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Patent Searching and Data


Matches 751 - 800 out of 18,983

Document Document Title
WO/2011/021784A2
The present invention relates to a wire saw, and particularly, to a wire saw that includes a partial coating layer formed on only a portion of ultrafine particle surfaces, in order to prevent the ultrafine particles from being over-depos...  
WO/2011/021784A3
The present invention relates to a wire saw, and particularly, to a wire saw that includes a partial coating layer formed on only a portion of ultrafine particle surfaces, in order to prevent the ultrafine particles from being over-depos...  
WO/2011/019547A2
An inlaid stone composite broadly includes a stone body and a stone inlay assembly secured to the stone body. The inlaid stone composite is constructed by forming a groove in the stone body, with the groove extending inwardly from an edg...  
WO/2011/018989A1
In order to improve the controllability of modified spots, a laser machining device (100) is provided with a first laser beam source (101) which emits a first pulsed laser beam (L1), a second laser beam source (102) which emits a second ...  
WO/2011/019547A3
An inlaid stone composite broadly includes a stone body and a stone inlay assembly secured to the stone body. The inlaid stone composite is constructed by forming a groove in the stone body, with the groove extending inwardly from an edg...  
WO/2011/018537A1
The present invention comprises a kind of low density natural stone, fixed to a transparent or translucent glass base, plexiglass, Lexan, etc., and to the method for obtaining same. Due to the density of the plate which can reach 2 mm, t...  
WO/2011/016996A3
Systems and methods are provided for processing abrasive slurry used in cutting operations such as slicing a water from a silicon ingot with a wive saw. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ul...  
WO/2011/016996A2
Systems and methods are provided for processing abrasive slurry used in cutting operations. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ultrasonically agitated such that abrasive grain contained in t...  
WO/2011/016299A1
Provided is a grinding method for a hard and brittle material by which, when a hole is formed in the hard and brittle material using a grinding drill, the grinding time of the hard and brittle material can be shortened. A grinding method...  
WO/2011/013556A1
Since the principal surface of a silicon substrate (12) is (100) surface, a crack (17) generated starting from a melt treatment region (13) extends in the cleavage direction of the silicon substrate (12) (direction orthogonal to the prin...  
WO/2011/014395A2
An interchangeable concrete cutting chainsaw cutting assembly (500) adapted for installation upon a drive assembly (112) in exchange for a removed, different type cutting head assembly. The chainsaw cutting assembly (500) includes a hous...  
WO/2011/013549A1
A rear surface (1b) of a processing target (1A) and a front surface (10a) of a processing target to be cut (10A) are anodically-bonded, and thus, a crack (17) generated from a melting treatment region (13) in the thickness direction of t...  
WO/2011/014395A3
An interchangeable concrete cutting chainsaw cutting assembly (500) adapted for installation upon a drive assembly (112) in exchange for a removed, different type cutting head assembly. The chainsaw cutting assembly (500) includes a hous...  
WO/2011/009927A1
A device for cleaning substrates on a carrier which has longitudinal channels running parallel to one another in its interior, these channels being connected to the outside on the underside of the carrier by means of openings, has a plur...  
WO/2011/009587A1
The present invention relates to methods for the shaping of a silicon crystal, in which at least on the contact face worked by a shaping device, the silicon crystal is brought into contact with an alkaline liquid, and also to the use of ...  
WO/2011/006195A1
A method for cutting a slab of material including cutting the slab with a cutting tool vibrating at a preselected frequency when the material is in a semi-set state.  
WO/2011/006194A1
A method for producing a cementitious slab including mixing together cement with other materials with the combined mixture of materials having physical particle sizes sufficiently small to allow the material to be cut with a vibrating cu...  
WO/2011/004189A1
An apparatus and method for aligning a gemstone such as diamond (106) with a predetermined vertical axis (108) is described. The apparatus includes an upwardly extending nozzle (105) aligned with the vertical axis (108) and sized to allo...  
WO/2011/005153A8
The invention relates to a diamond tool comprising a tool body (1, 2, 3) provided with diamond segments (4) manufactured by sintering and each segment comprising at least one diamond part (5) and a base part (6), or base (6), which base ...  
WO/2011/005153A1
The invention relates to a diamond tool comprising a tool body (1, 2, 3) provided with diamond segments (4) manufactured by sintering and each segment comprising at least one diamond part (5) and a base part (6), or base (6), which base ...  
WO/2011/003782A1
The invention relates to a method for preparing a suspension from a separation process, wherein the suspension is made of a particulate abrasive and a liquid slurrying agent. The method comprises the steps: a) thinning the suspension in ...  
WO/2011/002089A1
Provided are a cutting method and a cutting device for a brittle material substrate, by which the brittle material substrate can be cut without making the device complicated and the quality of a cut surface can be increased, as well as a...  
WO/2010/150460A1
Provided are a silicon ingot cutting method and a cutting system. The method comprises: performing a primary and secondary centrifugal separations on waste slurry produced when a silicon ingot is cut by a wire saw and separating the wast...  
