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Matches 51 - 100 out of 16,444

Document Document Title
WO/2023/100843A1
[Problem] To provide a curable resin composition capable of forming solder resists which combine long-lasting low glossiness and resultant long-term freedom from solder adhesion with withstand voltage on a high level. [Solution] A curabl...  
WO/2023/099995A1
Free-radically polymerizable compounds having a poly(diakylsiloxane) segment and at least one acryl group are disclosed. Compositions including the same, polymerized compounds, methods of making and articles including the same are also d...  
WO/2023/088330A1
Disclosed in the present application are a biological valve material, and a preparation method therefor and a use thereof. The preparation method comprises: S100, linking a first carbon-carbon double bond by means of a chemical reaction ...  
WO/2023/089976A1
The purpose of the present invention is to provide a curable resin which can be excellent in terms of heat resistance (high glass transition temperature) and dielectric characteristics (low-dielectric characteristics), a composition of t...  
WO/2023/090363A1
A resin composition including a maleimide resin (A) obtained by reacting one or more tetracarboxylic dianhydrides (a1), diamines (a2), and maleic anhydride (a3), wherein the tetracarboxylic dianhydrides (a1) include at least one compound...  
WO/2023/090351A1
Provided is a resin composition that contains: (A) at least one type selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of said maleimide resins, (B) a poly(phenylene ...  
WO/2023/077699A1
Disclosed in the present invention is a pH-responsive hydrogel biocarrier. The pH-responsive hydrogel biocarrier is prepared by irradiating sodium hyaluronate and methacrylic anhydride by using 365 nm ultraviolet laser in the presence of...  
WO/2023/074804A1
[Problem] To provide a UV-curable organopolysiloxane whose cured product (cured film) has sufficient mechanical strength, has good transparency, and is designable so as to have a desired refractive index, and which has high UV curability...  
WO/2023/074429A1
The present invention provides a heat-curable resin composition capable of giving cured objects which have reduced moduli and improved flexibility and are less apt to have impaired heat resistance. The heat-curable resin composition comp...  
WO/2023/067443A1
A graft copolymer includes a hydrocarbon backbone having a phenylene ether oligomer grafted therefrom. The graft copolymer can be particularly useful in curable compositions, thermoset compositions, and articles formed therefrom.  
WO/2023/058383A1
Provided are: rubber particles having high degradability and containing a polyorgano-siloxane structure; composite particles; and manufacturing methods for these particles. The rubber particles are made of a polymer containing a struct...  
WO/2023/054085A1
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive...  
WO/2023/053749A1
Provided is a resin composition that has excellent resistance to soldering heat, has a low dielectric characteristic at an initial state, and can suppress changes in dielectric characteristics when left for an extended period at a high t...  
WO/2023/053782A1
The purpose of the present invention is to provide: a halogen-free flame-retardant curable resin composition having excellent dielectric properties, adhesion properties and flame retardancy; a prepreg comprising a curable resin compositi...  
WO/2023/048228A1
Provided is a compound represented by general formula (1). In general formula (1), P1 represents a polymer structure comprising a sub-structure represented by general formula (2). In general formula (2), n is 1 or greater; when n1 is 1, ...  
WO/2023/032866A1
This curable composition comprises piezoelectric particles and a compound represented by formula (1). In formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having ...  
WO/2023/027060A1
The present invention can provide a resin composition containing a phenylene ether resin and a petrolium resin. The phenylene ether resin is represented by general formula (1) [in general formula (1), X represents a unit including an aro...  
WO/2023/026829A1
Provided are: a resin composition which, before moisture absorption (initial state) and after moisture absorption, is low in both permittivity and dielectric loss tangent and which is high in metal-foil peel strength; and a cured object,...  
WO/2023/017746A1
[Problem] To provide: a hot melt silicone composition that can be cured at a wide temperature range from low to high temperatures in accordance with a sealing process and the heat resistance of a resin member, can achieve suitable curabi...  
WO/2023/008367A1
The purpose of the present invention is to provide an ester bond-containing polycarboxylic acid (salt) having excellent biodegradability and an excellent rate of change in alkaline degradation, a method for producing the same, and a dete...  
WO/2023/286714A1
The present invention provides: a polymer that has excellent heat resistance and dielectric properties, that can dissolve in an organic solvent at a high concentration, and that has excellent compatibility with other thermoplastic resins...  
WO/2023/284618A1
The present invention provides a resin composition comprising an isocyanate component, a reactive component, and a free radical initiator. In the reactive component, the sum of the average number of acrylate double bonds and active hydro...  
WO/2022/270467A1
The purpose of the present invention is to provide a novel hydrazide compound. It is additionally the purpose of the present invention to provide: a curable resin composition that contains the hydrazide compound and that exhibits excepti...  
WO/2022/270462A1
The purpose of the present invention is to provide a sealing agent for liquid crystal display elements that has excellent adhesiveness and moisture permeation prevention properties in addition to excellent properties with regard to the a...  
WO/2022/270442A1
The present invention provides a composition containing a compound represented by the following formula (1) (where symbols are as described in the description).  
WO/2022/259893A1
Provided are: a curable resin composition comprising a polymer (S) having at least one structural unit that is selected from the group consisting of structural units (a) which include a fluorine atom and structural units (b) which includ...  
