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Patent Searching and Data


Matches 401 - 450 out of 17,227

Document Document Title
WO/2011/086170A1
In a method for providing wafers, in which a material block (11) sawed into wafers (22) is cleaned by means of a cutting suspension based on a suspending agent (17), good cleaning can be achieved, wherein the problems of "sticking" are s...  
WO/2011/086403A1
A pulley tire (450) is provided, for a pulley of a wire saw device having a wire forming a wire web, the pulley (700) comprising a wheel (410) and the tire (450). The tire (450) is essentially ring- shaped about an axis and has: a wire g...  
WO/2011/083203A1
The invention relates to a portable apparatus for cutting tiles (5) or the like. The cutting apparatus comprises a housing part (20), inside which there is fitted a carriage part (6), which is arranged to be moved in a power-driven manne...  
WO/2011/081532A1
Process for cutting a block of material 12 into a multiplicity of wafers by movement of a planar array of parallel fast moving wires 14 relative to the block (or vice versa) in a direction perpendicular to the plane of the wires and appl...  
WO/2011/080009A1
The invention relates to a rock drilling tool comprising a drilling head provided with a cutting body (3), and a helix arranged between the drilling head and a shaft, the cutting body (3) extending continuously over a nominal diameter of...  
WO/2011/080581A1
Machine tool (10) for cutting stone materials, comprising an apparatus for opening one end of the rotational shafts (14a, 15a) of the roller (14) and the pulleys (15), said apparatus comprising a pair of frames (110) each of which is fix...  
WO/2011/081533A1
There is provided a method for cutting a block (13) of silicon into a multiplicity of wafers, by movement of a planar array (11) of parallel fast moving wires relative to the block (13) (or vice versa) in a direction perpendicular to the...  
WO/2011/077559A1
Provided is a process for working rock by a laser, which is capable of achieving remarkably high working efficiency, a reduction in working time, and a reduction in working energy. By applying a laser (13) having a wavelength of 1.2 μm ...  
WO/2011/074026A1
A diamond wire machine for cutting natural or artificial stone, comprising: water distribution system (12) for cooling within the cut made by the diamond wire in the stone; at least one closed loop diamond wire (3) which, following a clo...  
WO/2011/075020A1
A tool unit (3) for a cutting or sawing machine with a tool carrier (103) enabling especially deep cuts, comprises a first tool (1) and a second part (2, 50). The first tool (1) comprises a disk shaped cutting blade (10) and a first blad...  
WO/2011/074026A8
A diamond wire machine for cutting natural or artificial stone, comprising: water distribution system (12) for cooling within the cut made by the diamond wire in the stone; at least one closed loop diamond wire (3) which, following a clo...  
WO/2011/070386A1
A wire monitoring device for a wire saw device, a wire saw device and a method of monitoring a wire saw device are described. The wire monitoring device includes at least two sensors, adapted to provide a change of a sensor output signal...  
WO/2011/070410A1
A motor (100) that includes a stator (20) and a rotor (10) disposed inside the stator (20) and a cleft magnet (30) is disposed within the rotor (10), the motor (100) characterized in that a notch (31) is formed in an outer lateral face (...  
WO/2011/066831A2
In a rotary drill, the drill is provided with at least one groove, of which one groove has a center lying on the axis of rotation of the drill. The two end points of the groove define a groove width, and the drill is provided with two or...  
WO/2011/066831A3
In a rotary drill (10), the drill is provided with at least one groove, of which one groove (17) has a center lying on the axis of rotation (1) of the drill. The two end points (13,14) of the groove (17) define a groove width, and the dr...  
WO/2011/064170A1
The invention relates to reclaiming silicon and/or silicon carbide from siliceous abrasive slurries, wherein the abrasive slurries are first subjected to a method for high-pressure extraction by means of liquid or supercritical carbon di...  
WO/2011/063437A1
The invention relates to a saw blade, in particular for reciprocating saws, for cutting stone. The problems of economical saw cut generation in a stone block, composed preferably of hard stone, for raw board production are primarily thos...  
WO/2011/064647A1
A tool (1) or mill for grinding glass comprised of an elongated cutting mill body (2) having a first portion (3) intended to be coupled to a base, which preferably allows it to rotate around a longitudinal axis (K) and a second portion (...  
WO/2011/065821A1
The present invention relates to a device (1) for cutting a slit (21) in a wall (8). The device (1) according to the invention comprises a hand-held circular saw (2) for cutting a slit (21), a guide rail (3) which can be arranged on a wa...  
WO/2011/065373A1
Laser beams (L1 to L3) are relatively moved along a scheduled cutting line (5) while a light collection step of concurrently collecting the laser beams (L1 to L3) to light collection positions (P1 to P3), which are separate from one anot...  
WO/2011/061138A1
Drive pulley for supporting cutting tools (11) of machine tools (10) for processing stone materials, comprising a body (21) provided on its circumferential surface with radial engaging means (22) extending annularly and parallel to each ...  
WO/2011/061039A1
The invention relates to a plant for separating grinding slurry originating from grinding machines into metal chips and grinding oil. According to the invention, a carrier bowl (3) in a frame (1) is filled with a divided volume of the gr...  
WO/2011/055903A2
The present invention relates to a diamond wire saw for cutting a silicon ingot for a solar cell, and more particularly, to a diamond wire saw in which the correlation among a wire, an electrodeposited nickel layer, and diamond particles...  
WO/2011/055902A2
The present invention relates to a wire saw, comprising: a core wire; an electrodeposited nickel layer which is electrodeposited on an outer surface of the core wire; a diamond arranged such that a portion thereof is outwardly exposed fr...  
WO/2011/055902A3
The present invention relates to a wire saw, comprising: a core wire; an electrodeposited nickel layer which is electrodeposited on an outer surface of the core wire; a diamond arranged such that a portion thereof is outwardly exposed fr...  
