Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 151 - 200 out of 16,444

Document Document Title
WO/2022/004746A1
The present invention provides a laminate, a production method for the laminate, a laminate-containing surface protective film for an image display device, an article provided with the laminate, and an image display device provided with ...  
WO/2021/261915A1
The present invention relates to a shape memory polymer that can be restored to an original shape from a deformed shape by means of body temperature in the body. When using the shape memory polymer of the present invention and a device f...  
WO/2021/261429A1
Provided are: a thermosetting resin having a polymerizable group and isoimide structure; a curable resin composition containing a radiation-sensitive polymerization initiator, a cured film formed by curing said curable resin composition,...  
WO/2021/256199A1
A polarizing film comprising: a photoalignment film; and a polarizer adjacent to the photoalignment film, wherein the photoalignment film is formed of a polymer containing a structural unit having a photoreactive group and a structural u...  
WO/2021/256131A1
Provided is a fluorine-containing polymerizable resin capable of forming a low refractive index layer having excellent slipperiness and scratch resistance. Specifically, provided is a fluorine-containing polymerizable resin that is a pro...  
WO/2021/251052A1
The purpose of the present invention is to provide: a cured product that exhibits excellent heat resistance and dielectric properties (low dielectric properties) through use of a curable resin having a specific structure; and a prepreg, ...  
WO/2021/246149A1
A compound comprising a (meth)acryloyloxy group and a linear polyoxyalkylene chain, wherein the polyoxyalkylene chain comprises a unit based on propylene oxide and a unit based on a monomer having, in the molecule, one epoxy group and an...  
WO/2021/246532A1
The present invention relates to: a thick molded body that comprises an addition reaction–type polyimide resin, has no surface defects, such as voids or fissures, and no internal voids, and is at least 5 mm thick; and a production meth...  
WO/2021/246382A1
The present invention addresses the problem of providing: a photosensitive resin composition for sandblasting use, which is less likely to become cloudy and has satisfactory developability; and a photosensitive film. The problem can be s...  
WO/2021/241255A1
Provided is a resin material that exhibits high thermal conductivity while having low relative permittivity and low dielectric loss tangent, and also has high heat resistance. A polyfunctional vinyl resin represented by general formula...  
WO/2021/241087A1
[Problem] To provide a material for forming a hard coat layer that has both excellent abrasion resistance and excellent stretchability, which are usually in a trade-off relationship. [Solution] A curable composition according to the pres...  
WO/2021/235299A1
Provided are: a photosensitive resin composition capable of patterning at exceptional resolution by alkaline development, the photosensitive resin composition yielding a cured product that can be applied to an insulating film, etc., havi...  
WO/2021/230097A1
Provided are: an epoxy acrylate resin or an alkali-soluble resin that can be cured by light or heat; and a photosensitive resin composition capable of patterning through alkaline development. This epoxy acrylate resin is represented by g...  
WO/2021/230005A1
Disclosed is a transparent material not only having excellent anti-fog performance but also showing excellent durability in exposure tests simulating various usage environments. The transparent material includes a transparent substrate a...  
WO/2021/229940A1
The present invention is a thermosetting silicone composition including: (A) an organopolysiloxane having average formula (1) of (SiO2)a1(R1 3SiO1/2)b1(X1O1/2)c1 (1) (50-99.9% of R1 is a methyl group, 0.1-50% of R1 is an alkenyl group, a...  
WO/2021/216389A1
A polyolefin-containing seam tape is described herein. The polyolefin may be at least one of a homopolymer, copolymer, terpolymer, or a polymer blend of polyethylene, polypropylene, or a combination of the two. The seam tape may be used ...  
WO/2021/200532A1
A member comprising: a cured article which is produced by curing a curable compound represented by formula 1 and has crystallinity; and a transesterification catalyst. (In formula 1, L1 represents a polyoxyalkylenecarbonyl group; X1 repr...  
WO/2021/200414A1
Provided is a resin material which has a low permittivity and a low dielectric dissipation factor and nevertheless exhibits high thermal conductivity and high heat resistance. The present invention relates to: a polyfunctional vinyl re...  
WO/2021/201137A1
A resin component in this resin composition has a group represented by general formula (11), (21) or (31) and a urethane bond. (In general formulae, Z1 represents an alkyl group, one or more hydrogen atoms in the alkyl group may be subst...  
WO/2021/200089A1
This ultraviolet-curable silicone adhesive composition comprises: (A) an organopolysiloxane having two specific (meth)acryloyloxy-containing groups in one molecule; (B) an organopolysiloxane resin having a specific (meth)acryloyloxy-cont...  
WO/2021/193280A1
Provided is a compound that includes at least two constituent units derived from a monomer M having a radical-polymerizable group and that has a free radical-polymerizable group A on a terminal thereof, wherein the monomer M includes a m...  
WO/2021/193878A1
This novolac resin has a partial structure represented by -C(CF3)H-. This photosensitive resin composition contains the novolac resin and a photosensitizer. This epoxy resin has a partial structure represented by -C(CF3)H-. This curable ...  
WO/2021/194766A1
The present disclosure relates to acid-blocked alkylaminopyridine catalysts for use in a polyurethane formulation. The polyurethane formulation may include the acid-blocked alkylaminopyridine catalyst, a compound containing an isocyanate...  
WO/2021/187294A1
An aspect of the present invention relates to a paste which comprises a perfluoropolyether (A) having two or more ethylenically unsaturated bonds in the molecule, a polysiloxane (B) having two or more ethylenically unsaturated bonds in t...  
