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Matches 1,451 - 1,500 out of 2,217

Document Document Title
JP2002107936A
To provide a positive type photoresist composition less liable to cause development defects in the production of a semiconductor device or excellent also in adhesion, exposure margin (particularly in the case of isolated lines), resistan...  
JP2002107933A
To provide a resist material excellent in resolving power and dry etching resistance in exposure with EB(electron beam), EUV(extreme-ultraviolet radiation) or X-rays.The resist material contains a polymer having repeating units each cont...  
JP2002102670A
To provide an inorganic dispersant which is excellent in bond force and free from the generation of an edge break and a crack.The inorganic dispersant is incorporated with a terpene-maleic anhydride copolymer and/or its derivative.  
JP2002099087A
To provide a positive type photoresist composition excellent in shelf stability and further excellent in close adhesion, margin for exposure, variation of sensitivity with the elapse of time, or the like in production of a semiconductor ...  
JP3269796B2
To easily carry out a lithographic process utilizing far UV and to form a fine pattern fit to highly integrate a semiconductor device by polymerizing plural kinds of specified alicyclic olefins. Two or more kinds of alicyclic olefins sel...  
JP2002097318A
To obtain a weather strip using an olefin-based polymer as a raw material, capable of forming on the surface a coating film of high adhesion using a water-based surface treatment agent.This weather strip is obtained by curing an olefin-b...  
JP3268005B2
PURPOSE: To provide an olefinic copolymer which is excellent in elastic recovery and low-temperature properties and can be improved in high-temperature properties, adhesiveness, etc., by grafting and a process for efficiently producing t...  
JP2002082441A
To provide a resist composition comprising a photosensitive polymer containing a lactone in the backbone.The photosensitive polymer constituting the resist composition contains at least one selected from repeating units of formulae (1)-(...  
JP2002080649A
To provide a cycloolefinic polymer solution, capable of productively giving a film with easy control of thickness and therefore suitable for a solution casting method, of a cycloolefinic polymer excellent in moistureproofness, tearabilit...  
JP2002080539A
To obtain a cyclopentadiene-based random copolymer having a narrow mol.wt. distribution and a high mol.wt.The cyclopentadiene-based random copolymer is produced by copolymerizing a cyclopentadiene-based monomer with a catiort-polymerizab...  
JP3266368B2
PURPOSE: To provide a method for producing a cyclic olefinic copolymer excellent in copolymerizability and polymerization activity, capable of giving the cyclic olefinic copolymer narrow in the mol.wt. distribution and high in the random...  
JP2002069408A
To develop a hot melt component which has a superior thermal stability and an improved heat-resistant tackiness in using for hot-melt type paint, printing ink, adhesives or sealant.The hot melt component is constituted of; (a) an ethylen...  
JP2002062657A
To provide a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type positive type resist, excellent in basic solid state properties as the resist, e.g. sensitivity, resolution and pat...  
JP2002062640A
To provide a resist composition which is imaged with 193 nm radiation and developed to form a resist structure having high resolution and excellent etching resistance.The acid catalyst type positive type resist composition contains a com...  
JP2002060438A
To obtain an ethylidene tetracyclododecene composition which scarcely produces a gel and is suitable for a polymerization feedstock.The problem to give the composition is solved by controlling the total content of methylmethylenetetracyc...  
JP3260847B2
PURPOSE: To obtain a copolymer having excellent oil-resistance, solvent- resistance, transparency, rigidity and heat-resistance and useful as optical material, etc., by copolymerizing an α-olefin and a specific cycloolefin under specifi...  
JP2002055454A
To provide a positive resist composition having high resolving power in the production of a semiconductor device, also having a rectangular shape and ensuring low edge roughness of a line pattern and a small shift in dimensions in patter...  
JP2002053617A
To provide an unfunctionalized, functionalized or grafted olefin- cycloolefin-alkylstyrene copolymer.The copolymer can be functionalized by functionalizing the benzyl proton of an alkylstyrene unit. The functionalized or grafted olefin- ...  
JP2002053612A
To provide photoresist polymer that is suitable for the Tips step.In the photoresist composition according to this invention including the photoresist polymer represented by chemical formula (I), the protecting groups are selectively unc...  
JP2002049154A
To provide a positive type photoresist composition having good resolution even in the case of a contact hole pattern and a trench pattern in the production of a semiconductor device.The positive type photoresist composition contains a re...  
JP2002504945A
(57) The method of preparing formless コポリマー of summary ethylene and at least one ノルボルネン (NB) type comonomer is indicated. Or that these polymer is random depending on the relative ratio of the monomer of a catalyst ...  
JP3255692B2
PURPOSE: To provide a shape-recovering molding capable of being deformed at room temperature, recovered into the original shape by heating the deformed molding at ≥ a constant temperature and of being utilized for industrial molding, t...  
JP2002047311A
To provide a hydrogenated styrene copolymer with high thermostability, and excellent in moldability and mechanical properties.A hydrogenated styrene copolymer is obtained from a styrene copolymer consisting of x wt.% unit derived from a ...  
JP2002504573A
(57) Multi-ring type polymer containing a summary pendant aromatic series machine is indicated. This polymer shows the character of optical transparency to a 深 UV wavelength, and is useful to the application to a high resolution Kohei ...  
