Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 301 - 350 out of 9,798

Document Document Title
WO/2012/017988
The disclosed method for cutting a glass film (G) involves: continuously cutting the glass film (G) along an intended cut line (8), which extends in the feed direction (a) in which the glass film is fed, and thereby splitting the glass f...  
WO/2012/011446
Disclosed is a laser processing method for cutting out at least a first effective section and a second effective section from a plate-shaped object to be processed. The method comprises a first step and a second step. In the first step, ...  
WO/2012/011445
Disclosed is a glass film cutting device (1) that uses thermal stress generated by local heating and cooling of the heated area along a planned cutting line (7) in a glass film (G) to move an initial crack (10) formed in the end section ...  
WO/2012/007275
The invention relates to a sawing apparatus (4) for producing a scintillator (2), which is structured into scintillator elements (1), for a radiation detector (3). Said sawing apparatus further comprises a rotatably mounted saw blade (5)...  
WO/2012/007381
A carrier (13) for a silicon block (31) is designed to be firmly connected as part of a carrier arrangement (11), together with a lower carrier part (25), to the silicon block (31), and to be moved together therewith for machining by saw...  
WO/2012/007956
Laser fire protection system used to prevent the diamond break due to fire on any unwanted focal point inside the diamond. Graphite layer is creates on the diamond surface before sawing process by applying high temperature of 800°c to 1...  
WO/2012/004052
The carrier device (10) is used for fixing a material block (13) in a cutting device during cutting into wafers. The material block (13) is fixed on a surface (2) of the carrier device (10) so as to be secure against slippage. A pluralit...  
WO/2012/001235
The invention relates to a loudspeaker enclosure consisting of stone, including a front cover (3), a back cover (5) as well as an edge (4,6) circulating the borders thereof and connecting them to each other to form a substantially sealed...  
WO/2012/000986
The invention relates to a cutting tool, in particular cutting wheels, and a method for producing the same. For the purposes of smoothing the surfaces (6a, 6b) and of sharpening the cutting edge (4), use is made of a method in which at l...  
WO/2012/001698
Multiple Diamond planning and Brating Machine is used to scan the multiple diamond on the single machine so, it reduce the labor and production cost. The invention mainly comprised in two parts; Flat scanner setup, Multi bruit machine wh...  
WO/2011/162392
Disclosed is a cutting method whereby a board to be processed can be accurately cut with a simple configuration. In the cutting method, an irradiation region (101) of a laser beam (100) is relatively moved along at least a part of a scri...  
WO/2011/158672
In a modified-region formation step, a element-array-bearing substrate (20) comprising a plurality of semiconductor light-emitting elements (21) formed on the front surface (11a) of a wafer substrate (11) is irradiated with laser light (...  
WO/2011/155314
Provided is a method for cutting a glass sheet, which makes it possible to perform cutting appropriately even for a thin glass sheet having a thickness of 1 mm or less. A scribe line (20a) is formed along part of a planned cutting line (...  
WO/2011/151022
The invention relates to a method for monitoring for wire breaks while hard solids are cut by means of a span of wire, wherein the solid is guided through the span of wire, and a direct current is conducted by the span of wire. The direc...  
WO/2011/151022
The invention relates to a method for monitoring for wire breaks while hard solids are cut by means of a span of wire, wherein the solid is guided through the span of wire, and a direct current is conducted by the span of wire. The direc...  
WO/2011/148559
Disclosed is a method for separating semiconductor wafers, wherein the wafers after being cut can be reliably separated one by one, and the wafers are not broken when the wafers are being separated. Since a separating liquid containing f...  
WO/2011/145858
The present invention relates to a wire tool comprising: a wire containing metal; a plating layer formed on the surface of the wire; a plurality of diamond particles arranged on the plating layer; and a first protection layer which cover...  
WO/2011/145005
A cutting device for a machine tool, suitable for mounting on the spindle support structure of a machine tool (200) for processing and cutting materials (224), incorporates sucker means (44a,b,c,d,e,f; 64a,b,c) able to cause said device ...  
WO/2011/144270
Machine (100) for machining materials in blocks or slabs (200) comprising: a) a tool-holder unit (10) displaceable above an external working surface (102), in a parallel and orthogonal directions with respect to the working surface (102)...  
WO/2011/145856
Provided is a wire tool, including: a metal-containing wire; a coated layer disposed on a surface of the wire; a plurality of diamond particles disposed at an upper portion of the coated layer; and a protective layer disposed between the...  
WO/2011/145270
Disclosed is a drill bit which maintains dust attraction performance and has increased rigidity at a connection portion between a bit tip portion and a bit shaft portion; wherein the drill bit (1) comprises the bit tip portion (3) arrang...  
WO/2011/142464
Provided are a cutting method and a cutting device which achieve improved heating efficiency and cutting accuracy and can easily correspond to the design change of a planned cut line. Specifically provided is a cutting method for cutting...  
WO/2011/141543
The present invention relates to a wire sawing device (10) for producing wafers, in particular for the semiconductor and photovoltaic industry, wherein the wire sawing device (10) comprises a wire field (18) of a sawing wire (16) that ca...  
WO/2011/132133
The aim of the invention is to provide a solution for guiding the cutting of a piece of plasterboard, which can be rapidly implemented, and does not require any finishing step for refilling the surface of the piece of plasterboard. To th...  
