Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 301 - 350 out of 9,664

Document Document Title
WO/2011/107872
The machine (1) for the mechanical machining of plate- shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-sha...  
WO/2011/107818
The invention relates to a method of cutting a foundation element (1 ) in the ground, characterised in that it comprises the steps of: (a) drilling at least two borings (B1, B2) in the ground around the foundation element (1 ), (b) wire ...  
WO/2011/106203
A method for spalling a layer from an ingot of a semiconductor substrate includes forming a metal layer on the ingot of the semiconductor substrate, wherein a tensile stress in the metal layer is configured to cause a fracture in the ing...  
WO/2011/104097
A method for producing a plurality of optoelectronic semiconductor chips is specified, comprising at least the following method steps: a) providing a carrier wafer (1) having a first surface (11) and a second surface (12) lying opposite ...  
WO/2011/105930
The invention relates to the field of mining and processing various hard materials by cutting. The technical result is an increase in the service life of the working member and a reduction in the energy intensity of the cutting process. ...  
WO/2011/105450
Provided is a method for designing a resin-coated saw wire such that when a workpiece is cut off using a resin-coated saw wire formed by coating the surface of a steel wire with resin, the depth of a machining-altered layer is shallow, a...  
WO/2011/105655
The present invention relates to an apparatus for dismantling a structure using a wire saw and a dust collector, and more particularly, to an apparatus for dismantling a structure using a three-dimensional bead and a cyclone dust collect...  
WO/2011/105339
Provided is a base wire that is used as a coated saw wire having an organic film on the surface, wherein the base wire is able to minimize the peeling of the organic film. Furthermore, the base wire for the coated saw wire provides the c...  
WO/2011/106203
A method for spalling a layer from an ingot of a semiconductor substrate includes forming a metal layer on the ingot of the semiconductor substrate, wherein a tensile stress in the metal layer is configured to cause a fracture in the ing...  
WO/2011/096018
Provided is a method of cutting a workpiece efficiently and with high accuracy in such a way that by using tension adjusting devices, only the tension in the portion of the wire on the winding side is effectively reduced, said tension ad...  
WO/2011/096619
The present invention relates to a wire saw with 3D-shaped beads. More particularly, the wire saw includes: a wire; first beads inserted on the wire and formed curvedly; second beads inserted on the wire to be adjacent to the first beads...  
WO/2011/095664
The invention relates to the sawing of granite, to a demonstration and to improvements, consisting of a method of demonstrating the improvements to the sawing of granite to the potential users in their own factory. Said method is charact...  
WO/2011/096388
Provided is a breaking method by which an end surface strength can be stronger. A method for breaking a brittle material substrate comprises a step for forming a scribe line on the brittle material substrate, and a breaking step for brea...  
WO/2011/096019
Provided is a wire saw which uses a cutting wire to cut a workpiece, this wire saw being such that wire tension can be adjusted with high responsiveness. The wire saw has first and second workpiece cutting sections (1A, 1B). The workpiec...  
WO/2011/093482
Provided is a method for producing a member having a bottomed hole wherein a two-point supported cutting wire is used to form a hollowed out bottom portion, so that yield of a material is good, durability as a cutting blade can be increa...  
WO/2011/091650
A laser marking dust-removal device (100) includes a process unit (1), a dust suction unit (2), a first filter unit (3), a high-pressure exhauster (4), and a number of electrostatic dust-removal rods (8). The process unit comprises an in...  
WO/2011/093764
The present invention relates to a laying machine for laying at least one flexible casing or tube, cable or wire including: - a blade arrangement (2) for making a trench (5) in the ground, a consolidation and laying means (3) being arran...  
WO/2011/089610
This invention relates to circular chain saws (100, 200) and more particularly to improved circular chain saws for cutting hard materials such as concrete and reinforced concrete, bricks, stone and building materials, including chains (1...  
WO/2011/089610
This invention relates to circular chain saws and more particularly to improved circular chain saws for cutting hard materials such as concrete and reinforced concrete, bricks, stone and building materials, including chains that can be r...  
WO/2011/089610
This invention relates to circular chain saws (100, 200) and more particularly improved circular chain saws for cutting hard materials such as concrete and reinforced concrete, bricks, stone and building materials, including chains (120,...  
WO/2011/089739
Provided are a tool wherein a super-hard tip, such as a cemented carbide tip, is fixed to a steel base, and which is suitable for use primarily for purposes such as opening a taphole; and a practical method of fixing the super-hard tip i...  
WO/2011/086736
A cutting machine configured in such a manner that, even if the depth to which the rotating blade cuts into a material to be cut is changed, the dust collection efficiency does not deteriorate. A cutting machine (1) configured in such a ...  
WO/2011/086170
In a method for providing wafers, in which a material block (11) sawed into wafers (22) is cleaned by means of a cutting suspension based on a suspending agent (17), good cleaning can be achieved, wherein the problems of "sticking" are s...  
WO/2011/086403
A pulley tire (450) is provided, for a pulley of a wire saw device having a wire forming a wire web, the pulley (700) comprising a wheel (410) and the tire (450). The tire (450) is essentially ring- shaped about an axis and has: a wire g...  
WO/2011/083203
The invention relates to a portable apparatus for cutting tiles (5) or the like. The cutting apparatus comprises a housing part (20), inside which there is fitted a carriage part (6), which is arranged to be moved in a power-driven manne...  
WO/2011/081532
Process for cutting a block of material 12 into a multiplicity of wafers by movement of a planar array of parallel fast moving wires 14 relative to the block (or vice versa) in a direction perpendicular to the plane of the wires and appl...  
