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Patent Searching and Data


Matches 801 - 850 out of 18,274

Document Document Title
WO/2009/107153A1
A machine (1) for multiple wire cutting of stone materials comprises a supporting structure (2), a plurality of cutting devices (7) mounted parallel with each other on the supporting structure (2) and a supporting device (12) for the cut...  
WO/2009/108093A1
The present invention relates to an electric saw (1) being powered by an external power supply (200) through a multicore cable (6). The multicore cable (6) includes electrical wires (24, 25, 27) for supplying power to the motors (5, 12, ...  
WO/2009/107794A1
A separation device of a mother board for a plane display panel consists of a plurality of tables for sucking and fixing one plane display panel, and a moving device for moving a part of the plurality of tables relatively to other tables...  
WO/2009/104412A1
A processing machine (1) of plate glass is arranged such that angular control of a cutting head (9) and a grinding head (10) provided, respectively, with angle control motors (46, 49) is performed synchronously about axes (39, 39) inters...  
WO/2009/104222A1
Provided is a wire saw comprising a wire wound on a plurality of grooved rollers, for reciprocating in the axial direction, a nozzle for feeding a slurry, a patch, and a work feeding device for feeding a work being held, to the wire thro...  
WO/2009/101339A2
Abrasive grain powder, especially for machining silicon ingots, such that the D40‑D60 particle size fraction comprises more than 15% and less than 80%, by volume per cent, of grains having a circularity of less than 0.85.  
WO/2009/101761A1
Cylindrical grinding equipment for grinding the side face of a columnar ingot, comprising at least three rollers, and a centering means consisting of an arm for supporting the rollers and coming into pressure contact with the rollers by ...  
WO/2009/101760A1
A blade fixing jig set comprising, at least, two guide pins each fixed coaxially with a shaft of a pulley to the lower end of the shaft of the pulley, a jib body having plural supporting members for supporting the side surface of a blade...  
WO/2009/102630A1
A wiresaw beam for use in an apparatus for slicing wafers from an ingot, such as semiconductor wafers from a single crystal ingot or a polycrystalline silicon ingot. The wiresaw beam may be made from a polymer composite material comprisi...  
WO/2009/098699A1
A guide bar (100, 200) for power chain saws, such as concrete cutting chain saws, whereas the guide bar (100, 200) includes a toothless front pulley (140, 240), which includes a four-point bearing and dirt trapping grooves (149). The gui...  
WO/2009/097987A1
The present invention relates to a method for laser cutting a nonmetal workpiece (1) along at least one cut line (SL) for generating at least two workpiece parts (1a, 1b), wherein the workpiece (1) has laser light (2) applied thereto, lo...  
WO/2009/099130A1
Polycrystalline diamond usable in many applications is provided. Also provided are a water-jetting orifice, stylus tool for gravure printing, scriber tool, diamond tool for cutting, and scribing wheel each employing the polycrystalline d...  
WO/2009/097849A1
A fine-grained material pounding device (PD) for pounding/cutting fine-grained materials (FGM), such as slate, fiber cement or tile, is disclosed, comprising a housing, at least one movable cutter, one or more jaw elements for resting on...  
WO/2009/098721A1
A machine (1) for wire cutting stone material comprises a supporting element (11), at least one connecting element (12) connected to the supporting element (11), at least one motor-driven pulley (7) and a tensioning device (13). Mounted ...  
WO/2009/093660A1
A cutter head device for a glass cutting machine has a cutter wheel for making a cut line in a glass plate, a cutter holder for rotatably supporting the cutter wheel, a head body for supporting the cutter holder via a plate spring so tha...  
WO/2009/091264A3
The invention comprises a device and method for surface cleaning of individual wafers or substrates arranged in a stack along a stacking direction, where a jet of fluid is sent towards the stack in a direction perpendicular to the stacki...  
WO/2009/087723A1
Disclosed is an ingot cutting apparatus characterized by comprising at least an ingot supporting pad for supporting the cut ending portion of an ingot from below at the position of a clearance of a cutting table for cutting the ingot wit...  
WO/2009/084068A1
A process for the complete separation of the suspending fluid from the solid components container in an exhausted slurry, either abrasive or not, coming from the cutting operation or other mechanical working of materials of monocrystalli...  
WO/2009/084489A1
Provided is a laser working apparatus which can apply an auxiliary parting force to the parting plane of the crack in accordance with the progressing situations of a crack, thereby to perform a full-cut work reliably to the terminal end ...  
WO/2009/084276A1
Provided is a laser processing apparatus which can easily and surely perform steps from double face scribing to double face breaking. The laser processing apparatus is provided with a first beam scanning optical system (22a), which shape...  
WO/2009/084398A1
Provided is a method for forming cracks on a substrate made of a brittle material by surely stopping a second crack at an intersection with a first crack. The first crack is formed by first laser scribing, then, after adhering a friction...  
WO/2009/081621A1
Provided is a laser processing apparatus wherein a cutting state of a substrate is correctly controlled in each processing step so that the substrate is surely not cut in a step of scribing by laser irradiation and the substrate is surel...  
WO/2009/081245A1
A method for separating and recovering silicon debris from sawing waste is characterized in that it comprises the following steps: - treating the sawing waste so as to deoxidize the silicon debris in a manner that reduces their surface e...  
WO/2009/081524A1
Disclosed are a band-saw cutting apparatus, in which an endless-belt blade constituted of a blade abrasive-grain portion and a blade base is tensed between pulleys and in which a pair of static pressure pads having coolant injection port...  
WO/2009/078130A1
A wire saw for cutting a work into a wafer shape by winding a wire around a plurality of grooved rollers and applying the work to the wire while supplying slurry to the grooved rollers and running the wire, characterized in that the wire...  
