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Matches 151 - 200 out of 17,227

Document Document Title
WO/2013/094059A1
In the present invention, a first scribe line (52a) comprising a perpendicular crack (53a) and a second scribe line (52b) comprising a perpendicular crack (53b) are formed by laser beam (LB) irradiation and the spray of a cooling medium ...  
WO/2013/093938A1
An indexing unit (100) of a gemstone processing machine and a method for processing gemstones (105) is described herein. In an embodiment, the indexing unit (100) of the gemstone processing machine includes a base plate (115) having a pl...  
WO/2013/094809A1
Disclosed is an ingot slicing wire guide around an outer face of which wires are wound. The guide has a first end and a second end opposite to the first end, and the outer face of the guide has a tilted face tilted at a predetermined ang...  
WO/2013/090533A1
A saw system (100) in one embodiment includes a base (110), a work support surface member (112) supported by the base (110) and including a work piece support surface defining a horizontal work piece support plane, and a plurality of whe...  
WO/2013/089570A1
The present invention refers to a method of chamfering panels with a core encased in a liner and a device for chamfering panels with a core encased in a liner. In the method according to the invention the previously cut panel (1) is cut ...  
WO/2013/084877A1
In a method for cutting toughened glass plates in one embodiment of the present invention, a toughened glass plate (10) provided with a front layer and a back layer that have residual compressive stresses and a middle layer that is forme...  
WO/2013/083838A1
Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot (30) by ...  
WO/2013/082830A1
A cutting device and method for a glass substrate. The cutting device for a glass substrate includes a laser emitting device (20, 60) and a cutting device (30, 70). The laser emitting device (20, 60) emits a laser beam onto the surface o...  
WO/2013/079683A1
Systems (100) and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine (103). The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an in...  
WO/2013/082107A1
Disclosed is a method of separating a glass sheet from a moving glass ribbon, wherein the glass ribbon comprises thickened bead portions. The method comprises weakening the bead portions of the ribbon using laser-initiated ablation at th...  
WO/2013/076403A1
The invention relates to a method for obtaining an ophthalmic lens, said method comprising: - the step of selecting a material that displays a threshold of pinhole formation during a machining step of a finished surface (20) in a materia...  
WO/2013/076166A1
The invention relates to a processing apparatus for processing an upper segment edge (8) of a tower segment of a concrete tower (102) in order to prepare the tower segment for the attachment of at least one further tower segment. Accordi...  
WO/2013/076905A1
The invention is a band saw cutting device that cuts an ingot by guiding a circularly driven blade using static pressure pads while propelling the blade downward relative to the ingot from above same. The band saw cutting device is chara...  
WO/2013/076319A1
The invention relates to the use of sodium bentonite as a fluid bed that supports the grit and debris resulting from sawing. The invention also relates to the use of vibrating tables for separating the debris resulting from bentonite saw...  
WO/2013/072761A1
A saw system (100) in one embodiment includes a base (102) including a rail system (110), a table (140) positionable on the rail system (110) and including a work piece support surface (142) defining a support plane, and a roller system ...  
WO/2013/072419A1
The invention relates to a method for connecting functional elements (14) to a shaft (10), having the following steps: (a) forming elevations (12) for receiving the functional elements (14), said elevations (12) being machined out of the...  
WO/2013/073477A1
A glass plate cleaving device (100) according to the present invention is provided with a cleaving member (10) that applies a force to the principal surface (Ga) of a glass plate (G) which has the principal surface (Ga) and a principal s...  
WO/2013/069175A1
A method of manufacturing a cut-out sintered ceramic sheet for quickly processing a sintered ceramic sheet into a complicated shape, and a cut-out sintered ceramic sheet manufactured by the above method are provided. A method of manufact...  
WO/2013/068152A1
The invention relates to a stone chisel (2) and to a method for producing a stone chisel (2). The stone chisel (2) comprises a shaft (3) and a head (5), said head (5) comprising a core (4) and a coating. The shaft (3) and the core (4) ar...  
WO/2013/064321A1
A method for the residue-free removal of mineral building materials, in particular for the cutting or drilling of mineral building materials, comprising the following steps: a laser beam is applied to a workpiece of a mineral building ma...  
WO/2013/061695A1
Provided are: a water-soluble cutting fluid for a fixed abrasive grain wire saw, causing little foaming and attaining high cutting performance; a cutting method using the same; and a recycling method therefor. A water-soluble cutting flu...  
WO/2013/061519A1
The present invention is a slurry manufacturing method whereby a slurry is manufactured by re-pulverizing with a jet mill all or a portion of abrasive grains which have been pulverized with either a roller mill or a ball mill to achieve ...  
WO/2013/060042A1
Disclosed are an LCD panel cutting chip suction and removal apparatus and a chip collection apparatus for a cutting mechanism. The chip collection apparatus comprises a collection hood (41) located to the rear of the direction of travel ...  
WO/2013/060491A1
The invention relates to a drill (1) having a shaft (4) along an axis (2) between a drill head (3) and an insertion end (5). The shaft (4) is provided with at least two first grooves (34) extending along the axis (2) and at least one sec...  
WO/2013/058201A1
[Problem] To provide a glass cutting device capable of cutting a glass substrate even when the force applied in the direction of the thickness of a glass substrate is relatively weak. [Solution] A glass substrate cutting device (100) acc...  
WO/2013/057091A1
Device for the artificial ageing of stones with at least an ageing channel (3) arranged on a support (1), a vibration device (5) to set the support (1) in motion, and a conveying device (8) t o move the stone (2) through the ageing chann...  
