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JP2023113483A |
To provide a photosensitive resin composition that has improved resolution, can suppress the occurrence of connection failure in via holes with a reduced diameter, and can form an insulating layer with reduced surface roughness.A photose...
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JP7327698B2 |
Provided are: a resin composition which, before moisture absorption (initial state) and after moisture absorption, is low in both permittivity and dielectric loss tangent and which is high in metal-foil peel strength; and a cured object,...
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JP7326633B2 |
The present invention provides a multi-phase structured UV-curable powder coating resin and a preparation method thereof, comprising (1) obtaining an emulsion of a liquid UV resin by heating the liquid UV resin and an emulsifier, dispers...
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JP7325831B2 |
Disclosed herein is a novel polymer having a structure based on a biodegradable polymer. In the novel polymer, the biodegradable polymer has at least one kind of functional groups from among a hydroxyl group and a carboxyl group, wherein...
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JP7325375B2 |
The present invention is a thermosetting silicone composition including: (A) an organopolysiloxane having average formula (1) of (SiO2)a1(R1 3SiO1/2)b1(X1O1/2)c1 (1) (50-99.9% of R1 is a methyl group, 0.1-50% of R1 is an alkenyl group, a...
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JP7324770B2 |
A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is di...
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JP7324568B2 |
To provide a (meth) acrylate that allows inorganic fine particles to be uniformly dispersed, and has excellent physical properties such as post-curing transparency.The problem is solved by using (meth) acrylate having a structure represe...
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JP7321444B2 |
To provide an ultraviolet curing-type coating material composition for coloration that is excellent in ultraviolet curability and produces a cured film having good appearance.The ultraviolet curing-type coating material composition inclu...
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JP2023533470A |
The present invention relates to mixtures of propoxylated 4-toluidines containing two or more different di- or tri-propoxylated or more propoxylated p-toluidines in specific weight ratios. , processes for their preparation and their use ...
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JP7318754B2 |
The present invention provides a method for producing a molded body, having the step 1 of applying a composition containing an alicyclic urethane (meth)acrylate to a thermoplastic resin substrate to obtain a coated material, the step 2 o...
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JP2023104928A |
To provide a copolymer having excellent solvent solubility and low dielectric loss tangent.This copolymer includes: an aromatic vinyl monomer unit; a crosslinkable group-containing monomer unit; and a monomer unit which gives a homopolym...
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JP7314630B2 |
To provide an active energy ray curable resin composition excellent in adhesiveness to a substrate, elongation and strength during curing, further having no surface tack feeling, excellent in chemical resistance, excellent in processabil...
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JP2023532026A |
The present invention relates to a shape-memory polymer that can restore its original shape after being deformed by body temperature. When using the shape memory polymer of the present invention and the mechanism for wrapping the outer w...
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JP7314015B2 |
To provide a novel fluorene derivative having a high refractive index, a method for producing the same, and a use thereof.The fluorene derivative is represented by formula (1) (where Zand Zeach independently represent a polycyclic arene ...
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JP2023102689A |
To provide a liquid composition for a fiber-reinforced plastic intermediate substrate capable of manufacturing an intermediate substrate excellent in accuracy of basis weight by suppressing exudation, and capable of imparting excellent F...
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JP2023101941A |
To provide an intermediate substrate that can secure gas barrier properties by FRP alone, and demonstrates excellent mechanical properties as a fiber-reinforced composite.An intermediate substrate comprises a curable liquid composition c...
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JP2023531158A |
The present invention relates to water-soluble crosslinkable prepolymers for the preparation of chemically stable crosslinkable polymer gels, processes for their preparation, compositions containing them and their use as medical or denta...
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JP7310480B2 |
To provide a resin film having mechanical characteristics such as flexibility and restorability, solvent resistance and heat resistance that withstand metal paste printing, and adhesion of a circuit pattern formed of a metal paste.A resi...
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JP2023100639A |
To provide a stepped substrate coating composition which forms a coating film on a substrate, the coating film being highly filling patterns, being able to form a coating film by photo-curing, having a flattening property, and acquiring ...
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JP2023099304A |
To provide a positive type photosensitive resin composition, and a cured film produced from the same.There are provided a positive type photosensitive resin composition, and a cured film produced from the same. The positive type photosen...
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JP7306451B2 |
A composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, each of which uses the above-descri...
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JP2023529349A |
The capped poly(arylene ether) copolymer contains reactive end groups, wherein the capped poly(arylene ether) copolymer is derived from an alkyl aryl-phenol.
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JP2023097189A |
To provide an active energy ray-curable composition that can give a coating film having excellent viscosity stability at low viscosity and also having excellent flexibility, and a coating agent and a coating film each including the same....
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JP7303891B2 |
Provided is a composition which is for forming an underlayer film, and includes a polymer compound A having a polymerizable functional group, a polymer compound B having a polymerizable functional group, and a solvent, wherein: the polym...
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JP2023094531A |
To provide modified polyolefin imparting excellent mechanical strength to a thermoplastic resin, especially, a polyolefin resin.Modified polyolefin (X) has such a structure that a (meth)acrylic acid (ester) (B) is added to a molecular te...
