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Patent Searching and Data


Matches 151 - 200 out of 18,851

Document Document Title
WO/2016/012952A1
Systems and methods for gemstone processing are described herein. According to an embodiment, a gemstone processing system includes a visualization system (100) for capturing stresses in a rough gemstone (104). The visualization system (...  
WO/2016/010789A3
A process for cold cleaving a single-crystal material such as sapphire at cryogenic temperatures includes cooling the single-crystal material to a cryogenic temperature such as, e.g., about the boiling point of nitrogen. The cooled singl...  
WO/2016/010422A1
Apparatus (1) for grinding material such as present in a blast furnace (3) hearth bottom (2), which apparatus comprises a grinder (4) for carbonaceous materials such as carbon blocks and/or bricks, which apparatus further comprises a rob...  
WO/2015/198281A1
A wire shaping machine (12) comprising two columns (14, 16) each of which is provided with a carriage (18, 20). At least one pulley (22, 24) is provided on each carriage (18, 20), the pulleys (22, 24) being adapted to engage with and mov...  
WO/2015/197665A1
Drive shaft (6) for a machine tool (1), for example, a core drilling machine, able to be connected to a drilling tool (2), in particular a core bit, containing a cavity (11) which substantially extends over the whole length of the drive ...  
WO/2015/196826A1
A method for treating stone blocks, comprising the following steps: S1, wrapping the stone blocks by a reinforcing material, and then wrapping the stone blocks by a sealing material, so as to form a sealed space between the sealing mater...  
WO/2015/197667A1
A method for controlling a water supply system (1) for use with a machine tool (2) containing a housing (3) with at least one interface (13) for supplying electrical energy; a water tank (4); a line (7); a pump device (9); a current-meas...  
WO/2015/198748A1
In the present invention, a cutting edge (51) having a protruding part (PP) and a front part leading to the protruding part (PP) is pressed onto a surface (SF) of a brittle substrate (4). Having been pressed thereon, the cutting edge (51...  
WO/2015/197523A1
The invention primarily relates to a device (1) for wire cutting (2) of a piece to be cut (3), intended to move with respect to the wire (2) to enable the cut, comprising at least one first rotary member (5a) rotating around a first axis...  
WO/2015/197669A1
The invention relates to a method for controlling a water supply system (11) to be used with a machine tool (2), in particular a core boring device, containing a water reservoir for storing water; a line (5) for transporting water from t...  
WO/2015/199565A1
Self-Propelled Machine for Slicing Rocks by means of Diamond. Wire for the Transformation of hewn slabs into blocks This invention relates to a self-propelled machine for slicing rocks by means of diamond wire (5) for the transformation ...  
WO/2015/194567A1
Multiple beads (3) are arranged apart from each other on a wire rope (2). Each bead (3) is equipped with an annular diamond layer (4) disposed on the outer circumferential surface of a base (5). At least one first protruded part (41a) an...  
WO/2015/190281A1
The present invention is a brittle substrate (W) cleavage device (20) for cleaving a brittle substrate (W) along an intended cleavage line (L). The cleavage device is equipped with: a processing pedestal (3) on which the brittle substrat...  
WO/2015/190960A9
The present invention relates to a wall or floor chain sawing device (1 ), comprising a chain bar assembly (37) which in turn comprises a chain bar (2) having a longitudinal extension (17) and guiding a chain (3) at least partly around i...  
WO/2015/190960A1
The present invention relates to a wall or floor chain sawing device (1 ), comprising a chain bar assembly (37) which in turn comprises a chain bar (2) having a longitudinal extension (17) and guiding a chain (3) at least partly around i...  
WO/2015/188859A1
A wire saw system for cutting semiconductor material and a method for cutting semiconductor material into a plurality wafers are described. The wire saw system (1000) has a wire (11) forming a wire web (111) for cutting semiconductor mat...  
WO/2015/186803A1
 The purpose of the present invention is to provide an adhesive agent composition for temporary fixation such that members fixed thereby do not detach during processing and do not separate during a post-processing cleaning step, specif...  
WO/2015/185739A1
The present invention relates to a device (10) and a method for removing contaminated material from a wall, the device (10) comprising - suction plates (26) which fix a support system (13) of the device (10) to the wall by means of negat...  
WO/2015/186350A1
One example of a glass plate separation device comprises a trigger device for forming a score mark on a planned separation line on a first main surface of a glass ribbon, a pair of holding members disposed on a first main surface side of...  
WO/2015/182023A1
The present invention provides an abrasive grain-fixed wire having a core wire surface on which abrasive grains are fixed, wherein the abrasive grain number density, which is the number of the abrasive grains per unit area, on the surfac...  
WO/2015/182298A1
A cutting edge (51) is slid across the surface (SF1) of a brittle substrate (4) so as to cause plastic deformation and form a trench line (TL) in the form of a groove. The brittle substrate (4) is connected in a continuous fashion direct...  
WO/2015/181681A1
A multiwire frame (12) for cutting blocks of stone and stone-like material comprises: two columns (14, 16) on each of which a slide (19, 20) adapted to move along the respective column (14, 16) is provided. On each slide (19, 20) there i...  
WO/2015/182241A1
Sliding motion of a cutting edge (51) is used to cause plastic deformation in a first surface (SF1) of a brittle substrate (4) and form a trench line (TL). Said trench line (TL) is formed in such a manner so as to produce a crack-free st...  
WO/2015/180947A1
Saw cords used for sawing natural or manmade stony materials are made of saw beads threaded on a steel cord (52,522,522'), wherein the saw beads are separated by polymer spacers. The saw beads comprise a metal sleeve (204, 304) of which ...  
WO/2015/182297A1
A cutting edge (51) is slid across the surface (SF1) of a brittle substrate (4) so as to cause plastic deformation and form a trench line (TL). The step in which said trench line (TL) is formed is performed in such a manner so as to prod...  