WO/2010/149379A1
The invention relates to a wear-resistant insert for a cutting or breaking tool having a metal main body and a coating applied to the metal main body, wherein the coating is a powder metallurgical coating having embedded hard phases, app...  
WO/2010/146434A1
A tensioning device of a flexible member wound on pulleys in a sawing machine for material in block form, comprising a shaft (15) to support one or more pulleys (18), on each whereof there is partially wound a respective cutting wire fle...  
WO/2010/143354A1
In a cutting method for a workpiece wherein a cylindrical workpiece is pressed against rows of wire which are formed by winding a wire spirally between a plurality of wire guides and the workpiece is cut into wafers by moving the wire wh...  
WO/2010/139199A1
A stone backing material and an inlaid decorative stone formed by the same are provided. The inlaid decorative stone comprises a stone body (1) formed by the stone backing material, and inlaid parts (3) are arranged on the surface of the...  
WO/2010/136568A1
The invention relates to a device for stacking a plurality of silicon wafers, comprising an upright machine carrier for accommodating a plurality of the silicon wafers, wherein the silicon wafers are provided in the machine carrier in a ...  
WO/2010/135949A1
A proton beam assisted ultraprecise processing method for processing single-crystal fragile material includes the following steps: a) utilizing a simulation software to simulate processing parameters according to a cutting depth, a surfa...  
WO/2010/136057A1
A method and a plant are described for calibrating surfaces of stone materials, suitable for working at least one slab (1) composed of an entry side and an exit side and of two parallel side edges; the slab (1) is pushed along the side e...  
WO/2010/137228A1
Provided is a method for cutting a silicon ingot, with which the waste slurry generated when a silicon ingot is cut by a wire saw is subjected to primary centrifugation and separated into a primary separated liquid and a solid component,...  
WO/2010/137778A1
The present invention relates to a concrete structure wrecker and a destruction method using the same. More specifically, first and second windings adjacent to a spring element which is electrodeposited with diamond segments are plastic ...  
WO/2010/135616A3
A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material...  
WO/2010/133682A1
The invention relates to a carrier (11) for a silicon block (15), which is rigidly connected to the carrier (11) and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier compri...  
WO/2010/135616A2
A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material...  
WO/2010/133683A1
The invention relates to a carrier for a silicon block, which is rigidly connected to the carrier and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier is made of plastic, p...  
WO/2010/132637A3
Methods for cutting a fragile material are provided. The methods comprise the step of heating the fragile material along a separation path to separate the fragile material into a first portion and a second portion. At least the first por...  
WO/2010/132637A2
Methods for cutting a fragile material are provided. The methods comprise the step of heating the fragile material along a separation path to separate the fragile material into a first portion and a second portion. At least the first por...  
WO/2010/128011A1
In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a generally inorganic crystalline material, more particularly a semiconductor material, a cutting yoke (5) having at least two angularly offset saw wire ...  
WO/2010/128925A9
The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion ...  
WO/2010/128925A1
The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion ...  
WO/2010/128903A1
A wall saw has a rotary saw blade, a motor (3) for driving the saw blade, and a stand (4), along which the motor (3) and the saw blade are displaceable as the saw blade is cutting. To rebuild the wall saw to a wire saw, a saw wire drive ...  
WO/2010/126678A2
An abrasive saw having an associated cutting wheel is used for cutting objects. The saw includes a base, a cutting assembly operably mounted to the base and a controller. The cutting assembly includes a pivot shaft, a drive shaft operabl...  
WO/2010/125085A1
A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120...  
WO/2010/126678A3
An abrasive saw (10) having an associated cutting wheel (W) is used for cutting objects. The saw includes a base (12), a cutting assembly operably mounted to the base (12) and a controller. The cutting assembly includes a pivot shaft, a ...  
WO/2010/119118A1
The invention relates to a cutting wheel (2) for cutting brittle materials, for example ceramic and/or glass, having a cutting edge (4) extending along the circumference, wherein the cutting edge (4) has a structure in the form of radial...  
WO/2010/116421A1
A scribing device is equipped with: a horizontal table (3) to which a glass plate (2) is affixed by means of vacuum adsorption; a feed screw (5) and Y-axis control motor (6) for moving the table (3) along guide rails (4, 4) under numeric...  
WO/2010/114545A1
A concrete saw (10) has an electric motor (24) energized by a battery pack (34) to drive a pair of saw arbors (42) and a transmission (30) to rear wheels (16) that provide self propulsion of the saw in cooperation with front wheels (20)....  
WO/2010/112412A1
The invention relates to a component (1) comprising a laser track (2) as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component (1) into ind...  
WO/2010/114411A1
The invention relates to mining and construction engineering, in particular to apparatus for directionally splitting monolithic blocks. The apparatus comprises a fixed bed consisting of two bearing members (1) and a cross member (2), gui...  

Matches 751 - 800 out of 18,983