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Patent Searching and Data


Matches 401 - 450 out of 9,797

Document Document Title
WO/2011/038466
A material cutting and finishing system; said system including a motor-driven articulated rotating tool head mounted to a guiding subsystem; said guiding subsystem providing movements of said articulated rotating tool head along horizont...  
WO/2011/039700
In a machine (10, 200) for processing slabs of natural or agglomerated stone material, ceramic material or glass material, comprising two longitudinally arranged support structures (30, 32) on which respective travel rails (34, 36) are p...  
WO/2011/041799
A power saw having a circular saw blade or, grinding wheel incorporated to a dust collection system that is easily portable is disclosed herein. In a preferred embodiment, negative pressure and resulting air flow is provided at a lower b...  
WO/2011/033542
A tensioning device (1) for machines (70) for multiple wire cutting of stone material (71) comprises a plurality of flywheels (2) each lying in its own plane (3) and drawn near one another so that the respective planes (3) in which they ...  
WO/2011/032599
A wire saw work piece support device (200) has a support surface (214, 314) adapted for supporting a work piece (100) being sawed by a wire saw (1) during sawing, the support surface (214, 314) defining a support plane. The wire saw work...  
WO/2011/033541
A multi-wire machine (1) for cutting stone material (2) comprises a base structure (3) which can rest on the ground (4) and a supporting frame (5) comprising a base portion (6) and slidably mounted on the base structure (3). The multi-wi...  
WO/2011/032600
A method of operating a wire saw device is described. The method includes a wire use cycle, which includes in the following order: a) accelerating the wire to a first moving speed in a first movement direction and moving the wire for a f...  
WO/2011/032553
The invention relates to a device and a method for separatively processing crystalline materials (W) such as silicon materials, in particular for machining silicon materials and the like, by means of at least one separating tool (2) desi...  
WO/2011/034439
A process for cutting a block of material (16) into a multiplicity of wafers by movement of a planar array of generally parallel fast moving wires (9) embedded with abrasive particles relative to the block (or vice versa) in a direction ...  
WO/2011/030802
Disclosed is a laser processing device and laser processing method having a high processing speed and high energy efficiency. By means of the light axis (O) of a focusing lens (21) being moved relatively along a line (S0) to be cut on a ...  
WO/2011/026473
The invention relates to a method for recovering exhausted machining slurries and to a device for carrying out said method. The exhausted machining slurry which contains a machining medium, a carrier fluid for the machining medium, mater...  
WO/2011/028154
A saw (1) being portable and/or wheeled, such as a wall saw, floor saw or masonry saw, comprising a rotatable circular saw blade (3), a drive motor (5) with an motor output shaft (9) for rotating the saw blade (3), and a transmission (20...  
WO/2011/027371
A displacing apparatus (1) for a tool holder assembly (10) comprises: a first shaft (2), provided with a respective inner through cavity, able to rotate around a rotation axis (A-A) perpendicular to a work surface (102) of a machine (100...  
WO/2011/028470
The invention relates to a rock drill bit having a drill-bit shank (1), the drill-bit shank (1) having an insertion portion (2) comprising an insertion profile (3); a helical portion (4), comprising at least one removal flute (5) and at ...  
WO/2011/024910
Disclosed is a silicon wafer for solar cells that has a plurality of similarly-oriented, minute, linear depressions that are saw marks formed upon the front and back surfaces of the wafer, whereby the light receiving area of the wafer is...  
WO/2011/023749
The invention relates to a method for producing wafers from silicon blocks, wherein a silicon block is fixed on a substrate via an adhesive layer. The silicon block is divided into wafer slices and the wafer slices are separated from the...  
WO/2011/024486
In the context of cutting silicon ingots, the provided water-soluble cutting fluid is more lubricating than existing products and therefore increases cutting efficiency. The provided cutting fluid also inhibits the generation of flammabl...  
WO/2011/021784
The present invention relates to a wire saw, and particularly, to a wire saw that includes a partial coating layer formed on only a portion of ultrafine particle surfaces, in order to prevent the ultrafine particles from being over-depos...  
WO/2011/021784
The present invention relates to a wire saw, and particularly, to a wire saw that includes a partial coating layer formed on only a portion of ultrafine particle surfaces, in order to prevent the ultrafine particles from being over-depos...  
WO/2011/018537
The present invention comprises a kind of low density natural stone, fixed to a transparent or translucent glass base, plexiglass, Lexan, etc., and to the method for obtaining same. Due to the density of the plate which can reach 2 mm, t...  
WO/2011/018989
In order to improve the controllability of modified spots, a laser machining device (100) is provided with a first laser beam source (101) which emits a first pulsed laser beam (L1), a second laser beam source (102) which emits a second ...  
WO/2011/019547
An inlaid stone composite broadly includes a stone body and a stone inlay assembly secured to the stone body. The inlaid stone composite is constructed by forming a groove in the stone body, with the groove extending inwardly from an edg...  
WO/2011/019547
An inlaid stone composite broadly includes a stone body and a stone inlay assembly secured to the stone body. The inlaid stone composite is constructed by forming a groove in the stone body, with the groove extending inwardly from an edg...  
WO/2011/016996
Systems and methods are provided for processing abrasive slurry used in cutting operations such as slicing a water from a silicon ingot with a wive saw. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ul...  
WO/2011/016299
Provided is a grinding method for a hard and brittle material by which, when a hole is formed in the hard and brittle material using a grinding drill, the grinding time of the hard and brittle material can be shortened. A grinding method...  