JP3255697B2
PURPOSE: To provide the olefinic synthetic wax excellent in the transparency and the low temperature characteristics, and further to provide a method for efficiently producing the same. CONSTITUTION: The wax comprises an α-olefin-cyclic...  
JP2002047310A
To provide a highly purified resin with high thermostability, plasticity and mechanical properties.A hydrogenated cyclic conjugated diene polymer containing transition metals and aluminium in total 10 ppm or less is obtained from a cycli...  
JP2002047317A
To provide a photoresist composition with low absorbance at 193 nm and 157 nm.The photoresist polymer shown in Formula (3) and the photoresist composition using the polymer are manufactured. The photoresist composition is effectively use...  
JP2002504172A
(57) Way summary ethylene and at least one sort of ノルボルネン (NB) type comonomers generally prepare an amorphous copolymer. This method includes polymerizing this monomer in the inside of a diluent, or bulk under existence of th...  
JP2002036433A
To provide a well-balanced laminated stretch film for packaging food, excellent in packaging properties such as practical heal sealability, finish properties or the like while putting characteristics possessed by a film comprising a cycl...  
JP2002504029A
(57) summary book invention to single or the multilayer film which has the theme composite which it was single or was generally contained in at least one layer of a multilayer film, the polymer composite which can give the reinforced bri...  
JP2002502888A
(57) How to manufacture the unsaturated annular compound which consists of a process of hydrogen-chloride-izing a summary terpene and preparing a hydrogen chloride-ized terpene, and a process of giving a hydrogen chloride-ized terpene to...  
JP2002020435A
To obtain a cycloolefin copolymer and an optical material both excellent in optical characteristics, heat resistance, adhesiveness, tightly contacting properties, and resistance to moisture absorption.The cycloolefin copolymer contains r...  
JP2002023376A
To provide a positive type photoresist composition having good preservability in the production of a semiconductor device and a positive type photoresist composition having improved exposure margin, edge roughness and resolution as well ...  
JP2002023354A
To provide a resist material sensitive to ArF excimer laser light, excellent in sensitivity and resolution, advantageous even to etching because film thickness can be increased and capable of easily forming a fine pattern perpendicular t...  
JP2002020454A
To obtain a thermosetting resin composition giving a cured substance excellent in adhesion and moisture-resistance as well as excellent in a dielectric characteristic (low dielectric constant) and thermostability.The thermosetting resin ...  
JP2002023375A
To provide a positive type photoresist composition which reduces the occurrence of development defects in the production of a semiconductor device, is free from particles generated in the dissolution of solid components in a solvent and ...  
JP3247130B2  
JP2002012723A
To provide a thermoplastic resin composition capable of producing moldings excellent in moldability, heat resistance, scratch resistance and in transparency, and moldings of the same.The thermoplastic resin composition contains (A) a cyc...  
JP2002012632A
To obtain a resist material comprising a polymer compound as a base resin useful for a fine processing with an electron beam or an far ultraviolet ray since the resist material responds to a high-energy ray and has sensitivity, resolutio...  
JP2002012631A
To obtain a resist material comprising a polymer compound as a base resin useful for a fine processing by an electron beam or an far ultraviolet ray since the resist material responds to a high-energy ray and has excellent sensitivity, r...  
JP2002006501A
To provide a resist composition, superior in transmittance to a light of ≤170 nm wavelength and suitable particularly for use in F2 excimer laser lithography.The chemical amplification resist composition contains a resin binder and a r...  
JP2002003543A
To provide a resin composition which has an excellent heat resistance and workability as well as a low hygroscopic property and low permittivity.This copolymer consists of at least a kind of vinyl monomer which can copolymerize at least ...  
JP2002003542A
To provide an ArF photosensitive film resin which does not dissolve in a developing solution easily as well as having an etching resistance, a heat resistance and an adhesive power, and to provide a production method of the same, further...  
JP2002003537A
To provide a resist material, a base resin of which is a polymer compound by this invention, which is useful for the microfabrication by the electron beam or far ultraviolet ray because the material is sensitive to a high energy beam and...  
JP2002003544A
To provide a resin composition which has an excellent heat resistance and optical character as well as low hygroscopic property and low permittivity.The copolymer consists of at least a kind of vinyl monomer which can copolymerize at lea...  
JP2002003541A
To provide an ArF photosensitive film resin which does not dissolve in a developing solution easily as well as having an etching resistance, a heat resistance and an adhesive power, and to provide a production method of the same, further...  
JP2002500678A
(57) Summary book invention relates to the ionicity composite which has the high ionic conductivity containing the salt which has the delocalized anion electric charge. An ionicity composite contains salt by the shape of solution in a so...  
JP2002500700A
(57) Summary book invention relates to the polymerization nature composite which has a high refractive index and a high Abbe number. The above-mentioned composite which consists of a polymerization nature monomer -- (A) -- ポリチオ (...  
JP2001356478A
To provide a positive type photoresist composition which suppresses the occurrence of development defects in the production of a semiconductor device, can prevent the generation of particles in the dissolution of a solid component in a s...  
JP2001356482A
To provide a photoresist composition having so improved resolution as to enable high resolution lithography performance using imaging radiation of 193 nm.The photoresist composition is obtained by using an imaging copolymer so as to impr...  

Matches 1,451 - 1,500 out of 2,217