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WO/2023/006741A1 |
The present invention relates to a binder system comprising: (i) an epoxy-based binder; (ii) trimethylolethane triglycidyl ether; (iii) a curing agent; and (iv) a homopolymerisation accelerator, wherein the wt% of trimethylolethane trigl...
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WO/2023/007439A1 |
A curable, one-part, dual-stage thiol-ene-epoxy liquid adhesive composition, articles, and methods, wherein the composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a t...
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WO/2023/007942A1 |
The present invention provides an epoxy resin curing agent comprising: a component (a1), a polyether polyamine; a component (a2), an aliphatic polyamine having an alicyclic structure; and a component (a3), an aliphatic polyamine having a...
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WO/2023/003011A1 |
This thiol-containing composition contains a polyfunctional secondary thiol compound (A) and a disulfide dimer (B). The polyfunctional secondary thiol compound (A) is an ester of a carboxylic acid having a secondary mercapto group and a ...
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WO/2023/000582A1 |
The present disclosure relates to a preparation method for a two-component epoxy resin adhesive and the two-component epoxy resin adhesive prepared thereby. The preparation method comprises the following steps: mixing an epoxy compound a...
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WO/2023/002902A1 |
The present invention addresses the problem of providing: a phenol mixture that is optimal as an epoxy resin production raw material and that is capable of realizing the high heat resistance required in recent years; and an epoxy resin, ...
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WO/2023/286701A1 |
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a U...
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WO/2023/286728A1 |
This resin composition for semiconductor sealing includes an epoxy resin (A), a curing agent (B) containing a phenol resin (B1) and an active ester resin (B2), and a curing accelerator (C). The active ester resin (B2) has a structure rep...
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WO/2023/288149A1 |
Room temperature, two-component curable compositions and their uses are described. The curable compositions are alternative to isocyanate systems and are kinetically tunable to cure within seconds to months. The curable compositions are ...
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WO/2023/286499A1 |
This epoxy resin composition comprises: a component (A) which is an epoxy resin; a component (B) which is a microcapsule-type curing agent; a component (C) which is a reactive diluent; and a component (D) which is a compound represented ...
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WO/2023/286699A1 |
The present invention addresses the problem of providing a UV-curable resin composition that provides a flexible cured product having a lower crosslinking density than conventional cured products. The present invention comprises the foll...
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WO/2023/285221A1 |
The present invention relates to epoxide-acrylate hybrid molecules, and their use in the resin component of a multi-component reactive resin composition for chemical anchoring. Furthermore, the invention relates to a multi-component reac...
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WO/2022/265096A9 |
The present invention provides an epoxy resin and a curable resin composition which give cured objects having excellent heat resistance and tracking properties. The epoxy resin is represented by formula (1) and has a value obtained by ...
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WO/2023/285188A1 |
The invention relates to the use of an amine of formula (I) for curing epoxy resins. The amine of formula (I) cures surprisingly fast, and in a trouble-free manner, provides a high final hardnesses, and produces beautiful, defect-free su...
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WO/2023/285255A1 |
The invention relates to an amine of formula (I) and its use for curing epoxy resins. According to the invention, the amine of formula (I) has a low viscosity and odour, and cures surprisingly fast, at ambient temperatures, to a material...
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WO/2023/286700A1 |
The present invention addresses the problem of providing a UV/heat-curing type curable resin composition which exhibits sufficiently high adhesion strength even after having only undergone either a UV-curing treatment or a heat-curing tr...
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WO/2023/285220A1 |
The present invention relates to epoxy resin mixtures comprising epoxide-acrylate hybrid molecules, and their use in the resin component of a multi-component reactive resin composition for chemical anchoring. Furthermore, the invention r...
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WO/2023/285189A1 |
The invention relates to the use of an amine of formula (I) for curing epoxy resins, whereby synthetic resin products with a surprisingly high glass transition temperature are formed with particularly low exotherm. According to the inven...
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WO/2023/280560A1 |
The present invention is directed to a two component (2K) composition based on modified epoxy resins. More particularly, the present invention is directed to a two component (2K) composition comprising, as a first component, a silicone-b...
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WO/2023/277016A1 |
[Problem] To provide a composition that satisfies patterning properties, film-forming properties, and a high refractive index which are required for a composition for forming an optical waveguide by overcoming a trade-off therebetween. [...
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WO/2023/276851A1 |
Provided is an epoxy resin composition which has favorable melt-kneading properties at 100°C or less and exhibits excellent solvent solubility, produces a cured product thereof which exhibits excellent heat resistance, heat decompositio...
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WO/2023/276622A1 |
An aspect of the present invention pertains to a resin composition that is for an optical waveguide and that contains an epoxy resin and a curing agent. In the resin composition for an optical waveguide, the number of aliphatic compound-...
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WO/2023/277060A1 |
The present invention provides a laminate which exhibits excellent shock resistance. The purpose of the present invention is to provide: an electronic device and cover glass which are obtained using said laminate; and a resin composition...
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WO/2022/270536A1 |
The purpose of the present invention is to provide an epoxy-based material for obtaining a cured product for which the elastic modulus has been reduced in order to maintain reliability of the cured product even for situations in which en...
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WO/2022/270467A1 |
The purpose of the present invention is to provide a novel hydrazide compound. It is additionally the purpose of the present invention to provide: a curable resin composition that contains the hydrazide compound and that exhibits excepti...
