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Matches 1 - 50 out of 18,981

Document Document Title
WO/2017/104386A1
This manufacturing device 1 for a glass plate 2 includes: a glass chuck 3 that suspends and supports, in a vertical orientation, the glass plate 2 having a first major surface 2a and a second major surface 2b; a wheel cutter 4 that forms...  
WO/2017/100478A1
Embodiments herein provide an abrasive saw chain that includes drive links and tie straps coupled to one another. Cutting elements, such as diamond cutting elements, may be coupled to upper surfaces of respective drive links. An upper su...  
WO/2017/095291A1
High power flat saw (10) having a large diameter saw blade (12), said flat saw (10) comprising a motor (11) and a blade shaft drive (1), wherein said blade shaft drive (1) comprises a first pulley (2) and a second pulley (3) and a belt (...  
WO/2017/091945A1
Processes for improving the cutting performance of a wire saw utilizing semi-aqueous or aqueous slurries comprises (a) contacting a cutting wire with a cutting slurry composition that comprises: (a.i) an abrasive component; (a.ii) a susp...  
WO/2017/091529A1
Methods of separating a glass web that is moving at a glass web velocity. The method includes exposing a separation path on the glass web to at least one laser beam spot that moves with a laser beam spot velocity vector that is equal to ...  
WO/2017/088110A1
Disclosed is a stone mining apparatus, comprising a base (100), a cutting unit (200), a driving unit, and a grinding unit (300). The cutting unit (200) comprises a plurality of transmission devices (201) surrounding the edge of the base ...  
WO/2017/086339A1
In order to respond flexibly to various processing modes, such as forming curved surface shapes, when cutting a workpiece using a wire saw, this wire saw device (1) is provided with: a single robot arm (2) that is capable of moving freel...  
WO/2017/086198A1
The present invention is configured such that, when forming a scribe line S by causing a cutter wheel 4 to run along a scheduled cutting section Gx on one surface of a glass plate G while using a support member 3 to support the scheduled...  
WO/2017/082729A1
The invention relates to a tooth system for a cutter head, the tooth system comprising; a tooth member comprising a cutting portion and a mounting portion with at least one curved surface, a holder comprising a receiving portion with a c...  
WO/2017/076170A1
A smart machining device and method for a multi-face profiling stone. The smart machining device for a multi-face profiling stone comprises a profiling cutting head (20), and a material rack (30) disposed corresponding to the profiling c...  
WO/2017/076875A1
The invention relates to a hard metal insert (2) for a rock drill (1), which is designed as a spiral drill operating without percussion, comprising a cylindrical drill head (11) and a working end (13) comprising the hard metal insert (2)...  
WO/2017/076760A1
The invention relates to a tool (10, 20) for fastening on a machine, in particular a screen machine, a road groover, or similar, the tool having a tool body (12, 50, 53), on which a functional unit (11, 11.1, 11.2, 11.4, 40, 30) comprisi...  
WO/2017/073118A1
A method for cutting glass is provided with a heating step for radiating laser light L11 to a portion to be cut CP of a tubular glass G2 and heating the portion to be cut CP, an internal crack region formation step for radiating laser li...  
WO/2017/068748A1
The present invention is a method for cutting a circularly columnar workpiece by a wire saw for simultaneously cutting the workpiece at a plurality of locations aligned in the axial direction by winding a fixed abrasive wire around a plu...  
WO/2017/068239A1
The invention relates to a replaceable blade piece (1) of a working cylinder of a screen crusher, which as viewed from the side is substantially T-shaped. The blade piece has a frame portion (2) forming the vertical shaft of the T and a ...  
WO/2017/068888A1
[Problem] To provide an electric cutting machine provided with a dust control function, the electric cutting machine having a cutting position indicator guide having excellent visibility/usability, whereby dust generated during processin...  
WO/2017/062767A1
A method of retrofitting an existing wire saw that includes loose abrasive to a replacement including a fixed abrasive wire includes removing an existing wire spool traverser, installing a replacement new wire spool traverser (330) inclu...  
WO/2017/056876A1
A cutting edge (51) having a protruding portion (PP) and a side portion (PS) that extends from the protruding portion (PP) and has a convex shape is caused to slide on one surface (SF1) of a brittle substrate (4) in a direction from the ...  
WO/2017/056009A1
A multi-wire frame (12) for cutting blocks of stone material into slabs comprises: at least two columns (14, 16), each of which has, mounted thereon, at least one slide (18, 20) designed to move along the respective column (14, 16); each...  
WO/2017/055240A1
Tool (100) for producing an opening (220) in a wall using a keyhole saw (10) and a centring device which has a centring axis (A) running through the centre point of the keyhole saw (10), wherein the centring device is embodied as a centr...  
WO/2017/055651A1
The invention relates to a ceramic cutter having liquid-cooling by immersion of the cutting disc, comprising: a support frame (1); an electric motor (2) for actuating a cutting disc (3); a tray (4) containing water for cooling the cuttin...  
WO/2017/057183A1
Dust collection covers for efficiently collecting dust are used in cutting machines used to cut stone and concrete. A dust collection cover of the present invention makes it possible to sufficiently collect dust by self dust collection w...  
WO/2017/055650A1
The invention relates to a cutting and separating device applicable to manual ceramic cutters, comprising: a carriage (1); a collapsible handle (3) with a cutting tool (4); a toothed part (5) comprising a separator (6) for separating cer...  
WO/2017/036888A1
The cutting wire (100) has an outer surface with roughness formed by abrasive grains (103) having a given mean diameter Dg. The monitoring method includes the following steps: emitting (E0) a light beam (FL) defined by two parallel plane...  
WO/2017/038093A1
A glass plate processing device 1 is provided with: a cutting part 2 serving as a processing position where a cut line is formed on a glass plate 5; a grinding part 3 serving as a processing position where the peripheral edge of the glas...  
