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JP7231114B2 |
The present invention provides a curable resin composition containing a resin (A) having an acid group and a polymerizable unsaturated group and a compound (B) containing a compound (b1) having a heteroatom having an unshared electron pa...
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JP7230480B2 |
To provide a photosensitive coloring composition for color filters, which does not cause wrinkles on a coating film surface and offers superior chemical resistance and peel developability, and to provide color filters produced using the ...
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JP7229422B2 |
An object is to provide a cured product and the like with excellent fire retardancy, heat resistance, and dielectric properties by using a curable resin having a specific structure and a curable resin composition containing the curable r...
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JP7228093B2 |
To provide an acid group-containing (meth)acrylate resin giving a cured product excellent in heat resistance and elongation, a curable resin composition containing the same, and an insulating material, a resin material for a solder resis...
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JP7226324B2 |
This resin film is characterized by comprising a segment represented by chemical formula 1 and a segment represented by chemical formula 2, and by satisfying condition 1. Condition 1: In an FT-IR spectrum of the resin film, a minimum val...
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JP2023025070A |
To provide a negative photosensitive resin composition and a method for forming a cured relief pattern using the same with which a high chemical resistance and resolution can be obtained and in which the occurrence of voids in the interf...
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JP2023506819A |
The present invention a polyester polyol; a compound comprising at least one functional group capable of reacting with a hydroxyl group of a polyester polyol and at least one other functional group selected from acrylate or methacrylate ...
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JP2023023223A |
To provide a curable composition that makes it possible to produce a membrane with a low dielectric constant and good curability.The curable composition contains: a component (A) that is a compound having a group represented by the follo...
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JP2023023334A |
To provide a composition to be a cured object which has flexibility, has high adhesiveness to low-roughness copper foil, is low in permittivity and dielectric dissipation factor, and has a high glass transition temperature.A resin compos...
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JP7221383B2 |
Provided is an ultraviolet curable urethane (meth) acrylate resin from which a cured coating film having excellent transparency, extensibility, water repellency, and chemical resistance can be formed. The ultraviolet curable urethane (...
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JP2023019618A |
To provide a liquid composition excellent in properties of impregnating into fiber materials, and to provide an intermediate material excellent in mechanical properties when used as a composite material.A liquid composition for a fiber-r...
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JP7219698B2 |
The present invention is a hydrophilic silicone particle containing a surfactant fixed by a chemical bond formed by radical polymerization to a surface of a silicone particle having a volume average particle size of 0.1 to 100 µm and a ...
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JP7215105B2 |
To provide an acid group-containing (meth)acrylate resin giving a cured product excellent in heat resistance, a curable resin composition containing the same, and an insulating material, a resin material for a solder resist, and a resist...
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JP7215061B2 |
To provide a block copolymer capable of enhancing an effect for adding detachability or the like to a surface, and containing an organopolysiloxane structure, a surface control agent, an adhesive sheet, an adhesive protective sheet, a la...
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JP2023014481A |
To provide granular hydrophilic resin particles for agriculture which can be widely used as a soil water retention material for agriculture having both a water retention effect and strength.Hydrophilic resin particles having an average p...
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JP7213042B2 |
The present invention provides a urethane (meth)acrylate which has a low viscosity and is capable of imparting a cured product thereof with high hardness and heat resistance. The present invention also provides: an active energy ray-cura...
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JP7212301B2 |
To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multila...
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JP2023011147A |
To provide a thermosetting maleimide resin composition which is formed into a cured product that has excellent dielectric characteristics and prevents ion migration.A thermosetting maleimide resin composition contains (A) a maleimide com...
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JP2023009771A |
To provide a polymerizable composition having less shrinkage during curing.There is provided a compound having a group represented by the following general formula (I). In the formula, R1 and R2 represent a hydrogen atom or a methyl grou...
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JP7209886B1 |
Kind Code: A1 A vinyl group-containing prepolymer having excellent dielectric properties is provided. A vinyl group-containing prepolymer according to an embodiment is derived from a first portion derived from a hydrogenated product of a...
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JP7207281B2 |
To provide an ultraviolet-curable silicone composition that is quickly cured at room temperature by ultraviolet irradiation to give a cured product that has sufficient strength and resists being swollen with an organic solvent.A composit...
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JP7207963B2 |
The present invention provides chemical mechanical (CMP) polishing pads for polishing a substrate chosen from a semiconductor substrate comprising the CMP polishing pad and having one or more endpoint detection windows which is the cured...
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JP7205538B2 |
Provided is a novel resin composition having excellent heat resistance, and which is suitable for use as a material for insulating films in electronic components and the like. The resin composition contains: a compound (a) represented by...
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JP7204154B2 |
The invention relates to a bifunctional modified biopolymer based polymer, comprising at least one polymer chain comprising n first functional groups and m second functional groups. The first functional groups comprise groups able of bei...
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JP7203848B2 |
The present invention provides a resin composition for resists that is for obtaining a resist which has the characteristics conventionally required of a resist and which also does not generate warping. This resin composition for resists ...
