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Patent Searching and Data


Matches 701 - 750 out of 18,321

Document Document Title
WO/2010/116421A1
A scribing device is equipped with: a horizontal table (3) to which a glass plate (2) is affixed by means of vacuum adsorption; a feed screw (5) and Y-axis control motor (6) for moving the table (3) along guide rails (4, 4) under numeric...  
WO/2010/114545A1
A concrete saw (10) has an electric motor (24) energized by a battery pack (34) to drive a pair of saw arbors (42) and a transmission (30) to rear wheels (16) that provide self propulsion of the saw in cooperation with front wheels (20)....  
WO/2010/112412A1
The invention relates to a component (1) comprising a laser track (2) as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component (1) into ind...  
WO/2010/114411A1
The invention relates to mining and construction engineering, in particular to apparatus for directionally splitting monolithic blocks. The apparatus comprises a fixed bed consisting of two bearing members (1) and a cross member (2), gui...  
WO/2010/108743A3
The invention relates to an ejector (20), in particular for a road milling machine, with which the maintenance effort is considerably simplified.  
WO/2010/110673A1
The invention provides apparatus for cutting a multiplicity of wafers from a block of generally square cross section (14), the apparatus comprising : - means (a supply reel - not shown) to supply one or more wires, - means (a collection ...  
WO/2010/108351A1
A method for double-driving force grooving and cutting wherein each driving force drives a cutting tool for grooving or cutting, and wherein the cutting tools rotate in opposing directions. A multifunction grooving machine made according...  
WO/2010/109141A1
The invention relates to a method for producing a semiconductor, of the photovoltaic cell type, or similar electronic components. According to the invention, at least one silicon wafer is cut from the cross-section of a silicon rod and, ...  
WO/2010/107425A1
A cutting machine (100) having a liquid lubrication delivery system includes: a work-piece platform (101) having an upper surface for supporting a work-piece (103) thereupon, a channel (105) establishing an open slot that receives a peri...  
WO/2010/107937A1
A cutting machine (109) having a liquid lubrication delivery system, said machine comprising: a work-piece platform (101) having an upper surface for supporting a work-piece (103) thereupon; a main channel (105) establishing an elongate ...  
WO/2010/103946A1
Provided are a method for manufacturing a solar cell and a grooving tool, wherein a worn or nicked cutting edge can be easily replaced with a new cutting edge without interchanging a grooving tool itself, and integrated thin film solar c...  
WO/2010/098186A1
The semiconductor element manufacturing method aims to divide wafers that include a substrate with high accuracy. The semiconductor element manufacturing method has a laser irradiation step in which a pulsed laser beam is focused inside ...  
WO/2010/098058A1
A small-sized brittle material substrate is scribed with excellent workability. A plurality of brittle material substrates (107a-107i) are respectively aligned and arranged on a table (106) with aligning pins (109). A recipe data table i...  
WO/2010/098306A1
Provided are a solar cell manufacturing method and a slotting tool that enable manufacture of integrated thin film solar cells with good yield. A slotting tool (8) is used wherein the shape of the bottom surface (83) of the cutting edge ...  
WO/2010/097223A1
The invention relates to a hollow drilling tool comprising an exchangeable drill bit for drilling hard materials, such as concrete, consisting of a support part (1) which has a tube body (12) and a drill bit part (2) that can be connecte...  
WO/2010/095137A1
Nibbling mechanism (100) for producing a plurality of indented surfaces within a cavity within a construction material (160) including a tube, a plurality of cutters and a cutter moving mechanism, each of the cutters (104) being coupled ...  
WO/2010/092964A1
In the case of cutting a brittle material substrate in two directions intersecting each other using a laser beam, a first scribe line (52a) composed of a perpendicular crack (53a) and a second scribe line (52b) composed of a perpendicula...  
WO/2010/090895A1
A cutting chain (10) for cutting concrete and other similar materials having wear and stretch resistant features. In one embodiment, the cutting chain (10) can include chain links (11) having a debris trap for hindering the entry of debr...  
WO/2010/087424A1
Provided is a substrate breaking apparatus which can accurately perform breaking position alignment even in the case where a brittle material substrate to be broken is thin and is to be broken with a small pitch. The substrate breaking a...  
WO/2010/087423A1
Provided is a cutter which can reliably form a diagonal crack further in the direction of the thickness of a brittle material substrate. The cutter has a shape wherein the congruent bottom surfaces of the two circular cones or two circul...  
WO/2010/088501A3
Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction ...  
WO/2010/087200A1
The motorized cutter with wheels (10) comprises a motorized cutter (20) and a carriage (30). The motorized cutter (20) is equipped with an engine (24), a blade (22) rotatably driven by the engine (24), and a light-emitting unit (50) that...  
WO/2010/084382A1
The present invention relates to a method used for reinforcing the products obtained from materials such as natural stone, travertine, granite, marble, limestone, etc. In this invention, a channel and/or channels (2) are provided on the ...  
WO/2010/081771A1
A wall chaser (100) with improved safety characteristics is described. The chaser includes insulating hood (180) to improve the safety during use of such wall chasers. The invention also relates to a handle coupling mechanism for a wall ...  
WO/2010/078274A3
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More par...  
WO/2010/078274A2
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More par...  
