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WO/2023/190660A1 |
A method for manufacturing a laminate (1) comprises a step for preparing a metal substrate (2), and a step for using sputtering to form an inorganic insulation layer (3) on one surface (21) of the metal substrate (2) in the thickness dir...
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WO/2023/189565A1 |
Provided is a carrier-attached metal foil in which the occurrence of fractures or cracks in the metal foil during handling thereof can be suppressed. The carrier-attached metal foil comprises a carrier, a release layer, and a metal foil ...
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WO/2023/191010A1 |
Provided are a film and a laminate using the film, the film comprising a layer A and a layer B, which is on at least one surface of layer A, the elastic modulus of layer A at 160°C being 100-2,500 MPa, and the difference LA-LB between t...
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WO/2023/190749A1 |
The present invention provides a polyimide precursor composition for flexible wiring boards, the polyimide precursor composition containing a polyimide precursor that has a repeating unit represented by general formula (I). A polyimide f...
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WO/2023/190944A1 |
A clad plate having: a first layer that comprises a stainless steel; a second layer that is bonded to the first layer, and comprises pure aluminum or an aluminum alloy; and a first oxide layer that is present between the first layer and ...
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WO/2023/189719A1 |
Provided is a laminate in which a first substrate, a silane coupling agent layer, and a second substrate are laminated in this order, wherein: [B1] ≥ [A1] is satisfied when A1 is the number of circular floats having a diameter of 0.5 m...
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WO/2023/190442A1 |
The purpose of the present invention is to provide a roll-bonded body that achieves both high peel strength and high resistance to bonding and bending. The present invention relates to a roll-bonded body comprising an aluminum layer an...
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WO/2023/189610A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/190845A1 |
Provided are a copper foil having high adhesion to a coating film, and a light-shielding material having, in addition to excellent light shielding properties, high adhesion to a black coating film and a substrate. A copper foil (1) has, ...
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WO/2023/189256A1 |
The present invention relates to a conductive film provided with a film-like base material and a conductive layer provided on one major surface side of the base material. The conductive layer comprises a first metal layer including a fir...
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WO/2023/192968A2 |
A method for producing a hardened wear plate to be used in mining or agricultural operations for transporting raw materials. The hardened wear plate is produced by providing a metal plate, overlaying a metal deposit, overlaying a flux, s...
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WO/2023/187625A1 |
The present invention relates to an adhesive-attached metal substrate and a laminate that have a low-dielectric property in a high-frequency region, and in which sufficient adhesive strength can be ensured between a resin film and a meta...
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WO/2023/181365A1 |
Provided is a metal vapor deposited film that has high gas-barrier characteristics against gas such as water vapor and oxygen, and provides high adhesion strength between a film base material and a metal thin film layer. A metal vapor ...
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WO/2023/182123A1 |
The purpose of the present invention is to provide: a resin composition which is suitable for use in the production of an insulating layer of a printed wiring board, the insulating layer having a high dielectric constant and a low dielec...
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WO/2023/182114A1 |
Provide is a steel sheet that is subjected to complex forming for which press forming is difficult, exhibits a low sliding resistance in a portion having a risk of cracking during the press forming, and has excellent press formability an...
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WO/2023/182096A1 |
The present disclosure provides a transfer sheet for manufacturing an exterior member comprising a metal member. The transfer sheet comprises a mold releasing film and a transfer layer disposed on one surface of the mold releasing film. ...
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WO/2023/181032A1 |
The present invention relates to hybrid foil which includes at least two layers, preferably, an aluminum layer and at least one additional layer, wherein the additional layer may be a polymer layer. The hybrid foil further includes an ad...
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WO/2023/182188A1 |
The present invention makes it less likely for a pattern to appear on the surface of a sheet glass that is equipped with a low-emissivity film and a protective film for protecting said low-emissivity film. This coated sheet glass (Cg) ...
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WO/2023/183131A1 |
Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film. The dielectric films of the present disclos...
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WO/2023/181963A1 |
A molded styrene-based resin including a syndiotactic polystyrene resin is provided, the molded resin having heat resistance and a low transmission loss. This molded styrene-based resin including a syndiotactic polystyrene resin contai...
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WO/2023/181964A1 |
The present invention provides a styrene resin molded body which contains a syndiotactic polystyrene resin, and has heat resistance, flame retardancy and a low transmission loss. The present invention provides a styrene resin molded bo...
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WO/2023/182122A1 |
The purpose of the present invention is to provide a resin composition having a high dielectric constant and a low dielectric loss tangent and that can be suitably used to prepare an insulating layer on a printed wiring board having exce...
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WO/2023/182384A1 |
The present invention provides a flameproof structure that, in addition to having a more exceptional heat-insulating effect and flameproof effect, achieves enhanced joint strength between a battery case and a heat-insulating material, un...
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WO/2023/176648A1 |
A composite substrate according to the present invention is for production of a graphene film, and comprises, in the following order, a substrate which has a thermal expansion coefficient of not more than 2.0×10-6(K-1), an oxide film, a...
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WO/2023/176764A1 |
The present invention provides: a resin composition which has excellent moldability and a low dielectric loss tangent (Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed wiring board; and a se...
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WO/2023/176763A1 |
Provided are: a resin composition having excellent moldability and a low dissipation factor (Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed circuit board; and a semiconductor device. A res...
