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Patent Searching and Data


Matches 801 - 850 out of 9,771

Document Document Title
WO/2007/082065
A concrete saw can be operated at multiple speeds. The saw includes at least one neutral. A multispeed gearbox has one configuration with no more than two gear shafts. The gearbox can be mounted directly to an engine output shaft. The en...  
WO/2007/077589
A device for drilling printed circuit boards comprising a first drill head (8a) guided along a drilling axis (Z) towards and away from a corresponding first drilling plane ((XY)a) substantially perpendicular to the drilling axis, the dri...  
WO/2007/076997
The invention relates to a preliminary material (1) for a stone gang saw (2), in particular for processing bright types of stone, comprising a steel strip support (10) having a plurality of slots (20) in the centre stip of the steel stri...  
WO/2007/074823
A focusing point P is adjusted to the inside of a substrate (4) of a working object (1) comprising a substrate (4) and a plurality of functional elements (15) provided on a surface (3) of the substrate (4). A laser beam L is applied to t...  
WO/2007/072464
A machine for optimized cutting of slabs (16) of stone or stone-like material lying on a primary bench (34) comprises a first beam (28) on which a plurality of spindles (30) are mounted and is movably supported on two travelways (24, 26)...  
WO/2007/073356
A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a long...  
WO/2007/073356
A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a long...  
WO/2007/072464
A machine for optimized cutting of slabs (16) of stone or stone-like material lying on a primary bench (34) comprises a first beam (28) on which a plurality of spindles (30) are mounted and is movably supported on two travelways (24, 26)...  
WO/2007/069668
[PROBLEMS] To provide a diamond scriber suitable for a plate member requiring a scribe particularly under a high load and to provide a shank for fabricating the diamond scriber. [MEANS FOR SOLVING PROBLEMS] A shank (2) can hold a single ...  
WO/2007/065309
A diamond tool for cutting stone material comprises a base body, and a stepped connecting portion that is provided concentrically on the outer periphery of the base body. A plurality of pillar cutting blades are provided on the connectin...  
WO/2007/065665
An apparatus for cleaning a sawn wafer block (40) has a cleaning basin (10), a holder (50, 52) for holding a sawn wafer block (40) in the cleaning basin (10) in such a way that, when there is a cleaning fluid (34) in the cleaning basin (...  
WO/2007/063979
A chip (14) is rotatably attached to a chip holder (10). The chip holder (10) is made into a cylindrical shape and its tip end has an attachment unit (16). An opening is arranged at a holder joint. The chip holder (10) is adsorbed by a m...  
WO/2007/063559
A machine for cutting stone materials comprises a fixed supporting structure (2) and a frame (3) slidably mounted on the supporting structure (2). A plurality of cutting devices (4) is mounted parallel with one another on the frame (3). ...  
WO/2007/061018
A method of glass substrate working, comprising the step of irradiating glass substrate (1) with pulsed laser beams (L) so that the same is focused within the glass substrate (1), thereby creating, around the portion where the pulsed las...  
WO/2007/059251
The present invention is directed to new uses and applications for colorless, single- crystal diamonds produced at a rapid growth rate. The present invention is also directed to methods for producing single crystal diamonds of varying co...  
WO/2007/054995
The block (3) is surrounded by a draining layer and by a sealed, flexible, gas-impermeable sheath; suction is implemented from the top of the volume enclosed by the sheath to create therein a high degree of vacuum; polymerizable liquid r...  
WO/2007/054525
The present invention relates to a device and a method for dividing up substrates (2) in wafer form (e.g. wafers), which is used in the semiconductor industry, MST (microstructure technology) industry and photovoltaic industry, whereby i...  
WO/2007/055353
A diameter expanding groove cutting device capable of concurrently cutting a plurality of annular diameter expanding grooves in the inner peripheral wall of an anchor rough hole for anchor reinforcement implanting and an expanding/contra...  
WO/2007/054711
A tool (1) adapted in use to split a masonry block (33) , comprising a substantially ' C ' shaped frame (2) , the stem of the C being provided with a cutting member (15) , arranged so that the limbs (5, 7) of the frame are at opposite en...  
WO/2007/053167
A concrete cutting tool wherein the pitch of the handles relative to the ground surface is relative to, and interlinked, to the pitch of the connected saw blade, so that as the saw blade is raised and/or lowered into the surface to be cu...  
WO/2007/049309
A blade (1, 2, 8, 200, 300) for sawing stone material (15) comprises recesses (10, 11) on the side faces (5) and/or on the cutting edge (4) for receiving fine granules of abrasive matierial (12) necessary for the sawing operation.  
WO/2007/049020
A drill bit (10) has a cutting face (12) for engaging a workpiece. The cutting face (12) forms an annular cut. A mouth (14) is bounded by the cutting face (12) and receives material of the workpiece from within the annular cut, as cuttin...  
WO/2007/049668
A method of forming a scribe line, and apparatus therefor, realizing division of a substrate of brittle material with high straightness along a scribe line. The surface of brittle material substrate is heated at a temperature lower than ...  
WO/2007/049012
A hole saw holder comprising an elongate body having a first end and a second end, wherein the first end has an external thread (6) of sufficient length t receive a plurality of hole saws (16) , a support formation (8) at the end of the ...  
WO/2007/049020
