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Patent Searching and Data


Matches 751 - 800 out of 9,664

Document Document Title
WO/2007/106052
A stone edge slitting and cutting machine which enables the production and mounting of granite ceramics used in the external coatings (10) of buildings such as houses, business centres, public and social buildings via clipped external su...  
WO/2007/104844
The invention concerns a method including the successive steps of storing the desired shape and dimensions of a hole (700) drilled in the lens and the position of said hole on the lens surface, positioning a drilling tool (637) opposite ...  
WO/2007/104021
A method of cutting a sheet of fiber-cement and cutting machine programmed to effect such a method is disclosed. The method includes aligning a cutting plane of the sheet with at least one blade of a first cutting station. The sheet is c...  
WO/2007/100214
A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has...  
WO/2007/093356
The invention relates to a device for tilting stones (1), in particular split stones (1), which have a fractured structure (1a) on at least one surface, in such a way that a surface oriented laterally before the tilting forms the top sid...  
WO/2007/094348
Provided are a laser scribing method and a laser scribing apparatus, by which the cross section of the cut end edge portion of a substrate after cutting is permitted to have high qualities with excellent squareness and linearity without ...  
WO/2007/092975
Cutting tool (1) having a support (2) and a multiplicity of saw teeth (3) which have a tip region (4) and a root region (5), wherein the saw teeth (3) are welded directly or indirectly to the support (2) at the root region (5), and where...  
WO/2007/093356
The invention relates to a device for tilting stones (1), in particular split stones (1), which have a fractured structure (1a) on at least one surface, in such a way that a surface oriented laterally before the tilting forms the top sid...  
WO/2007/087510
A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby pro...  
WO/2007/087354
A method of creating thin wafers of single crystal silicon wherein an ingot of single-crystal silicon with a (111) axis is flattened and polished at one end normal to the axis, and a notch with a vertex in the (111) plane is produced on ...  
WO/2007/082776
The invention relates to a method in which a second planar measurement substrate (1) is arranged on an essentially planar first carrier substrate (3) for components relative to the carrier substrate (3) in such a manner that the planar m...  
WO/2007/084372
A bimodal tile saw includes a tray supported on a base extending in a first direction and a water-cooled saw unit suspended from a telescoping arm. Both the tray and the saw unit move relative to the base along the first direction. In a ...  
WO/2007/084372
A bimodal tile saw includes a tray supported on a base extending in a first direction and a water-cooled saw unit suspended from a telescoping arm. Both the tray and the saw unit move relative to the base along the first direction. In a ...  
WO/2007/082064
A movable saw has a handle that is movable sideways relative to the saw. The handle may also be movable so as to change its vertical position.  
WO/2007/082065
A concrete saw can be operated at multiple speeds. The saw includes at least one neutral. A multispeed gearbox has one configuration with no more than two gear shafts. The gearbox can be mounted directly to an engine output shaft. The en...  
WO/2007/082064
A movable saw has a handle that is movable sideways relative to the saw. The handle may also be movable so as to change its vertical position.  
WO/2007/082065
A concrete saw can be operated at multiple speeds. The saw includes at least one neutral. A multispeed gearbox has one configuration with no more than two gear shafts. The gearbox can be mounted directly to an engine output shaft. The en...  
WO/2007/077589
A device for drilling printed circuit boards comprising a first drill head (8a) guided along a drilling axis (Z) towards and away from a corresponding first drilling plane ((XY)a) substantially perpendicular to the drilling axis, the dri...  
WO/2007/076997
The invention relates to a preliminary material (1) for a stone gang saw (2), in particular for processing bright types of stone, comprising a steel strip support (10) having a plurality of slots (20) in the centre stip of the steel stri...  
WO/2007/074823
A focusing point P is adjusted to the inside of a substrate (4) of a working object (1) comprising a substrate (4) and a plurality of functional elements (15) provided on a surface (3) of the substrate (4). A laser beam L is applied to t...  
WO/2007/072464
A machine for optimized cutting of slabs (16) of stone or stone-like material lying on a primary bench (34) comprises a first beam (28) on which a plurality of spindles (30) are mounted and is movably supported on two travelways (24, 26)...  
WO/2007/073356
A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a long...  
WO/2007/073356
A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a long...  
WO/2007/072464
A machine for optimized cutting of slabs (16) of stone or stone-like material lying on a primary bench (34) comprises a first beam (28) on which a plurality of spindles (30) are mounted and is movably supported on two travelways (24, 26)...  
WO/2007/069668
[PROBLEMS] To provide a diamond scriber suitable for a plate member requiring a scribe particularly under a high load and to provide a shank for fabricating the diamond scriber. [MEANS FOR SOLVING PROBLEMS] A shank (2) can hold a single ...  
WO/2007/065309
A diamond tool for cutting stone material comprises a base body, and a stepped connecting portion that is provided concentrically on the outer periphery of the base body. A plurality of pillar cutting blades are provided on the connectin...  
WO/2007/065665