WO/2022/257317A1
The present invention provides a polyurethane resin and a preparation method therefor. The preparation method for the polyurethane resin comprises mixing a first component and a second component to prepare the polyurethane resin, wherein...  
WO/2022/259851A1
One aspect of the present invention is a resin composition which comprises a radical-polymerizable compound (A) having a carbon-carbon unsaturated double bond in the molecule and a phosphoric acid ester compound (B) having an alicyclic h...  
WO/2022/255451A1
The purpose of the present invention is to provide a liquid crystal display element sealant that is excellent in terms of storage stability, adhesive properties, and low liquid crystal contamination properties. The purpose of the present...  
WO/2022/255217A1
Provided is a composition including a magnetic powder having excellent fluidity and a sufficient curing speed. The present invention is a thermosetting composition including: a crystalline radically polymerizable compound which has a mel...  
WO/2022/224793A1
Provided is a UV-curable silicone composition containing: (A) an organopolysiloxane having, in one molecule, two groups represented by formula (1) (R1 is a monovalent hydrocarbon group, R2 is an oxygen atom or an alkylene group, R3 is an...  
WO/2022/215716A1
Provided is a thermosetting composition containing (A) a compound represented by formula (A2) or (A3), (B) a thermal polymerization initiator, and (E) an inorganic filler.  
WO/2022/215715A1
This thermosetting composition for injection molding contains (A) a compound represented by formula (A2) or (A3) as well as (B) a thermal polymerization initiator, and also does of does not contain (G) titanium oxide. If component (G) is...  
WO/2022/215711A1
A thermosetting composition for injection molding that includes: (A) a di(meth)acrylate compound that has a structural unit that is represented by formula (A1); and (B) a thermal polymerization initiator.  
WO/2022/215708A1
A thermosetting composition which contains (A) a di(meth)acrylate compound that has a structural unit represented by formula (A1), (B) a thermal polymerization initiator and (E) an inorganic filler.  
WO/2022/210095A1
One embodiment of the present invention relates to a polymer, a composition, a cured product, a multilayer body or an electronic component; and the polymer has a repeating structural unit that is represented by formula (1), while having ...  
WO/2022/209222A1
The present invention addresses the problem of providing: adhesive tape in which adhesive force with respect to an adherend can be adequately reduced and which can easily be detached and removed, without damaging or dirtying the adherend...  
WO/2022/210664A1
This curable composition for imprinting is a composition containing: a component (A) that is a bifunctional (meth)acrylate monomer represented by general formula (1); and a component (B) that is a bifunctional urethane (meth)acrylate mon...  
WO/2022/210096A1
A radiation-sensitive composition for insulation film formation use, which comprises at least one polyfunctional compound (A) selected from a polyfunctional maleimide compound (A-1) and a polyfunctional styryl compound (A-2), a polymer (...  
WO/2022/209248A1
This resin composite laminate comprises: a urethane resin layer comprising urethane resin that comprises a urethane bond and a siloxane bond, has a weight average molecular weight of 52,200-260,000, and is soluble in a solvent; and a pol...  
WO/2022/210532A1
The present invention pertains to a resin composition containing a polyimide precursor including a structure represented by formula (1-1) and a repeat unit represented by formula (2), a cured product obtained by curing the resin composit...  
WO/2022/209689A1
The present invention provides a curable resin composition for stereolithography, the resin composition containing a urethane resin (A) having a (meth)acryloyl group and a photopolymerization initiator, wherein the amount of the (meth)ac...  
WO/2022/196721A1
[Problem] A purpose of the present invention is to provide a siloxane compound having an amide bond and a (meth)acrylate group. Another purpose of the present invention is to provide a method for producing a siloxane compound that has a ...  
WO/2022/195055A1
The present invention relates to a multilayer coating system present on a substrate and comprising at least two coating layers L1 and L2 being different from one another, namely a first coating layer L1 applied over at least a portion of...  
WO/2022/196720A1
[Problem] A purpose of the present invention is to provide a siloxane compound having an amide bond and a (meth)acrylate group. Another purpose of the present invention is to provide a method for producing a siloxane compound that has a ...  
WO/2022/190262A1
This optical film is formed from a cured material of a curable composition including an epoxy (meth)acrylate represented by formula (1). (In the formula, X represents a specific linking group, ring Z1a and ring Z1b are mutually the same ...  
WO/2022/190497A1
A polyphenylene ether which is characterized by comprising a repeating unit that is derived from a phenol of formula (1), a repeating unit that is derived from a phenol of formula (2) and a structural unit that is derived from a phenol o...  
WO/2022/191056A1
The present invention provides a resin composition that can be molded into a film-like shape, and is such that a cured product thereof has high thermostability and adhesiveness and a low dielectric constant and dielectric loss tangent.ã€...  
WO/2022/190755A1
The present invention provides: an unsaturated acrylic resin characterized by having polymerizable unsaturated groups and being the reaction product of a copolymer of a polymerizable compound including a polysiloxane compound (A) having ...  
WO/2022/186209A1
A composition having magnetostrictive properties and comprising: a compound (component (P)) including a polymerizable group; a powdery magnetostrictive material (component (M)); and a radical polymerization initiator (component (R)).  

Matches 51 - 100 out of 16,444