WO/2013/053545A1
The invention relates to a hammer core bit (1) for the rotary or rotary percussive drilling of reinforced concrete or other reinforced materials or stone materials, comprising a clamping shaft (2), a drill sleeve (3) having a drill sleev...  
WO/2013/053813A3
The invention relates to a securing element (30) for a shank tool (10), said element at least partially surrounding a mounting opening (31) by means of an elastic clamping part (32). Securing elements of this type offer a secure clamping...  
WO/2013/050352A1
The invention relates to a method for performing at least one mechanical operation on a structure (10) comprising at least one first layer (12) stacked on top of at least one second layer (14), said first layer being formed by at least o...  
WO/2013/051183A1
The present invention is a workpiece cutting method having a wire wound around a plurality of grooved rollers and moving reciprocatingly in the axial direction, the wire supplying a slurry whilst a workpiece is pushed downward relative t...  
WO/2013/052350A1
Systems and methods are disclosed for connecting an ingot (102) to a wire saw (103) with an ingot holder (110), a bond beam (130), and a bar (150). The bar (150) has an angled mating surface (160) that engages a recessed surface (140) fo...  
WO/2013/047678A1
The present invention is equipped with: a fine division step wherein a cutting or grinding device (1) equipped with a fixed abrasive grain wire (2) to which abrasive grains are adhered, a support unit (8) that supports an material (10) t...  
WO/2013/041886A1
A composition which effervesces when added to water, comprises diamond particles with a median equivalent volumetric diameter (Dv50) of less than 40 μm. The compositions are useful as cleaning compositions, particularly for cleaning dia...  
WO/2013/042055A1
The invention relates to a sacrificial substrate (1) having a mounting surface (2) for holding a piece of material (3), such as an ingot, brick or core, for cutting a plurality of wafers from the piece of material (3), wherein the sacrif...  
WO/2013/041140A1
A method of cutting a semiconductor workpiece with a wire saw is described. The method includes applying a tension of at least 150 newtons to a wire (10); moving the wire (10) substantially along its length; and contacting the wire to th...  
WO/2013/039012A1
In the present invention, laser light (L) is focused onto a quartz-crystal workpiece (1) such that a modified region (7) containing a plurality of modified spots (S) is formed in the workpiece (1) along a planned-cut line (5). To do so, ...  
WO/2013/039006A1
In the present invention, laser light (L) is focused onto a quartz-crystal workpiece (1) such that a modified region (7) containing a plurality of modified spots (S) is formed in the workpiece (1) along a planned-cut line (5). To do so, ...  
WO/2013/038059A1
The invention relates to a tool for a breaking hammer, a breaking hammer, and the use of a breaking hammer. The breaking hammer comprises a percussion device (5), the percussion piston (9) of which provides impacts to the tool (6) for br...  
WO/2013/039150A1
In the present invention, laser light is focused onto a quartz-crystal workpiece from the top surface thereof so as to form a modified region along a planned-cut line near the roughened bottom surface of the workpiece, thereby preventing...  
WO/2013/039162A1
In the present invention, when forming modified spots in a workpiece with said spots exposed to the surface upon which laser light is incident, the aberration of said laser light is corrected such that the focal point of the laser light ...  
WO/2013/036977A1
In order to produce a edge cutout (3), in particular a edge cutout (3) in the shape of a segment of a circle (3) in a glass pane (2), a cutting tool having a small cutting wheel (13) is used to produce a circular arc-shaped score line (1...  
WO/2013/035373A1
In a method for producing a III-nitride crystal substrate according to the present invention, a saw wire (22) which comprises a steel wire having a carbon concentration of 0.90 to 0.95 mass%, a silicon concentration of 0.12 to 0.32 mass%...  
WO/2013/031778A1
The present invention relates to a cutting method for a reinforced glass plate (10). The reinforced glass plate (10), which has a front surface layer (13) and a back surface layer (15) having residual compressive stress and also has an i...  
WO/2013/032374A1
A guide and control assembly of a battery driven portable handheld power tool (1) is provided, which guide and control assembly (10) comprises a main handle (20) of the tool, arranged to be gripped by a hand of an operator, in an operati...  
WO/2013/032372A1
A portable handheld power tool is provided, the power tool comprising a housing (10), an electric motor (11) accommodated in the housing (10), a battery pack (12) detachably connected to the housing, and a cooling fan (14) accommodated i...  
WO/2013/026594A1
The invention relates to a drill bit (1), in particular a ferroconcrete drill bit for rotary or rotary percussion drilling of ferroconcrete or other reinforced materials, wherein the drill bit (1) comprises a clamping shank (2), a drill ...  
WO/2013/027702A1
A wire (12) is passed multiple times around working rollers (11). A gripping mechanism (13) and a depression mechanism (25) are provided above the region through which the wire (12) is passed. The gripping mechanism (13) elastically grip...  
WO/2013/027880A1
The present invention enables the sequential cutting, chamfering, and grinding of both side surfaces of a silicon ingot in order to achieve the objectives of improving the workability of the ingot and rationalizing the processing degree ...  
WO/2013/029063A1
The invention provides an attachment (40) for a power tool (10) for use in cutting grooves in masonry, the attachment (40) comprising an elongated nose (14), with a shaft (16) locatabie through its front end, and including a pair of rota...  
WO/2013/024424A1
A drill bit for boring an undercut hole comprising a shaft, with at least one cutting edge on one end. The shaft of the bit further comprising a bearing surface located eccentrically to the shaft axis. During drilling the bit can produce...  

Matches 151 - 200 out of 17,227