An apparatus for cleaning a sawn wafer block (40) has a cleaning basin (10), a holder (50, 52) for holding a sawn wafer block (40) in the cleaning basin (10) in such a way that, when there is a cleaning fluid (34) in the cleaning basin (...  
WO/2007/063979
A chip (14) is rotatably attached to a chip holder (10). The chip holder (10) is made into a cylindrical shape and its tip end has an attachment unit (16). An opening is arranged at a holder joint. The chip holder (10) is adsorbed by a m...  
WO/2007/063559
A machine for cutting stone materials comprises a fixed supporting structure (2) and a frame (3) slidably mounted on the supporting structure (2). A plurality of cutting devices (4) is mounted parallel with one another on the frame (3). ...  
WO/2007/061018
A method of glass substrate working, comprising the step of irradiating glass substrate (1) with pulsed laser beams (L) so that the same is focused within the glass substrate (1), thereby creating, around the portion where the pulsed las...  
WO/2007/059251
The present invention is directed to new uses and applications for colorless, single- crystal diamonds produced at a rapid growth rate. The present invention is also directed to methods for producing single crystal diamonds of varying co...  
WO/2007/054995
The block (3) is surrounded by a draining layer and by a sealed, flexible, gas-impermeable sheath; suction is implemented from the top of the volume enclosed by the sheath to create therein a high degree of vacuum; polymerizable liquid r...  
WO/2007/054525
The present invention relates to a device and a method for dividing up substrates (2) in wafer form (e.g. wafers), which is used in the semiconductor industry, MST (microstructure technology) industry and photovoltaic industry, whereby i...  
WO/2007/055353
A diameter expanding groove cutting device capable of concurrently cutting a plurality of annular diameter expanding grooves in the inner peripheral wall of an anchor rough hole for anchor reinforcement implanting and an expanding/contra...  
WO/2007/054711
A tool (1) adapted in use to split a masonry block (33) , comprising a substantially ' C ' shaped frame (2) , the stem of the C being provided with a cutting member (15) , arranged so that the limbs (5, 7) of the frame are at opposite en...  
WO/2007/053167
A concrete cutting tool wherein the pitch of the handles relative to the ground surface is relative to, and interlinked, to the pitch of the connected saw blade, so that as the saw blade is raised and/or lowered into the surface to be cu...  
WO/2007/049309
A blade (1, 2, 8, 200, 300) for sawing stone material (15) comprises recesses (10, 11) on the side faces (5) and/or on the cutting edge (4) for receiving fine granules of abrasive matierial (12) necessary for the sawing operation.  
WO/2007/049020
A drill bit (10) has a cutting face (12) for engaging a workpiece. The cutting face (12) forms an annular cut. A mouth (14) is bounded by the cutting face (12) and receives material of the workpiece from within the annular cut, as cuttin...  
WO/2007/049668
A method of forming a scribe line, and apparatus therefor, realizing division of a substrate of brittle material with high straightness along a scribe line. The surface of brittle material substrate is heated at a temperature lower than ...  
WO/2007/049012
A hole saw holder comprising an elongate body having a first end and a second end, wherein the first end has an external thread (6) of sufficient length t receive a plurality of hole saws (16) , a support formation (8) at the end of the ...  
WO/2007/049020
A drill bit (10) has a cutting face (12) for engaging a workpiece. The cutting face (12) forms an annular cut. A mouth (14) is bounded by the cutting face (12) and receives material of the workpiece from within the annular cut, as cuttin...  
WO/2007/050434
A method of creating a pigmented image on a monument stone substrate includes positioning the stone relative to a laser engraving apparatus, masking the stone substrate in an image area in which the image is to be created with a first ma...  
WO/2007/045343
In a device for fixing non-ferrous metal blocks intended for being sawn up, at least one fixing unit (3) is provided for the secure fixing and simple release of a non-ferrous metal block, said fixing unit (3) having at least three lockab...  
WO/2007/045960
An abrasive cutoff wheel comprising a central disk (2) and a plurality of sintered abrasive segments (6) that are undetachably affixed to the outer circumference (8, 30) of the central disk (2) and that bilaterally protrude beyond the ce...  
WO/2007/040002
A method for growing a semiconductor ingot by Czochralski method and producing a semiconductor wafer from the ingot comprises a step (S3) for taking operational data concerning the diameter and/or the pulling speed of the ingot along the...  
WO/2007/041606
A hardfacing composition (32) that includes a plurality of hard particles (54) wherein the hard particles (54) include a mode particle size distribution, one particle size distribution smaller than the mode particle size distribution, an...  
WO/2007/036784
The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs and each...  
WO/2007/036845
The present invention finds application in the processing of stones and the like and particularly relates to a machine tool for surface processing of slabs or products having a flat surface of stone material or the like, which machine co...  
WO/2007/037118
A laser cutting device for a brittle material capable of realizing the high quality and high speed cutting of a substrate formed of the brittle material to be cut irrespective of the size of the substrate to be cut. In the laser cutting ...  
WO/2007/037096
Provided is a method for manufacturing a (110) silicon wafer by slicing a silicon single crystal ingot having plane orientation (110) by using a wire saw. The method for manufacturing the (110) silicon wafer is characterized in that the ...  

Matches 751 - 800 out of 9,664