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Patent Searching and Data


Matches 151 - 200 out of 17,895

Document Document Title
WO/2014/140052A1
A cutting apparatus comprising a cutting tool and a collection assembly designed for diverting, collecting and disposing dust generated during the cutting process. The apparatus includes a cutting tool, a collection assembly together wit...  
WO/2014/140946A1
A multi-tool machine for processing products (P) made of stone materials to be processed, comprising a support surface (2) extending along a longitudinal axis (L) for supporting one or more products (P), a bearing structure (3) designed ...  
WO/2014/137276A1
The invention concerns a proceeding for the production of slab-shaped stone products (1) from blocks (2) of natural stone. According to the invention, occurring stresses in the stone block (2) are removed, before saw-cutting of said ston...  
WO/2014/131929A1
The invention relates to a breaking system applied to ceramic-cutting machines, the configuration and design thereof allowing it to be used both by left-handed people and right-handed people. This breaking system solves the unsolved prob...  
WO/2014/128095A1
Apparatus (10) for separating a workpiece (18) along a separating line (63) between a first and a second end point (E1, E2), having a sawing head (12), an advancing device (13) with a guiding carriage (24) and an advancing motor (25), wh...  
WO/2014/129119A1
Provided is a diameter-expanding drill bit with a simple structure and capable of handling even small diameter pilot holes. A diameter-expanding drill bit (10) used by inserting into a pilot hole (H) bored in a building frame (A) to expa...  
WO/2014/127037A3
An improved design for a dust shroud providing an airflow conduit for collecting dust off a work piece and a saw blade is disclosed. The dust shroud is configured with either one or two extending and telescoping lower rigid jaws that are...  
WO/2014/124912A1
A method for controlling a device system (10) having a saw blade (14) that is secured to a saw arm (15) and can be moved along an advancement direction (26) by means of a motor-driven advancing mechanism (13), wherein a delivery movement...  
WO/2014/126525A1
The present invention relates to a tool holding arrangement (1) comprising a tool holding device (2), an outer sleeve (3) and a shaft (4) connectable to a tool motor, The tool holding device (2) comprises a first torque-transmitting mean...  
WO/2014/124931A1
A method for controlling a device system (10) during the cutting of a workpiece (18) along a separating line (43) up to a first end point (E1), said device system having a saw head (12) that can be moved on a guide rail (11) along an adv...  
WO/2014/123080A1
In the present invention, a laser beam is focused into an annular shape and irradiated on a beam-focus location within a substrate thickness range; and, in a process in which the beam-focus location is shifted in the substrate thickness ...  
WO/2014/123459A1
The present invention relates to liquid dispensing system for a rotatable work tool (2), comprising a control valve (13), an inlet and outlet liquid guiding device (11, 15). The control valve (13) comprises a housing (18) with a rotatabl...  
WO/2014/118035A1
The method comprises providing a substrate like a semiconductor wafer (1), applying a laser cut (4) of the substrate, and subsequently applying a saw to divide the substrate from a main surface (10). The laser cut (4) may be used to cut ...  
WO/2014/117890A1
The invention relates to a method for detaching a disc-shaped monocrystal from a base body (1) which comprises the disc-shaped monocrystal, wherein the base body (1) has a planar surface (5) at least in the region in which the disc-shape...  
WO/2014/111304A1
The invention relates to a device (123) for securing a workpiece (5) for a wire sawing process. The invention is characterized in that the device consists of a component.  
WO/2014/110324A3
A method of preparing a plurality of workpieces for concurrent cutting using a stone cutting machine is disclosed. Each workpiece can include a stone slab that has two parallel faces and one or more edges, a substrate that is bonded to a...  
WO/2014/110324A2
A method of preparing a plurality of workpieces for concurrent cutting using a stone cutting machine is disclosed. Each workpiece can include a stone slab that has two parallel faces and one or more edges, a substrate that is bonded to a...  
WO/2014/108956A1
In a wire saw operation for cutting a workpiece into wafers by supplying new wire from a supply side to a recovery side while the wire is reciprocated in the axial direction of the wire and supplying a cutting slurry to the wire as the w...  
WO/2014/105753A1
An apparatus for producing rectangular seeds for use in semiconductor or solar material manufacturing includes a template (202) having a top surface and parallel slots (204), and an adhesive layer connected to the top surface of the temp...  
WO/2014/105749A1
A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alig...  
WO/2014/104925A1
The invention relates to piston pairs and metering pumps on the basis thereof, to the manufacture of devices and parts thereof, and in particular to a method for processing cylindrical surfaces of parts consisting of a crystal on the bas...  
WO/2014/097341A1
Machine tool, in particular for the processing of materials or pieces used in the building industry such as tiles or slabs of stone materials, comprising a rotary tool (1) grafted on a spindle driven by a high speed electric motor (2). T...  
WO/2014/096487A1
The invention relates to a blade (1) for a cutting tool (2) of a ceramic cutting machine (3), said blade taking the form of a disc having a pre-determined cutting diameter (H) and including at least one conical surface (13) on each side ...  
WO/2014/089600A1
A method, of treating particulate (34), in substance including selecting a load (17) based on a planned in use loading of the particulate; applying the load to the particulate; injecting material (28) below the load; and removing the load.  
WO/2014/092015A1
The present invention pertains to an electronic device manufacturing method, said electronic device including a detachable glass substrate and a member for an electronic device. The method comprises: a resin layer-forming step for formin...  
