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Patent Searching and Data


Matches 401 - 450 out of 9,664

Document Document Title
WO/2011/002089
Provided are a cutting method and a cutting device for a brittle material substrate, by which the brittle material substrate can be cut without making the device complicated and the quality of a cut surface can be increased, as well as a...  
WO/2010/149379
The invention relates to a wear-resistant insert for a cutting or breaking tool having a metal main body and a coating applied to the metal main body, wherein the coating is a powder metallurgical coating having embedded hard phases, app...  
WO/2010/150460
Provided are a silicon ingot cutting method and a cutting system. The method comprises: performing a primary and secondary centrifugal separations on waste slurry produced when a silicon ingot is cut by a wire saw and separating the wast...  
WO/2010/146434
A tensioning device of a flexible member wound on pulleys in a sawing machine for material in block form, comprising a shaft (15) to support one or more pulleys (18), on each whereof there is partially wound a respective cutting wire fle...  
WO/2010/143354
In a cutting method for a workpiece wherein a cylindrical workpiece is pressed against rows of wire which are formed by winding a wire spirally between a plurality of wire guides and the workpiece is cut into wafers by moving the wire wh...  
WO/2010/139199
A stone backing material and an inlaid decorative stone formed by the same are provided. The inlaid decorative stone comprises a stone body (1) formed by the stone backing material, and inlaid parts (3) are arranged on the surface of the...  
WO/2010/137778
The present invention relates to a concrete structure wrecker and a destruction method using the same. More specifically, first and second windings adjacent to a spring element which is electrodeposited with diamond segments are plastic ...  
WO/2010/136057
A method and a plant are described for calibrating surfaces of stone materials, suitable for working at least one slab (1) composed of an entry side and an exit side and of two parallel side edges; the slab (1) is pushed along the side e...  
WO/2010/137228
Provided is a method for cutting a silicon ingot, with which the waste slurry generated when a silicon ingot is cut by a wire saw is subjected to primary centrifugation and separated into a primary separated liquid and a solid component,...  
WO/2010/136568
The invention relates to a device for stacking a plurality of silicon wafers, comprising an upright machine carrier for accommodating a plurality of the silicon wafers, wherein the silicon wafers are provided in the machine carrier in a ...  
WO/2010/135949
A proton beam assisted ultraprecise processing method for processing single-crystal fragile material includes the following steps: a) utilizing a simulation software to simulate processing parameters according to a cutting depth, a surfa...  
WO/2010/133682
The invention relates to a carrier (11) for a silicon block (15), which is rigidly connected to the carrier (11) and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier compri...  
WO/2010/135616
A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material...  
WO/2010/135616
A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material...  
WO/2010/133683
The invention relates to a carrier for a silicon block, which is rigidly connected to the carrier and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier is made of plastic, p...  
WO/2010/132637
Methods for cutting a fragile material are provided. The methods comprise the step of heating the fragile material along a separation path to separate the fragile material into a first portion and a second portion. At least the first por...  
WO/2010/132637
Methods for cutting a fragile material are provided. The methods comprise the step of heating the fragile material along a separation path to separate the fragile material into a first portion and a second portion. At least the first por...  
WO/2010/128903
A wall saw has a rotary saw blade, a motor (3) for driving the saw blade, and a stand (4), along which the motor (3) and the saw blade are displaceable as the saw blade is cutting. To rebuild the wall saw to a wire saw, a saw wire drive ...  
WO/2010/128011
In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a generally inorganic crystalline material, more particularly a semiconductor material, a cutting yoke (5) having at least two angularly offset saw wire ...  
WO/2010/128925
The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion ...  
WO/2010/126678
An abrasive saw (10) having an associated cutting wheel (W) is used for cutting objects. The saw includes a base (12), a cutting assembly operably mounted to the base (12) and a controller. The cutting assembly includes a pivot shaft, a ...  
WO/2010/125085
A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120...  
WO/2010/126678
An abrasive saw having an associated cutting wheel is used for cutting objects. The saw includes a base, a cutting assembly operably mounted to the base and a controller. The cutting assembly includes a pivot shaft, a drive shaft operabl...  
WO/2010/119118
The invention relates to a cutting wheel (2) for cutting brittle materials, for example ceramic and/or glass, having a cutting edge (4) extending along the circumference, wherein the cutting edge (4) has a structure in the form of radial...  
WO/2010/116421
A scribing device is equipped with: a horizontal table (3) to which a glass plate (2) is affixed by means of vacuum adsorption; a feed screw (5) and Y-axis control motor (6) for moving the table (3) along guide rails (4, 4) under numeric...  
