Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 701 - 750 out of 17,536

Document Document Title
WO/2009/060562A1
Provided is a wire saw apparatus comprising a wire made to run on a plurality of grooved rollers for running reciprocally in an axial direction, a nozzle for feeding slurry, and a work feeding mechanism for feeding a work to the wire whi...  
WO/2009/060691A1
A machining method of a bonded substrate which can be machined surely according to a prescribed procedure even if the width of an end material portion to be cut off in order to expose a terminal portion becomes small. (a) A first scribe ...  
WO/2009/057474A1
A device for scoring a glass sheet applies a score line for cutting to the glass sheet conveyed on conveyance rollers. The device has a cutter for applying a score line to a glass sheet, ball slide means capable of lifting and lowering t...  
WO/2009/057381A1
Provided is a method which can stably cut a substrate while reducing a bending moment (break pressure) required for the cutting. The method for cutting a fragile material substrate includes: a step for forming a crack along a planned cut...  
WO/2009/056153A1
The present invention relates to a method and a system for manufacturing wafer-like slices from a body (10) of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing...  
WO/2009/056227A1
The invention relates to a shank chisel, particularly a chisel for milling roads, with a carrier part (10) comprising a shank (11), wherein the shank is provided with a chisel tip (18) made of a hard material. The carrier part comprises ...  
WO/2009/053004A1
The invention relates to a wire saw comprising a lapping suspension which contains abrasive grain in a thixotropic suspension medium. The invention also relates to a method for machining workpieces, wherein said wire saw is used.  
WO/2009/053006A1
The invention relates to the use of a mixture of a thixotropic dispersant and abrasive grains as abrasives for machining workpieces, especially semiconductor crystals. The invention thus provides a method for recovering the mixture in an...  
WO/2009/053007A1
The invention relates to a method and a device for recovering a mixture of a dispersant and abrasive grains as abrasives. The mixture is used for machining, especially for separating by machining, workpieces, preferably semiconductor cry...  
WO/2009/050938A1
A method of easily forming a linear or curved continuous or discontinuous U-shaped groove on a substrate surface, and a chamfering method using the same. Part of the surface of a substrate made of a fragile material is rapidly heated und...  
WO/2009/051524A1
Mechanism (10) for a telescopic rig system(l) including a telescopic support column (2), a drill column (5) for a concrete drilling machine, the drill column pivotal about a horizontal axis of rotation (59) for positioning the drill colu...  
WO/2009/051745A1
A scribing system comprising a mounting mechanism, stylus, and force generating mechanism is provided. The mounting mechanism is configured to rotate an elongated object in such a manner that the object is subjected to a bow effect where...  
WO/2009/051745A8
A scribing system comprising a mounting mechanism, stylus, and force generating mechanism is provided. The mounting mechanism is configured to rotate an elongated object in such a manner that the object is subjected to a bow effect where...  
WO/2009/051522A1
The invention relates generally to concrete drilling machines and specifically to a telescopic (2) column included in a rig system for such machines and to a machine cart which may be employed as a base structure for said column. Wheels ...  
WO/2009/047990A1
Provided is a method for forming a scribe line excellent in linearity along a scribe-scheduled line. A laser beam irradiating mechanism is relatively moved such that irradiation area adjusting means (44b) is attached to the laser beam ir...  
WO/2009/043944A1
The invention relates to a cutter including: a base (1) with an upper surface for supporting the ceramic part (9a, 9b, 9c) to be cut, a longitudinal rail (2) positioned above the longitudinal mid-zone of the base (1) parallel thereto, an...  
WO/2009/040841A1
The machine for cutting blocks of natural or similar types of stone comprises: a plurality of diamond-wire (11 ) loops, wound about an assembly for the support and transmission (12) of the cutting motion to said diamond-wire loops and at...  
WO/2009/040704A1
A device (4) for breaking blocks of stone, marble, granite, concrete and similar (8), comprising an element (40) that expands under the action of a pressurised fluid. The device (4) makes it possible to perform the breaking of a block of...  
WO/2009/040109A1
A description is given of a method for producing wafers from ingots comprising adhesively bonding the ingot (4) to a first surface of an ingot carrier (3), dividing up the ingot into wafer slices and releasing the adhesive bond to free t...  
WO/2009/040870A1
A device for the support and/or drive of diamond wire (2) of machines for cutting natural or agglomerate stones, comprising: at least one pulley, wheel or drum for support and/or drive, provided with at least one groove for holding at le...  
WO/2009/041443A1
A water-soluble processing oil for free-abrasive-grain wire saws which, when used in cutting a high-hardness brittle material such as silicon, attains high accuracy of processing and high processing efficiency and causes no problems, e.g...  
WO/2009/040039A1
A device (1) for processing a slab of stone or stone-like material, comprises a support table (2), adapted for receiving the slab, and a fixed guide rail (3) running in a first direction (X) along a side of the support table. The device ...  
WO/2009/036785A1
A displacing apparatus (1) for a tool holder assembly (10) of a machine for working block or slab materials, wherein the tool holder assembly (10) is rotatable around a rotation axis (A-A) perpendicular to a work surface of said machine,...  
WO/2009/036744A1
The invention relates to a small cutting wheel for creating a notched predetermined breaking line. Said small cutting wheel has a radial circumferential line which defines an outer circumference of the small wheel and at least partly com...  
WO/2009/035419A2
An apparatus (5) for dicing an integrated circuit substrate having a loader (30) for loading the substrate to the apparatus, said substrate loaded in a first direction corresponding to a loading axis, an inlet rail (35) said inlet rail i...  
