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Patent Searching and Data


Matches 301 - 350 out of 17,261

Document Document Title
WO/2012/115462A3
Provided is an apparatus for slicing an ingot. The apparatus for slicing the ingot includes a mounting part on which the ingot is mounted, a wire saw disposed under the mounting part, a slurry supply part supplying slurry from an upper s...  
WO/2012/115462A2
Provided is an apparatus for slicing an ingot. The apparatus for slicing the ingot includes a mounting part on which the ingot is mounted, a wire saw disposed under the mounting part, a slurry supply part supplying slurry from an upper s...  
WO/2012/115099A1
Provided is a water-soluble working fluid for a fixed abrasive grain wire saw, which can suppress an increase in viscosity when contamination by chips occurs and suppress the occurrence of clogged piping or firm sticking in equipment cau...  
WO/2012/110102A1
A wire saw device (100; 200) for sawing a hard material is described. The device includes an inlet spool (130) for providing wire towards the wire web (111; 211; 310), the wire web having an inlet side and an outlet side, a main frame (1...  
WO/2012/110976A1
A device for tensioning the cutting wires (20) in a multiwire machine (1) for cutting slabs from blocks (B) of stone material. The device comprises one support element (30) including one annular seat (35) for housing a respective cutting...  
WO/2012/108055A1
The present invention addresses the problem of providing a monocrystalline substrate production method capable of easily producing a relatively large and thin monocrystalline substrate, and a monocrystalline member with a modified layer ...  
WO/2012/108391A1
The present invention relates to a glass plate cutting method for cutting along a cut line a glass plate machined to have said cut line, wherein a pair of holding members holds the bottom surface and the top surface in the width directio...  
WO/2012/108866A1
The present invention is drawn to a process of drilling organic glasses, comprising the following steps: (a) providing a substrate of organic glass, preferably of optical grade, (b) laminating onto at least one surface of said organic gl...  
WO/2012/108054A1
The present invention addresses the problem of providing a monocrystalline substrate production method capable of easy producing a relatively large and think monocrystalline substrate, and a monocrystalline member with a modified layer f...  
WO/2012/108052A1
The present invention addresses the problem of providing a monocrystalline substrate production method capable of easily producing a relatively large and thin monocrystalline substrate, and a monocrystalline member with a modified layer ...  
WO/2012/108056A1
The present invention addresses the problem of providing a monocrystalline member with a stress layer formed in the interior and a monocrystalline substrate production method capable of easily producing a relatively large and thin monocr...  
WO/2012/105876A1
A chain bar guiding system for a wall chain saw, mainly for cutting concrete, comprising: a safety cover (110) rotatably coupled to a cover anchor mechanism (108) coupled to the wall saw (100); a chain saw assembly housing (150) slidingl...  
WO/2012/105904A1
A chain bar unit (2600) for a wall saw (100) include a bar (1116) configured to receive a circulating chain or wire around a perimeter of the bar (1116). The chain bar unit (2600) also includes a driving gear (1140) for driving the chain...  
WO/2012/106280A1
Strengthened glass substrate sheets and methods of fabricating glass panels from glass substrate sheets are disclosed. In one embodiment, a method includes forming at least one series of holes through a thickness of the glass substrate s...  
WO/2012/100659A1
A wire saw, especially a wire saw for cutting stones, comprising a rope-shaped cord and a plurality of saw blades, and the plurality of saw blades are fixed to the rope-shaped cord; the saw blade comprises a central body (2), a grinding ...  
WO/2012/102659A1
The present invention relates to a laying machine for laying at least one flexible casing or tube, cable or wire including: a blade arrangement (2) for making a trench (5) in the ground, a consolidation and laying means (3) being arrange...  
WO/2012/102659A8
The present invention relates to a laying machine for laying at least one flexible casing or tube, cable or wire including: a blade arrangement (2) for making a trench (5) in the ground, a consolidation and laying means (3) being arrange...  
WO/2012/099509A1
A cutting and dust or slurry collecting assembly that comprises: a) a circular saw blade (4) b) a blade guard (5) c) a cover device (6), and the cover device (6) has a front end (31), a rear end (32), a top surface (34), a bottom surface...  
WO/2012/099444A2
The present invention relates to a wire saw apparatus for cutting an ingot. The wire saw apparatus for cutting a downwardly moving ingot according to the present invention comprises: a plurality of bobbins which are spaced apart from eac...  
WO/2012/099522A1
A cutting and dust or slurry collecting assembly that comprises: a) a circular saw blade (4) b) a blade guard (5) c) a cover device (6), and the cover device (6) has a front end (31 ), a rear end (32), a top surface (34), a bottom surfac...  
WO/2012/099361A3
An apparatus for fixing a substrate block for slicing a substrate block which includes a side surface having a plane shape and corner surfaces formed at both ends of the side surface to be inclined with respect to the side surface, and f...  
WO/2012/099361A2
An apparatus for fixing a substrate block for slicing a substrate block which includes a side surface having a plane shape and corner surfaces formed at both ends of the side surface to be inclined with respect to the side surface, and f...  
WO/2012/099444A3
The present invention relates to a wire saw apparatus for cutting an ingot. The wire saw apparatus for cutting a downwardly moving ingot according to the present invention comprises: a plurality of bobbins which are spaced apart from eac...  
WO/2012/093422A1
This apparatus for scribing a silicon carbide board is provided with: a horizontal table (3), which fixes a silicon carbide board (2) by vacuum suction; a feed screw (5) and a Y axis control motor (6), which move the table (3) along guid...  
WO/2012/091559A1
The invention relates to a seal for a sawing machine (1) for separating electronic components (12), comprising: an elongate form- retaining holder (20,22), a flexible, elongate expandable body (8,9)and a pressure source (24) for a medium...  