A drill bit (10) has a cutting face (12) for engaging a workpiece. The cutting face (12) forms an annular cut. A mouth (14) is bounded by the cutting face (12) and receives material of the workpiece from within the annular cut, as cuttin...  
WO/2007/050434
A method of creating a pigmented image on a monument stone substrate includes positioning the stone relative to a laser engraving apparatus, masking the stone substrate in an image area in which the image is to be created with a first ma...  
WO/2007/045343
In a device for fixing non-ferrous metal blocks intended for being sawn up, at least one fixing unit (3) is provided for the secure fixing and simple release of a non-ferrous metal block, said fixing unit (3) having at least three lockab...  
WO/2007/045960
An abrasive cutoff wheel comprising a central disk (2) and a plurality of sintered abrasive segments (6) that are undetachably affixed to the outer circumference (8, 30) of the central disk (2) and that bilaterally protrude beyond the ce...  
WO/2007/040002
A method for growing a semiconductor ingot by Czochralski method and producing a semiconductor wafer from the ingot comprises a step (S3) for taking operational data concerning the diameter and/or the pulling speed of the ingot along the...  
WO/2007/041606
A hardfacing composition (32) that includes a plurality of hard particles (54) wherein the hard particles (54) include a mode particle size distribution, one particle size distribution smaller than the mode particle size distribution, an...  
WO/2007/036784
The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs and each...  
WO/2007/036845
The present invention finds application in the processing of stones and the like and particularly relates to a machine tool for surface processing of slabs or products having a flat surface of stone material or the like, which machine co...  
WO/2007/037118
A laser cutting device for a brittle material capable of realizing the high quality and high speed cutting of a substrate formed of the brittle material to be cut irrespective of the size of the substrate to be cut. In the laser cutting ...  
WO/2007/037096
Provided is a method for manufacturing a (110) silicon wafer by slicing a silicon single crystal ingot having plane orientation (110) by using a wire saw. The method for manufacturing the (110) silicon wafer is characterized in that the ...  
WO/2007/035097
The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a...  
WO/2007/035097
The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a...  
WO/2007/032346
A cutter (51) is composed of a disc-shaped cutting blade (22) having a through hole (21) at the center; an annular piezoelectric vibrator (25), which is concentrically fixed with the blade (22), in a region inside an outer circumference ...  
WO/2007/032392
A laser processing method in which the sectional shape at a focusing point P of a laser beam L is such that a maximum length in a direction perpendicular to a scheduled cutting line (5) is shorter than a maximum length in a direction par...  
WO/2007/028359
The invention relates to a method and device for processing workpieces (1), which are made of glass or glass ceramics, with tools (4, 5) having a special geometric blade. To this end, the material of the workpiece (1) is first softened i...  
WO/2007/026512
Disclosed are a wire saw device; and a method of improving a nanotopography on the surface of a wafer formed by cutting an ingot by a wire saw device. The method improves the straightness of the feeding of a work feed table installed in ...  
WO/2007/020835
A system for brittle material cutting process is provided to perform high quality and high speed cutting process to a brittle material substrate to be processed, irrespective of sizes of the substrate to be processed. A substrate holder ...  
WO/2007/020822
A laser processing method in which particles are prevented from being generated from the cutting surface of a chip obtained by cutting a silicon wafer. Irradiation conditions of laser light (L) for forming modified regions (77-712) are a...  
WO/2007/021193
Method and system for controlling a wire tension system for a diamond wire saw in a diamond wire machine, comprising monitoring the cylinder extension (CE) as a measure of the wire extension and comparing the wire extension with the maxi...  
WO/2007/020414
An apparatus for splitting stones and blocks comprises means (5A, 6A) for supporting a stone or block while it is subject to a splitting operation, a unit which includes an upper blade (1) for engaging an upper surface of the stone or bl...  
WO/2007/017569
An ophthalmic lens milling and boring device comprising supporting means for clamping and rotating the lens about an axis of rotation, means for milling the lens in the supporting means, and means for boring the lens in the supporting me...  
WO/2007/017870
A machine for shaping blanks to create a lens, the machine comprising a pair of worktables, driven by a first motor, and supporting blanks to be shaped; a drill bit unit with a rotatable drill bit; an elevator, driven by a second motor, ...  
WO/2007/017870
A machine for shaping blanks to create a lens, the machine comprising a pair of worktables, driven by a first motor, and supporting blanks to be shaped; a drill bit unit with a rotatable drill bit; an elevator, driven by a second motor, ...  
WO/2007/012717
The inventive machine (11) comprises a lens support (19), a tool holding assembly (21) provided with a rotatable drilling tool (39) and means (25) for controlling the drilling tool (39) position with respect to the support (19) comprisin...  
WO/2007/009436
Thin natural stone slabs (1), which are glued to a support (2, 3), can be produced by sawing thick natural stone slabs with the aid of a splitting machine (4).  
WO/2007/010177
There is provided a cutting tool (100; 200; 300) which is capable of performing cutting operations on a variety of materials such as, for example, plasterboard, glass, wood, laminated wood, cardboard, Perspex (Trade Mark), tiles, plastic...  

Matches 801 - 850 out of 9,771