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Patent Searching and Data


Matches 151 - 200 out of 17,556

Document Document Title
WO/2014/035481A1
The present invention discloses a group III nitride wafer such as GaN, AlN, InN and their alloys having one surface visually distinguishable from the other surface. After slicing of the wafer from a bulk crystal of group III nitride with...  
WO/2014/033243A3
The present invention relates to a method for the treatment and/or recycling of sawing slurries, particularly of semiconductor materials, arising in mechanical cutting methods. The sawing slurries contain particles of semiconductor mater...  
WO/2014/034841A1
A method for cutting a high-hardness material by a multi-wire saw comprises: a step (A) for preparing at least one ingot having a main body portion (10a) having both ends and a low-quality crystalline portion (10e) located at only one of...  
WO/2014/034805A1
A manufacturing method of one embodiment of the present invention includes: a step for forming a taper-shaped first groove (151) in the front surface (100a) of a semiconductor wafer (110); a step for forming a narrow-width cut groove (15...  
WO/2014/033594A1
The present invention relates to a process for obtaining an annular element for a wire for cutting stone material, comprising the following sequential steps: fitting at least one elastically yieldable element (5) on a bar (8); placing a ...  
WO/2014/029734A1
A diamond bead (10) for cutting stone-like material, comprising a central supporting element (11), provided with a through opening (12), and a diamond annular cutting body (13), which is fixed so as to surround the central supporting ele...  
WO/2014/029671A1
A method of cutting a super-hard material (8) using an electron beam (6), wherein the electron beam (6) is directed onto a surface of the super-hard material (8) and moved relative to the surface such that the electron beam (6) moves acr...  
WO/2014/021606A2
The present invention relates to a method and apparatus for processing an edge of glass, and more particularly, to a method and apparatus for heat treating and processing an edge of a large thin glass sheet used for a liquid crystal TV o...  
WO/2014/022333A1
A tool holder (46) is disclosed for use with a milling drum (16). The tool holder may have a generally cylindrical body (82) defining a first end (86) configured to be received within a tool mounting block (44) of the milling drum, and a...  
WO/2014/022331A1
A tool mounting block (44) is disclosed for use with a milling drum (16). The tool mounting block (44) may have a flighting portion (50) with a base surface (56) configured to engage an outer cylindrical surface (30) of the milling drum ...  
WO/2014/021606A3
The present invention relates to a method and apparatus for processing an edge of glass, and more particularly, to a method and apparatus for heat treating and processing an edge of a large thin glass sheet used for a liquid crystal TV o...  
WO/2014/017748A1
The present invention relates to a wire saw which enables materials such as concrete or stone to be cut, and one object thereof is to provide a diamond wire saw in which the front of a bead is curved for appropriate work without being in...  
WO/2014/017878A2
The present invention relates to a scribing wheel comprising: a wheel-shaped wheel body, the thickness of at least the edge of the circumference of which gradually decreases when progressing radially outward; and a cutter unit having a p...  
WO/2014/017577A1
A method for manufacturing sheet glass, comprising forming, on the periphery of an edge part (Ga) of a rectangular sheet glass (G), a scribe (S) parallel to the edge part (Ga) on one surface of the sheet glass (G), and breaking the sheet...  
WO/2014/017878A3
The present invention relates to a scribing wheel comprising: a wheel-shaped wheel body, the thickness of at least the edge of the circumference of which gradually decreases when progressing radially outward; and a cutter unit having a p...  
WO/2014/012879A1
The invention relates to a device for separating wafers from a wafer stack which is located on a support device in a liquid container, said support device being equipped with an advancing device for the wafer stack. The aim of the invent...  
WO/2014/013466A3
An apparatus (1) with a reciprocating component (3) fitted with composite cushioning slides (13) on an exterior surface (8, 9). The reciprocating component (3) is movable along a reciprocation path and the composite cushioning slide (13)...  
WO/2014/013450A1
A method for manufacturing tubular supports (4) designed to support respective diamond cutting members (3) to obtain diamond beads (5) coupled to a flexible support structure (2) for manufacturing a wire (1) for cutting slabs from blocks...  
WO/2014/008726A1
A stone floor tile manufacturing method for manufacturing the floor tile (10) of a stone floor (1), the method comprising the following steps: (1) processing a stone into a slab; (2) polishing the slab to give a definite thickness and pr...  
WO/2014/008723A1
Automatic Cutting equipment for processing stone floor tile, the equipment comprising: a material feeding device (31), a conveying device, a cutting device, and a material discharge device (39). The conveying device conveys a fixed-thick...  
WO/2014/008742A1
A method for hole grinding with a small-size drill bit. The method comprises the following steps of: (S1) designing a processing drawing; and assisting the shape and dimension design of the hole needing to be processed on computer accord...  
WO/2014/010154A1
A scribing device (1) is provided with: a worktable (6) on which a glass substrate (5) as a brittle material substrate on which alignment marks (M1, M2, M3...) are made on the upper surface thereof, is mounted, aligned, and secured by su...  
WO/2014/008721A1
An inlaying and tiling method for an inlaid stone floor (1), the method comprising the following steps: (1) processing a stone floor tile (10) to give the tile (10) a tiling structure (11, 12); (2) processing inlaid floor tile (10) to gi...  
WO/2014/010686A1
Provided is a method for producing a functional substrate and that achieves sufficiently high production characteristics. In a cutting step of the method for producing a functional substrate, an intermediate layer (17) is locally heated ...  
WO/2014/005221A1