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WO/2023/176615A1 |
This roller bearing comprises: an inner member; an outer member; rollers (4, 5) interposed between the orbital planes of the inner member and outer member; and a retainer that retains the rollers (4, 5). The rollers (4, 5) each have a DL...
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WO/2023/176768A1 |
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide comp...
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WO/2023/176964A1 |
This adhesion method is for adhering adherend 1 formed from resin (1) and adherend 2 formed from resin (2) different from the resin (1) to each other, the method having: a step for obtaining a laminate by laminating the adherend 1, a hot...
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WO/2023/176766A1 |
The present invention provides: a resin which has an indane skeleton and exhibits excellent heat resistance and excellent dielectric characteristics; a resin composition which uses this resin; a cured product; a prepreg; a metal foil-cla...
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WO/2023/176212A1 |
[Problem] To provide a polyamide film which not only has excellent cold-forming properties regardless of the removal position in the widthwise direction of the film, but also springs back very little, resulting in excellent dimensional a...
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WO/2023/176679A1 |
The purpose of the present invention is to provide an aluminum alloy foil for printed wiring boards which is excellent for fine-line etching for circuit wiring and which has high strength that makes breaks unlikely. Provided is an alumin...
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WO/2023/176765A1 |
Provided is a styrene resin which can give cured objects excellent in terms of low-dielectric characteristics (Dk and/or Df) and heat resistance. Also provided are a hydroxy resin, a method for producing the hydroxy resin, a method for p...
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WO/2023/177535A2 |
Film structures and methods of forming a film structure are described herein. The film structure includes a polymeric substrate having an inorganic coating thereon. The film structure has a polymeric buffer layer positioned between the p...
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WO/2023/176770A1 |
Provided is a heat dissipation substrate in which a metal member is provided adjacent to one surface of an insulating layer. The metal member has a material made from copper, a copper alloy, aluminum, or an aluminum alloy and has a sheet...
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WO/2023/176432A1 |
This packaging material for aqueous content is a packaging bag comprising at least a gas barrier laminate obtained by laminating, in the sequence listed, a paper substrate, an anchor coating layer, a vapor deposition layer, and an overco...
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WO/2023/174781A1 |
The invention relates to a multi-layer body, comprising (I) a carrier layer made of a special thermoplastic polycarbonate molding compound and (II) a metal layer which has one or more recesses. The invention also relates to a lighting or...
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WO/2023/171027A1 |
One aspect of the present invention relates to a stretchable resin composition which comprises an epoxy resin and a hardener, wherein the epoxy resin has a weight-average molecular weight of 50,000-3,000,000 and an average-molecular-weig...
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WO/2023/170642A1 |
The present invention concerns in general a process (100) for making a layered material comprising a micro- and/or nanostructured layer (14) in a resin comprising the steps which consist in providing (110) a substrate (11) configured to ...
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WO/2023/171173A1 |
One purpose of the present invention is to provide an organic resin-coated steel sheet on which molding that is complicated and difficult to be conducted through press molding is to be performed, and which has a small sliding resistance ...
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WO/2023/171554A1 |
Provided are: a resin composition having excellent moisture absorption heat resistance while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet;...
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WO/2023/171553A1 |
Provided are: a resin composition having a low coefficient of thermal expansion (CTE) while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; ...
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WO/2023/170612A1 |
A pliable insulation sheet has a plurality of layers. The pliable insulating sheet has a perforated insulating layer and a non-perforated water vapour permeable layer. Interposed between and bonding together at least two layers of the sh...
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WO/2023/171705A1 |
The present invention relates to a method for manufacturing a single-side metal-clad layered plate comprising: core layers (110, 120) made of a heat-resistant film; and metal foil (151, 152) adhesively layered onto thermoplastic resin la...
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WO/2023/171194A1 |
Provided is a substrate treatment agent capable of provide a metal material with preferable adhesiveness, acid resistance, and alkali resistance to a laminate film. For the substrate treatment agent, the concentration of a water-soluble ...
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WO/2023/166971A1 |
A polyimide resin composition that contains polyimide resin (A) having a specific structure and compound (B) represented by formula (5). (R51 is an alkyl group having 1-10 carbon atoms or an alkoxy group having 1-10 carbon atoms. R52 to ...
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WO/2023/167152A1 |
The present invention provides a block copolymer which comprises a polymer block (B) that is mainly composed of a conjugated diene monomer unit, and a polymer block (A) that is mainly composed of a vinyl aromatic monomer unit and/or a po...
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WO/2023/166858A1 |
Provided is a hot-dip Al-Zn plated steel sheet that has excellent corrosion resistance in a stable manner with certainty. The hot-dip Al-Zn plated steel sheet according to the present invention comprises a plating film and is character...
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WO/2023/166783A1 |
Provided is an electromagnetic wave shielding material which has favorable shielding properties in a low-frequency range. The electromagnetic wave shielding material has a structure in which a ferromagnetic layer and a non-magnetic condu...
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WO/2023/167151A1 |
The present invention provides a block copolymer which comprises a polymer block (C) that is composed of a vinyl aromatic monomer unit and a conjugated diene monomer unit, and a polymer block (A) that is mainly composed of a vinyl aromat...
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