WO/2010/114411
The invention relates to mining and construction engineering, in particular to apparatus for directionally splitting monolithic blocks. The apparatus comprises a fixed bed consisting of two bearing members (1) and a cross member (2), gui...  
WO/2010/114545
A concrete saw (10) has an electric motor (24) energized by a battery pack (34) to drive a pair of saw arbors (42) and a transmission (30) to rear wheels (16) that provide self propulsion of the saw in cooperation with front wheels (20)....  
WO/2010/112412
The invention relates to a component (1) comprising a laser track (2) as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component (1) into ind...  
WO/2010/110673  
WO/2010/109141
The invention relates to a method for producing a semiconductor, of the photovoltaic cell type, or similar electronic components. According to the invention, at least one silicon wafer is cut from the cross-section of a silicon rod and, ...  
WO/2010/108743
The invention relates to an ejector (20), in particular for a road milling machine, with which the maintenance effort is considerably simplified.  
WO/2010/108351
A method for double-driving force grooving and cutting wherein each driving force drives a cutting tool for grooving or cutting, and wherein the cutting tools rotate in opposing directions. A multifunction grooving machine made according...  
WO/2010/107937
A cutting machine (109) having a liquid lubrication delivery system, said machine comprising: a work-piece platform (101) having an upper surface for supporting a work-piece (103) thereupon; a main channel (105) establishing an elongate ...  
WO/2010/107425
A cutting machine (100) having a liquid lubrication delivery system includes: a work-piece platform (101) having an upper surface for supporting a work-piece (103) thereupon, a channel (105) establishing an open slot that receives a peri...  
WO/2010/103946
Provided are a method for manufacturing a solar cell and a grooving tool, wherein a worn or nicked cutting edge can be easily replaced with a new cutting edge without interchanging a grooving tool itself, and integrated thin film solar c...  
WO/2010/098186
The semiconductor element manufacturing method aims to divide wafers that include a substrate with high accuracy. The semiconductor element manufacturing method has a laser irradiation step in which a pulsed laser beam is focused inside ...  
WO/2010/098058
A small-sized brittle material substrate is scribed with excellent workability. A plurality of brittle material substrates (107a-107i) are respectively aligned and arranged on a table (106) with aligning pins (109). A recipe data table i...  
WO/2010/098306
Provided are a solar cell manufacturing method and a slotting tool that enable manufacture of integrated thin film solar cells with good yield. A slotting tool (8) is used wherein the shape of the bottom surface (83) of the cutting edge ...  
WO/2010/097223
The invention relates to a hollow drilling tool comprising an exchangeable drill bit for drilling hard materials, such as concrete, consisting of a support part (1) which has a tube body (12) and a drill bit part (2) that can be connecte...  
WO/2010/095137
Nibbling mechanism (100) for producing a plurality of indented surfaces within a cavity within a construction material (160) including a tube, a plurality of cutters and a cutter moving mechanism, each of the cutters (104) being coupled ...  
WO/2010/092964
In the case of cutting a brittle material substrate in two directions intersecting each other using a laser beam, a first scribe line (52a) composed of a perpendicular crack (53a) and a second scribe line (52b) composed of a perpendicula...  
WO/2010/090895
A cutting chain (10) for cutting concrete and other similar materials having wear and stretch resistant features. In one embodiment, the cutting chain (10) can include chain links (11) having a debris trap for hindering the entry of debr...  
WO/2010/087424
Provided is a substrate breaking apparatus which can accurately perform breaking position alignment even in the case where a brittle material substrate to be broken is thin and is to be broken with a small pitch. The substrate breaking a...  
WO/2010/087200
The motorized cutter with wheels (10) comprises a motorized cutter (20) and a carriage (30). The motorized cutter (20) is equipped with an engine (24), a blade (22) rotatably driven by the engine (24), and a light-emitting unit (50) that...  
WO/2010/087423
Provided is a cutter which can reliably form a diagonal crack further in the direction of the thickness of a brittle material substrate. The cutter has a shape wherein the congruent bottom surfaces of the two circular cones or two circul...  
WO/2010/088501
Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction ...  
WO/2010/084382
The present invention relates to a method used for reinforcing the products obtained from materials such as natural stone, travertine, granite, marble, limestone, etc. In this invention, a channel and/or channels (2) are provided on the ...  
WO/2010/081771
A wall chaser (100) with improved safety characteristics is described. The chaser includes insulating hood (180) to improve the safety during use of such wall chasers. The invention also relates to a handle coupling mechanism for a wall ...  
WO/2010/078274
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More par...  
WO/2010/078274
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More par...  

Matches 401 - 450 out of 9,664