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JP2023093999A |
To provide a curable resin composition which can form a cured product having excellent heat resistance and dielectric characteristics, a cured product of the curable resin composition, and an article having a coating film comprising the ...
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JP2023093924A |
To provide a photocrosslinkable liquid crystal polymer which is a raw material of a thermo-responsive liquid crystal polymer having a large shrinkage force.Provided are: a photocrosslinkable liquid crystal polymer which is a reaction pro...
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JP7301831B2 |
Provided are an alicyclic diol represented by formula (1), a method for producing the same, and the like.
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JP2023527381A |
Provided are photocurable resins comprising poly(siloxane)-based copolymers along with photoinitiators and other optional ingredients such as photocurable diluents, light absorbers, photosensitizers, or hydrophilic additives. be. Methods...
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JP7298112B2 |
To provide a resin molding used as a film member and a transparent base material, and has high heat resistance while maintaining flexibility.A resin molding has a photocurable composition at least containing: two or more different uretha...
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JP7298476B2 |
The present invention provides a modified block copolymer composition comprising a modified block copolymer containing at least one aromatic vinyl polymer block and at least one conjugated diene polymer block, and having at least one mod...
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JP7297338B2 |
The curable resin composition according to the present invention, which has high storage stability, excellent curability and good washing properties, comprises a curable resin (A), a latent curing agent (B) and an isocyanate compound (C)...
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JP2023087852A |
To provide a curable resin that is superior in heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties) and the resin composition, and a cured product thereof.A curable resin comprises a ...
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JP7296748B2 |
To improve heat resistance and light fastness, to ensure a low coefficient of linear expansion and to achieve high hardness of a cured product of a resin composition for a wafer-level optical semiconductor device, and to further improve ...
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JP7295854B2 |
The present invention generally relates to the field of radiation curable compositions comprising (meth)acrylated acrylic polymers comprising pendant hydroxyl groups, methods for making these radiation curable compositions and their uses...
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JP7293621B2 |
To provide a composition capable of forming a wiring interlayer insulating layer excellent in insulation reliability.A curable composition according to one aspect of the present invention contains a maleimide compound, a nadiimide compou...
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JP2023525674A |
The present disclosure provides a polymerizable compound of formula [1] (wherein G is the residue of a hydrophobic hydroxy-functional oligomer, n is 1-10, each R1independently, C6~C20is the residue of an aliphatic, cycloaliphatic, or aro...
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JP2023083652A |
To provide a sealant for a liquid crystal dropping technique which has an excellent adhesion before and after a PCT test, and a liquid crystal display cell sealed with a cured material.The sealant for liquid crystal dropping technique in...
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JP7291590B2 |
Provided is a silicone rubber composition that allows for both the securing of time for filling materials and an improvement in productivity which is achievable due to a short curing time, and that has excellent reproducibility of curing...
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JP2023082855A |
To provide a photosensitive resin composition which reduces transmittance change due to light irradiation from a light-emitting element, is excellent in light resistance, and is usable for protection of the light-emitting element.A photo...
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JP2023082852A |
To provide a photosensitive resin composition which is transparent to a light emitting wavelength of a light emitting element represented by a light emitting diode, and has improved light resistance.A photosensitive resin composition con...
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JP7290150B2 |
Provided are: a photosensitive resin composition comprising an acid group-containing (meth)acrylate resin (A) and a photopolymerization initiator (B), characterized in that the photopolymerization initiator (B) is a product of a Michael ...
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JP2023079227A |
To provide a resin composition which gives a film excellent in film thickness uniformity when forming a thick film, and excellent in adhesion to a substrate after development.A resin composition includes: (A) 100 pts.mass of a resin whic...
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JP7288233B2 |
Provided is a polymerizable compound that can be used in the formation of ultra-fine wiring patterns, due to having superior optical characteristics, etching tolerance, curability, solvent solubility, and similar, as well as superior inf...
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JP2023075383A |
To provide a copper-clad laminate obtained by curing a copper foil with resin having a resin layer formed of a resin composition excellent in coatability, and a resin layer formed of a resin composition belonging to the copper foil with ...
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JP7281161B2 |
To provide a resin composition capable of forming a decorative film having not only excellent curability with active energy rays and a surface excellent in surface hardness, scratch resistance and chemical resistance but also high temper...
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JP7279802B2 |
This paste-like resin composition contains: (A) a (meth)acryloyl group-containing compound that is bifunctional or higher and has two or more linear or branched oxyalkylene group repeating units; and (B) metal-containing particles that i...
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JP7276652B2 |
[Problem] The purpose of the present invention is to provide a coating composition in which oxygen inhibition at the surface of a coating can be reduced for a photoradical composition that uses a radical photopolymerization initiator whi...
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JP7275748B2 |
To provide an active energy ray-curable resin composition which hardly causes curling due to a small curing shrinkage when forming a cured coating film, has high hardness, can obtain an effect excellent in flexibility and has good storag...
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JP7275898B2 |
To provide an acid group-containing (meth)acrylate resin excellent in alkali developability and high photo sensitivity, of which cured product has excellent elasticity and adhesion to a substrate, a curable resin composition containing t...
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