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JP2017186265A |
To provide a novel benzoxazine compound capable of providing a cured article excellent in toughness, heat resistance and flame retardancy without combining with other components.There is provided a benzoxazine compound represented by the...
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JP6202197B2 |
A bisphenol resin obtained by reacting (a) a bisphenol compound, (b1) at least one compound selected from a group consisting of aminoalkyl sulfonic acids, aminoalkyl sulfonic acid derivatives, aminonaphthalene sulfonic acid, and aminonap...
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JP2017160303A |
To provide a bisphenol resin powder which makes it possible to obtain excellent cycle characteristics in a lead storage battery.A bisphenol resin powder is obtained by the reaction among (a) a bisphenol compound, (b) at least one selecte...
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JP2017160304A |
To provide a bisphenol resin having excellent storage stability.A bisphenol resin is obtained by the reaction among (a) a bisphenol compound, (b) at least one selected from the group consisting of aminobenzenesulfonic acid and aminobenze...
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JP2017160326A |
To provide a phenolic resin which makes it possible to obtain excellent cycle characteristics in a lead storage battery.A phenolic resin is obtained by the reaction among (a) a phenolic compound, (b) at least one selected from the group ...
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JP6172384B2 |
A bisphenol-based resin obtained by a reaction of (a) a bisphenol-based compound, (b) at least one selected from the group consisting of aminobenzenesulfonic acids and aminobenzenesulfonic acid derivatives, and (c) at least one selected ...
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JP6153234B2 |
Disclosed herein are monofunctional benzoxazine compounds having at least one electron-withdrawing group. The monofunctional benzoxazine compounds may be combined with one or more multifunctional benzoxazine compounds to form a unique be...
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JP6150213B2 |
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JP6146110B2 |
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JP6137486B2 |
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JP6114989B2 |
A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin...
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JP6109750B2 |
The invention relates to an underlayer coating composition comprising a polymer, where the polymer comprises at least one hydroxyaromatic unit in the backbone of the polymer phenol which has a pendant group comprising a fluoro or iodo mo...
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JP6094947B2 |
There are provided a novel resin having a fluorene structure which has a relatively high carbon concentration in the resin, which has a relatively high heat resistance and also a relatively high solvent solubility, and which can be appli...
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JP2017506682A |
The present disclosure provides a hybrid benzoxazine resin and produces such a resin by reacting an aldehyde compound and an organic primary monoamine with a polyfunctional phenol monomer and a monofunctional phenol monomer in the presen...
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JPWO2014123051A1 |
Provided are an allyl ether resin suitable for electrical and electronic materials and raw materials thereof, which can be obtained at low cost with low halogen, and an epoxy resin using the same. The allyl ether resin is represented by ...
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JP6065215B2 |
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JP6011745B2 |
A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectri...
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JP2016180115A |
To provide a novel liquid resin intended for being a constitutional component of a sizing composition for mineral fiber.The invention relates to a liquid resin intended for being a constitutional component of a sizing composition for min...
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JP5950127B2 |
To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excelle...
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JP5938037B2 |
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JP5931089B2 |
A curable polymer composition containing: (A) a thermoset benzoxazine resin precursor component; (B) optionally, an aryl sulphone-containing benzoxazine component, and (C) a polyarylsulphone thermoplastic toughening agent, wherein in the...
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JP2016079188A |
To provide a solid adsorbent being excellent in heat resistance, specific surface, and carbonic acid gas absorption performance, inexpensively and conveniently.A basic porous resin material is obtained by heating a phenolic resin compoun...
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JP2016074871A |
To provide a bismaleimide resin composition which can be cured at a low temperature and can obtain a cured product excellent in heat resistance.There is provided a bismaleimide resin composition which comprises a bismaleimide compound as...
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JP5899497B2 |
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JP5892404B1 |
Provided are a curable resin composition having excellent fluidity, heat resistance in a cured product, moisture resistance and solder resistance, flame retardancy, and various physical properties of dielectric properties. The resin (A) ...
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JP2016028156A |
To provide a liquid resin composition that exhibits a low viscosity and exceptional stability over an extended period of time.The present invention provides a liquid resin composition including a liquid monobenzoxazine monomer of formula...