WO/2017/037825A1
In a wire saw, an object to be processed is pressed against a wire (10), whereby the object to be processed is cut. This wire saw is provided with a first bobbin (11) having a wire reel surface on which the wire (10) is reeled before the...  
WO/2017/038853A1
A method for manufacturing a glass plate, said method comprising: (1) a step for preparing a glass material which has a first main surface and a second main surface, said main surfaces opposing each other; (2) a step for laser-irradiatin...  
WO/2017/032588A1
An apparatus for removing construction material has a removal unit (8) that is rotatable about a longitudinal centre axis and, in order to remove at least one brittle component of a construction material, has groups of beater discs (9). ...  
WO/2017/031091A1
Tools are described having removable working elements, include saws having removable cutting elements. Interface geometries on one or more of a core structure and removable elements may be simple or complex geometries. Securement element...  
WO/2017/028202A1
A chainsaw(1) h has a low profile chain cover(645) and a chain bar tightening clutch system(500). The chain bar tightening clutch system(500) can have a bar tightening knob(600) which drives a clutch. The clutch governs the amount of pre...  
WO/2017/026191A1
A blade edge is moved on a first surface (SF1) of a brittle substrate (11) while the blade edge is pressed against the first surface (SF1), and a trench line (TL) having a first portion (LR) and a second portion (HR) is thereby formed so...  
WO/2017/020119A1
There is disclosed a method for purifying sapphire which includes irradiating a sapphire sample with microwave radiation with power in a range from about 0.3kW to about 300kW, at a frequency in a range from about 300 MHz to 600 GHz for a...  
WO/2017/023804A1
A cutting bit assembly for a mining machine includes a holder having a first surface, a second surface, and a bore extending therebetween, and a bit having a first end and a second end. The bit further includes a tip, a shank, and a shou...  
WO/2017/017919A1
The present invention provides a workpiece holder that is used when cutting a workpiece using a wire saw. The workpiece holder is provided with: a workpiece plate that is adhered and fixed to a workpiece with a back plate interposed ther...  
WO/2017/016622A1
A diamond wire (10) for cutting blocks of marble, granite and stone materials in general and different materials, comprises a steel cable (12) of several strands provided with a plurality of beads (14) axially perforated. These beads are...  
WO/2017/013837A1
A cutting device is provided with a first flange and a second flange secured to a rotary shaft in such a state as to sandwich a rotary blade. The first flange is provided with an annular holding part in close contact at the outer-periphe...  
WO/2017/006902A1
The semiconductor element (12) production method comprises steps of: forming a plurality of semiconductor elements (12) on the main surface of a wafer (11); forming a plurality of cleaving groove groups (20), each disposed on a division ...  
WO/2017/002656A1
Disclosed is a method for cutting a glass plate through fold-cutting, characterized by comprising: a step for generating an initial crack at an edge section of the glass plate on a planned cutting line; a step for emitting and linearly c...  
WO/2017/002670A1
A cutting assist device for silicon materials which, when cutting a silicon material, supplies an inorganic-alkali electrolyzed water containing fine bubbles and having a pH of 10 or higher as a cutting fluid to the part of the silicon m...  
WO/2017/000397A1
Disclosed is a gang saw using a saw blade to cut granite and quartz stone slantwise, comprising a gang saw (1), an electric motor I(3), an electric motor II(4), a stone material rack (5), a base platform (7), wherein the stone material r...  
WO/2017/003301A1
A tool connection (9, 47) for connecting a tool (1) to a tool support (16), the tool connection (9, 47) including at least one radial shock absorber (19, 20) for at least partially absorbing shock imparted by the tool (1) via the tool co...  
WO/2017/002035A1
Described is an apparatus for cutting slabs made of porcelain or like materials, comprising a support and blocking plane (P) of at least a slab (L), and at least a cutting group (1) of the slab, arranged superiorly thereof; the group com...  
WO/2016/207489A1
An apparatus (100) for cutting workpieces comprises a clamping mechanism (2) adapted to be fastened to said workpiece (1) rotatably therearound. The clamping mechanism (2) comprises a frame element (5) and first and second arms (6, 7) ex...  
WO/2016/208112A1
Provided are a wire saw device and a workpiece cutting method which are capable of efficiently collecting spattered slurry even in an intermediate stage of a workpiece cutting process and improving the surface quality of a cut workpiece....  
WO/2016/207277A1
The invention relates to a method for cutting solids wafers (1) off a donor substrate (2). The method comprises the following steps: providing a donor substrate (2), and producing at least one modification (10) in the interior of the don...  
WO/2016/207851A1
A method for driving a first component (11) into a second component (12) by superimposing a mechanical wave of ultrasonic frequency (18) onto the movement (17) of at least one of the components (11, 12). The method comprises a step of ad...  
WO/2016/208248A1
In this method for cutting a tube glass G1, the tube glass G1 is irradiated with a laser light L that is focused inside the tube glass G1, and an inner crack region C1 which includes one or multiple cracks is formed on a portion of the t...  
WO/2016/207276A1
The present invention relates to a method for separating solid wafers (1) from a donor substrate (2). The method comprises the steps of: creating modifications (10) within the donor substrate (2) by means of laser beams (12), wherein the...  
WO/2016/207738A1
The cutting tool comprises: - a cutting-wheel handle (3) with an uniform cross-section with an outer contour including points arranged following two opposed straight rows and points arranged following one or more curved line segment (S3,...  
WO/2016/202769A1
The invention relates to a device for detecting the breakage of at least one cutting element (2) arranged in a guide (1), comprising at least one sensor (3), wherein at least one slider (4), which can be displaced linearly relative to th...  

Matches 1 - 50 out of 18,981