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Matches 401 - 450 out of 1,755

Document Document Title
JP2015101655A
To provide a method of producing a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, and a method of producing a semiconductor sealing material.The method of produci...  
JP2015101725A
To provide versatile substantially formaldehyde free binder compositions comprising a material which can be used in an alkaline environment and provides robust mechanical properties when cured.A substantially formaldehyde free thermosett...  
JP2015101667A
To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, a semiconductor sealing material formed using the semiconductor sealing resin composition, and an exce...  
JP2015098533A
To provide a prepreg capable of obtaining a fiber-reinforced composite material which can simultaneously achieve interlaminar fracture toughness, CAI and flexural modulus at high dimension and maintain the glass transition temperature of...  
JP2015515511A
The present invention is general formula (I) (inside of a formula, R).1は水素 or *CH3Come out, and it is and is R.2は *CH2It is OH and R.3At least one phenol of being は水素 or *CH3 (hydroxymethyl), At least one polyamine and the ...  
JP5721519B2  
JPWO2013115097A
[Subject] A resist lower layer film formation constituent for forming a resist lower layer film which has dry etching tolerance and heat resistance is provided. [Means for Solution] Following formula (1) : [Formula 1]The resist lower lay...  
JPWO2013115097A1
【課題】 ドライエッチング耐性、耐熱性を兼ね備えた レジスト下層膜を形成するためのレジスト下 層膜形成組成物を提供する。【解決手段】 下記式(1):【化1】で表さ...  
JP2015512459A
The monofunctional benzoxazine compound which has at least one electron attracting group is indicated by this specification. This monofunctional benzoxazine compound can form a peculiar benzoxazine blend in combination with one or more s...  
JP2015074717A
To provide a phenolic resin and an epoxy resin, and production methods of these resins which have excellent fluidity and exhibit, in a cured product thereof, high flame retardancy, high adhesiveness to a substrate, and a low coefficient ...  
JP5698000B2  
JP5693618B2  
JPWO2013047106A1
樹脂中の炭素濃度が比較的に高く、耐熱性が 比較的に高く、溶媒溶解性も比較的に高く湿 式プロセスが適用可能な、新規なフルオレン 構造を有する樹脂及びその製造方法、並...  
JPWO2013047106A
Carbon concentration in resin is high in comparison, its heat resistance is high in comparison, and solvent solubility can also apply a wet process highly in comparison, In order to form resin which has a new full オレン structure, a ...  
JP2015048429A
To provide a benzoxazine resin composition having a viscosity of 0.5 Pa s or less at 100°C and good workability.A benzoxazine resin composition is characterized by compounding a naphthoxazine compound like, for example, 2-phenyl-2,3 dih...  
JPWO2013021869A1
誘電率及び誘電正接が低く、且つ、優れた難 燃性及び耐熱性を有する硬化物を実現可能で あり、しかも比較的に低粘度で優れた溶剤溶 解性を有し取扱性にも優れる、新規なシ...  
JP2015507064A
The method of producing the polymer particles of a gel form according to emulsion and/or a サスペンジョン process is provided. This method can contain the step which prepares the reaction thing mixture containing the monomer ingre...  
JPWO2013021869A
Provide a new cyanate ester compound with which a dielectric constant and a dielectric dissipation factor are low, and have the solvent solubility which could realize a hardened material which has outstanding fire retardancy and heat res...  
JP5675832B2  
JPWO2012173129A
The technique of the ability to manufacture advantageously novolac type phenol resin which denatured with a method of manufacturing stably easy urea denaturation novolac type phenol resin which has hypoviscosity and a lot of urea of hand...  
JPWO2012165206A
Even if there is stay under high temperature, there is little gelling concern and it provides a resin composition for electric sealed electronic parts which is excellent in initial adhesion intensity to aluminum material, and moreover ex...  
JPWO2012173129A1
取り扱いの容易な、低粘度を有する尿素変性 ノボラック型フェノール樹脂を、安定的に製 造することの出来る方法、及び多量の尿素に て変性されたノボラック型フェノール樹...  
JPWO2012165206A1
高温下での滞留があってもゲル化懸念が少な く、なおかつ、アルミニウム材への初期密着 強度に優れ、冷熱サイクル負荷等の環境負荷 に対する耐久性に優れる電気電子部品封...  
JP2015025121A
To provide a resin composition for semiconductor encapsulation, from which a semiconductor encapsulating material excellent in heat resistance can be formed, and to provide a semiconductor device having excellent reliability, manufacture...  
JP5658457B2  
JP5657971B2  
JP2015000969A
To provide a resin containing no diaryl methane which causes performance deterioration such as mechanical strength or thermal decomposition resistance.There is provided an aromatic hydrocarbon formaldehyde resin which is obtained by reac...  
JP5635258B2  
JP2014214254A
To provide a resin composition for impregnation capable of obtaining a cured product which can be uniformly impregnated (prevent migration) in a thickness direction of a fiber substrate, and has excellent durability, and to provide a fri...  
JP2014529348A
The present invention provides the self-fire-extinguishing epoxy resin for epoxy molding compounds (EMC) of a chemical formula (1). Even if the epoxy resin (constituent) of the present invention did not use a halogen series flame retarda...  
JP5615374B2  
JP2014528025A
A new type of oligomer and polymer which are guided from a reaction with a mixture of thiol compounds and an amine compound of a benzoxazine compound are indicated. In other uses of coating, sealant, adhesives, and a large number, this c...  
JP2014525973A
[Subject] The water-borne-adhesive constituent which constitutes the useful substitute to use of formaldehyde system RFL adhesives is provided. [Means for Solution] The present invention is one A at least. Phenol / aldehyde resin, B of a...  
JP5598489B2  
JP5595972B2  
JP2014172923A
To provide an epoxy resin excellent in fire resistance and metal substrate adhesiveness, a curable resin composition using the same, its cured body and a sealing material.There is provided an epoxy resin having a skeleton which a cyclohe...  
JP5585985B2  
JP2014162915A
To provide a thermosetting benzoxazine resin composition capable of shortening a curing time of benzoxazine.There is provided a thermosetting resin composition obtained by adding an aromatic thiol compound or a mercapto group-containing ...  
JP5581576B2  
JP5580712B2  
JP2014152262A
To provide a method for curing a thermosetting resin composition which can improve the curing speed in a resin composition containing a benzoxazine compound, a thermosetting resin composition, a prepreg using the same, a metal-clad lamin...  
JP2014141426A
To provide a thermosetting resin composition that includes a benzoxazine compound as a base and has a high hardening rate, and a hardening method therefor.In this invention, upon hardening a specific benzoxazine compound, a benzoxazine c...  
JP5552075B2  
JP5515583B2  
JP5516980B2  
JPWO2012090408A1
半導体用のコーティング剤やレジスト用樹脂 として使用できる炭素濃度が高く、酸素濃度 が低い芳香族炭化水素樹脂を提供すること、 及び多層レジストプロセス用下層膜とし...  
JPWO2012090408A
Aromatic hydrocarbon resin with high carbon concentration which can be used as the coating agent and resin for resist for semiconductors, and low oxygen concentration is provided, And it aims at providing the pattern formation method usi...  
JP5514719B2  
JP2014513312A
The present invention includes the unit which is related with the lower layer coating constituent containing polymer, and contains at least one hydroxy aromatic series which has a pendant machine with which polymer has フルオロ or an...  
JP5498200B2  

Matches 401 - 450 out of 1,755