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WO/2022/045237A1 |
[Problem] A purpose of the present invention is to provide a liquid composition having appropriate viscosity, suitable for use, for example, as a resist composition, and a base material with protrusions having protrusions with few defect...
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WO/2022/038893A1 |
The purpose of the present invention is to provide: a curable resin that has a specific structure; and a cured product and the like, which has excellent flame retardancy, heat resistance (high glass transition temperature), and dielectri...
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WO/2022/035605A1 |
Described herein are modified thermoplastic polyurethanes, methods of reactively extruding the modified thermoplastic polyurethanes, and methods of using the modified thermoplastic polyurethanes. The modified thermoplastic polyurethanes ...
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WO/2022/032817A1 |
A method of preparing antimicrobial 3D-printed material with antimicrobial agents integrated with the 3D-printed material. The 3D-printed material fabricated with the method of the present disclosure includes antimicrobial agent (s) full...
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WO/2022/034752A1 |
Provided are a novel resin having excellent dielectric characteristics, a method for producing the resin, a curable resin composition, and a cured object. The resin has constituent units shown by group (1). R1 moieties each independently...
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WO/2022/026847A1 |
The present disclosure relates generally to signal encoding for flexographic printing plates. One aspect is a flexographic, photopolymer printing plate having transparent layers to allow encoded signal printed or laser ablated thereon to...
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WO/2022/014558A1 |
Provided are a urethane (meth)acrylate composition and an active energy ray-curable composition with which a high hardness and excellent flexibility and weather resistance are obtained in a cured product. Also provided is a cured product...
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WO/2022/009977A1 |
The present invention provides: a resin composition able to give a cured product having a reduced dielectric loss tangent and a sufficiently reduced dielectric loss while maintaining a low relative dielectric constant in a high frequency...
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WO/2022/004436A1 |
A fluorine-containing ether compound represented by formula (1). A1 and A2 represent curable functional groups, r1 and r2 represent integers of 1 or more, Y1 and Y2 represent linking groups that do not have a fluorine atom, Rf1 represent...
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WO/2022/004435A1 |
A fluorine-containing ether compound represented by formula (1). A1 and A2 represent curable functional groups, r1 and r2 represent integers of 1 or more, Y1 and Y2 represent linking groups that do not have a fluorine atom, Rf1 represent...
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WO/2022/004285A1 |
Provided are: a photosensitive resin composition; a cured product thereof; and a wiring structure, an electronic component, a semiconductor device, and a camera module containing the cured product. The photosensitive resin composition is...
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WO/2022/004746A1 |
The present invention provides a laminate, a production method for the laminate, a laminate-containing surface protective film for an image display device, an article provided with the laminate, and an image display device provided with ...
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WO/2021/261915A1 |
The present invention relates to a shape memory polymer that can be restored to an original shape from a deformed shape by means of body temperature in the body. When using the shape memory polymer of the present invention and a device f...
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WO/2021/261429A1 |
Provided are: a thermosetting resin having a polymerizable group and isoimide structure; a curable resin composition containing a radiation-sensitive polymerization initiator, a cured film formed by curing said curable resin composition,...
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WO/2021/256199A1 |
A polarizing film comprising: a photoalignment film; and a polarizer adjacent to the photoalignment film, wherein the photoalignment film is formed of a polymer containing a structural unit having a photoreactive group and a structural u...
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WO/2021/256131A1 |
Provided is a fluorine-containing polymerizable resin capable of forming a low refractive index layer having excellent slipperiness and scratch resistance. Specifically, provided is a fluorine-containing polymerizable resin that is a pro...
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WO/2021/251052A1 |
The purpose of the present invention is to provide: a cured product that exhibits excellent heat resistance and dielectric properties (low dielectric properties) through use of a curable resin having a specific structure; and a prepreg, ...
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WO/2021/246149A1 |
A compound comprising a (meth)acryloyloxy group and a linear polyoxyalkylene chain, wherein the polyoxyalkylene chain comprises a unit based on propylene oxide and a unit based on a monomer having, in the molecule, one epoxy group and an...
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WO/2021/246532A1 |
The present invention relates to: a thick molded body that comprises an addition reaction–type polyimide resin, has no surface defects, such as voids or fissures, and no internal voids, and is at least 5 mm thick; and a production meth...
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WO/2021/246382A1 |
The present invention addresses the problem of providing: a photosensitive resin composition for sandblasting use, which is less likely to become cloudy and has satisfactory developability; and a photosensitive film. The problem can be s...
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WO/2021/241255A1 |
Provided is a resin material that exhibits high thermal conductivity while having low relative permittivity and low dielectric loss tangent, and also has high heat resistance. A polyfunctional vinyl resin represented by general formula...
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WO/2021/241087A1 |
[Problem] To provide a material for forming a hard coat layer that has both excellent abrasion resistance and excellent stretchability, which are usually in a trade-off relationship. [Solution] A curable composition according to the pres...
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WO/2021/235299A1 |
Provided are: a photosensitive resin composition capable of patterning at exceptional resolution by alkaline development, the photosensitive resin composition yielding a cured product that can be applied to an insulating film, etc., havi...
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WO/2021/230097A1 |
Provided are: an epoxy acrylate resin or an alkali-soluble resin that can be cured by light or heat; and a photosensitive resin composition capable of patterning through alkaline development. This epoxy acrylate resin is represented by g...
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WO/2021/230005A1 |
Disclosed is a transparent material not only having excellent anti-fog performance but also showing excellent durability in exposure tests simulating various usage environments. The transparent material includes a transparent substrate a...
