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Matches 1 - 50 out of 20,139

Document Document Title
WO/2019/054945A1
The invention includes a system and method of using a laser for singulation of a polymer resin mold compound substrate into packages or chips by a laser ablation process. A metal jig used for holding the substrate includes trenches to al...  
WO/2019/045614A1
The present disclosure relates to a cutter clamp (8, 37) that comprises a first arm part (10, 39) and a second arm part (11, 40), where the arm parts (10, 11; 39, 40) are arcuate and arranged to adjustably at least partially enclose a ma...  
WO/2019/041430A1
The invention relates to a wall-boring apparatus, and particularly to a durable powered wall-boring apparatus, so as to solve the technical problem of how to provide a durable powered wall-boring apparatus that saves time and manpower, h...  
WO/2019/042604A1
A cutting machine with multi-wires having diamond pearls for cutting blocks of natural or artificial stone, including a command and control pulley associated to an engine, in relation with a tension pulley that is attached to a pneumatic...  
WO/2019/044142A1
Provided is a technique relating to a method for manufacturing a substrate. This method for manufacturing a substrate includes an irradiation step of irradiating the inside of a gallium nitride (GaN) ingot with laser light from a directi...  
WO/2019/034209A1
The invention relates to a device (1, 1a, 1b) for dismantling vertically aligned objects comprising a wall (2), in particular with a circular cross-section. The device (1, 1a, 1b) has at least two extension arms (4, 4-1, 4-2, 4-3), each ...  
WO/2019/032022A1
A hole saw (1 ) comprising a cylindrical unit (2) with an expanse in a longitudinal direction (Z), the cylindrical unit (2) being rotation-symmetrical about a center axis, which has an expanse in the longitudinal direction (Z). The cylin...  
WO/2019/030247A1
The invention relates to a production facility (40) for detaching wafers (2) from donor substrates (4). According to the invention, the production facility comprises at least one analysis device (6) for determining at least one individua...  
WO/2019/030400A1
The present invention relates to a method, according to claim 1, for separating at least one solid body layer (1), particularly a solid body disk, from a donor substrate (2). The method according to the invention comprises preferably at ...  
WO/2019/030520A1
The invention provides a method for laser modification of a sample to form a modified region at a target location within the sample. The method comprises positioning a sample in a laser system for modification by a laser; measuring tilt ...  
WO/2019/029143A1
A water tank cutting machine, comprising: a box (1), in which a motor (2) is mounted; a working station base (4), which is mounted on the box, wherein the working station base comprises a sliding working station base (6) and a rotating w...  
WO/2019/026931A1
A glass plate splitting machine 1 is provided with a flexible endless belt 3, a supporting member 4 for supporting the endless belt 3, two glass plate receiving devices 7, 7a having glass plate receiving surfaces 6, 6a, movement devices ...  
WO/2019/026586A1
A glass plate splitting machine 1 is provided with a flexible endless belt 3, a support mechanism having a support surface for supporting a glass plate at a center part of the bottom surface of the glass plate via the endless belt 3, gla...  
WO/2019/021172A1
An electronically-controlled multi-functional work center can be used to machine plates of natural or synthetic stone or glass plates. The work center is configured to perform both the cutting operations on a plate (L1, L2) and the machi...  
WO/2019/018531A1
A milling machine for milling a surface of a roadway includes a frame and a milling assembly having a cutter drum that is mounted for rotation with respect to the frame. The cutter drum has a drive shaft on which a sheave is mounted. A p...  
WO/2019/007885A1
The invention relates to a material removal device comprising a rotating cylindrical drum (4) and cutting tools (6) mounted on the drum. The cutting tools are distributed around the periphery of the drum in an axial direction.  
WO/2019/007064A1
Provided is a diamond chainsaw, comprising a plurality of links (100), wherein each of the links of the chainsaw is an integrated link, one of the links and another of the links are connected by means of a male end (3) and female end (2)...  
WO/2019/008132A1
The invention relates to a machining arrangement (1) and a method for attaching such an arrangement to and machining a working piece (2), comprising; - a frame (3) comprising a first end (4) and a second end (5); - a rotatable attachment...  
WO/2019/002025A1
The invention relates to a drill (1) for chiseling stone, the drill having an impact surface (7) on an insertion end (6), a hollow shaft (4) inside which a conveying duct (35) is provided, and a drill head (2). The drill head (2) has thr...  
WO/2019/004665A1
The present invention relates to equipment and a method for cutting bedrock at the correct position by means of a diamond wire-saw, and more particularly, to equipment and a method for cutting bedrock at the correct position by means of ...  
WO/2019/003151A1
A method for synthesizing a diamond by chemical vapor deposition, the method may include heating at least one internal space of at least one hot filament unit; wherein the at least one hot filament unit is positioned in a vacuum chamber;...  
WO/2018/237085A1
Various aspects of an apparatus are disclosed. In a particular aspect, an apparatus comprising a cylindrical filter, a filter cleaning knob, and a filter cleaning flap is disclosed. Within such embodiment, the filter cleaning knob is con...  
WO/2018/235008A1
A combined cutting and bevelling machine (10) for slabs of stone or stone-like material comprises a workpiece support bench (30) and a work unit (16) provided with a cutting unit (50) and a bevelling unit (40), wherein the cutting unit (...  
WO/2018/235843A1
A semiconductor device manufacturing method comprises: a step of preparing a semiconductor wafer source including a first major surface on one side, a second major surface on another side, and a side wall connecting the first major surfa...  
WO/2018/231104A1
The invention relates to a method for producing and a cutting tool, respectively, for cutting hard materials such a natural stone or concrete or the like. A ductile support body (2) is the base body of the cutting tool, and a plurality o...  