WO/2021/182207A1
Provided is a resin material that can effectively remove smears using de-smear treatment, reduce the dielectric loss tangent of a cured product, and increase the thermal dimensional stability of a cured product. The resin material acco...  
WO/2021/181958A1
Provided is a (meth)acrylate resin which can be used for forming an ultrafine wiring pattern as a result of having a low viscosity and low polarity. Specifically, the present invention is a (meth)acrylate resin obtained by reacting an un...  
WO/2021/177316A1
A purpose of the present invention is to provide a curable resin composition which exhibits excellent visible light curability and adhesiveness, while having excellently low liquid crystal contamination possibility if used in a sealing a...  
WO/2021/172316A1
Provided are a resin composition that exhibits low water absorbency, a cured product, a prepreg, a metal foil-clad laminate board, a resin sheet, and a printed circuit board. The resin composition includes a compound (A) represented by f...  
WO/2021/171943A1
Provided are: a coating composition for producing an interlayer insulation film, which makes it possible to produce a pattern-formed interlayer insulation film having a high Young's modulus and a low relative permittivity with high throu...  
WO/2021/166649A1
The present invention provides: a curable resin composition with which it is possible to provide a molded article or a cured product having improved heat resistance, compatibility, dielectric characteristics, hygrothermal reliability, an...  
WO/2021/166992A1
A curable composition which is used for the formation of an intermediate layer that is present between a substrate and a curable layer, while containing a curable base material having a polymerizable functional group, a polymerization in...  
WO/2021/161800A1
The present invention is characterized by comprising an aqueous solution containing 1.0-2.5 mass% of a polyethylene glycol dimethacrylate and 0.5-2.0 mass% of a thermal polymerization initiator.  
WO/2021/157596A1
A curable composition including a first compound, which has a group represented by general formula (x) and an epoxy group and has a molecular weight of 1,000 or lower. In general formula (x), Rf1 and Rf2 each independently represent a fl...  
WO/2021/157320A1
A polyalkylene glycol mono(meth)acrylate which is represented by formula (1): CH2=CR-COO-(AO)n-H and in which the ratio wb/wf of wb and wf calculated from a chromatogram measured with gel permeation chromatography satisfies formula (2): ...  
WO/2021/157282A1
[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure ...  
WO/2021/153405A1
This paste-like resin composition contains: (A) a (meth)acryloyl group-containing compound that is bifunctional or higher and has two or more linear or branched oxyalkylene group repeating units; and (B) metal-containing particles that i...  
WO/2021/140862A1
A curable composition which comprises (A) an organopolysiloxane represented by formula (1) (wherein R1 represents an alkyl group, R2 represents an alkyl or aryl group, R3 represents a hydrogen atom or methyl group, Me represents a methyl...  
WO/2021/133840A1
Methods of spatially directing the orientation and placement of multiple block copolymer (BCP) domains on isolated regions of a substrate are described. The methods involve epitaxially directing the assembly of BCP domains using spatial ...  
WO/2021/131566A1
Provided is a prepreg containing a urethane (meth)acrylate (A), a polymerization initiator (B), and a reinforcing fiber (C), wherein the polymerization initiator (B) is an alkyl peroxyester compound having a 10-hour half-life temperature...  
WO/2021/132303A1
An ink for hydrogel shaping, the ink including a modified vinyl alcohol polymer (A) including vinyl ester units represented by formula (1), and an initiator (B), the sulfur content in the ink being 0.001-2000 ppm. This ink has low odor d...  
WO/2021/132050A1
Provided is an optical article including, in the following order: a base material; a primer layer obtained by curing a polymerizable composition for forming a primer layer; and a photochromic layer obtained by curing a (meth)acrylate-bas...  
WO/2021/124938A1
Provided is a curable composition with which it is possible to form a flexible and heat-resistant cured article. This curable composition contains a curable compound and a silicate. The silicate is preferably a flaky silicate or a li...  
WO/2021/117763A1
A purpose of the present invention is to provide a sealing agent for display elements, said sealing agent having excellent storage stability and excellent adhesiveness, while being suitable for use in a display element that has a small c...  
WO/2021/112192A1
Provided are a low viscosity resin composition and a resin cured product thereof. A resin composition containing a first monomer and a second monomer, wherein the proportion of the first monomer with respect to the total mass of the fi...  
WO/2021/111757A1
The present invention is a silicone particle that contains a dialkylsiloxane unit represented by general formula (1): R4 2SiO2/2. (In formula (1), the R4 moieties are each independently a monovalent hydrocarbon group having 1-6 carbon at...  
WO/2021/111758A1
The present invention provides hydrophilic silicone particles characterized in that a surfactant is chemically bound by radical polymerization to the surfaces of silicone particles having a volume average particle size of 0.1 to 100 μm,...  
WO/2021/107104A1
Provided is an inkjet printing ink that satisfies, to a high degree and in good balance, the properties required of printing inks for commercial inkjet printers, i.e., excellent environmental safety, high image quality performance, high ...  
WO/2021/100658A1
The compound according to the present invention is represented by formula (1) below. (X and Y within formula (1) each represent a different arbitrary organic group. If a plurality of Xs are present, the Xs may be the same, or may differ ...  
WO/2021/095688A1
An unsaturated polyester resin composition according to the present invention contains an unsaturated polyester, a vinyl ester, a polymerizable monomer, and aluminum hydroxide. The vinyl ester is a reaction product of an epoxy resin and ...  
WO/2021/090730A1
Provided is a resin composition having excellent dielectric properties, high adhesiveness to low-roughness surfaces, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene et...  

Matches 151 - 200 out of 16,444