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WO/2021/229940A1 |
The present invention is a thermosetting silicone composition including: (A) an organopolysiloxane having average formula (1) of (SiO2)a1(R1 3SiO1/2)b1(X1O1/2)c1 (1) (50-99.9% of R1 is a methyl group, 0.1-50% of R1 is an alkenyl group, a...
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WO/2021/216389A1 |
A polyolefin-containing seam tape is described herein. The polyolefin may be at least one of a homopolymer, copolymer, terpolymer, or a polymer blend of polyethylene, polypropylene, or a combination of the two. The seam tape may be used ...
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WO/2021/200532A1 |
A member comprising: a cured article which is produced by curing a curable compound represented by formula 1 and has crystallinity; and a transesterification catalyst. (In formula 1, L1 represents a polyoxyalkylenecarbonyl group; X1 repr...
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WO/2021/200414A1 |
Provided is a resin material which has a low permittivity and a low dielectric dissipation factor and nevertheless exhibits high thermal conductivity and high heat resistance. The present invention relates to: a polyfunctional vinyl re...
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WO/2021/201137A1 |
A resin component in this resin composition has a group represented by general formula (11), (21) or (31) and a urethane bond. (In general formulae, Z1 represents an alkyl group, one or more hydrogen atoms in the alkyl group may be subst...
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WO/2021/200089A1 |
This ultraviolet-curable silicone adhesive composition comprises: (A) an organopolysiloxane having two specific (meth)acryloyloxy-containing groups in one molecule; (B) an organopolysiloxane resin having a specific (meth)acryloyloxy-cont...
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WO/2021/193280A1 |
Provided is a compound that includes at least two constituent units derived from a monomer M having a radical-polymerizable group and that has a free radical-polymerizable group A on a terminal thereof, wherein the monomer M includes a m...
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WO/2021/193878A1 |
This novolac resin has a partial structure represented by -C(CF3)H-. This photosensitive resin composition contains the novolac resin and a photosensitizer. This epoxy resin has a partial structure represented by -C(CF3)H-. This curable ...
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WO/2021/194766A1 |
The present disclosure relates to acid-blocked alkylaminopyridine catalysts for use in a polyurethane formulation. The polyurethane formulation may include the acid-blocked alkylaminopyridine catalyst, a compound containing an isocyanate...
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WO/2021/187294A1 |
An aspect of the present invention relates to a paste which comprises a perfluoropolyether (A) having two or more ethylenically unsaturated bonds in the molecule, a polysiloxane (B) having two or more ethylenically unsaturated bonds in t...
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WO/2021/182207A1 |
Provided is a resin material that can effectively remove smears using de-smear treatment, reduce the dielectric loss tangent of a cured product, and increase the thermal dimensional stability of a cured product. The resin material acco...
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WO/2021/181958A1 |
Provided is a (meth)acrylate resin which can be used for forming an ultrafine wiring pattern as a result of having a low viscosity and low polarity. Specifically, the present invention is a (meth)acrylate resin obtained by reacting an un...
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WO/2021/177316A1 |
A purpose of the present invention is to provide a curable resin composition which exhibits excellent visible light curability and adhesiveness, while having excellently low liquid crystal contamination possibility if used in a sealing a...
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WO/2021/172316A1 |
Provided are a resin composition that exhibits low water absorbency, a cured product, a prepreg, a metal foil-clad laminate board, a resin sheet, and a printed circuit board. The resin composition includes a compound (A) represented by f...
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WO/2021/171943A1 |
Provided are: a coating composition for producing an interlayer insulation film, which makes it possible to produce a pattern-formed interlayer insulation film having a high Young's modulus and a low relative permittivity with high throu...
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WO/2021/166649A1 |
The present invention provides: a curable resin composition with which it is possible to provide a molded article or a cured product having improved heat resistance, compatibility, dielectric characteristics, hygrothermal reliability, an...
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WO/2021/166992A1 |
A curable composition which is used for the formation of an intermediate layer that is present between a substrate and a curable layer, while containing a curable base material having a polymerizable functional group, a polymerization in...
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WO/2021/161800A1 |
The present invention is characterized by comprising an aqueous solution containing 1.0-2.5 mass% of a polyethylene glycol dimethacrylate and 0.5-2.0 mass% of a thermal polymerization initiator.
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WO/2021/157596A1 |
A curable composition including a first compound, which has a group represented by general formula (x) and an epoxy group and has a molecular weight of 1,000 or lower. In general formula (x), Rf1 and Rf2 each independently represent a fl...
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WO/2021/157320A1 |
A polyalkylene glycol mono(meth)acrylate which is represented by formula (1): CH2=CR-COO-(AO)n-H and in which the ratio wb/wf of wb and wf calculated from a chromatogram measured with gel permeation chromatography satisfies formula (2): ...
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WO/2021/157282A1 |
[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure ...
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WO/2021/153405A1 |
This paste-like resin composition contains: (A) a (meth)acryloyl group-containing compound that is bifunctional or higher and has two or more linear or branched oxyalkylene group repeating units; and (B) metal-containing particles that i...
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WO/2021/140862A1 |
A curable composition which comprises (A) an organopolysiloxane represented by formula (1) (wherein R1 represents an alkyl group, R2 represents an alkyl or aryl group, R3 represents a hydrogen atom or methyl group, Me represents a methyl...
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WO/2021/133840A1 |
Methods of spatially directing the orientation and placement of multiple block copolymer (BCP) domains on isolated regions of a substrate are described. The methods involve epitaxially directing the assembly of BCP domains using spatial ...
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WO/2021/131566A1 |
Provided is a prepreg containing a urethane (meth)acrylate (A), a polymerization initiator (B), and a reinforcing fiber (C), wherein the polymerization initiator (B) is an alkyl peroxyester compound having a 10-hour half-life temperature...
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