WO/2009/078400A1
A cutting device having a ring saw can easily perform high-speed cutting of rock, stone, concrete, or the like. To cut such a material, the cutting device rotates the ring saw while applying impact force to the material and cuts the mate...  
WO/2009/078884A1
A gemstone is provided that has an improved brilliance, especially at the crown portion of the gemstone. The gemstone has a crown angle that is less than an ideal cut round diamond and, preferably the crown angle is less than 27 degrees....  
WO/2009/077282A1
The invention relates to a wire spool, particularly for receiving saw wire during wire sawing, comprising a spool body having at least one attachment flange (2, 3) on a spool body front side. According to the invention, the spool body ha...  
WO/2009/078324A1
Provided is a method for chamfering/machining brittle material substrates, by which the substrate surfaces can be chamfered or rounded. A laser beam is applied to an edge line (EL) where chamfering/machining is to be performed such that ...  
WO/2009/074776A1
Cutting apparatus (10) includes a pilot arrangement (20) which has a tip (42). The tip engages a workpiece to form a pilot recess to engage the workpiece and prevent the apparatus skidding across the surface of the workpiece. The tip (42...  
WO/2009/074317A1
In a method of separating wafers (12) from a vertical wafer stack (16), the wafers (12) are transported away individually from above via movement means (23) which act from above. The movement means (23) are designed as circulating belts ...  
WO/2009/075612A1
A preferred embodiment of a hand-operated flush cutting machine (1) comprises a front section (3) with a first and a second disc shaped cutter blade (7,8) which are rotary about an axis of rotation (26) and mounted in the front end of an...  
WO/2009/075062A1
A wire saw for cutting a work at a plurality of points arranged in the axial direction simultaneously by winding a cutting wire around a plurality of rollers to form a wire line, driving the cutting wire reciprocatingly in the axial dire...  
WO/2009/072959A1
An exemplary breaking or excavating tool (2) includes a body (4) having a mounting end (6) and a working end (8). A seating surface (12) at the working end (8) includes a cavity (14) and axially projecting sidewalls (16) formed integral ...  
WO/2009/072176A1
In a multiwire saw, a wire string formed by winding a wire between a plurality of rollers having a plurality of wire grooves is traveled, a work is press-fitted to the wire while working fluid comprising grains is supplied to the wire st...  
WO/2009/071724A1
The invention relates to a tool comprising a handle (1) which is coupled to the cutter and a cutting disk (3) which is mounted by means of a pivot pin (2) to a fork (11) defined at the front end of the handle. The cutting disk (3) is for...  
WO/2009/073804A9
Self-propelled cutting apparatus and related methods are disclosed. An exemplary apparatus includes a frame to which are mounted at least one cutting device and a locomotion device. A control device, coupled to the locomotion device and ...  
WO/2009/072958A1
An exemplary breaking or excavating tool (102) comprising a body (104) having a mounting end (106) and a working end (108). Aseating surface (112) at the working end (108) including a cavity (114) and axially projecting sidewalls (116) f...  
WO/2009/073804A3
Self-propelled cutting apparatus and related methods are disclosed. An exemplary apparatus includes a frame to which are mounted at least one cutting device and a locomotion device. A control device, coupled to the locomotion device and ...  
WO/2009/069375A1
A laser machining device enabling a reduction in installation space and rotation of a substrate by using a fixed table without using a table rotating mechanism. A laser machining device comprises a positionally fixed table (40) whose sub...  
WO/2009/067967A1
The invention relates to a tumbler (1) for the treatment of molded bricks (2), particularly made of concrete, comprising a drum (4) that can be rotated about the longitudinal axis (3) thereof, the drum (4) comprising a pipe (5) and at le...  
WO/2009/062744A1
A method for dividing monocrystals is provided, comprising the following steps: preadjusting the crystallographic cleavage plane (2') with respect to the cleaving device; predetermining a stress intensity (K) via stress fields (3', 4'); ...  
WO/2009/060562A1
Provided is a wire saw apparatus comprising a wire made to run on a plurality of grooved rollers for running reciprocally in an axial direction, a nozzle for feeding slurry, and a work feeding mechanism for feeding a work to the wire whi...  
WO/2009/060691A1
A machining method of a bonded substrate which can be machined surely according to a prescribed procedure even if the width of an end material portion to be cut off in order to expose a terminal portion becomes small. (a) A first scribe ...  
WO/2009/056153A1
The present invention relates to a method and a system for manufacturing wafer-like slices from a body (10) of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing...  
WO/2009/057381A1
Provided is a method which can stably cut a substrate while reducing a bending moment (break pressure) required for the cutting. The method for cutting a fragile material substrate includes: a step for forming a crack along a planned cut...  
WO/2009/057474A1
A device for scoring a glass sheet applies a score line for cutting to the glass sheet conveyed on conveyance rollers. The device has a cutter for applying a score line to a glass sheet, ball slide means capable of lifting and lowering t...  
WO/2009/056227A1
The invention relates to a shank chisel, particularly a chisel for milling roads, with a carrier part (10) comprising a shank (11), wherein the shank is provided with a chisel tip (18) made of a hard material. The carrier part comprises ...  
WO/2009/053007A1
The invention relates to a method and a device for recovering a mixture of a dispersant and abrasive grains as abrasives. The mixture is used for machining, especially for separating by machining, workpieces, preferably semiconductor cry...  
WO/2009/053006A1
The invention relates to the use of a mixture of a thixotropic dispersant and abrasive grains as abrasives for machining workpieces, especially semiconductor crystals. The invention thus provides a method for recovering the mixture in an...  

Matches 801 - 850 out of 18,274