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Matches 401 - 450 out of 3,715

Document Document Title
WO/1990/011317A1
Solution blending of (a) a conductive polymer containing carbon-nitrogen linkages, such as polyaniline, having an organic group or an inorganic group, e.g., derived from an anhydride or an aromatic multisulfonic acid, covalently linked t...  
WO/1990/010661A1
Free-radical curable compositions contain a (meth)acrylate oligomer and at least one of a single functional diluent, a mixture of single functionality diluents and a dual functional monomer wherein the ratio of electron-rich double bonds...  
WO/1990/009410A1
Thermosetting resins for use in high performance fiber-reinforced composites are toughened without compromising their processibility by the inclusion of micron-sized particles of thermoplastic material which are solid at ambient temperat...  
WO/1990/009365A1
This invention relates to new monoester compounds of itaconic acid represented by general formula (1), wherein R1 represents H or CH3 and R2 represents C2 to C10 alkylene, oxyethylene or derivative thereof. These compounds are generally ...  
WO/1990/009616A1
Non-linear materials based on side-chain polymers, in which the main chains contain aliphatic elements and in which the side chains contain a conjugated $g(p)-system as a non-linear optical chromophore, an electron donor (d) being linked...  
WO/1990/003405A1
A tough, high performance polyimide is provided by reacting a triple bond conjugated with an aromatic ring in a bisethynyl compound with the active double bond in a compound containing a double bond activated toward the formation of a Di...  
WO/1989/009239A1
This invention relates to water soluble heterocyclic cationic graft polymers of cellulose containing units of structure (I), wherein R is the residue of a cellulosic polymer containing hydroxyl groups; R1 is hydrogen or methyl; R2+ is a ...  
WO/1989/004850A1
Bismaleinimides of formula (I) in which R is a residue of formula (II), polyimides prepared from these bismaleinimides, if necessary with addition of an aromatic diamine. These polyimides may be reinforced with fibers.  
WO/1989/003382A1
The invention comprises cyclobutarene ketoaniline monomers and the process for preparing them. The monomers can be used to graft and/or endcap a monomer or polymer having at least 1 amino-reactive functionality. The grafted and/or endcap...  
WO/1988/005040A1
A compound which comprises an amido alkenoic acid or a water-soluble salt thereof and an arylcyclobutene moiety, wherein the cyclobutene moiety is fused to the aryl radical, and wherein the amide nitrogen is connected to the aryl radical...  
WO/1988/002380A1
A process for producing a heat resistant resin composition, which comprises polymerizing by suspension polymerization a monomer mixture comprising from 30 to 80 % by weight of an aromatic vinyl monomer, from 10 to 50 % by weight of an N-...  
WO/1988/002010A1
Polymerisates containing silyl groups, which are introduced therein by ethylenically unsaturated monomers having general formula (a), where R1 is alkyl, aryl, acyl, aralkyl with 1 to 10 atoms of carbon, R2 is an organic residue having a ...  
WO/1987/005303A1
Monomeric compound comprising (a) a reactive arylcyclobutene moiety and (b) a molecular group which is bonded to the aryl group of the arylcyclobutene moiety. The molecular group which is bonded to the aryl moiety can comprise at least o...  
WO/1986/006738A1
Compositions and methods for inhibiting the cure of cyanoacrylate adhesives and cure inhibited cyanoacrylate adhesive compositions. The cure inhibited compositions comprise an organic carboxylic acid; and a hydrated or anhydrous metal ch...  
WO/1985/005366A1
Heat resistant thermosetting prepolymers are prepared by reacting one or more methylated pyridines or pyrazines with one or more aromatic dialdehydes, and isopropenyl phenols. The prepolymers can be further reacted with bismaleimides to ...  
WO/1984/003097A1
An alpha-cyanoacrylate-based instant adhesive composition containing benzophenonetetracarboxylic acid or its anhydride. This composition has an excellent heat resistance of resisting to 150oC heating, while maintaining instant adhesive p...  
WO/1983/002450A1
Cyanoacrylate adhesive compositions containing elastomeric polymers as fillers. Preferred fillers are the acrylic rubbers. Filler concentration range from about 0.5 - 40 % by weight of the composition. Beneficial results include improved...  
WO/1982/000829A1
Adhesive composition of the cyanoacrylate type containing Phthalic anhydride as an additive to improve the resistance to moisture and/or heat of the resulting adhesive bonds.  
WO/1981/001059A1
Photographic material including in one of its layers a polymeric product having an aminoallylidenemalononitrile ultraviolet absorber unit which can be introduced into a photographic layer by aqueous solutions, with the method according t...  
WO/1980/002690A1
Molding compositions are prepared containing a divinyl polyester resin having the following skeletal structure (FORMULA) a polymerizable monomer, and from about 1 to about 30 parts by weight of an epihalohydrin polymer per 100 parts by w...  