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WO/2022/270471A1 |
This hard coating film (10) sequentially comprises, on a transparent film (1), a hard coating layer (3) and a top coating layer (5); and the top coating layer is positioned on the outermost surface. The hard coating layer has a thickness...
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WO/2022/267202A1 |
The present invention relates to the field of powder coatings. Specifically provided is a method for preparing a low-temperature cured powder coating by means of post-mixing. In the method, a composite nano low-temperature cured catalyst...
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WO/2022/271338A1 |
Amine-substituted copolymers that may include an amine-substituted 2-amino-ethan-1-ol moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diam...
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WO/2022/270118A1 |
Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a benzotriazole compound.
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WO/2022/261739A1 |
The present disclosure provides diglycidyl ethers and esters of 2,4-furandimethanol (2,4- FDME) and of2,4-furandicarboxylicacid (2,4-FDCA), methods of making diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, epoxy resins derived fro...
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WO/2022/265060A1 |
Provided is an epoxy resin which is represented by general formula (1). (In the formula, X denotes a nitrogen atom, CF, C(CmH2m+1) or C(Ph), A is an optionally substituted aromatic group, B1 and B2 are each independently a hydrogen atom ...
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WO/2022/263943A1 |
A curable composition and a method of making a cured composition are provided. The curable composition contains at least two parts with the first part containing three different types of curing agents that contain multiple -NHR1 groups (...
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WO/2022/259463A1 |
Provided is an epoxy resin prepolymer (4) that can be advantageously used as a material of an epoxy resin composition capable of yielding a cured product having high thermal conductivity. This epoxy resin prepolymer (4) is represented by...
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WO/2022/255272A1 |
An aqueous resin composition comprising an aqueous resin emulsion (α), a curing agent (β), and a curing accelerator (γ), wherein the aqueous resin emulsion (α) contains a copolymer (X), a polyepoxy compound (Y), and an aqueous medium...
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WO/2022/256783A1 |
The present invention relates to a powder coating composition including: an addition polymer including epoxy functional groups; a carboxylic acid functional crosslinker; and a blocked isocyanate functional crosslinker. The addition polym...
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WO/2022/255231A1 |
Provided are: a modified epoxy resin having excellent dielectric properties, heat conductivity, and fluidity; a resin composition containing said modified epoxy resin and a curing agent; a cured product thereof having excellent dielectri...
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WO/2022/253878A1 |
The present application is directed to a dual curing composition which may be cured at room temperature but which is also heat- and photo-curable, said composition comprising, based on the weight of the composition: from 10 to 95 wt.% of...
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WO/2022/254906A1 |
A thermoplastic epoxy resin including a product of reaction between a bifunctional epoxy compound, which has two glycidyl groups in the molecule, and one or more bifunctional thiol compounds, which each have two mercapto groups in the mo...
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WO/2022/255037A1 |
To provide a novel amino compound useful as an epoxy resin curing agent, a method for producing the same, etc., disclosed is an amino compound represented by formula (1) that has a quaternary carbon at the β-position of an amino group. ...
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WO/2022/255122A1 |
Provided are: a phosphorus-containing epoxy resin having exceptional flame retardancy and solubility; a resin composition containing said phosphorus-containing epoxy resin and a curing agent; a cured product of the resin composition, the...
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WO/2022/249282A1 |
The present invention provides a curable composition containing an elastomer (A), an epoxy resin (B), and a latent curing agent (C), wherein the latent curing agent (C) encompasses a combination of two or more types of latent curing agents.
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WO/2022/156832A9 |
Disclosed is a preparation method for a high-insulativity low-temperature electronic packaging material, relating to the field of electronic packaging materials. A modified epoxy resin and a modified boron nitrate are added to a high-spe...
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WO/2022/248266A1 |
The invention relates to a process for preparing hydrogenated polyether-modified polybutadienes and to hydrogenated polyether-modified polybutadienes that can be prepared according to this process, said process comprising the following s...
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WO/2022/249966A1 |
An objective of the present invention is to obtain: a polymer composition that can be used as a curing agent of an epoxy resin having a high curing rate even in a low temperature environment as well as low viscosity and favorable stabili...
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WO/2022/251804A1 |
The present disclosure is directed to a composite structure comprising at least one reinforced polymer layer comprising a reinforcing material; a layer comprising a metal substrate comprising a surface and a conformal organic coating pre...
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WO/2022/248267A1 |
The invention relates to a process for preparing hydrogenated polyether-modified amino-functional polybutadienes and to hydrogenated polyether-modified amino-functional polybutadienes that can be prepared according to this process, said ...
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WO/2022/242545A1 |
Disclosed in the present invention are a low-viscosity oxetane fluorine-containing polymer, a preparation method therefor, and an application thereof, as well as an energy curing composition containing the polymer. The polymer has a stru...
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WO/2022/239553A1 |
Provided is an underfill resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a polyether-modified silicone compound having a hydroxy group at an end of the main chain and/or in a side chain, wherein the ...
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WO/2022/239658A1 |
A liquid crystal alignment agent according to the present invention comprises the following components (A), (B), and (C). Component (A): at least one polymer (A) which is selected from the group consisting of polymers (A-1) having a ...
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WO/2022/239554A1 |
A resin composition for underfills which comprises an epoxy resin, a hardener, an inorganic filler, and one or more silicone compounds including a polyglycerin-modified silicone compound and/or a polyester-modified silicone compound.
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