WO/2011/080009
The invention relates to a rock drilling tool comprising a drilling head provided with a cutting body (3), and a helix arranged between the drilling head and a shaft, the cutting body (3) extending continuously over a nominal diameter of...  
WO/2011/080581
Machine tool (10) for cutting stone materials, comprising an apparatus for opening one end of the rotational shafts (14a, 15a) of the roller (14) and the pulleys (15), said apparatus comprising a pair of frames (110) each of which is fix...  
WO/2011/081533
There is provided a method for cutting a block (13) of silicon into a multiplicity of wafers, by movement of a planar array (11) of parallel fast moving wires relative to the block (13) (or vice versa) in a direction perpendicular to the...  
WO/2011/077559
Provided is a process for working rock by a laser, which is capable of achieving remarkably high working efficiency, a reduction in working time, and a reduction in working energy. By applying a laser (13) having a wavelength of 1.2 μm ...  
WO/2011/074026
A diamond wire machine for cutting natural or artificial stone, comprising: water distribution system (12) for cooling within the cut made by the diamond wire in the stone; at least one closed loop diamond wire (3) which, following a clo...  
WO/2011/075020
A tool unit (3) for a cutting or sawing machine with a tool carrier (103) enabling especially deep cuts, comprises a first tool (1) and a second part (2, 50). The first tool (1) comprises a disk shaped cutting blade (10) and a first blad...  
WO/2011/074026
A diamond wire machine for cutting natural or artificial stone, comprising: water distribution system (12) for cooling within the cut made by the diamond wire in the stone; at least one closed loop diamond wire (3) which, following a clo...  
WO/2011/070386
A wire monitoring device for a wire saw device, a wire saw device and a method of monitoring a wire saw device are described. The wire monitoring device includes at least two sensors, adapted to provide a change of a sensor output signal...  
WO/2011/070410
A motor (100) that includes a stator (20) and a rotor (10) disposed inside the stator (20) and a cleft magnet (30) is disposed within the rotor (10), the motor (100) characterized in that a notch (31) is formed in an outer lateral face (...  
WO/2011/066831
In a rotary drill, the drill is provided with at least one groove, of which one groove has a center lying on the axis of rotation of the drill. The two end points of the groove define a groove width, and the drill is provided with two or...  
WO/2011/066831
In a rotary drill (10), the drill is provided with at least one groove, of which one groove (17) has a center lying on the axis of rotation (1) of the drill. The two end points (13,14) of the groove (17) define a groove width, and the dr...  
WO/2011/064170
The invention relates to reclaiming silicon and/or silicon carbide from siliceous abrasive slurries, wherein the abrasive slurries are first subjected to a method for high-pressure extraction by means of liquid or supercritical carbon di...  
WO/2011/063437
The invention relates to a saw blade, in particular for reciprocating saws, for cutting stone. The problems of economical saw cut generation in a stone block, composed preferably of hard stone, for raw board production are primarily thos...  
WO/2011/064647
A tool (1) or mill for grinding glass comprised of an elongated cutting mill body (2) having a first portion (3) intended to be coupled to a base, which preferably allows it to rotate around a longitudinal axis (K) and a second portion (...  
WO/2011/065821
The present invention relates to a device (1) for cutting a slit (21) in a wall (8). The device (1) according to the invention comprises a hand-held circular saw (2) for cutting a slit (21), a guide rail (3) which can be arranged on a wa...  
WO/2011/065373
Laser beams (L1 to L3) are relatively moved along a scheduled cutting line (5) while a light collection step of concurrently collecting the laser beams (L1 to L3) to light collection positions (P1 to P3), which are separate from one anot...  
WO/2011/061138
Drive pulley for supporting cutting tools (11) of machine tools (10) for processing stone materials, comprising a body (21) provided on its circumferential surface with radial engaging means (22) extending annularly and parallel to each ...  
WO/2011/061039
The invention relates to a plant for separating grinding slurry originating from grinding machines into metal chips and grinding oil. According to the invention, a carrier bowl (3) in a frame (1) is filled with a divided volume of the gr...  
WO/2011/055903
The present invention relates to a diamond wire saw for cutting a silicon ingot for a solar cell, and more particularly, to a diamond wire saw in which the correlation among a wire, an electrodeposited nickel layer, and diamond particles...  
WO/2011/055902
The present invention relates to a wire saw, comprising: a core wire; an electrodeposited nickel layer which is electrodeposited on an outer surface of the core wire; a diamond arranged such that a portion thereof is outwardly exposed fr...  
WO/2011/055902
The present invention relates to a wire saw, comprising: a core wire; an electrodeposited nickel layer which is electrodeposited on an outer surface of the core wire; a diamond arranged such that a portion thereof is outwardly exposed fr...  
WO/2011/054339
Multi-purpose milling crusher, in particular for roadbuilding and soil stabilization, comprising a milling roller equipped with cutters and at least one crusher device interacting with the milling roller, characterized in that the crushe...  
WO/2011/055903
The present invention relates to a diamond wire saw for cutting a silicon ingot for a solar cell, and more particularly, to a diamond wire saw in which the correlation among a wire, an electrodeposited nickel layer, and diamond particles...  
WO/2011/054510
The present invention relates to a method of handling a plurality of wafers (1). The method comprises the steps of: providing a plurality of wafers (1), each wafer being bonded to a substrate (3a) along a first edge. The wafers (1) are s...  

Matches 301 - 350 out of 9,664