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WO/1990/011317A1 |
Solution blending of (a) a conductive polymer containing carbon-nitrogen linkages, such as polyaniline, having an organic group or an inorganic group, e.g., derived from an anhydride or an aromatic multisulfonic acid, covalently linked t...
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WO/1990/010661A1 |
Free-radical curable compositions contain a (meth)acrylate oligomer and at least one of a single functional diluent, a mixture of single functionality diluents and a dual functional monomer wherein the ratio of electron-rich double bonds...
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WO/1990/009410A1 |
Thermosetting resins for use in high performance fiber-reinforced composites are toughened without compromising their processibility by the inclusion of micron-sized particles of thermoplastic material which are solid at ambient temperat...
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WO/1990/009365A1 |
This invention relates to new monoester compounds of itaconic acid represented by general formula (1), wherein R1 represents H or CH3 and R2 represents C2 to C10 alkylene, oxyethylene or derivative thereof. These compounds are generally ...
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WO/1990/009616A1 |
Non-linear materials based on side-chain polymers, in which the main chains contain aliphatic elements and in which the side chains contain a conjugated $g(p)-system as a non-linear optical chromophore, an electron donor (d) being linked...
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WO/1990/003405A1 |
A tough, high performance polyimide is provided by reacting a triple bond conjugated with an aromatic ring in a bisethynyl compound with the active double bond in a compound containing a double bond activated toward the formation of a Di...
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WO/1989/009239A1 |
This invention relates to water soluble heterocyclic cationic graft polymers of cellulose containing units of structure (I), wherein R is the residue of a cellulosic polymer containing hydroxyl groups; R1 is hydrogen or methyl; R2+ is a ...
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WO/1989/004850A1 |
Bismaleinimides of formula (I) in which R is a residue of formula (II), polyimides prepared from these bismaleinimides, if necessary with addition of an aromatic diamine. These polyimides may be reinforced with fibers.
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WO/1989/003382A1 |
The invention comprises cyclobutarene ketoaniline monomers and the process for preparing them. The monomers can be used to graft and/or endcap a monomer or polymer having at least 1 amino-reactive functionality. The grafted and/or endcap...
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WO/1988/005040A1 |
A compound which comprises an amido alkenoic acid or a water-soluble salt thereof and an arylcyclobutene moiety, wherein the cyclobutene moiety is fused to the aryl radical, and wherein the amide nitrogen is connected to the aryl radical...
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WO/1988/002380A1 |
A process for producing a heat resistant resin composition, which comprises polymerizing by suspension polymerization a monomer mixture comprising from 30 to 80 % by weight of an aromatic vinyl monomer, from 10 to 50 % by weight of an N-...
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WO/1988/002010A1 |
Polymerisates containing silyl groups, which are introduced therein by ethylenically unsaturated monomers having general formula (a), where R1 is alkyl, aryl, acyl, aralkyl with 1 to 10 atoms of carbon, R2 is an organic residue having a ...
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WO/1987/005303A1 |
Monomeric compound comprising (a) a reactive arylcyclobutene moiety and (b) a molecular group which is bonded to the aryl group of the arylcyclobutene moiety. The molecular group which is bonded to the aryl moiety can comprise at least o...
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WO/1986/006738A1 |
Compositions and methods for inhibiting the cure of cyanoacrylate adhesives and cure inhibited cyanoacrylate adhesive compositions. The cure inhibited compositions comprise an organic carboxylic acid; and a hydrated or anhydrous metal ch...
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WO/1985/005366A1 |
Heat resistant thermosetting prepolymers are prepared by reacting one or more methylated pyridines or pyrazines with one or more aromatic dialdehydes, and isopropenyl phenols. The prepolymers can be further reacted with bismaleimides to ...
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WO/1984/003097A1 |
An alpha-cyanoacrylate-based instant adhesive composition containing benzophenonetetracarboxylic acid or its anhydride. This composition has an excellent heat resistance of resisting to 150oC heating, while maintaining instant adhesive p...
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WO/1983/002450A1 |
Cyanoacrylate adhesive compositions containing elastomeric polymers as fillers. Preferred fillers are the acrylic rubbers. Filler concentration range from about 0.5 - 40 % by weight of the composition. Beneficial results include improved...
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WO/1982/000829A1 |
Adhesive composition of the cyanoacrylate type containing Phthalic anhydride as an additive to improve the resistance to moisture and/or heat of the resulting adhesive bonds.
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WO/1981/001059A1 |
Photographic material including in one of its layers a polymeric product having an aminoallylidenemalononitrile ultraviolet absorber unit which can be introduced into a photographic layer by aqueous solutions, with the method according t...
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WO/1980/002690A1 |
Molding compositions are prepared containing a divinyl polyester resin having the following skeletal structure (FORMULA) a polymerizable monomer, and from about 1 to about 30 parts by weight of an epihalohydrin polymer per 100 parts by w...
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WO/1980/001164A1 |
Carboxyl or carboxyl salt containing polymers are prepared by polymerizing carboxyl containing monomers wherein greater than one percent of the carboxyl groups are neutralized with an alkali, ammonia or an amine, optionally copolymerized...
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WO/1980/000571A1 |
The use of polymer or copolymer of an unsaturated acid ester represented by the following general formula; (FORMULA) (wherein R1 and R2 each present an alkyl group containing 1-4 carbon atoms, X and Y each represent a hydrogen atom, an a...
