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Patent Searching and Data


Matches 201 - 250 out of 17,251

Document Document Title
WO/2013/050352A1
The invention relates to a method for performing at least one mechanical operation on a structure (10) comprising at least one first layer (12) stacked on top of at least one second layer (14), said first layer being formed by at least o...  
WO/2013/051183A1
The present invention is a workpiece cutting method having a wire wound around a plurality of grooved rollers and moving reciprocatingly in the axial direction, the wire supplying a slurry whilst a workpiece is pushed downward relative t...  
WO/2013/052350A1
Systems and methods are disclosed for connecting an ingot (102) to a wire saw (103) with an ingot holder (110), a bond beam (130), and a bar (150). The bar (150) has an angled mating surface (160) that engages a recessed surface (140) fo...  
WO/2013/047678A1
The present invention is equipped with: a fine division step wherein a cutting or grinding device (1) equipped with a fixed abrasive grain wire (2) to which abrasive grains are adhered, a support unit (8) that supports an material (10) t...  
WO/2013/041886A1
A composition which effervesces when added to water, comprises diamond particles with a median equivalent volumetric diameter (Dv50) of less than 40 μm. The compositions are useful as cleaning compositions, particularly for cleaning dia...  
WO/2013/042055A1
The invention relates to a sacrificial substrate (1) having a mounting surface (2) for holding a piece of material (3), such as an ingot, brick or core, for cutting a plurality of wafers from the piece of material (3), wherein the sacrif...  
WO/2013/041140A1
A method of cutting a semiconductor workpiece with a wire saw is described. The method includes applying a tension of at least 150 newtons to a wire (10); moving the wire (10) substantially along its length; and contacting the wire to th...  
WO/2013/039012A1
In the present invention, laser light (L) is focused onto a quartz-crystal workpiece (1) such that a modified region (7) containing a plurality of modified spots (S) is formed in the workpiece (1) along a planned-cut line (5). To do so, ...  
WO/2013/039006A1
In the present invention, laser light (L) is focused onto a quartz-crystal workpiece (1) such that a modified region (7) containing a plurality of modified spots (S) is formed in the workpiece (1) along a planned-cut line (5). To do so, ...  
WO/2013/038059A1
The invention relates to a tool for a breaking hammer, a breaking hammer, and the use of a breaking hammer. The breaking hammer comprises a percussion device (5), the percussion piston (9) of which provides impacts to the tool (6) for br...  
WO/2013/039150A1
In the present invention, laser light is focused onto a quartz-crystal workpiece from the top surface thereof so as to form a modified region along a planned-cut line near the roughened bottom surface of the workpiece, thereby preventing...  
WO/2013/039162A1
In the present invention, when forming modified spots in a workpiece with said spots exposed to the surface upon which laser light is incident, the aberration of said laser light is corrected such that the focal point of the laser light ...  
WO/2013/036977A1
In order to produce a edge cutout (3), in particular a edge cutout (3) in the shape of a segment of a circle (3) in a glass pane (2), a cutting tool having a small cutting wheel (13) is used to produce a circular arc-shaped score line (1...  
WO/2013/035373A1
In a method for producing a III-nitride crystal substrate according to the present invention, a saw wire (22) which comprises a steel wire having a carbon concentration of 0.90 to 0.95 mass%, a silicon concentration of 0.12 to 0.32 mass%...  
WO/2013/031778A1
The present invention relates to a cutting method for a reinforced glass plate (10). The reinforced glass plate (10), which has a front surface layer (13) and a back surface layer (15) having residual compressive stress and also has an i...  
WO/2013/032374A1
A guide and control assembly of a battery driven portable handheld power tool (1) is provided, which guide and control assembly (10) comprises a main handle (20) of the tool, arranged to be gripped by a hand of an operator, in an operati...  
