| Document |
Document Title |
|
JP7462709B2 |
An objective of the present invention is to provide an active energy ray curable resin composition which gives a cured film excellent in heat resistance and developability. A reactive carboxylic acid compound (A) is formed by reacting: a...
|
|
JP7461148B2 |
The present invention provides a radically curable composition curable at a low temperature, comprising: (A) a (meth)acrylic group-containing compound having a skeleton comprising an addition reaction product of (a) an Si-H group-contain...
|
|
JP7459394B2 |
The present invention provides: a resin composition which has excellent moldability and a low dielectric loss tangent (Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed wiring board; and a se...
|
|
JP2024042604A |
[Problem] A curable resin composition that has excellent photosensitivity, exhibits a high glass transition temperature, and can form a cured product with excellent adhesion and low dielectric properties; The obtained cured product, insu...
|
|
JP7457669B2 |
A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
|
|
JP2024042605A |
[Problem] To provide a curable resin composition that exhibits a high glass transition temperature and is capable of forming a cured product with excellent adhesion and low dielectric properties, and a cured product or article obtained u...
|
|
JP2024041267A |
The present invention provides a resin composition capable of forming a cured product having a high elastic modulus and Tg and a low coefficient of linear expansion while sufficiently maintaining a low dielectric constant and a low diele...
|
|
JP2024041281A |
[assignment] Provided is a curable composition containing a fluorine-containing surface modifier having a high fluorine concentration and excellent solubility, which enables a homogeneous composition to be obtained even in the absence of...
|
|
JP2024040909A |
[Challenge] A colorant that can achieve a wide color gamut, has high contrast, and has excellent patterning properties. A colored resin composition is provided. [Solution] (A) Colorant, (B) Solvent, (C) Alkali-soluble resin, (D) Photopol...
|
|
JP2024040585A |
[Problem] To provide a curable resin composition for a bonding film that has high adhesive strength to copper foil with a small surface roughness used in high frequency applications, maintains high adhesive strength even after HAST, and ...
|
|
JP7455475B2 |
Provided are a heat-curable maleimide resin composition capable of yielding a cured product with a high glass-transition temperature, excellent dielectric properties and a superior adhesiveness to a metal foil, and being evenly cured wit...
|
|
JP7455027B2 |
To provide a conductive polymer dispersion that can reduce the particle size of a conductive polymer and a method for producing the same, and a method for producing a conductive film using the conductive polymer dispersion.A conductive p...
|
|
JP7453906B2 |
An adhesive composition comprising a core shell vinyl ester and a urethane acrylate, which is suitable to be applied to a rough or uneven surface of a substrate to render a smooth surface. The present adhesive composition is particularly...
|
|
JP7453910B2 |
One of the purposes of the present invention is to provide a resin composition which exhibits excellent coating properties, adhesive properties and moisture permeation resistance and which, when used as a periphery-sealing agent for an o...
|
|
JP2024036910A |
An object of the present invention is to provide a novel active energy ray-curable resin composition that can provide a cured film with excellent antifogging properties and abrasion resistance. [Solution] A (meth)acrylate (A) represented...
|
|
JP2024511739A |
The present invention relates to Type I photoinitiators for free radical curing of radiation curable compositions. In particular, the present invention relates to silicone compositions comprising a Type I photoinitiator and an organopoly...
|
|
JP2024511689A |
The present disclosure relates to curable compositions that include at least first, second, and third polymers. The first polymer includes a first monomer unit and a second monomer unit different from the first monomer unit, the first mo...
|
|
JP7450224B2 |
The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.
|
|
JP2024033212A |
The present invention provides a modified resin with excellent storage stability and a method for producing the same. [Solution] The present invention is a method for producing a carbon dioxide gas-miscible modified resin, which comprise...
|
|
JP2024033039A |
The present invention provides a dielectric composition for a film capacitor that provides a dielectric material with good handling properties, a high dielectric constant, and a low dielectric loss tangent, and a film capacitor using a c...
|
|
JP7447484B2 |
To provide a resin composition having excellent film strength and high elongation and flexibility, and a laminate composed of the resin composition.A resin composition contains a urethane-acryl composite resin (C) in which a urethane uni...
|
|
JP2024032725A |
[Problem] To provide a photosensitive resin composition and a resin layer which do not generate voids at the interface of a Cu layer in contact with a cured photosensitive resin layer after a high temperature storage test, and which prov...
|
|
JP2024031928A |
The present invention provides a negative photosensitive resin composition that provides high mechanical strength and exhibits good adhesion to aluminum, and a method for producing a cured relief pattern using the photosensitive resin co...
|
|
JP7443975B2 |
The present invention provides a resin composition and the like from which a cured product with low dielectric properties and excellent adhesion between copper foils can be obtained. The present invention comprises the resin composition ...
|
|
JP2024028222A |
The present invention provides a photocurable composition that allows curved adherends to be bonded together while following changes in the adherends. [Solution] A sheet-shaped photocurable composition that contains the following compone...
|
|
JP2024027794A |
[Object] To provide a resin composition that provides a cured product with a high glass transition temperature and excellent dielectric properties. [Solution] (A) The following formula (1) (In formula (1), A independently represents a te...
