Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 301 - 350 out of 18,625

Document Document Title
WO/2014/068672A1
Provided are a hole machining system (10), robot (RB), hand (40), and method for controlling a hole machining system (10), capable of removing a cut piece (CP) of a workpiece (W) remaining inside a hole saw (50) and collecting the same i...  
WO/2014/063910A1
The invention relates to a fixed abrasive sawing wire wherein abrasive particles are held in a metal matrix fixed to a metal wire. The metal wire has an oblong cross section and particular about the wire is that the abrasive particles ar...  
WO/2014/065248A1
After forming an initial crack (3) in a portion of the planned cutting line (2) of the glass film (1), in a state in which one surface of the glass film (1) is supported on a support member (5), the glass film (1) is flexed such that the...  
WO/2014/064628A1
The equipment (1) for cutting slabs of ceramic material comprises a frame (2) for bearing movement means of at least a slab of ceramic material to cut along a forward direction (4), first cutting means (5) with water jet, arranged along ...  
WO/2014/061050A1
An automatic sawing machine (1) for cutting stones and materials of irregular shape and different sizes, comprising at least one frame (2, 4) for supporting at least two longitudinal conveyor elements (5, 6) with at least two respective ...  
WO/2014/061053A1
In a wire saw apparatus (1), a cutting wire (3) wrapped in a spiral on a plurality of wire guides (2) is caused to travel, and a workpiece (W) is simultaneously pressed against the cutting wire (3) and cut and machined while the cutting ...  
WO/2014/052445A1
The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the f...  
WO/2014/052296A1
A process to make atomically sharp cutting devices is described. The process may provide for a cost effective and efficient technique of producing the atomically sharp cutting devices made from single crystal material such as, for exampl...  
WO/2014/045106A1
The invention relates to a wafer receiving box (3) for receiving wafers (5), the wafer receiving box (3) having in a first area (1 1) a width (W1), characterized in that the wafer receiving box (3) has in a further area (12, 13) which is...  
WO/2014/045108A1
The invention relates to a method of making wafers (5) from an ingot (4) which is fixed to a beam (19) by means of a gluing layer (10) wherein the beam (19) has at least one internal channel (11), the method comprising the steps of: cutt...  
WO/2014/036714A1
A shaped sawing wire adapted to cutting hard materials, comprises a wire having bends with segments in between. The wire has subsurface tensile residual stresses for keeping the shape of the wire while sawing. The sawing wire keeps its s...  
WO/2014/035481A1
The present invention discloses a group III nitride wafer such as GaN, AlN, InN and their alloys having one surface visually distinguishable from the other surface. After slicing of the wafer from a bulk crystal of group III nitride with...  
WO/2014/033243A3
The present invention relates to a method for the treatment and/or recycling of sawing slurries, particularly of semiconductor materials, arising in mechanical cutting methods. The sawing slurries contain particles of semiconductor mater...  
WO/2014/034841A1
A method for cutting a high-hardness material by a multi-wire saw comprises: a step (A) for preparing at least one ingot having a main body portion (10a) having both ends and a low-quality crystalline portion (10e) located at only one of...  
WO/2014/033594A1
The present invention relates to a process for obtaining an annular element for a wire for cutting stone material, comprising the following sequential steps: fitting at least one elastically yieldable element (5) on a bar (8); placing a ...  
WO/2014/034805A1
A manufacturing method of one embodiment of the present invention includes: a step for forming a taper-shaped first groove (151) in the front surface (100a) of a semiconductor wafer (110); a step for forming a narrow-width cut groove (15...  
WO/2014/029734A1
A diamond bead (10) for cutting stone-like material, comprising a central supporting element (11), provided with a through opening (12), and a diamond annular cutting body (13), which is fixed so as to surround the central supporting ele...  
WO/2014/029671A1
A method of cutting a super-hard material (8) using an electron beam (6), wherein the electron beam (6) is directed onto a surface of the super-hard material (8) and moved relative to the surface such that the electron beam (6) moves acr...  
WO/2014/022333A1
A tool holder (46) is disclosed for use with a milling drum (16). The tool holder may have a generally cylindrical body (82) defining a first end (86) configured to be received within a tool mounting block (44) of the milling drum, and a...  
WO/2014/021606A2
The present invention relates to a method and apparatus for processing an edge of glass, and more particularly, to a method and apparatus for heat treating and processing an edge of a large thin glass sheet used for a liquid crystal TV o...  
WO/2014/021606A3
The present invention relates to a method and apparatus for processing an edge of glass, and more particularly, to a method and apparatus for heat treating and processing an edge of a large thin glass sheet used for a liquid crystal TV o...  
WO/2014/022331A1
A tool mounting block (44) is disclosed for use with a milling drum (16). The tool mounting block (44) may have a flighting portion (50) with a base surface (56) configured to engage an outer cylindrical surface (30) of the milling drum ...  
WO/2014/017878A3
The present invention relates to a scribing wheel comprising: a wheel-shaped wheel body, the thickness of at least the edge of the circumference of which gradually decreases when progressing radially outward; and a cutter unit having a p...  
WO/2014/017878A2
The present invention relates to a scribing wheel comprising: a wheel-shaped wheel body, the thickness of at least the edge of the circumference of which gradually decreases when progressing radially outward; and a cutter unit having a p...  
WO/2014/017748A1
The present invention relates to a wire saw which enables materials such as concrete or stone to be cut, and one object thereof is to provide a diamond wire saw in which the front of a bead is curved for appropriate work without being in...  
