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Patent Searching and Data


Matches 801 - 850 out of 18,628

Document Document Title
WO/2010/006148A3
A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques ...  
WO/2010/006148A2
A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques ...  
WO/2010/000169A1
A device for cutting wafers by wire and its method, which grinds wafers by a steel wire web (2) formed by one steel wire guided multiple times around a wire guiding rolls (1) provided with grooves. Based on the principle that the diamete...  
WO/2010/001529A1
Provided is a method for cutting a work into the shape of a wafer by pressing a cylindrical work held by a work holder against a wire array formed of wires wound spirally between a plurality of wire guides and then running the wires whil...  
WO/2010/001961A1
A method of regenerating a coolant is provided with which a regenerated slurry can be inhibited from having an increased viscosity. The method of coolant regeneration comprises subjecting a spent slurry discharged after the cutting of a ...  
WO/2009/157757A1
The invention relates to a device and method for manufacturing decorative elements from glass and/or ceramic marbles (35), wherein the method comprises steps for: - providing at least one marble (35); - fixing the marble in a fixing memb...  
WO/2009/157757A8
The invention relates to a device and method for manufacturing decorative elements from glass and/or ceramic marbles (35), wherein the method comprises steps for: - providing at least one marble (35); - fixing the marble in a fixing memb...  
WO/2009/157440A1
Provided is a scribing apparatus (1000), which can form scribing lines on two parts at the same time, on the front surface and the rear surface of a bonded substrate formed by bonding brittle substrates, and thus, can shorten a machining...  
WO/2009/153877A1
[PROBLEMS] In cutting an ingot by using a multi-wire saw, to improve material use efficiency by reducing variations in thickness among wafers to be obtained to thereby reduce material loss in cutting and improve working efficiency by sho...  
WO/2009/154022A1
Provided is a substrate processing system wherein a unit display panel arranged on a mother board in prescribed layout can be taken out without damaging a terminal region. The substrate processing system is provided with a scribe apparat...  
WO/2009/153887A1
[PROBLEMS] In cutting an ingot by using a multi-wire saw, to improve material use efficiency by reducing variations in thickness among wafers to be obtained to thereby reduce material loss in cutting and improve working efficiency by sho...  
WO/2009/154012A1
Provided is a method for processing a substrate wherein occurrence of a defective article due to adhesion of an end material region to the side of terminal cut surface is eliminated. In a method for processing the substrate of a mother b...  
WO/2009/150520A1
An apparatus comprises a conveying device (2) arranged for advancing a ceramic product (1) along an advancing direction (F) and fracture promoting means arranged for fracturing said ceramic product (1), said fracture promoting means comp...  
WO/2009/149784A1
In a method of processing plaster elements, a laying unit comprising a number of plaster elements (12) and a corresponding joint pattern (14) is placed on a substantially smooth support (10) such that the plaster elements (12) are locate...  
WO/2009/147074A1
The method relates to the manufacture of a reinforced diamond-coated cable for cutting structures and materials of steel, concrete, steel and concrete, stone materials or the like, in which such diamond-coated cable comprises a plurality...  
WO/2009/146940A1
In order to fasten a silicon block (13) on a support (16) for improved further handling, fibre material (22) which is impregnated with adhesive (23) and consists of glass fibres is introduced into an adhesive join (20) between the silico...  
WO/2009/148073A1
Provided is a scribing wheel, which has a long service life with less wearing of a blade edge and can generate a deeper vertical crack as needed, and furthermore, has less blade edge wearing even when a relatively hard substrate, such as...  
WO/2009/143567A1
A wet cutting saw comprising: a blade rotatable about an axis; a liquid feed conduit for feeding liquid onto a surface of the blade as it rotates; a hood comprising a top wall located above the blade and a side wall located to one side o...  
WO/2009/144594A1
A method for processing diamonds and corresponding ornamental diamond structures employ diamonds having visible cloud inclusions. The diamond is cut and polished to form crown and pavilion facets angled so as to form a light transmission...  
WO/2009/145058A1
Provided is a scribe apparatus wherein the width of a scribe line to be formed can be easily adjusted. The scribe apparatus is provided with a supporting means which supports a substrate of a thin film solar cell; a scribe head which pre...  
WO/2009/145008A1
Provided are a laser working method and a laser working apparatus using a cooling method by a solid contact, which are freed from the problem of producing metal powder, the problem of sticking blots of a cooling member to a substrate, an...  
WO/2009/145026A1
The issue is to provide a chamfering method that can work even in a narrow space without using an abrasive member and without the need for a washing process to accompany the chamfering process. A brittle material substrate surface is scr...  
WO/2009/143247A2
A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being ...  
WO/2009/142578A1
A road grading pick includesa cutting head, a shank, a shoulder at a transition between the cutting head and the shank, and a polygonal-shaped washeror an oval- shaped washer. The shank is positioned in anopening of the washer to positio...  
WO/2009/143247A3
A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being ...  
WO/2009/135681A4
The invention relates to a drill comprising a one-piece hard-metal element, which extends transversely over the drill head in a star shape. A cutting edge (22) of the drill head, especially a single one, extends in the central region the...  