WO/2012/090828A1
The purpose of the present invention is to provide a method for effectively manufacturing a hexagonal semiconductor plate crystal with small warpage. This method for manufacturing the hexagonal semiconductor plate crystal is a method for...  
WO/2012/084357A1
The invention relates to a cutting element for a drill, designed for rotating about a rotary axis (R) when drilling and comprising at least one first grinding particle type (1). In order to increase the effectiveness and service life of ...  
WO/2012/081239A1
A wire saw slurry management device is provided with: a first tank (5A) which receives slurry waste (3); a centrifugal separator (14) into which the slurry waste (3b) from the first tank (5A) is introduced and which isolates the slurry (...  
WO/2012/080821A1
The invention is a milling element (1; 20; 50) for milling drums (T) of ground surface scarifiers, comprising: a support (2; 22; 52) suited to be applied to the outside of the cylindrical core (A) of the drum (T) and provided with a hous...  
WO/2012/076139A1
The invention relates to a method for cutting and/or comminuting silicon blocks, silicon disks (1), or silicon rods (7) along a cutting line (2) or a comminuting line. The method is characterized in that heat is introduced with a thermal...  
WO/2012/075067A3
A cutting guide includes a central support (14), a plurality of legs (16) supporting the central support, and a guide rail (22) disposed on the central support. The guide rail defines a first end and a second end. A carriage (38) is slid...  
WO/2012/073428A1
The present invention is an ingot cutting method for cutting a monocrystalline ingot having a cylindrical straight body portion that has been cylindrically ground, and a conical end portion with a mirror finish that has not been cylindri...  
WO/2012/075067A2
A cutting guide includes a central support, a plurality of legs supporting the central support, and a guide rail disposed on the central support. The guide rail defines a first end and a second end. A carriage is slidably disposable in t...  
WO/2012/071623A1
A tool (10) for dislodging grout from a joint between two adjacent planar surfaces, or for removing a strip of material from a masonry surface including, a generally elongate body (12) having a lower portion (14) dimensioned to fit at le...  
WO/2012/074439A4
This invention provides two variations of methods of separating a surface layer (307) of the semiconductor crystal (101). In the first variation of the method, a focused laser beam (102) is directed onto the crystal (101) in such a way t...  
WO/2012/074439A3
This invention provides two variations of methods of separating a surface layer (307) of the semiconductor crystal (101). In the first variation of the method, a focused laser beam (102) is directed onto the crystal (101) in such a way t...  
WO/2012/070989A1
A power cutter powered by a single cylinder internal combustion engine, the power cutter comprising: a tool unit having at least one tool, which can be rotated about an axis of rotation (108); a drive unit (104) comprising an engine, the...  
WO/2012/062296A3
The invention relates to a device for structuring thin-film solar cell modules (1) in a highly accurate manner, comprising a conveying apparatus (2) and a process unit (12), which has movable retainers (4) on a rail (5) perpendicular to ...  
WO/2012/062455A1
The invention relates to an interchangeable holder system (1) having a base part (2) and an interchangeable holder (3) that can be attached to the base part (2) for receiving a machining tool (4) for machining the floor, and a constructi...  
WO/2012/064274A1
The present invention relates to a saw blade for a sawing machine, said sawing machine (10) being arranged for cutting micro trenches by means of said saw blade (1), wherein said micro trenches are adapted for receiving at least one duct...  
WO/2012/064273A1
The present invention relates to a control method in a system comprising - a server unit having computer means, communication means and a first data base, said first data base including positioning data and a plurality of work orders, wh...  
WO/2012/059287A1
A grinding and/or cutting tool for a machine tool with an oscillating drive has a holder part for connection to a tool shaft and a main removal element for machining a workpiece, which element is formed as a hollow body and a cavity of t...  
WO/2012/056512A1
The purpose of the present invention is to provide: a polishing pad that improves dressing properties, and with which the surface of an object to be polished is not easily scratched; and a method for producing the polishing pad. This pol...  
WO/2012/056513A1
The purpose of the present invention is to provide: a polishing pad that improves dressing properties, and with which the surface of an object to be polished is not easily scratched; and a method for producing the polishing pad. This pol...  
WO/2012/055052A1
The device (4) for clamping a fixture attachment (19) to a machine comprises tension rods (20) for fixing the fixture attachment to an adapter piece (21) attached to a machine part, whereby the adapter piece (21) is provided at one side ...  
WO/2012/052952A1
A cutting wire for stone material designed to be wrapped around a supporting and moving device thereof of the drum or pulley type. The wire comprises a plurality of diamond beads (5) and a plurality of polymeric beads (9) coupled in a re...  
WO/2012/053488A1
The present invention is a method for drilling a mother glass substrate for a plasma display panel, wherein a rotating drill is moved to the mother glass substrate side, and a hole is made in the mother glass substrate. The method has: a...  
WO/2012/050307A2
Provided are an apparatus and a method for sawing a single crystal ingot. The apparatus includes a wire saw sawing an ingot, a roller driving the wire saw, and a bath containing a liquid cooling the ingot before sawing the ingot.  
WO/2012/050307A3
Provided are an apparatus and a method for sawing a single crystal ingot. The apparatus includes a wire saw sawing an ingot, a roller driving the wire saw, and a bath containing a liquid cooling the ingot before sawing the ingot.  
WO/2012/046439A1
This scoring and cutting device (100) is configured in such a manner that a scoring movable frame (21) moves from the downstream side of a scoring level block (40) toward the upstream side to longitudinally move longitudinally movable cu...  

Matches 301 - 350 out of 17,261