WO/2011/016996
Systems and methods are provided for processing abrasive slurry used in cutting operations. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ultrasonically agitated such that abrasive grain contained in t...  
WO/2011/014395
An interchangeable concrete cutting chainsaw cutting assembly (500) adapted for installation upon a drive assembly (112) in exchange for a removed, different type cutting head assembly. The chainsaw cutting assembly (500) includes a hous...  
WO/2011/013549
A rear surface (1b) of a processing target (1A) and a front surface (10a) of a processing target to be cut (10A) are anodically-bonded, and thus, a crack (17) generated from a melting treatment region (13) in the thickness direction of t...  
WO/2011/013556
Since the principal surface of a silicon substrate (12) is (100) surface, a crack (17) generated starting from a melt treatment region (13) extends in the cleavage direction of the silicon substrate (12) (direction orthogonal to the prin...  
WO/2011/014395
An interchangeable concrete cutting chainsaw cutting assembly (500) adapted for installation upon a drive assembly (112) in exchange for a removed, different type cutting head assembly. The chainsaw cutting assembly (500) includes a hous...  
WO/2011/009927
A device for cleaning substrates on a carrier which has longitudinal channels running parallel to one another in its interior, these channels being connected to the outside on the underside of the carrier by means of openings, has a plur...  
WO/2011/009587
The present invention relates to methods for the shaping of a silicon crystal, in which at least on the contact face worked by a shaping device, the silicon crystal is brought into contact with an alkaline liquid, and also to the use of ...  
WO/2011/006194
A method for producing a cementitious slab including mixing together cement with other materials with the combined mixture of materials having physical particle sizes sufficiently small to allow the material to be cut with a vibrating cu...  
WO/2011/006195
A method for cutting a slab of material including cutting the slab with a cutting tool vibrating at a preselected frequency when the material is in a semi-set state.  
WO/2011/005153
The invention relates to a diamond tool comprising a tool body (1, 2, 3) provided with diamond segments (4) manufactured by sintering and each segment comprising at least one diamond part (5) and a base part (6), or base (6), which base ...  
WO/2011/004189
An apparatus and method for aligning a gemstone such as diamond (106) with a predetermined vertical axis (108) is described. The apparatus includes an upwardly extending nozzle (105) aligned with the vertical axis (108) and sized to allo...  
WO/2011/003782
The invention relates to a method for preparing a suspension from a separation process, wherein the suspension is made of a particulate abrasive and a liquid slurrying agent. The method comprises the steps: a) thinning the suspension in ...  
WO/2011/005153
The invention relates to a diamond tool comprising a tool body (1, 2, 3) provided with diamond segments (4) manufactured by sintering and each segment comprising at least one diamond part (5) and a base part (6), or base (6), which base ...  
WO/2011/002089
Provided are a cutting method and a cutting device for a brittle material substrate, by which the brittle material substrate can be cut without making the device complicated and the quality of a cut surface can be increased, as well as a...  
WO/2010/149379
The invention relates to a wear-resistant insert for a cutting or breaking tool having a metal main body and a coating applied to the metal main body, wherein the coating is a powder metallurgical coating having embedded hard phases, app...  
WO/2010/150460
Provided are a silicon ingot cutting method and a cutting system. The method comprises: performing a primary and secondary centrifugal separations on waste slurry produced when a silicon ingot is cut by a wire saw and separating the wast...  
WO/2010/146434
A tensioning device of a flexible member wound on pulleys in a sawing machine for material in block form, comprising a shaft (15) to support one or more pulleys (18), on each whereof there is partially wound a respective cutting wire fle...  
WO/2010/143354
In a cutting method for a workpiece wherein a cylindrical workpiece is pressed against rows of wire which are formed by winding a wire spirally between a plurality of wire guides and the workpiece is cut into wafers by moving the wire wh...  
WO/2010/139199
A stone backing material and an inlaid decorative stone formed by the same are provided. The inlaid decorative stone comprises a stone body (1) formed by the stone backing material, and inlaid parts (3) are arranged on the surface of the...  
WO/2010/137778
The present invention relates to a concrete structure wrecker and a destruction method using the same. More specifically, first and second windings adjacent to a spring element which is electrodeposited with diamond segments are plastic ...  
WO/2010/136057
A method and a plant are described for calibrating surfaces of stone materials, suitable for working at least one slab (1) composed of an entry side and an exit side and of two parallel side edges; the slab (1) is pushed along the side e...  
WO/2010/137228
Provided is a method for cutting a silicon ingot, with which the waste slurry generated when a silicon ingot is cut by a wire saw is subjected to primary centrifugation and separated into a primary separated liquid and a solid component,...  
WO/2010/136568
The invention relates to a device for stacking a plurality of silicon wafers, comprising an upright machine carrier for accommodating a plurality of the silicon wafers, wherein the silicon wafers are provided in the machine carrier in a ...  
WO/2010/135949
A proton beam assisted ultraprecise processing method for processing single-crystal fragile material includes the following steps: a) utilizing a simulation software to simulate processing parameters according to a cutting depth, a surfa...  
WO/2010/133682
The invention relates to a carrier (11) for a silicon block (15), which is rigidly connected to the carrier (11) and is moved together with the carrier for processing by means of sawing, cleaning, or the like, wherein said carrier compri...  

Matches 401 - 450 out of 9,797