriented substantially radially in relation to the longitudinal axis of the drill when seen from ...  
WO/2008/095716A3
The invention relates to a rock drill comprising a drill head. At least two blades (3, 4) are arranged on the drill head, said blades being oriented substantially radially in relation to the longitudinal axis of the drill when seen from ...  
WO/2008/092840A2
A cutting machine for cutting stones, rock, stone materials or the like and particularly for cutting up stone blocks or the like, in which machine cutting is performed by a diamond wire (2), comprising a plurality of diamond elements, kn...  
WO/2008/092840A3
A cutting machine for cutting stones, rock, stone materials or the like and particularly for cutting up stone blocks or the like, in which machine cutting is performed by a diamond wire (2), comprising a plurality of diamond elements, kn...  
WO/2008/093482A1
A rotary excavating tool, a road surface excavating device equipped with the rotary excavating tool, and a road surface excavating method using the rotary excavating tool are provided. A male screw cylindrical part (21) formed at the upp...  
WO/2008/087612A1
A cutting disk is provided for. forming a scribed line on a surface of a body or object. The cutting disk comprises a disk shaped body (10) having a peripheral portion having first and second circumferentially extending tapered surfaces ...  
WO/2008/086701A1
A forming machine of sheet made of industrial synthetic stone includes a base (1), a press plate (2), a pressure system (3), a vibration system (4) and a moulding board (5). The press plate (2) is positioned above said base (1) and recip...  
WO/2008/087612A8
A cutting disk is provided for. forming a scribed line on a surface of a body or object. The cutting disk comprises a disk shaped body (10) having a peripheral portion having first and second circumferentially extending tapered surfaces ...  
WO/2008/074464A1
The invention relates to a tool, an ingot, a wafer, and a method for chamfering wafers, in particular silicon discs for photovoltaic applications, wherein an edge profile is impressed on the ingot. Following the impression of the edge pr...  
WO/2008/075071A1
A jig (1) for cutting a brick or bricks, comprises a base (3) and alignment means (7, 9, 11, 13) arranged such that the brick or bricks can be laid out on the base (3) with part of the or each brick in contact with the alignment means (7...  
WO/2008/075777A1
A cutter having a dust-collecting cover capable of avoid-ing damage to a workpiece even if the latter hits a workpiece, and capable of enhancing collecting efficiency of cutting chips. The cutter 1 includes a protection cover 4 covering ...  
WO/2008/076690A1
A pedestal assembly (20) for an asphalt cutter and/or a longwall shearer includes a cutting bit (26) detachably secured in a tool body (27) mounted within a block (24) with the block (24) fixedly secured to a pedestal (22). The first end...  
WO/2008/075970A1
The invention relates to a method for separation of a silicon wafer (12a) from a vertical stack (10) of silicon wafers (12). The method is characterised in that it comprises attaching a movable transport device (2) to a surface of the si...  
WO/2008/069099A1
It is an object to provide a light condensing optical system that does not cause problems such as the declining of the intensity of a condensed light spot and the discontinuing of an intensity distribution before and behind a focus, and ...  
WO/2008/065556A2
A machine (100) for cutting an object (10) along a non-flat cut section, comprising a support (120) for the object (10), a tool-carrying assembly (140) equipped with a cutting-wire (159), and a mechanism for moving the support (120) and ...  
WO/2008/065556A3
A machine (100) for cutting an object (10) along a non-flat cut section, comprising a support (120) for the object (10), a tool-carrying assembly (140) equipped with a cutting-wire (159), and a mechanism for moving the support (120) and ...  

Matches 701 - 750 out of 17,240