WO/2014/017577A1
A method for manufacturing sheet glass, comprising forming, on the periphery of an edge part (Ga) of a rectangular sheet glass (G), a scribe (S) parallel to the edge part (Ga) on one surface of the sheet glass (G), and breaking the sheet...  
WO/2014/013466A3
An apparatus (1) with a reciprocating component (3) fitted with composite cushioning slides (13) on an exterior surface (8, 9). The reciprocating component (3) is movable along a reciprocation path and the composite cushioning slide (13)...  
WO/2014/013450A1
A method for manufacturing tubular supports (4) designed to support respective diamond cutting members (3) to obtain diamond beads (5) coupled to a flexible support structure (2) for manufacturing a wire (1) for cutting slabs from blocks...  
WO/2014/012879A1
The invention relates to a device for separating wafers from a wafer stack which is located on a support device in a liquid container, said support device being equipped with an advancing device for the wafer stack. The aim of the invent...  
WO/2014/010154A1
A scribing device (1) is provided with: a worktable (6) on which a glass substrate (5) as a brittle material substrate on which alignment marks (M1, M2, M3...) are made on the upper surface thereof, is mounted, aligned, and secured by su...  
WO/2014/008723A1
Automatic Cutting equipment for processing stone floor tile, the equipment comprising: a material feeding device (31), a conveying device, a cutting device, and a material discharge device (39). The conveying device conveys a fixed-thick...  
WO/2014/008726A1
A stone floor tile manufacturing method for manufacturing the floor tile (10) of a stone floor (1), the method comprising the following steps: (1) processing a stone into a slab; (2) polishing the slab to give a definite thickness and pr...  
WO/2014/008721A1
An inlaying and tiling method for an inlaid stone floor (1), the method comprising the following steps: (1) processing a stone floor tile (10) to give the tile (10) a tiling structure (11, 12); (2) processing inlaid floor tile (10) to gi...  
WO/2014/010686A1
Provided is a method for producing a functional substrate and that achieves sufficiently high production characteristics. In a cutting step of the method for producing a functional substrate, an intermediate layer (17) is locally heated ...  
WO/2014/008742A1
A method for hole grinding with a small-size drill bit. The method comprises the following steps of: (S1) designing a processing drawing; and assisting the shape and dimension design of the hole needing to be processed on computer accord...  
WO/2014/005221A1
A powered tile breaker having a main adjustable frame with handlebars located at a top end section thereof, at least one wheel located at a lower end section thereof, and an adjustable shaft connected between the top end section and the ...  
WO/2014/001428A3
The present invention relates to a crushing machine pulverizing the asphalt layer (RAP), which is desired to be recycled by being removed from the place thereof, in order to transform the RAP into recycled asphalt concrete (RAC).  
WO/2014/000003A1
The invention relates to a cable saw (1) comprising a sawing device (2). Said sawing device (2) comprises a saw cable (3) provided, in particular with diamond sections, and a guide device for the saw cable (3) which can be driven by a dr...  
WO/2014/000005A1
The invention relates to a cable saw for extracting, for example, a block of stone from a mountain, comprising a sawing unit comprising a saw cable (1) which is provided with, in particular, diamond sections, and a guide device for the s...  
WO/2014/001428A2
The present invention relates to a crushing machine pulverizing the asphalt layer (RAP), which is desired to be recycled by being removed from the place thereof, in order to transform the RAP into recycled asphalt concrete (RAC).  
WO/2014/003157A1
An aqueous processing liquid to be used when cutting a fragile material with a wire saw incorporates a water-soluble polymer, and is characterized in that the mass average molecular weight of the water-soluble polymer is 3×103 to 6×105...  
WO/2014/000004A1
The invention relates to a device for quarrying solid workpieces such as stone or concrete foundations, comprising a milling cutter (1) with a milling head (7) and which can be driven by a drive cable (9) provided with diamond segments a...  
WO/2013/185952A1
The invention relates to a method for cutting a single crystal (1) having a first polar axis (P1) comprising the steps of arranging the single crystal (1) relative to a cutting tool (2) in such a way that the first polar axis (P1) is ori...  
WO/2013/187837A3
An electric power saw/cutter (1) comprising: a.a rotatable saw structure (2) b.a rear handle (5) with a switch/speed control (6) c.a front handle (7) d.a drive unit (8) for rotating the saw structure (2), the drive unit (8) itself compri...  
WO/2013/183831A1
The present invention relates to a stone cutting machine and provides an ultra-slim stone cutting machine, comprising: a "U" shaped port frame (1) open at the bottom side thereof and mounted on the ground surface and including two column...  
WO/2013/179498A1
[Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains a smooth wafer in which the thickness of a damaged layer on the wafer surface caused by cuttin...  
WO/2013/176089A1
The invention sets cut plan lines (51, 52) for cutting an item to be processed (1) such that neither of said cut plan lines (51, 52) is parallel to an a-plane or an m-plane of a hexagonal crystalline compound. A laser beam (L) is irradia...  
WO/2013/175398A1
A cutting apparatus (1) for use in machines for cutting blocks (2) of schistose materials comprises: a cutting actuator unit (4) that exerts a pushing action in a pushing direction on a cutting blade (10) whose blade body has an overall ...  
WO/2013/166976A1
A method for manufacturing a resin diamond wire comprising viscose, carborundum, and a core wire. The method comprises the steps of: preparing a carborundum resin liquid comprising carborundum coated with metal, a resin adhesive, an orga...  
WO/2013/156606A1
The machine comprises a bearing structure (103), a first guide drum (109) for guiding at least one cutting wire (F) and a second guide drum (111) for the cutting wire. The first guide drum and the second guide drum are movable along the ...  

Matches 301 - 350 out of 18,625