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Matches 851 - 900 out of 67,001

Document Document Title
WO/2013/047847A1
The present invention provides a copper foil for a printed circuit board and a laminated plate using the same which make it possible to form a circuit with a trapezoidal cross-section having a small footing, which is suitable for making ...  
WO/2013/046687A1
Provided is a resin-coated metal sheet which is for a container and which can adapt to the various properties required of a material for food cans. A resin coating layer (A) having a multi-layer structure and having polyester resin as th...  
WO/2013/047699A1
The conductive composition contains, at a minimum, (a) conductive metal fibers of average short-axis length of 1 nm to 150 nm inclusive, and (b) a compound represented by the following general formula (1) or general formula (2), in an am...  
WO/2013/047699A9
The conductive composition contains, at a minimum, (a) conductive metal fibers of average short-axis length of 1 nm to 150 nm inclusive, and (b) a compound represented by the following general formula (1) or general formula (2), in an am...  
WO/2013/046688A1
Provided is a resin-coated metal sheet which is for a container and which can adapt to the various properties required of a material for food cans. A resin coating layer (A) having a multi-layer structure and having polyester resin as th...  
WO/2013/046601A1
Provided is a high-strength alloyed hot-dipped galvanized steel sheet which has excellent corrosion resistance after coating. This high-strength alloyed hot-dipped galvanized steel sheet contains, in mass%, 0.05-0.15% of C, 0.1-1.0% of S...  
WO/2013/047285A1
The present invention relates to a case for electronic devices, which comprises: a base that is mainly formed of a polylactic acid resin; a close adhesion layer that is coated over the base and is mainly formed of a polylactic acid resin...  
WO/2013/047056A1
The purpose of the present invention is to provide a copper foil for lamination, said copper foil exhibiting excellent adhesion to a substrate and being capable of forming a high-precision wiring pattern. This copper foil for lamination ...  
WO/2013/047700A1
A method for manufacturing a compound structure for which a resin structure (2) and a metal plate (3) are bonded together using an adhesive agent (5), wherein the resin structure (2) is equipped with multiple erect bodies (8) by means of...  
WO/2013/047147A1
This conductive composition contains: (a) metal conductive fibers that have an average minor axis length of from 1 nm to 150 nm (inclusive); and (b) at least one compound that is selected from the group consisting of monosaccharides and ...  
WO/2013/047963A1
The present invention relates to a multi-nozzle bed, a heat transfer film having a multi-nozzle bed, and a method for manufacturing same. The multi-nozzle bed and the heat transfer film having the multi-nozzle bed according to the presen...  
WO/2013/045129A1
The invention relates to a method for joining an aluminium rib to a steel tube, comprising the steps of (a) providing a first component in the form of a steel tube having an inner surface and an outer surface, and wherein at least the ou...  
WO/2013/048689A2
Disclosed is a multilayer adhesive film comprising surface adhesive layers, an internal Controlled Bond Layer ("CBL") comprising a propylene-based polymer strippably adhered to an adjacent layer; an internal Strong Bond Layer ("SBL") dif...  
WO/2013/046195A1
A composite insulating panel comprises an external sheet (2), an internal sheet (4), and an insulating body between the external sheet and the internal sheet. There is a photovoltaic solar collector module (10) on the external surface of...  
WO/2013/046631A1
 The metal-clad laminate (100) according to the present invention comprises an insulating layer (101) including a thermosetting resin, a filler material, and a fibre base, and is provided with metal foil (103) on both surfaces of the i...  
WO/2013/043434A3
The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of LEDs. The method includes individual processes (in no particular order) like continuous contacting of various layers of ...  
WO/2013/042356A1
Provided are an alloyed hot-dip galvanized steel sheet which includes a Si-containing high-strength steel sheet as the base and which, after coated, has excellent corrosion resistance and a process for producing the galvanized steel shee...  
WO/2013/043434A2
The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of LEDs. The method includes individual processes (in no particular order) like continuous contacting of various layers of ...  
WO/2013/042572A1
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal materi...  
WO/2013/043564A3
Melt processed polyarylene sulfide compositions are described as are methods of forming the melt processed polyarylene sulfide compositions. The melt processed polyarylene sulfide compositions are formed according to a melt processing me...  
WO/2013/042719A1
This heat ray shielding material has an adhesive layer and a metal-particle-containing layer containing at least one type of metal particles; the metal particles have at least 60% by number of hexagonal to circular plate-shaped metal par...  
WO/2013/042781A1
The objective of the present invention is to provide a laminate body such that a metal and a fluorine-containing polymer are directly and rigidly affixed. The laminate body has a layer (A) comprising a metal and a layer (B) formed on lay...  
WO/2013/041712A1
A laminate or structure which comprises a conductive layer, a fibrous layer and a support layer adhering to an outer face of the laminate or structure, the support layer preventing distortion of the conductive layer during slitting of th...  
WO/2013/042635A1
Provided are a laminate and a method for manufacturing said laminate, the laminate having a strong adhesion between the substrate, which is obtained from a metal or an alloy, and the thermally sprayed film layer formed on the surface of ...  