WO/2013/032372A1
A portable handheld power tool is provided, the power tool comprising a housing (10), an electric motor (11) accommodated in the housing (10), a battery pack (12) detachably connected to the housing, and a cooling fan (14) accommodated i...  
WO/2013/026594A1
The invention relates to a drill bit (1), in particular a ferroconcrete drill bit for rotary or rotary percussion drilling of ferroconcrete or other reinforced materials, wherein the drill bit (1) comprises a clamping shank (2), a drill ...  
WO/2013/027702A1
A wire (12) is passed multiple times around working rollers (11). A gripping mechanism (13) and a depression mechanism (25) are provided above the region through which the wire (12) is passed. The gripping mechanism (13) elastically grip...  
WO/2013/027880A1
The present invention enables the sequential cutting, chamfering, and grinding of both side surfaces of a silicon ingot in order to achieve the objectives of improving the workability of the ingot and rationalizing the processing degree ...  
WO/2013/029063A1
The invention provides an attachment (40) for a power tool (10) for use in cutting grooves in masonry, the attachment (40) comprising an elongated nose (14), with a shaft (16) locatabie through its front end, and including a pair of rota...  
WO/2013/024424A1
A drill bit for boring an undercut hole comprising a shaft, with at least one cutting edge on one end. The shaft of the bit further comprising a bearing surface located eccentrically to the shaft axis. During drilling the bit can produce...  
WO/2013/024900A1
The present invention provides a resin-coated saw wire that, when cutting a workpiece using the saw wire, has a shallow depth of the work-affected layer and can obtain a cut body having a smooth surface. The resin-coated saw wire, which ...  
WO/2013/024451A3
A system (100) for ultrasonically cleaning one or more wires (102) of a wire saw (104) for slicing semiconductor or solar material (105) into wafers. The system (100) includes an ultrasonic transducer (302) connected to a sonotrode (304)...  
WO/2013/023945A1
The invention relates to an aqueous cutting solution, containing 80 to 99.5 wt% of water, 0.1 to 20 wt% of at least one glycol compound, and optionally one or more compounds selected from the group comprising pH-regulating compounds, sol...  
WO/2013/021945A1
The purpose of the present invention is to provide an acrylic adhesive composition for temporary fixing, which is suitable for suppressing chipping of a silicon wafer when the silicon wafer is processed from a silicon block. This adhesiv...  
WO/2013/021327A1
A machine (12) for cutting blocks of stone material (14) into slabs by means of cutting wires (16) comprises a frame (22) on which the following are rotatablv mounted: a set of driving pulleys (18) suitable for rotation by first motor me...  
WO/2013/018534A1
A method for manufacturing a group-III nitride crystal substrate of the present invention comprises a first step (S1) for preparing a group-III nitride crystal, and a second step (S2) for manufacturing a group-III nitride crystal substra...  
WO/2013/018556A1
The wire saw is provided with: multiple processing rollers (11A, 11B) across which the wire (12) for processing the workpiece is suspended; supply side bobbins (13A, 13B) that rotate to supply the wire (12) between the processing rollers...  
WO/2013/016818A1
A coloring system and a manufacturing process for coloring artificial covering stones are provided. A board layout represents a board of artificial covering stones. Several natural stone color patterns are provided, each being different ...  
WO/2013/013322A1
A saw-blade comprises a disc and a plurality of tooth holders. The saw blade disc has a plurality of receiving stations with at least one recess with an indentation extending tangentially from a radially inner leading edge portion thereo...  
WO/2013/015053A1
In this device for producing a field-pole magnet, a magnet is placed on a protrusion as a contact section disposed at a bottom tool in a manner so as to extend in the widthwise direction of the magnet, and the magnet is segmented by caus...  
WO/2013/015047A1
This device for producing a field-pole magnet segments a magnet to produce magnet pieces that configure a field-pole magnet disposed in a dynamo-electric machine. The production device is provided with: a support unit on which the magnet...  