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JP5861927B2 |
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JP5848638B2 |
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JP5835528B1 |
Polyarylene ether resin and its manufacturing method, which are excellent in heat resistance, heat decomposition resistance, moisture and solder resistance, flame retardancy and dielectric properties of cured products, curable resin mate...
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JP5813112B2 |
A process for preparing benzoxazine-thiol polymer film is described comprising forming a rolling bank of a curable composition comprising a polybenzoxazine and a polythiol, wherein the rolling bank contacts first and second carrier subst...
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JP2015183171A |
To provide a phenolic resin which makes it possible to obtain excellent cycle characteristics in a lead storage battery.A phenolic resin is obtained by a reaction between (a) a phenolic compound, (b) at least one selected from the group ...
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JP5788835B2 |
The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:
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JP2015174872A |
To provide a bisphenol resin which makes it possible to obtain excellent cycle characteristics in a lead storage battery.A bisphenol resin is obtained by a reaction between (a) bisphenol F or bisphenol AF, (b) at least one selected from ...
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JP2015137331A |
To provide a bisphenolic resin which can provide an excellent cycle characteristic of a lead storage battery.A bisphenolic resin is obtained by reacting (a) a bisphenolic compound, (b) a compound represented by the general formula (I) in...
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JP2015137330A |
To provide a bisphenolic resin which can provide an excellent cycle characteristic of a lead storage battery.A bisphenolic resin is obtained by reacting (a) a bisphenolic compound, (b) at least one selected from the group consisting of a...
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JP5754662B2 |
A self-extinguishing epoxy resin for an epoxy molding compound (EMC) represented by Formula 1 is disclosed. The epoxy resin (composition) has excellent flame retardancy without using a halogen flame retardant or a phosphorous flame retar...
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JP2015101668A |
To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, a semiconductor sealing material formed using the semiconductor sealing resin composition, and an exce...
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JP2015101669A |
To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance and adhesion, and an excellently reliable semiconductor device in which elements are sealed with the co...
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JP2015101654A |
To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, a semiconductor sealing material formed using the semiconductor sealing resin composition, and a semic...
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JP2015101655A |
To provide a method of producing a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, and a method of producing a semiconductor sealing material.The method of produci...
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JP2015101667A |
To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, a semiconductor sealing material formed using the semiconductor sealing resin composition, and an exce...
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JP5721519B2 |
To provide a phenolic polymer having flame retardancy and softening point in the same level as in conventional phenol aralkyl resins; and to provide a composition thereof and a method for producing the same.The phenolic polymer is obtain...
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JP5698000B2 |
The invention provides a benzoxazine resin composition having excellent resistance to heat and moisture and providing excellent handleability when made into prepreg, and prepreg and a fiber-reinforced composite material prepared from the...
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JP5693618B2 |
Polynuclear phenolic compounds (Q) with up to 20 benzene nuclei per molecule obtained by the reaction of tetrahydrobenzoxazine compound (I) with one or more phenol compound (II) or one or more another tetrahydrobenzoxazine are used as st...
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JP2015048429A |
To provide a benzoxazine resin composition having a viscosity of 0.5 Pa s or less at 100°C and good workability.A benzoxazine resin composition is characterized by compounding a naphthoxazine compound like, for example, 2-phenyl-2,3 dih...
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JP2015507064A |
Provided is a method of making polymer particles in gel form by an emulsion and / or suspension process. The method may include preparing a reactant mixture comprising a carrier fluid and a monoma component containing one or more phenoli...
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JP5675832B2 |
A method for the production of a mechanically stabilized polyazole polymer membrane or film having the following steps: a) providing a membrane or film containing i.) a polyazole with at least one amino group in a repeating unit except t...
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JPWO2012165206A1 |
Resin compositions for encapsulating electrical and electronic components, which are less likely to gel even if they stay at high temperatures, have excellent initial adhesion strength to aluminum materials, and have excellent durability...
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JP5658457B2 |
The present invention relates to a catalyst, which is an organic component with electron withdrawing substituents and to compositions with such catalyst and at least one benzoxazine component, and the use of such compositions in adhesive...
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JP5657971B2 |
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