WO/1980/001164A1
Carboxyl or carboxyl salt containing polymers are prepared by polymerizing carboxyl containing monomers wherein greater than one percent of the carboxyl groups are neutralized with an alkali, ammonia or an amine, optionally copolymerized...  
WO/1980/000571A1
The use of polymer or copolymer of an unsaturated acid ester represented by the following general formula; (FORMULA) (wherein R1 and R2 each present an alkyl group containing 1-4 carbon atoms, X and Y each represent a hydrogen atom, an a...  
JP6571481B2  
JP2019143157A
[Subject] Offer of a constituent for manufacturing polymer with a high glass transition temperature. [Means for Solution] A constituent containing a 1 and 1-2 substitution Al Ken compound which can manufacture polymer which has a glass t...  
JP2019522064A
The constituent containing a graft copolymer and a graft copolymer, an intermediate substance, and a related method are indicated, and it is this graft copolymer here, A graft is carried out to the 2nd ingredient including the 1st polyme...  
JP2019133015A
[Subject] When a polymer which has a different main bone rank from Polya Mick acid, Polya Mick acid ester, polyimide, and polyorgano Siloxane is used as a polymer ingredient, provide a rubbing agent which can obtain a film for Liquid cry...  
JP2019124781A
[Subject] The present invention relates to a manufacturing method of an optical compensation film suitable as an optical medium, and relates to a method of manufacturing in more detail an optical compensation film which is excellent in t...  
JP2019519550A
The present invention is a formula (3) (the inside of a formula, X).+It is a compound of being a Is proton, and when it measures in accordance with ASTM standard D6866-12 and method B, it is related with the compound containing 28 % of t...  
JP2019106369A
To provide a novel electrode composition which meets the needs both of the battery safety and electrode conductivity.Provided is a method for forming a slurry to be used for a positive electrode plate. The method comprises the steps of: ...  
JP6535056B2  
JP2019101301A
To provide an optical composition capable of forming a cured product and an optical element with a characteristic of a high chromatic aberration correction function that hardly crystallizes.The cured product is obtained by polymerizing c...  
JPWO2018062529A1
Antimicrobial performance (antibacterial performance and mildew resistant performance) is high, and aims at providing the antimicrobial agent of the polymer type excellent in the endurance of antibacterial performance which can control e...  
JP2019517023A
The present invention provides the hardening film prepared from a photosensitive resin composition and it. A photosensitive resin composition contains the mixture of two or more Shiroki Sunpolymer which has a different rate of solution t...  
JP2019095581A
To solve such problems that when a resin film is formed of a negative photosensitive resin composition using a photoacid generator as a photosensitive agent, a post-exposure baking (PEB) process is required to carry out after exposure, t...  
JP2019515780A
The compound granulation containing a binder and polymer adsorbent material for, catching reactant gas is provided. In order to catch the method of manufacturing compound granulation, and reactant gas, the method of using compound granul...  
JP6528421B2  
JP2019085505A
To provide a radical polymerization method for alleviating yellow discoloration phenomenon of a photoradical polymer of a photoradical polymerizable composition without using a specific photoinitiator such as an acylphosphine oxide-based...  
JP6525056B2  
JP2019077788A
To provide a composition which is excellent in economy as a material used for temporary fixation of an optical member or the like, has a sufficient set time in performing alignment, has a proper adhesion strength to a base material and h...  
JP2019512567A
The present invention relates to the thing containing an optical hardenability electronic insufficient Olefin containing composition, for example, specific 2-cyanoacrylate, 2-cyano Penta dienoate, methylidyne malonate, cyanidation Vinyli...  
JP2019511604A
The present invention contains polymer constituent P which can be obtained by the free radical polymerization of monomer constituent M, Or it is the washing activity and the cleaning active polymer film consisting of polymer constituent ...  
JP2019065257A
To provide an active energy ray curable composition in which improvement of curability when an ultraviolet light emitting diode for irradiation with ultraviolet ray having luminescence peak in wavelength of 365 nm to 405 nm is used, and ...  
JP6503074B2  
JP2019509888A
The compound granulation containing a binder and the polymer adsorbent material for catching aldehyde, such as formaldehyde, is provided. The method of manufacturing compound granulation, the method of catching aldehyde using compound gr...  
JP6497676B2  
JP6496804B2  
JPWO2017209043A1
The resin composition for underfill material whose boiling point of the 2nd class monoamino compound (B) a maleimide compound (A) and the 2nd class monoamino compound (B) are contained, and is more than 120 degreeC.  
JPWO2017209237A1
The present invention provides the compound which is excellent in a low melting point and heat resistance. Following formula (1) :(n and m are the integers of 1~5 independently, respectively. inside of a formula (1), and Aly, a following...  
JPWO2017209236A1
Since bismaleimide (BMI) reveals the heat resistance (high Tg and high heat-resistant resolvability) outstanding as compared with an epoxy resin and phenol resin, in addition to the examination to a Electricity material use, it attracts ...  
JP6491506B2  

Matches 401 - 450 out of 3,715