A powered tile breaker having a main adjustable frame with handlebars located at a top end section thereof, at least one wheel located at a lower end section thereof, and an adjustable shaft connected between the top end section and the ...  
WO/2014/000005A1
The invention relates to a cable saw for extracting, for example, a block of stone from a mountain, comprising a sawing unit comprising a saw cable (1) which is provided with, in particular, diamond sections, and a guide device for the s...  
WO/2014/000003A1
The invention relates to a cable saw (1) comprising a sawing device (2). Said sawing device (2) comprises a saw cable (3) provided, in particular with diamond sections, and a guide device for the saw cable (3) which can be driven by a dr...  
WO/2014/001428A2
The present invention relates to a crushing machine pulverizing the asphalt layer (RAP), which is desired to be recycled by being removed from the place thereof, in order to transform the RAP into recycled asphalt concrete (RAC).  
WO/2014/003157A1
An aqueous processing liquid to be used when cutting a fragile material with a wire saw incorporates a water-soluble polymer, and is characterized in that the mass average molecular weight of the water-soluble polymer is 3×103 to 6×105...  
WO/2014/000004A1
The invention relates to a device for quarrying solid workpieces such as stone or concrete foundations, comprising a milling cutter (1) with a milling head (7) and which can be driven by a drive cable (9) provided with diamond segments a...  
WO/2014/001428A3
The present invention relates to a crushing machine pulverizing the asphalt layer (RAP), which is desired to be recycled by being removed from the place thereof, in order to transform the RAP into recycled asphalt concrete (RAC).  
WO/2013/185952A1
The invention relates to a method for cutting a single crystal (1) having a first polar axis (P1) comprising the steps of arranging the single crystal (1) relative to a cutting tool (2) in such a way that the first polar axis (P1) is ori...  
WO/2013/187837A3
An electric power saw/cutter (1) comprising: a.a rotatable saw structure (2) b.a rear handle (5) with a switch/speed control (6) c.a front handle (7) d.a drive unit (8) for rotating the saw structure (2), the drive unit (8) itself compri...  
WO/2013/183831A1
The present invention relates to a stone cutting machine and provides an ultra-slim stone cutting machine, comprising: a "U" shaped port frame (1) open at the bottom side thereof and mounted on the ground surface and including two column...  
WO/2013/179498A1
[Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains a smooth wafer in which the thickness of a damaged layer on the wafer surface caused by cuttin...  
WO/2013/176089A1
The invention sets cut plan lines (51, 52) for cutting an item to be processed (1) such that neither of said cut plan lines (51, 52) is parallel to an a-plane or an m-plane of a hexagonal crystalline compound. A laser beam (L) is irradia...  
WO/2013/175398A1
A cutting apparatus (1) for use in machines for cutting blocks (2) of schistose materials comprises: a cutting actuator unit (4) that exerts a pushing action in a pushing direction on a cutting blade (10) whose blade body has an overall ...  
WO/2013/166976A1
A method for manufacturing a resin diamond wire comprising viscose, carborundum, and a core wire. The method comprises the steps of: preparing a carborundum resin liquid comprising carborundum coated with metal, a resin adhesive, an orga...  
WO/2013/156606A1
The machine comprises a bearing structure (103), a first guide drum (109) for guiding at least one cutting wire (F) and a second guide drum (111) for the cutting wire. The first guide drum and the second guide drum are movable along the ...  
WO/2013/150428A1
An apparatus (12) for calibrating slabs of agglomerated or natural stone material comprises at least one calibrating unit (15) provided with a calibrating head which is rotatable about a first rotational axis (16) perpendicular to a work...  
WO/2013/151074A1
This glass film fracturing method involves a full body fracturing step in which an initial crack (8) is developed along a planned cutting line (4, 5) by heating the 200μm or thinner glass film (GF) with a laser (9) and performing coolin...  
WO/2013/151075A1
A laminate body manufacturing step is carried out in which a glass film laminate body (3) is manufactured by placing in contact with one another the surfaces (1a, 2a) of a 200μm or thinner glass film (GF) and a support glass (GS) suppor...  
WO/2013/150990A1
The present invention relates to a reinforced glass sheet-cutting method for cutting by irradiating a reinforced glass sheet (10) with laser light. This reinforced glass sheet-cutting method is provided with: a step for cutting out a fir...  
WO/2013/151660A1
The disclosure is directed to a cutting process involving: (a) creating a starter crack (41-48) using a scribe wheel, (b) application of laser or electrothermal heating, and (c) subsequent cooling from a gas or an aerosol jet, as the las...  
WO/2013/143844A1
Previously, in order to produce a dimensionally stable fused-quartz hollow cylinder, an output cylinder having a centre axis would have been prepared, said output cylinder being produced by means of a bore having a boring bar, said bore ...  
WO/2013/140198A1
A cutting blade includes a blade body 10 with one or more cutting elements 20/50 positioned along its periphery. The elements can be keyed to the blade core to help provide secure mounting onto the blade, and can include a polychrystalin...  
WO/2013/139668A1
In the case of a drilling tool (1), comprising a drilling stub (6), a cutting element attached to the drilling stub (6) and an attachment portion for attachment to a tool holder (3), wherein the attachment portion is divided into at leas...  
WO/2013/133030A1
The periphery of a scribing wheel (10) is polished in a V shape, and a diamond film (14) is formed on a polished surface. A polished surface (15) is then formed by rough polishing a band-shaped portion including a ridge line at the tip o...  
WO/2013/130581A1
Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having a main surface, a tension region within an interior thereof, and a compression...  
WO/2013/128688A1
[Problem] To provide a method that is for cutting a silicon ingot and that, without using an abrasive grit, can efficiently cut a silicon ingot by means of a simple process, and that can cause a silicon wafer to become a thin film and to...  

Matches 151 - 200 out of 17,556