WO/2015/177052A1
The invention relates to a method for processing remainders from the machining of silicon products for subsequent silane synthesis, wherein the remainders comprise at least silicon, particles containing carbon, and metal components. In t...  
WO/2015/173739A1
The invention relates to a wafer processing method performed subsequent to cutting (1), the wafer processing method comprising: a) a step of transporting (2); b) a first wafer processing step comprising charging (4) the wafer receiving c...  
WO/2015/170868A1
The invention relates to a jig apparatus comprising: a main body; a front pulley for winding a wire saw and changing the direction of the wire saw; and a supporting member having a plurality of flexible supporting parts, wherein the jig ...  
WO/2015/168034A1
Embodiments of the invention are directed to cutting tool assemblies (100) that include one or more superhard working surfaces (121) and one or more shields (130) and to a rotary drum assembly (300) that comprises such cutting tool assem...  
WO/2015/165552A1
The present invention relates to a method for producing at least one three-dimensional solid layer (4), in particular for use as a wafer, and/or at least one three-dimensional solid (40). The method according to the invention preferably ...  
WO/2015/163752A1
The invention relates to a system for perforating lenses for rimless spectacle frames, characterised in that said system has a template made of resilient, flexible material, having an undersized cavity in the shape of the lens, having a ...  
WO/2015/159270A1
A machine tool (38) comprises means for moving a spindle (66). The spindle (66) comprises a spindle drive unit (68) having an output shaft (67). A cutting disc (70) is positioned on the output shaft (67). The machine is characterized in ...  
WO/2015/160508A1
A surfacing apparatus supported adjacent a substantially vertical surface of a structure for applying an even and uniform texture to the surface of the structure using a selectively adjustable force exerted on a texturing means to engage...  
WO/2015/158290A1
A method of forming a non-optically detectable identifiable mark at an outer surface of an article formed from a solid state material, said method including the steps of forming a plurality of recesses within a predetermined region of a ...  
WO/2015/159493A1
A drill bit comprising a pointed end and a bit shaft. A dust suction passage is formed in the bit shaft. A hole, which has an opening in the pointed end or in an area near the front end of the bit shaft, is formed. The bit shaft has a fi...  
WO/2015/155699A1
A machine tool (1) for processing products (P) made of stone or stone-like materials, comprising a support surface (2) which extends along a first longitudinal direction (L), a plurality of processing modules (3), each comprising a toolh...  
WO/2015/155729A1
The invention relates to a system for transporting workpieces (3', 3") such as wafers or solar cells. The system consisting of a mainly vertical (10) and a downstream mainly horizontal (12) conveyor belt and being capable of transferring...  
WO/2015/151125A8
Machine tool, comprising a base (1) with a bottom (10) and a peripheral wall (11) of predetermined height to delimit an internal volume of predetermined capacity and open at the top, in which on the upper edge of said wall (11) is placed...  
WO/2015/151755A1
 A cutting edge (51) is pressed against a brittle-material substrate (4) so that a protruding part (PP) of the cutting edge (51) is arranged between a first edge (ED1) of the brittle-material substrate (4) and the side part (PS) of the...  
WO/2015/151408A1
Provided is a workpiece cutting method for cutting a workpiece by forming a wire column with a wire that travels in the axial direction and that is wound in a helical shape between a plurality of wire guides, and supplying a working flui...  
WO/2015/151125A1
Machine tool, comprising a base (1) with a bottom (10) and a peripheral wall (11) of predetermined height to delimit an internal volume of predetermined capacity and open at the top, in which on the upper edge of said wall (11) is placed...  
WO/2015/144664A1
The invention relates to a machine tool (1), containing a housing (10); a motor (20), in particular an electric motor; a drive shaft (22), which can be driven by the motor (20); a belt drive (50) for transferring the driving force of the...  
WO/2015/148657A1
A heat exchanger includes first and second sets of parallel arranged tubes. The first set of tubes extends along a first arcuate path, the second set of tubes extends along a second arcuate path, and each one of the second set of tubes i...  
WO/2015/137161A1
[Solution] A cutter device that forms a cutting line on a brittle sheet supported by a support member. The cutter device is characterized by: comprising a pressing member that presses the brittle sheet on to the support member, a case th...  
WO/2015/136946A1
A carrying-in position (3), a scribe position (4), a removal position (5), a polishing position (6), and a carrying-out position (7) are arranged at even intervals along a straight line in the conveying direction, in a glass plate proces...  
WO/2015/132423A1
The invention relates to a machine (1) for cutting stone-like blocks in situ, said machine comprising a frame (2) having a bridge (3) with upper and lower bridge tracks (4, 5) for moving an automotive carriage (6) in order to generate th...  
WO/2015/131216A1
Described is a saw blade comprising a blade member (1), the lateral surfaces (4) of which are provided with a coating and the cutting segments (2) of which protrude beyond the coated blade member (1) on both sides. In order to create adv...  
WO/2015/125366A1
A silicon wafer manufacturing method comprising: a wire traveling step for rotating a plurality of main rollers around which a corrugated wire (7) is helically wound to cause the corrugated wire (7) to travel in a direction approximately...  
WO/2015/125122A3
A multi-wire frame (12) for cutting blocks of stone material comprises two columns (14, 16) each of which is provided with a slide (18, 20) designed to move along the respective column (14, 16). At least one multi-groove drum (22, 24) is...  
WO/2015/126003A1
The present invention relates to a device for controlling parallel alignment of guide rollers used in a wire saw apparatus, and more specifically, to a device for controlling parallel alignment of guide rollers used in a wire saw apparat...  

Matches 151 - 200 out of 18,851