WO/2013/010227A1
A profiling device (100) is discussed, the profiling device is adapted for mounting to a cutting implement such as an angle grinder (10) having body (11), head (12), blade (13) and guard (14). The profiling device (100) preferably includ...  
WO/2013/013023A1
A coring bit accessory for a rotary tool is provided herein, including a shank for coupling with a rotary tool, a body including a generally cylindrical structure having a proximal end portion defining a leading rim, an abrasive ring bon...  
WO/2013/010943A1
Saw for cutting silicon into seed rods for use in a chemical vapor deposition polysilicon reactor Systems and methods are provided for cutting silicon into seed rods for use in a chemical vapor deposition polysilicon reactor. A method in...  
WO/2013/011854A1
The wire saw is provided with: multiple processing rollers (14A, 14B) across which a wire (11) for processing workpieces is installed and circles; and a pair of traversers (16A, 16B) that are each moved back and forth along directions th...  
WO/2013/009569A1
Presented is a concrete saw for sawing into concrete surfaces to provide expansion slots or joints. The concrete saw has powered front wheels and may optionally have powered front wheels, so that with improved traction the full potential...  
WO/2013/005900A1
Disclosed is a road-surface cutting device in which the air cooling method is used in order to cool down the high temperatures which occur in cutting tools when cutting tools are used for the work of cutting concrete road surfaces, there...  
WO/2013/002061A1
A production method for a silicon wafer (1) for a solar cell, including: a step in which a silicon crystal ingot (50) is sliced by a resin bond wire (53) comprising abrasive grains (22) having an average particle diameter of 10-20 µm; a...  
WO/2013/002060A1
A production method for a silicon wafer (1) for a solar cell, including: a step in which a silicon crystal ingot (50) is sliced by an electrodeposition wire (53) comprising abrasive grains (22) having an average particle diameter of 8-11...  
WO/2012/174577A1
Sawing wire (1) for use in a wire saw machine, having a wire (2) and cutting beads (3, 3', 3'') arranged thereon, wherein the ends (4) of the wire (2) are connected to one another by a sleeve‑like press closure (5), wherein the sleeve...  
WO/2012/171306A1
A seed crystal production method for casting quasi-monocrystalline silicon ingots utilizes monocrystalline silicon of orientation <100>, having a resistivity of ≥0.1Ω•cm and any polarity. The manufacturing process follows the follow...  
WO/2012/164848A1
The present invention maintains a constant wire deflection amount from the wire supply side to the wire collection side by reducing the tension of a wire on the wire supply side (new wire side), thereby making it possible to reduce the r...  
WO/2012/163721A1
The invention relates to a cutting device, as well as to the use of a cutting device, comprising a cutting blade (10) which is pivotably fixed to a stand (1), the cutting edge (12) of said cutting blade (10) descending into an entry slot...  
WO/2012/164757A1
Provided is a device for preventing cracks and defects when a substrate composed of a hard brittle crystal material is manufactured. A holding means holds both ends of a workpiece, and the distal end of a polishing brush, which is a mach...  
WO/2012/163720A1
The invention relates to a cutting device comprising a cutting blade (10) which is pivotably fixed to a stand (1), the cutting edge (12) of said cutting blade (10) descending into an entry slot (6) between two supporting members (2) duri...  
WO/2012/164860A1
The present invention relates to a coolant supply device (A) attached to an electric drill device to supply coolant to a piercing portion at a tip end of the drill (10) at the time of piercing. The coolant supply device comprises a first...  
WO/2012/159947A3
The invention relates to a rock drill (20, 30) comprising a shank (23, 33), a drill head (21, 31) and a drill helix (22, 32), the rotational movement of which rock drill can be carried out during drilling about a drill axis (2). Said roc...  
WO/2012/159881A3
The invention relates to a rock drill having an axis of rotation (3) about which a rotational movement can be carried out during drilling. Said rock drill comprises a cutting body which has at least one cutting edge (2) on the front face...  

Matches 201 - 250 out of 17,251