|
|
JP2024509148A |
The present invention relates to a new class of dielectric polymeric materials particularly suitable for the manufacture of electronic devices. Dielectric polymeric materials are formed by reacting bismaleimide compounds and exhibit a ba...
|
|
JP2024508842A |
The present invention provides a class of high RI polysiloxane vinyl crosslinkers. Each polysiloxane vinyl crosslinker of the present invention comprises (1) a polysiloxane segment comprising a dimethylsiloxane unit and an aryl-containin...
|
|
JP2024024785A |
An object of the present invention is to provide an organic EL device coating composition that can be applied directly onto an organic EL device by an inkjet method and can form a protective film that does not affect the organic EL devic...
|
|
JP2024024718A |
The present invention provides a hard coat resin composition and a film that have high pencil hardness and steel wool resistance and can withstand bending with a small radius of curvature whether the cured layer surface faces inward or o...
|
|
JP2024025723A |
[Problem] To provide artificial leather that has a low environmental impact because no organic solvent is used in the manufacturing process, and that does not wrinkle during three-dimensional molding. [Solution] Artificial leather is mad...
|
|
JP2024025722A |
[Problem] To provide artificial leather that has a low environmental impact because no organic solvent is used in the manufacturing process and has an excellent clarity of embossed pattern. [Solution] Artificial leather is made of a nonw...
|
|
JP7438129B2 |
Compounds and compositions are provided which are useful in additive printing, particularly additive printing techniques such as stereolithography (SLA) wherein a macromer is photopolymerized to form a manufactured article. Representativ...
|
|
JP2024024907A |
An object of the present invention is to provide a curable composition that is preferably used for adhesion between articles in automobile manufacturing. [Solution] The cured product obtained by heating at 150°C for 1 hour and then at 2...
|
|
JP2024508230A |
An object of the present invention is to provide a masking material that has excellent shape retention, excellent flexibility in coating shape, can be quickly formed into a film, or is highly economical. Further, the present invention pr...
|
|
JP7434708B2 |
To provide an active energy ray-curable resin composition capable of forming a coated film which is excellent in storage stability of a coating liquid, and is excellent in antifouling performance (contamination resistance and its persist...
|
|
JP7435914B2 |
The present invention provides an active energy ray-curable anti-fogging composition capable of forming a cured coating film which exhibits excellent anti-fogging properties and persistence thereof, exhibits anti-fogging properties after...
|
|
JP7431398B1 |
[Problem] To create a resin layer that has excellent light transmittance in the visible light range (wavelength 380 nm to 780 nm), light blocking property in the near infrared range (wavelength 800 nm to 2,500 nm), and excellent surface ...
|
|
JP7431292B2 |
An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure ofwherein X is —O—,and each R1 is independently CH3, CH2F, CHF2, or CF3. A comp...
|
|
JP2024020256A |
The present invention provides a composition and a laminate containing the same, which provide a cured product having excellent low dielectric properties and high adhesion to metal foil. [Solution] A laminate including a resin layer cont...
|
|
JP2024504654A |
The present invention relates to silicone urethane (meth)acrylates having especially at least 3 (meth)acrylate groups and no more urethane groups than (meth)acrylate groups, a process for preparing said silicone urethane (meth)acrylates,...
|
|
JP2024014872A |
[Problem] Used as a material for forming the adhesive layer of an adhesive sheet, it has sufficient adhesive strength to an adherend, and allows the adherend to which the adhesive sheet is attached to be brought to a high temperature sta...
|
|
JP2024014715A |
The present invention provides a broadly curable bioink for digital photoprocessing (DLP) that can be printed with a hydrogel that is extremely strong, stretchable, has excellent electrical conductivity, and biocompatibility, and a metho...
|
|
JP7424233B2 |
The purpose of the present invention is to provide urethane (meth)acrylate which provides a cured product with low moisture permeability and an active energy ray-curable resin composition. The present invention comprises: a hydride (a1) ...
|
|
JP7421976B2 |
To provide a pellicle having high adhesion with a substrate and excellent load resistance and to provide a method for producing the same.There is provided a pellicle having a pellicle frame, a pellicle film stretched on one end face of t...
|
|
JP2024503200A |
The method of preparing the film includes applying the composition onto a substrate to obtain an uncured layer. The method further includes irradiating the uncured layer to obtain a film. The composition includes (a) a polysiloxane resin...
|
|
JP2024011747A |
[Problem] According to the present invention, it is possible to provide a urethane resin used for a material that has excellent substrate adhesion, coating film physical properties (scratch resistance), and high refractive index. The ure...
|
|
JP2024009606A |
The present invention provides an alkali-soluble resin composition capable of providing a cured product with a high refractive index, and a cured product thereof. An alkali-soluble resin composition comprising an alkali-soluble resin hav...
|
|
JP7418644B2 |
Provided are a maleimide compound, a curable resin composition and a cured product thereof that have high heat resistance, excellent low dielectric properties and good curability, and an amine compound and a reaction product of an amine ...
|
|
JP2024008082A |
[Problem] A urethane (meth)acrylate resin capable of forming a cured coating film with high hardness and excellent scratch resistance, flexibility, and curl resistance, an active energy ray-curable composition containing the same, a cure...
|