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JP7203386B2 |
One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond,...
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JP7202920B2 |
An object of the present invention is to provide a resin composition containing polyphenylene ether, which is excellent in electrical characteristics, and also provides an electronic circuit board material, a resin film, a prepreg and a ...
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JP7200562B2 |
To provide a laminate that is flexible and yet has an excellent post-processing property.Provided is a laminate having a flexible resin layer between two release films having a release layer on at least one surface of a supporting substr...
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JP7199510B2 |
Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit includi...
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JP2023000195A |
To provide an active energy ray-curable resin composition having excellent workability and curability and capable of providing a coating film having an excellent self-repairing property.Used is an active energy ray-curable resin composit...
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JP2022192012A |
To provide a photosensitive composition having excellent developability and capable of forming a cured film having excellent adhesion, heat cycle resistance, and solvent resistance.Provided is a photosensitive composition comprising a ne...
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JP7196587B2 |
To provide an acid group-containing (meth)acrylate resin giving a cured product excellent in heat resistance and elongation, a curable resin composition containing the same, and an insulating material, a resin material for a solder resis...
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JP2022190545A |
To provide an antimicrobial/antiviral agent composition which has excellent stability and can form a cured film excellent in an antimicrobial/antiviral property, antimicrobial/antiviral immediate effectivity, and transparency.An antimicr...
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JP7192319B2 |
To provide a (meth) acrylate resin that can give a cured film excellent in all of hardness, solvent resistance, adhesion, and flexibility, and a curable resin composition containing the resin and a cured product of the composition.A (met...
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JP7192521B2 |
To provide an acid group-containing (meth)acrylate resin which has excellent alkali developability and high photo sensitivity and excellent elasticity and heat resistance in a cured product, a curable resin composition containing the sam...
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JP7192520B2 |
To provide an epoxy (meth)acrylate resin which has low viscosity and excellent curability and excellent elasticity in a cured product, a curable resin composition containing the same, a cured product of the curable resin composition, and...
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JP7192796B2 |
An embodiment of the present invention relates to a curable resin composition, a layered body, an optical filter, and a compound, the curable resin composition containing at least one type of compound (A) selected from compounds represen...
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JP2022187901A |
To provide a composition of a polymer which exhibits a high phase difference even under a low heating temperature.A resin composition is provided, containing: 80-99.99 wt.% of unsaturated polyester composed of a bisphenol residue having ...
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JP7190461B2 |
To provide a silicone which can give a copolymer including polymerizable groups at both ends, including an amphiphilic side chain, and having high surface wettability.The present invention relates to a silicone represented by the formula...
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JP2022185863A |
To provide a method for producing a polyimide precursor that allows reduction in the number of steps for purification, and a method for producing a cured product.A method for producing a polyimide precursor includes the steps of: prepari...
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JP2022184569A |
To provide a curable composition, preferably an active energy ray-curable composition excellent in curability with a low viscosity, making the cured film excellent in cohesion force, and specifically, containing a polyfunctional urethane...
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JP7188053B2 |
To provide an acid group-containing (meth)acrylate resin giving a cured product excellent in heat resistance, a curable resin composition containing the same, and an insulating material, a resin material for a solder resist, and a resist...
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JP7186524B2 |
The present invention provides a diffraction optical element which has resistance to sticking under a wet heat condition, and in which a pattern is rarely torn, a manufacturing method therefor, an acrylic resin composition for forming th...
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JP2022182471A |
To provide an active energy ray-curable pressure-sensitive adhesive composition which is excellent in coating property, and is excellent in pressure-sensitive adhesive characteristics before and after irradiation with active energy rays,...
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JP7183761B2 |
To provide an acid group-containing (meth)acrylate resin giving a cured product excellent in heat resistance, elongation, and adhesion to a substrate, a curable resin composition containing the same, and an insulating material, a resin m...
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JP7181281B2 |
One or more embodiments of the present invention relate to a thermoplastic acrylic resin that is a graft copolymer in which a stem polymer is an acrylic resin containing acrylonitrile and another ethylenically unsaturated monomer, and a ...
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JP7180202B2 |
The present invention relates to a curable composition capable of forming a cured film having high hardness and excellent solvent resistance in spite of a film obtained by a curing firing process according to 200°C or less, while improv...
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JP7177748B2 |
To provide a material which enables optical patterning, is excellent in heat resistance that can withstand generation of heat of a solder when a substrate is manufactured and heat of an element used in a substrate, and is excellent in st...
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JP7176574B2 |
The present invention provides a coating agent characterized by containing a silane condensate that has a structure (A) represented by formula (1), a structure (B) represented by formula (3), and one or both of a urethane bond and a urea...
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JP2022548672A |
(a) to produce objects that are suitable for use in additive manufacturing techniques such as bottom-up and top-down stereolithography, (b) that are bioabsorbable, and (c) (preferably at least typical Provided herein according to aspects...
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