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JP2024515360A |
The present invention relates to a new class of dielectric polymeric materials particularly suitable for the manufacture of electronic devices. Dielectric polymeric materials are formed by reacting bismaleimide compounds and exhibit a ba...
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JP7462913B2 |
Provided is a novel phosphorus compound. A compound represented by general formula (I)or a salt thereof. (In the formula, each of R1and R2independently represents a substituted or unsubstituted aryl group; each of R3and R4independently r...
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JP2024037687A |
An object of the present invention is to provide a structure for sealing an organic EL display element that can suppress deterioration and corrosion of metal layers, wiring, etc. and has excellent barrier properties. The present inventio...
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JP7443747B2 |
Provided are (i) a solution for forming an organic semiconductor layer which solution has an excellent coating property, (ii) an organic semiconductor which is produced with use of the solution and which has high heat resistance, (iii) a...
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JP2024027794A |
[Object] To provide a resin composition that provides a cured product with a high glass transition temperature and excellent dielectric properties. [Solution] (A) The following formula (1) (In formula (1), A independently represents a te...
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JP2024508468A |
The present invention relates to a method for producing a superabsorbent resin, and more specifically, the present invention relates to a method for producing a superabsorbent resin, and more specifically, it uses a specific inorganic su...
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JP7426154B2 |
To provide a resin composition which is curable in short time at low temperature around room temperature, prevents contamination in the periphery by resin volatile, and is suitable as a one-pack type adhesive for manufacturing an electro...
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JP2024012085A |
The present invention provides a polymer compound, a resin composition, a resin film, a prepreg, a laminate, a printed wiring board, and a semiconductor package that have low dielectric constant, solvent solubility, and heat resistance. ...
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JP7419953B2 |
To provide a retardation film which expresses a property close to ny≒nz with a single film for the purpose of improving contrast as compared to a property of nx
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JP7415310B2 |
The present invention has an object to provide a film forming material for lithography that is applicable to a wet process, has excellent heat resistance and film flatness in a supporting material having difference in level, and has exce...
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JP7415357B2 |
To provide an active energy ray-curable composition excellent in color developing property, adhesiveness to a substrate and discharge stability in a high concentration region.The active energy ray-curable composition contains substantial...
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JP2024004392A |
[Problem] Polymaleimide resin that has high solubility in solvents and exhibits low dielectric loss tangent and high heat resistance when cured, curable compositions containing the polymaleimide resin, and cured products thereof, prepreg...
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JP7413728B2 |
To provide a resin composition which exhibits phase difference characteristics and wavelength dependence at high levels when being used as an optical film, maintains them even under high temperature environment, and is excellent in phase...
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JP2024002673A |
[Problem] The maleimide compound that serves as the base resin in the composition has a low viscosity, so the composition has excellent workability and flowability, and exhibits excellent dielectric properties even at high frequencies, a...
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JP7409388B2 |
A polymer (A) having structural units derived from at least one monomer selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2) is included in this liquid crystal alignment ag...
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JP7404272B2 |
The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic ...
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JP2023179928A |
To provide an encapsulation resin composition favorable for application of encapsulating a semiconductor element-mounted face of a circuit board mounted with a semiconductor element, or a semiconductor element-formed face of a wafer form...
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JP2023552473A |
- preparing an oil phase comprising a polyfunctional ethylenically unsaturated monomer or oligomer, wherein the water solubility of the polyfunctional ethylenically unsaturated monomer or oligomer in deionized water at 20°C is less than...
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JP7396742B1 |
[Problem] To provide a bismaleimide in which the amino group of dimaziamine is converted into maleimide, which has sufficiently improved mixing compatibility and handling properties when mixed with other agents such as a curable resin, a...
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JP7386268B2 |
The present invention provides a method for producing an optical film, the method being capable of producing an optical film having a liquid crystal layer having few alignment defects in a liquid crystal compound. This method for produci...
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JP7385669B2 |
An optical film, a polarizing plate, and an image display device, each having an optically anisotropic layer obtained by curing a polymerizable liquid crystal composition including immobilizing an alignment state of a rod-shaped liquid c...
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JP7383921B2 |
To provide a polymer-containing composition or polymer which has moderate solubility in an alkaline developer and can form a film which is less likely to cause cracks.The present invention provides: a polymer-containing composition which...
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JP7379157B2 |
Disclosed herein are methods of making and using cyanoacrylate compositions comprising one or more cyanoacrylates, a high level of at least one stabilizing agent and at least one free-radical polymerization inhibitor. Methods disclosed c...
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JP7375658B2 |
The objective of the present invention is to provide a resin composition from which an insulating layer having a low dissipation factor and excellent adhesion strength with a conductor layer can be obtained. To this end, the present inve...
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JP2023161165A |
To provide a method for producing a cured product of a thermosetting maleimide resin composition that does not cause curing failure or resulting poor appearance.There is provided a method for producing a cured product of a thermosetting ...
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JP2023158014A |
To provide a composition for forming a pattern, from which a film for forming a pattern showing excellent etching processability can be formed.A composition for forming a pattern is a composition for forming a pattern comprising a polyme...
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JP7369777B2 |
Provided are: a resin composition for polarizer protection that has excellent adhesion to a polarizer and can prevent defects such as decoloration from an edge or whitening of a protective layer; and a polarizing plate comprising a prote...
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JP7365574B2 |
To provide a maleimide compound that expresses excellent adhesiveness to a chip, a substrate or the like, and a method of producing the same.The present invention relates to a maleimide compound represented by the formula (1) (where, R1 ...
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