WO/2013/043652A3
The invention provides a layered structure comprising at least two layers: A) a first layer A, formed from a composition A, comprising a polyurethane; and B) a second layer B, formed from a composition B, comprising at least one function...  
WO/2013/043083A1
The utility model relates to labels with a metal layer, wherein said utility model has an appearance of a metal plate. The label with a layer of a metal foil according to the claimed utility model is made of a composite material. It addi...  
WO/2013/037391A1
Known protective coatings with a high Cr-content and silicon as an additive have brittle phases which become additionally brittle under the influence of carbon during use. The protective coating according to the invention has a double me...  
WO/2013/037918A1
The invention relates to a strip consisting of an aluminum material for producing components with exacting shaping requirements, a method for producing the strip and the use of sheets produced from the strip according to the invention. T...  
WO/2013/038644A1
The surface of an Al-alloy-plated steel sheet is coated with a chemical conversion treatment liquid, which is dried to form a chemical conversion treatment film having a thickness of 0.5-10 μm. The chemical conversion treatment liquid c...  
WO/2013/038643A1
The surface of an Al-containing Zn-alloy-plated steel sheet is coated with a chemical conversion treatment liquid, which is dried to form a chemical conversion treatment film having a thickness of 0.5-10 μm. The chemical conversion trea...  
WO/2013/040400A1
Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as...  
WO/2013/035283A1
[Problem] To obtain a transparent conductive film for organic electronic devices that exhibits both high transparency and high conductivity, and that can be roll-formed on low-cost film substrates. [Solution] The transparent conductive f...  
WO/2013/036077A2
The present invention relates to a flexible metal laminate having low permittivity, capable of being applied to a soft printed circuit board. According to one aspect of the present invention, the flexible metal laminate comprises: a firs...  
WO/2013/036220A1
Described herein are solar reflectors which provide a low cost reflector construction that has a unique set of attributes: high solar reflectance, abrasion resistance, UV stability, mechanical integrity, and flexibility. The abrasion res...  
WO/2013/036324A3
Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, ≤ 12.0 μm. The films also include a metal layer in surface contact...  
WO/2013/035805A1
 One purpose of the present invention is to provide a metal wire for rubber reinforcement that exhibits excellent wire drawability and adhesion with rubber compositions. The aforementioned issue is resolved by a metal wire for rubber...  
WO/2013/036077A3
The present invention relates to a flexible metal laminate having low permittivity, capable of being applied to a soft printed circuit board. According to one aspect of the present invention, the flexible metal laminate comprises: a firs...  
WO/2013/032211A3
The present invention relates to a polymer resin composition which can provide an insulating material having superior mechanical properties and a low dielectric constant, to a polyimide resin film obtained using same, to a method for pre...  
WO/2013/031344A1
Provided is an aluminium coated sheet material for moulding, which has excellent wax-deposition resistance for a moulding die, and, furthermore, effectively restricts or prevents outer wax that is coated on a resin film from being stripp...  
WO/2013/031913A1
Provided is a copper foil with a carrier, in which an ultrathin copper layer is not separated from a carrier before a process for lamination on an insulating substrate, while the ultrathin copper layer can be separated therefrom after th...  
WO/2013/032211A2
The present invention relates to a polymer resin composition which can provide an insulating material having superior mechanical properties and a low dielectric constant, to a polyimide resin film obtained using same, to a method for pre...  
WO/2013/033384A1
A method of electrically insulating one or more components of a boom assembly involves applying a seamless coating of dielectric material to an outer surface of each of one or more boom assembly components, the boom assembly components b...  
WO/2013/030469A1
The subject of the invention is a composite sheet material made of aluminium alloy for motor vehicle body components, in which a cladding sheet is applied to at least one side of a core, the compositions of the core and of the cladding s...  
WO/2013/032542A1
A low emissivity and EMI shielding transparent composite film typically for use in association with window glazing and comprising a transparent film substrate having on one side thereof an underlayer of abrasion resistant hardcoat materi...  
WO/2013/029271A1
A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclot...  
WO/2013/031200A1
Provided is an electromagnetic steel sheet having an insulating coating, which has excellent punchability, excellent coating adhesiveness, and excellent coating characteristics after annealing, even without including a chrome compound in...  
WO/2013/030972A1
A resin coated metal sheet (1) is provided with a metal sheet (2), a resin coating layer (3) which is formed on the front surface side of the metal sheet (2), and a resin coating layer (4) which is formed on the rear surface side of the ...  
WO/2013/027663A1
Provided are: a thermally adhesive polyimide film; a method for producing the thermally adhesive polyimide film; and a polyimide metal laminate produced using a thermally adhesive polyimide film. A single-layer thermally adhesive polyimi...  
WO/2013/028734A1
The present invention relates to growth of vertically-oriented crystalline nanowire arrays upon a transparent conductive or other substrate for use in 3rd generation photovoltaic and other applications. A method of growing crystalline an...  
WO/2013/027732A1
Provided is a curable resin composition, which contains an epoxy compound (A1), an active ester compound (A2), a filler (A3) and an alicyclic olefin polymer (A4) containing a group that is reactive with an epoxy group, and wherein the co...  

Matches 851 - 900 out of 67,001