WO/2011/129745
A machining assembly (1) comprising a drive unit (2) with a drive motor and a drive member rotatable by the drive motor, which drive member is rotatably arranged in a housing (6) of the drive unit, and a transmission unit (4) which is at...  
WO/2011/129732
According to an embodiment, a leveling aid (102) for a drilling tool (100) is disclosed. The leveling aid (102) includes a mounting means adapted to be attached to the drilling tool (100). The leveling aid (102) further includes a level ...  
WO/2011/129751
A coupling device for coupling together a tool holder (3) with a rotatable spindle (2) of a machining machine. The coupling de- vice comprises: - a female-shaped coupling part (10) with an internally cone- shaped section (11) and a male-...  
WO/2011/128447
The invention relates to a device for artificially ageing stones (2), in particular concrete stones, clinker tiles and natural stones, comprising a support (1) on which the stones (2) can be placed such that a side surface (2e) of the st...  
WO/2011/129731
The present invention relates to a core drilling machine (100). The core drilling machine (100) includes a front housing part (102) including a protruding nose. The drilling machine (100) includes a front handle assembly (118) and an out...  
WO/2011/129265
Disclosed is a glass sheet processing apparatus, which relatively moves a cutter (30) and a glass sheet (40), said cutter being connected to one end of an air cylinder (10) with a holder (20) therebetween, in a state wherein the cutter (...  
WO/2011/124143
A bridge cutting saw includes a trolley (1), two vertical beams (2) provided with linear guide rails (21) and fixedly connected with two sides of the trolley (1), a beam (3) walking on the linear guide rails (21) of the vertical beams, a...  
WO/2011/122144
The disclosed main roller for a wire saw has wire grooves with increased rigidity, improves cutting precision, and can improve the yield of a product. As well as maintaining the rigidity of the partitions and a high level of yield, even ...  
WO/2011/123382
The invention is directed to a wall chaser (10) for producing slots or similar recesses in masonry or the like, wherein a drive section (1) having a drive motor (2) and gear unit (3) connected on the output side and a tool section (4) ha...  
WO/2011/117050
The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element (1) comprising the steps of -manufacturing at least two cavities (2, 3) on the surface of the element to be polished, the dept...  
WO/2011/118864
The present invention relates to a method for slicing an ingot that can reduce slicing time and wire consumption when slicing a synthetic corundum single-crystal ingot having an R-axis direction. According to the present invention, the m...  
WO/2011/116827
A segmented cutting disc, in particular a diamond cutting disc, having a disc body 1 and having cutting segments 2 distributed over the circumference of the disc body 1, wherein the disc body 1 defines a central cutting plane 4, and wher...  
WO/2011/117050
The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element (1) comprising the steps of -manufacturing at least two cavities (2, 3) on the surface of the element to be polished, the dept...  
WO/2011/110430
Method for machining a semiconductor wafer (11), comprising a) providing a wafer (11) which is divided off from a crystal of semiconductor material by means of a wire saw and which has a laser marking (7) and a sawing substrate (12) in t...  
WO/2011/107872
The machine (1) for the mechanical machining of plate- shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-sha...  
WO/2011/107818
The invention relates to a method of cutting a foundation element (1 ) in the ground, characterised in that it comprises the steps of: (a) drilling at least two borings (B1, B2) in the ground around the foundation element (1 ), (b) wire ...  
WO/2011/106203
A method for spalling a layer from an ingot of a semiconductor substrate includes forming a metal layer on the ingot of the semiconductor substrate, wherein a tensile stress in the metal layer is configured to cause a fracture in the ing...  
WO/2011/104097
A method for producing a plurality of optoelectronic semiconductor chips is specified, comprising at least the following method steps: a) providing a carrier wafer (1) having a first surface (11) and a second surface (12) lying opposite ...  
WO/2011/105930
The invention relates to the field of mining and processing various hard materials by cutting. The technical result is an increase in the service life of the working member and a reduction in the energy intensity of the cutting process. ...  
WO/2011/105450
Provided is a method for designing a resin-coated saw wire such that when a workpiece is cut off using a resin-coated saw wire formed by coating the surface of a steel wire with resin, the depth of a machining-altered layer is shallow, a...  
WO/2011/105655
The present invention relates to an apparatus for dismantling a structure using a wire saw and a dust collector, and more particularly, to an apparatus for dismantling a structure using a three-dimensional bead and a cyclone dust collect...  
WO/2011/105339
Provided is a base wire that is used as a coated saw wire having an organic film on the surface, wherein the base wire is able to minimize the peeling of the organic film. Furthermore, the base wire for the coated saw wire provides the c...  
WO/2011/106203
A method for spalling a layer from an ingot of a semiconductor substrate includes forming a metal layer on the ingot of the semiconductor substrate, wherein a tensile stress in the metal layer is configured to cause a fracture in the ing...  
WO/2011/096018
Provided is a method of cutting a workpiece efficiently and with high accuracy in such a way that by using tension adjusting devices, only the tension in the portion of the wire on the winding side is effectively reduced, said tension ad...  
WO/2011/096619
The present invention relates to a wire saw with 3D-shaped beads. More particularly, the wire saw includes: a wire; first beads inserted on the wire and formed curvedly; second beads inserted on the wire to be adjacent to the first beads...  
WO/2011/095664
The invention relates to the sawing of granite, to a demonstration and to improvements, consisting of a method of demonstrating the improvements to the sawing of granite to the potential users in their own factory. Said method is charact...  

Matches 301 - 350 out of 9,798