WO/2009/135681A1
The invention relates to a drill comprising a one-piece hard-metal element, which extends transversely over the drill head in a star shape. A cutting edge (22) of the drill head, especially a single one, extends in the central region the...  
WO/2009/133612A1
A water-soluble cutting fluid composition which is inhibited from catching fire or generating a gas, is highly safe, and changes little in viscosity; a water-soluble cutting fluid; and a method of cutting with the water-soluble cutting f...  
WO/2009/133832A1
Provided are a brittle material breaking apparatus and a brittle material breaking method wherein a brittle material can be broken while continuously moving the brittle material, and the brittle material can be surely broken without alig...  
WO/2009/133453A1
The present invention relates to a process for reinforcing blocks (1) or slabs of stone material in a quarry, including the cutting and/or perforation of a bench (2) at at least three faces of a block to be obtained and its separation fr...  
WO/2009/134968A1
Embodiments of the present invention are directed to a fixture assembly that is capable of holding work pieces such tiles of various sizes in various positions in a manner which enables freehand cutting. Various embodiments include a mai...  
WO/2009/134212A1
A system for cutting a plurality of substrates of integrated circuit units comprising a plurality of tables (40, 55), each table including a plurality of trays (37A, 37B, 57A, 57B), each tray arranged to receive one of said substrates; e...  
WO/2009/130549A1
The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of ...  
WO/2009/128334A1
A method of machining a fragile material substrate enables stable laser break processing. The method of machining, in machining the substrate from a first substrate end to a second substrate end along a scribe-scheduled line, executes a ...  
WO/2009/128314A1
Provided is a method for processing a fragile material substrate that can carry out stable laser break processing. A method for processing a fragile material substrate comprises (a) an initial crack forming step of forming an initial cra...  
WO/2009/128315A1
Provided is a method for processing a fragile material substrate that enable to stably execute laser break processes, such as complete cutting-off of the substrate and forming of a deeper scribe line. A method for processing a fragile ma...  
WO/2009/128316A1
Provided is a method for processing a fragile material substrate that enables to stably execute processes, such as complete cutting off of the substrate and forming of a deeper scribe line. A method for processing a fragile material subs...  
WO/2009/124415A1
A stone saw blade is a longitudinal rectangular long-bar in shape and has two opposite longitudinal upper top surface (20) and lower bottom surface (20'), two opposite longitudinal lateral surfaces (10, 10'), and two opposite end surface...  
WO/2009/112838A1
A method of producing a strip of laminate stone material, the method including the steps of slicing a plurality of thin sheets of stone, bonding the sheets to form a laminate structure, and cutting the laminate structure end-on to produc...  
WO/2009/112960A1
Method for sawing blocks of stone material by means of a multi-blade machine, comprising a blade-holder frame (20) provided with straight cutting blades, in which said frame is brought into contact with the block (50) to be cut with a re...  
WO/2009/109405A1
The invention relates to a grinding tool for building elements or building constructions made of concrete, stone, brick and similar mineral substances for producing a T-shaped back-cut notch in the building element (50) or building const...  
WO/2009/109837A1
An apparatus (1) for dividing flat products (M), comprising conveying means (3, 4) for introducing into said apparatus (1) and extracting from said apparatus (1) a flat product (M), incision means (9) for making incisions on a visible su...  
WO/2009/108094A1
A saw (1) being portable and/or wheeled, such as a wall saw, floor saw or masonry saw,comprising a rotatable circular saw blade (3), a drive motor (5) with an output shaft (9) for rotating the saw blade (3), and a transmission (20) for i...  
WO/2009/107153A1
A machine (1) for multiple wire cutting of stone materials comprises a supporting structure (2), a plurality of cutting devices (7) mounted parallel with each other on the supporting structure (2) and a supporting device (12) for the cut...  
WO/2009/108093A1
The present invention relates to an electric saw (1) being powered by an external power supply (200) through a multicore cable (6). The multicore cable (6) includes electrical wires (24, 25, 27) for supplying power to the motors (5, 12, ...  
WO/2009/107794A1
A separation device of a mother board for a plane display panel consists of a plurality of tables for sucking and fixing one plane display panel, and a moving device for moving a part of the plurality of tables relatively to other tables...  
WO/2009/104412A1
A processing machine (1) of plate glass is arranged such that angular control of a cutting head (9) and a grinding head (10) provided, respectively, with angle control motors (46, 49) is performed synchronously about axes (39, 39) inters...  
WO/2009/104222A1
Provided is a wire saw comprising a wire wound on a plurality of grooved rollers, for reciprocating in the axial direction, a nozzle for feeding a slurry, a patch, and a work feeding device for feeding a work being held, to the wire thro...  
WO/2009/101339A2
Abrasive grain powder, especially for machining silicon ingots, such that the D40‑D60 particle size fraction comprises more than 15% and less than 80%, by volume per cent, of grains having a circularity of less than 0.85.  
WO/2009/101761A1
Cylindrical grinding equipment for grinding the side face of a columnar ingot, comprising at least three rollers, and a centering means consisting of an arm for supporting the rollers and coming into pressure contact with the rollers by ...  

Matches 801 - 850 out of 18,628