WO/2010/074091A1
A method of cutting a brittle-material plate is provided by which the brittle-material plate can be cut into a desired planar shape through automatic machine production without complicating the device. Also provided are a window glass f...  
WO/2010/072675A3
It is disclosed a method of printing comprising the steps of: providing a solid state material having at least one exposed surface; applying an auxiliary layer to the exposed surface to form a composite structure, the auxiliary layer hav...  
WO/2010/075592A2
Abrasive tip for abrasive tool and method for forming and replacing thereof are disclosed. The abrasive tip facilitates easy and quick attachment to an abrasive tool.  
WO/2010/074513A3
The present invention relates to a method for cutting or drilling a brittle workpiece including stones such as marble and granite, brick, concrete and asphalt, using a frame gang saw, and has as its objective a reduction in the initial c...  
WO/2010/075592A3
Abrasive tip for abrasive tool and method for forming and replacing thereof are disclosed. The abrasive tip facilitates easy and quick attachment to an abrasive tool.  
WO/2010/074513A2
The present invention relates to a method for cutting or drilling a brittle workpiece including stones such as marble and granite, brick, concrete and asphalt, using a frame gang saw, and has as its objective a reduction in the initial c...  
WO/2010/071128A1
Provided is a splitting apparatus for a brittle material wherein a highly versatile CO2 laser source is used as a laser source, a cleavage rate is widely increased, and full body cleavage in a straight line is possible so that a cleavage...  
WO/2010/066519A1
A machine (1a, 1b) for cutting substantially slab-like articles, particularly made of ceramic, stone-like and similar materials, which comprises a frame (2) for supporting at least one cutting assembly (3), which can move alternately alo...  
WO/2010/068148A1
A portable water tank assembly for a dust emitting construction machine, such as a machine for cutting concrete, stone, ceramic materials and the like, said assembly comprising a water container (1) and an electric pump (2) powered by a ...  
WO/2010/063036A3
Dust collection for an abrasive tool is disclosed. In one embodiment, a first dust extraction component extracts dust from an upper part of material that is machined, while a second dust extraction component extracts dust from a lower pa...  
WO/2010/063036A2
Dust collection for an abrasive tool is disclosed. In one embodiment, a first dust extraction component extracts dust from an upper part of material that is machined, while a second dust extraction component extracts dust from a lower pa...  
WO/2010/057671A3
In a method for handling a wafer block cut into individual wafers while the block is being held by the carrier device, brushes having bristles as pressing means are moved up to the cut wafer block in horizontal position from both sides, ...  
WO/2010/059084A1
A drill stand (3) for a concrete drilling apparatus having a concrete drill (1) and a drilling device (2) for rotating the concrete drill (1), said drill stand (3) including a support device (4) having a base (4') adapted to be anchored ...  
WO/2010/058389A1
An apparatus for separating a front wafer from a stack of wafers with internal gaps between the wafers is disclosed. The apparatus includes a chuck for gripping the front wafer, coupled to a mechanical arm and a drive for moving the arm ...  
WO/2010/058009A3
In a method for rotating a wafer block which is sawed into individual wafers, the wafer block is held along at least one side by a support apparatus and sawed into individual wafers, wherein the individual wafers at this at least one sid...  
WO/2010/056209A3
A singulation system for dicing IC units from a substrate comprising; a block (30) for receiving said substrate (31), said block movable from a substrate receiving station to a dicing station; a first dicing saw (10) for dicing the subst...  
WO/2010/052827A1
Provided are an ingot cutting apparatus and a cutting method, wherein the ingot cutting apparatus comprising at least one coolant pocket storing a coolant to be supplied to a blade is characterized in that the abrasive grain portion of t...  
WO/2010/048890A1
A table saw (1) comprises a table (10), a workpiece abutting device (4), a first motor, a saw blade (33) and an electric planer (2). The table (10) has a working surface (11) on which a workpiece is placed. The workpiece abutting device ...  
WO/2010/050859A1
A device for moving a jet member in a first path over a layer to be treated by the jet has means configured to enable input of data relating to a geometrical shape of a surface of said layer to be treated by the jet member and means conf...  
WO/2010/043596A1
In a method for separating wafers from a support device (17), wherein the wafers are formed by sawing a wafer block (40) fastened to the support device (17) by way of adhesives, and wherein the wafers themselves are still adhering on one...  
WO/2010/041862A3
The present invention relates to an apparatus and to a method for cutting a concrete structure using a diamond wire saw. More particularly, the present invention relates to an environmentally-friendly cutting apparatus using a wire saw a...  
WO/2010/041862A2
The present invention relates to an apparatus and to a method for cutting a concrete structure using a diamond wire saw. More particularly, the present invention relates to an environmentally-friendly cutting apparatus using a wire saw a...  
WO/2010/038563A1
Provided is a scribing method, wherein abnormal destruction or generation of burs due to poor cutting phenomenon do not tend to occur. A scribing method of a substrate (10) of fragile material comprises forming, in the surface of the sub...  
WO/2010/034692A1
The invention relates to a method for making a heat exchanger system including at least one module (1) through which extends a row of channels, wherein the module is made as follows: forming an assembly (4) including, in parallel, a plur...  

Matches 701 - 750 out of 18,321