WO/2011/054339A1
Multi-purpose milling crusher, in particular for roadbuilding and soil stabilization, comprising a milling roller equipped with cutters and at least one crusher device interacting with the milling roller, characterized in that the crushe...  
WO/2011/055903A3
The present invention relates to a diamond wire saw for cutting a silicon ingot for a solar cell, and more particularly, to a diamond wire saw in which the correlation among a wire, an electrodeposited nickel layer, and diamond particles...  
WO/2011/054510A3
The present invention relates to a method of handling a plurality of wafers (1). The method comprises the steps of: providing a plurality of wafers (1), each wafer being bonded to a substrate (3a) along a first edge. The wafers (1) are s...  
WO/2011/052193A1
Disclosed is a guide roller wherein bearings are held in a housing, and liquid mixed with abrasive grains is prevented from entering the interior of the housing through a shaft hole, thereby improving service life. The guide roller (1) i...  
WO/2011/051329A1
A tilting device (10) for cropping a sheet of laminated glass, comprising two side-by-side rows (11, 12) of suckers (13, 14), each supported by a bar (15, 16) of a frame (18, 19) which is pivoted, on the opposite side with respect to the...  
WO/2011/050945A1
The present application relates to a wire saw (1) comprising a wire web (2) equipped with cutting means, wherein at least one nozzle (5) blasts the cutting chips from the wire web (2) at least over the width of the cutting surface of the...  
WO/2011/053999A1
Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at% iron, nickel and/or cobalt in the range of about 7 to 50 at%, at least one non-metal or meta...  
WO/2011/046301A3
The present invention relates to a diamond wire saw which cuts a silicon ingot for solar light, and more particularly to a diamond wire saw which has an optimized volume ratio of a chip pocket, prevents diamond particles from falling and...  
WO/2011/047133A3
A device and system for removing structures embedded in surrounding material is disclosed. Embodiments include a powered, expandable clamp attached to a rotating cutting tool for removing manholes from roadways. Select embodiments includ...  
WO/2011/044615A1
A cutting apparatus of a type having two juxtaposed blades (1 and 2) with each having an outermost cutting edge with teeth (12 and 13), with retention and driving of the blades adapted to effect an oscillatory motion to each of the cutti...  
WO/2011/044871A1
The invention relates to the separation of substrates (1), e.g., wafers for semiconductors or solar cells, which are located in a stack (2) and are wetted with a liquid and adhere to each other by means of adhesive force. In order to avo...  
WO/2011/046301A2
The present invention relates to a diamond wire saw which cuts a silicon ingot for solar light, and more particularly to a diamond wire saw which has an optimized volume ratio of a chip pocket, prevents diamond particles from falling and...  
WO/2011/047133A2
A device and system for removing structures embedded in surrounding material is disclosed. Embodiments include a powered, expandable clamp attached to a rotating cutting tool for removing manholes from roadways. Select embodiments includ...  
WO/2011/042057A1
The invention relates to a device (100, 100a) for removing a coating from a solar module, comprising a rotatable scraper (6, 6a), which is connected to a driveshaft (18, 18a) and which can be driven by means of said driveshaft (18, 18a) ...  
WO/2011/043177A1
Disclosed is a method for cutting a silicon ingot, wherein the quantity of a fixed-abrasive grain wire required for the purpose of slicing the silicon ingot is reduced as much as possible and manufacture cost is significantly reduced, in...  
WO/2011/038466A1
A material cutting and finishing system; said system including a motor-driven articulated rotating tool head mounted to a guiding subsystem; said guiding subsystem providing movements of said articulated rotating tool head along horizont...  
WO/2011/039700A1
In a machine (10, 200) for processing slabs of natural or agglomerated stone material, ceramic material or glass material, comprising two longitudinally arranged support structures (30, 32) on which respective travel rails (34, 36) are p...  
WO/2011/041799A2
A power saw having a circular saw blade or, grinding wheel incorporated to a dust collection system that is easily portable is disclosed herein. In a preferred embodiment, negative pressure and resulting air flow is provided at a lower b...  
WO/2011/033542A1
A tensioning device (1) for machines (70) for multiple wire cutting of stone material (71) comprises a plurality of flywheels (2) each lying in its own plane (3) and drawn near one another so that the respective planes (3) in which they ...  
WO/2011/032599A1
A wire saw work piece support device (200) has a support surface (214, 314) adapted for supporting a work piece (100) being sawed by a wire saw (1) during sawing, the support surface (214, 314) defining a support plane. The wire saw work...  
WO/2011/033541A1
A multi-wire machine (1) for cutting stone material (2) comprises a base structure (3) which can rest on the ground (4) and a supporting frame (5) comprising a base portion (6) and slidably mounted on the base structure (3). The multi-wi...  
WO/2011/032600A1
A method of operating a wire saw device is described. The method includes a wire use cycle, which includes in the following order: a) accelerating the wire to a first moving speed in a first movement direction and moving the wire for a f...  
WO/2011/032553A1
The invention relates to a device and a method for separatively processing crystalline materials (W) such as silicon materials, in particular for machining silicon materials and the like, by means of at least one separating tool (2) desi...  
WO/2011/034439A1
A process for cutting a block of material (16) into a multiplicity of wafers by movement of a planar array of generally parallel fast moving wires (9) embedded with abrasive particles relative to the block (or vice versa) in a direction ...  
WO/2011/030802A1
Disclosed is a laser processing device and laser processing method having a high processing speed and high energy efficiency. By means of the light axis (O) of a focusing lens (21) being moved relatively along a line (S0) to be cut on a ...  

Matches 401 - 450 out of 17,227