WO/2014/082870A1
Metal sleeves are used as carriers for the abrasive layer of sawing beads. Such sawing beads are threaded on a steel cord and are separated by a polymer thus forming a sawing cord for sawing of hard and brittle materials such as stone or...  
WO/2014/083590A1
A coolant regeneration method for making coolant, which has been used when cutting an ingot using a wire saw, reusable is characterized in that coolant is supplied respectively into the respective hollow sections of one or multiple hollo...  
WO/2014/080396A1
The present invention discloses a chain tool for chip removing and / or shredding. The chain tool comprises a tool body having a longitudinal axis, and a chain arranged about the tool body and comprising chain members consecutively linke...  
WO/2014/080822A1
The present invention is provided with: a laser light source (10) for emitting a pulse laser light having a peak in the wavelength range of 8-11 ┬Ám and a pulse width of 30 ns or less; an optical system (40) for concentrating and irradia...  
WO/2014/079834A1
A tool device (10) for machining a workpiece (23), having a machining tool (12), which can be rotated by a drive device (13) in a rotational direction (14) about a rotational axis (15), a protective hood (25), which surrounds the machini...  
WO/2014/079827A1
The invention relates to a tool apparatus (10) for machining a workpiece (23), comprising a machining tool (12), which can be rotated about a rotational axis (15) in a direction of rotation (14) by a driving device (13), a protective hoo...  
WO/2014/078827A1
A method of preparing a directional solidification system (DSS) furnace for use in semiconductor or solar manufacturing includes slicing a plurality of cylindrical rods to produce a plurality of rectangular seed bricks, a plurality of co...  
WO/2014/078763A1
A method of producing rectangular seed bricks for use in semiconductor or solar manufacturing includes connecting an alignment layer to a top surface of a template, drawing alignment lines on the alignment layer to demarcate a plurality ...  
WO/2014/075690A1
A method and a device for machine patination, artificial ageing, of concrete products. The products (12) are provided irregular edges by a process in which the products are lifted up against a matrix (45) that substantially corresponds t...  
WO/2014/075995A3
The application relates inter alia to a method for preparing the separation of transparent workpieces (2). Aligned filament structures (4, 5, 6) extending transversely through the workpiece (2) are generated along a pre-determined breaki...  
WO/2014/066927A1
A portable quarrying mill comprising a demountable frame having spaced longitudinal rails joined at both ends by cross rails, the longitudinal rails supporting an overhead gantry extending between the rails, the gantry supporting a milli...  
WO/2014/070054A1
A spacer (1) for spacing a tool such as a drill motor from a tool stand such as a drill stand, the spacer (1) comprising a spacer body (2) and a locking member (3), the spacer body (2) having first (4) and second (5) opposing faces, the ...  
WO/2014/068672A1
Provided are a hole machining system (10), robot (RB), hand (40), and method for controlling a hole machining system (10), capable of removing a cut piece (CP) of a workpiece (W) remaining inside a hole saw (50) and collecting the same i...  
WO/2014/063910A1
The invention relates to a fixed abrasive sawing wire wherein abrasive particles are held in a metal matrix fixed to a metal wire. The metal wire has an oblong cross section and particular about the wire is that the abrasive particles ar...  
WO/2014/065248A1
After forming an initial crack (3) in a portion of the planned cutting line (2) of the glass film (1), in a state in which one surface of the glass film (1) is supported on a support member (5), the glass film (1) is flexed such that the...  
WO/2014/064628A1
The equipment (1) for cutting slabs of ceramic material comprises a frame (2) for bearing movement means of at least a slab of ceramic material to cut along a forward direction (4), first cutting means (5) with water jet, arranged along ...  
WO/2014/061050A1
An automatic sawing machine (1) for cutting stones and materials of irregular shape and different sizes, comprising at least one frame (2, 4) for supporting at least two longitudinal conveyor elements (5, 6) with at least two respective ...  
WO/2014/061053A1
In a wire saw apparatus (1), a cutting wire (3) wrapped in a spiral on a plurality of wire guides (2) is caused to travel, and a workpiece (W) is simultaneously pressed against the cutting wire (3) and cut and machined while the cutting ...  
WO/2014/052445A1
The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the f...  
WO/2014/052296A1
A process to make atomically sharp cutting devices is described. The process may provide for a cost effective and efficient technique of producing the atomically sharp cutting devices made from single crystal material such as, for exampl...  
WO/2014/045106A1
The invention relates to a wafer receiving box (3) for receiving wafers (5), the wafer receiving box (3) having in a first area (1 1) a width (W1), characterized in that the wafer receiving box (3) has in a further area (12, 13) which is...  
WO/2014/045108A1
The invention relates to a method of making wafers (5) from an ingot (4) which is fixed to a beam (19) by means of a gluing layer (10) wherein the beam (19) has at least one internal channel (11), the method comprising the steps of: cutt...  
WO/2014/036714A1
A shaped sawing wire adapted to cutting hard materials, comprises a wire having bends with segments in between. The wire has subsurface tensile residual stresses for keeping the shape of the wire while sawing. The sawing wire keeps its s...  
WO/2014/035481A1
The present invention discloses a group III nitride wafer such as GaN, AlN, InN and their alloys having one surface visually distinguishable from the other surface. After slicing of the wafer from a bulk crystal of group III nitride with...  
WO/2014/033243A3
The present invention relates to a method for the treatment and/or recycling of sawing slurries, particularly of semiconductor materials, arising in mechanical cutting methods. The sawing slurries contain particles of semiconductor mater...  

Matches 151 - 200 out of 17,895