WO/2009/035153A1
A cutter for cutting a workpiece while using a water includes a housing (2), an electric motor (12) disposed in the housing, a rotation shaft (5A), a base (7), and a splashboard (11A). The rotation shaft (5A) is supported by the housing ...  
WO/2009/035419A3
An apparatus (5) for dicing an integrated circuit substrate having a loader (30) for loading the substrate to the apparatus, said substrate loaded in a first direction corresponding to a loading axis, an inlet rail (35) said inlet rail i...  
WO/2009/034759A1
A cutter wheel providing a good cut surface. This is achieved by improving the ability of biting of the cutter wheel into the glass plate so that the cutter wheel does not slip against the glass plate. The cutter wheel has a rotatably su...  
WO/2009/031438A1
Disclosed is a boring tool comprising a shank (13) at a front end side of a main body of the boring tool, and a bit (14) at a front end side of the shank. The shank (13) and the bit (14) (combined body) are connected together by a screw,...  
WO/2009/027567A1
The invention relates to a method for obtaining slabs of natural stone for use in decorating external and internal surfaces. The invention consists of a first pre-treatment comprising the exfoliation of a natural stone (1) and the subseq...  
WO/2009/026497A2
Embodiments of the disclosure provide an aggregate cutting saw chain having a pitch in the range of approximately.440 to approximately.450. Embodiments also include tie straps and/or other components having fluid distribution features.  
WO/2009/026497A3
Embodiments of the disclosure provide an aggregate cutting saw chain having a pitch in the range of approximately.440 to approximately.450. Embodiments also include tie straps and/or other components having fluid distribution features.  
WO/2009/022586A1
A scribing head using a servomotor to cause a cutter mechanism to be in pressure contact with a glass substrate, wherein a scribing load is reduced. The cutter mechanism (26) for scribing a surface of the glass substrate placed in a hori...  
WO/2009/020004A1
A working object (1) is irradiated with a laser beam (L), which is to be concentrated in a working object (1) and which has been modulated by a reflection type spatial light modulator (203) such that its aberration may be at a predetermi...  
WO/2009/013854A1
First and second arms (2, 4) are rotatably held by a rotation shaft (6). Plate glass in which a scribe line is formed in advance is held between a roller (24) and a roller (45). When handles (20, 40) are operated so as to reduce a gap be...  
WO/2009/011454A1
A portable cutter has a base member (8), a main body (2), a cutting blade (3), a protection member (4), a dust collection member (12), and a guide member (8A). The base member moves on a workpiece, the base member having a shaft provided...  
WO/2009/011454A4
A portable cutter has a base member (8), a main body (2), a cutting blade (3), a protection member (4), a dust collection member (12), and a guide member (8A). The base member moves on a workpiece, the base member having a shaft provided...  
WO/2009/011246A1
Provided is a method for processing a brittle material substrate, in which cutting is performed with excellent end surface qualities on a cut surface and excellent linearity. In the method for cutting the brittle material substrate to be...  
WO/2009/008984A1
A material shearing apparatus uses a horizontal receiver bar in support of a pair of spaced apart vertical guide rods having retainer blocks fixed in place on them, and a shearing head slidingly engaged with the guide rods so as to move ...  
WO/2009/007711A1
A brick cutler (10, 100, 200, 300, 400, 500, 600) has an advanceable cutting jaw (104, 204, 330, 456) which can be urged towards a brick (8, 98, 301, 401) to provide a non-impact based cutting force. The cutting force can be enhanced wit...  
WO/2009/003561A1
The invention relates to a shank chisel comprising a chisel head (10) and a chisel shank (20), wherein the chisel shank bears a clamping sleeve (23), in which the chisel shank is held captively in the direction of its longitudinal axis a...  
WO/2009/003008A1
A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle betwee...  
WO/2009/001453A1
Provided is a multi-wire saw that can prevent wires from being displaced in guide roller grooves due to the lifting of the wires when the cutting of an ingot is started. Wires (11) are wound around wire guide rollers (14a, 14b, 41), and ...  
WO/2008/156355A1
A natural stone element (1) comprises a natural stone plate (30) and a stress absorbing layer (40) which is applied to a non-viewing side of the plate (30). In a preferred embodiment of the natural stone element (1), the natural stone pl...  
WO/2008/156355A8
A natural stone element (1) comprises a natural stone plate (30) and a stress absorbing layer (40) which is applied to a non-viewing side of the plate (30). In a preferred embodiment of the natural stone element (1), the natural stone pl...  
WO/2008/154291A1
The invention provides a block splitter assembly comprising first lower and second upper opposed splitter blade assemblies. The splitter blade assemblies have a splitting blade and two or more first forming blades. One forming blade is d...  
WO/2008/151313A9
A cutting tool (10) includes a mandrel (12); a matrix (20) affixed to the mandrel; and cutting material disposed within the matrix and method of making the same.  
WO/2008/149490A1
A method for cutting an ingot into a wafer by entraining a wire about a roller with a plurality of groove and, while supplying cutting slurry to the grooved roller, pressing the reciprocating wire against the ingot. A wire saw device cut...  
WO/2008/149514A1
Provided is a hand cutter comprising a holder fitting unit (30) having a fitting hole portion (35). A tip holder (10) for the column-shaped hand cutter includes a tip (14) rotatably fitted at its one end, and a fitting portion (16) forme...  
WO/2008/151313A1
A cutting tool (10) includes a mandrel (12); a matrix (20) affixed to the mandrel; and cutting material disposed within the matrix and method of making the same.  

Matches 701 - 750 out of 17,536