WO/2018/225379A1
A high output and a long work time are required to open a single hole with a drilling apparatus in which a rotary blade having a cutting portion obtained by affixing diamond particles to the tip of a rotary body of a bottom cylindrical s...  
WO/2018/224867A1
A crushing tool (1), suitable for being fixed to a movable arm of operating machinery or another similar device, comprising a support (2) fixable to the free end of the movable arm, a first jaw (5) connected to the support (2), a second ...  
WO/2018/215898A1
A method for reinforcing a slab of natural or artificial stone material comprising the steps of: a) sealing the non-visible surface (16) of the slab and, where necessary, the surfaces of the edges (18, 20, 22, 24); b) positioning the sla...  
WO/2018/217093A1
A device and a method for attaching a drill body (8) to a tubular slot drill (1) which is arranged to drill in the ground (4), the slot drill (1) being provided, at its lower end portion (10), with at least one drill body (8) detachable ...  
WO/2018/210099A1
A groove cutter, comprising a T-shaped cutter plate, the T-shaped cutter plate comprising an internal cylinder-shaped central cutting base (1) and an externally sleeved cylinder-shaped outer cutting base (10); a bottom surface and side w...  
WO/2018/208008A1
The present invention relates to an air cylinder which operates by a pneumatic pressure, a piston which moves up and down in the interior of the air cylinder, and an air hammer bit which is coupled to the piston and crushes a reinforced ...  
WO/2018/203448A1
The present invention is a wire-saw-based workpiece cutting method in which a fixed abrasive particle wire, to the surface of which are bonded abrasive particles, is wrapped around a plurality of grooved rollers to form a wire array, and...  
WO/2018/201263A1
A multi-wire slicer employing diamond wires, consisting of a wire mesh (2) for cutting, guide wheels, wire wheels (6), a cutting head, and a cooling system. Diamond wires (7) leading out from two ends of the wire mesh respectively pass o...  
WO/2018/192691A1
The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser be...  
WO/2018/193583A1
Provided are a scribing device and a scribing method with which breakage of a substrate can be prevented. The scribing device is a scribing device that causes a blade part and a substrate to move relative to each other while pressing the...  
WO/2018/193416A1
A resin line (1) for manufacturing reinforced stone or ceramic slabs (S) comprising a loading station (2) for loading one slab (S) at a time, a spraying station (4) for spraying a substantially uniform layer of a resin (R) on the top sur...  
WO/2018/193298A1
The present invention relates generally to a wire saw and, particularly but not exclusively, relate to a wire saw for cutting stones in mining and quarrying applications. The wire saw (200, 300) comprises a wire (201, 301). A plurality o...  
WO/2018/194729A1
Methods of recycling silicon swarf into electronic grade polysilicon or metallurgical-grade silicon are described herein are described. In an example, a method includes cutting a silicon ingot and recovering silicon swarf having a first ...  
WO/2018/192689A1
The present invention therefore relates to a method for separating at least one solid body layer (2) from a donor substrate (1). According to the invention, the method preferably comprises at least the steps of: providing the donor subst...  
WO/2018/186087A1
The present invention is a workpiece cutting method that uses a wire saw in which a fixed abrasive-grain wire, which is sent out by one side of a set of wire reels and taken up by a wire reel on the other side and has abrasive grains fix...  
WO/2018/178819A1
An engraving machine for engraving building material articles comprises a working plane (2) on which, in use, at least one building material article (S) or slab rests, and defining a working area having a predetermined width (W), an engr...  
WO/2018/180833A1
[Problem] An anti-rotation ring-shaped member that prevents a second element threadably linked to a first element from being rotated in a thread-release direction. [Solution] This anti-rotation ring-shaped member has: a ring-shaped body ...  
WO/2018/171339A1
Provided is a stone cutting chain saw drive guide wheel with a grooved washer. The drive guide wheel (2) is provided with a groove (1). The groove of the drive guide wheel is provided with a washer (4) which has a recess (3), and the rec...  
WO/2018/173693A1
The present invention provides an ingot cutting method using a wire saw, the method comprising forming a wire column from a wire wound spirally between a plurality of wire guides and travelling in an axial direction, cut-feeding the ingo...  
WO/2018/171338A1
A stone cutting chainsaw which fits with a drive guiding wheel having a grooved washer, comprising: an outer chain piece (1), an inner chain piece (2), a pin shaft (3) and a cutter head (4); the curvature of a bottom portion (5) of the o...  
WO/2018/174785A1
A machining assembly with a drive unit (10) detachably mountable to the feed module (30) and moveable along a guide track on a machine stand via the feed module. The feed module is provided with a feed gear wheel (33) configured for enga...  
WO/2018/172884A1
Cutting chain for ornamental stones chain cutting machines, comprising a plurality of inner (2) and outer (1) links alternating with respect to each other, the outer links (1) being of the modular type, in two or three pieces. Around the...  
WO/2018/169008A1
The present invention relates to a brittle material processing liquid which contains water, (A) one or more substances selected from the group consisting of acetylene glycols having an HLB value of from 4 to 12 (inclusive) and alkylene o...  
WO/2018/168366A1
In this method for manufacturing a glass plate, a first scribe line 3 that does not accompany a median crack is formed on one main surface 2a of an original glass plate 2. Then, a second scribe line 4 which intersects the first scribe li...  
WO/2018/168381A1
Disclosed is a glass film manufacturing method wherein production-related treatment is performed with respect to a glass film G, while transferring the glass film G. The glass film manufacturing method is provided with a step for sucking...  

Matches 1 - 50 out of 20,139