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WO/2022/168666A1 |
The purpose of the present invention is to provide a curable resin composition having an excellent balance between curability and storage stability. The curable resin composition according to the present invention contains: (A) an epox...
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WO/2022/168694A1 |
The present invention provides an encapsulating resin composition for use in encapsulating a GaAs chip, wherein the die shear strength measured under condition 1 is more than or equal to 1.5 N/mm2. (Condition 1) The sealing resin composi...
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WO/2022/168806A1 |
Provided is a negative photosensitive composition which is for forming a top plate section of a hollow structure, and which comprises: an epoxy group-containing compound; a cationic polymerization initiator; a polyfunctional (meth)acryla...
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WO/2022/162805A1 |
The present invention provides: an insulating resin composition which improves the surface tactility of a cured object; a cured product of the composition; a rotary machine coil having favorable surface tactility; and a rotary machine us...
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WO/2022/163555A1 |
The present invention addresses the problem of providing a production method having higher safety and efficiency in a method for producing a target benzoxazine compound that does not create a sudden temperature rise or smoke when introdu...
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WO/2022/161847A1 |
The invention relates to an amino-functional adduct from the reaction of at least one amine of formula (I) with at least one epoxy novolac resin having an average functionality in the range of 2.5 to 4. The adduct is liquid at room tempe...
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WO/2022/163611A1 |
The present invention addresses the problem of providing an epoxy resin composition that has a low viscosity and excellent impregnation properties; that is stable due to the capability of suppressing an increase in viscosity even at an i...
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WO/2022/163795A1 |
The present invention provides a curable composition comprising: a vinyl group-bound monoepoxy compound represented by formula (1); and a radical polymerization initiator.
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WO/2022/163676A1 |
The present invention provides: a composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, eac...
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WO/2022/161837A1 |
The present invention relates to the use of boronic acids to increase the storage stability of epoxy resin compositions and to epoxy resin compositions comprising an epoxy resin, a hardener and a boronic acid.
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WO/2022/163673A1 |
The present invention provides: a composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, eac...
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WO/2022/161846A1 |
The invention relates to an anti-corrosion coating comprising: - at least one epoxy novolac resin having an average functionality of at least 2.3; - at least one amine of formula (I): Z—NH—A—NH—CH2—Y, wherein A represents a div...
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WO/2022/159777A1 |
Poly(cyclic acetal)s, methods of making same, and uses of same. The poly(cyclic acetal)s may have a number average molecular weight (Mn) of 10 to 3000 kiloDaltons (kDa) and over 50% of the chain ends may exclude hydroxyl groups. The poly...
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WO/2022/158283A1 |
Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a carboxylic acid quaternary ammonium c...
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WO/2022/159801A1 |
A shape memory polymer foam comprising a reaction product of a reaction of an epoxide and a thiol monomer in the presence of an organobase is provided. In addition, a method of making the shape memory polymer foam is provided. The method...
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WO/2022/158527A1 |
A non-electroconductive flux is provided with which connected structures having enhanced impact resistance are obtained with heightened production efficiency, the flux being able to inhibit the occurrence of solder flush. This non-elec...
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WO/2022/158444A1 |
A resin molding composition comprises an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the ratio CTE1/CTE2 for the resin molding composition between the linear expansion coefficient CTE1 at a temperature below...
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WO/2022/151754A1 |
Disclosed in the present invention are a waterborne epoxy resin for an anti-corrosion coating, an application thereof, and a preparation method therefor. The preparation method for the waterborne epoxy resin achieves a self-emulsifying f...
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WO/2022/152851A1 |
The present invention relates to a composition, preferably for bonding metal sheets, comprising: a. 1 molar part of at least one linear epoxy resin having an average epoxy equivalent weight of 600 to 5000 g/mol and an epoxy functionality...
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WO/2022/152942A1 |
The invention relates to epoxy adhesive compositions comprising low glass transition temperature elastomeric core nanoparticles, a process for the preparation thereof, and uses thereof, in particular at a low temperature.
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WO/2022/153807A1 |
The present invention addresses the problem of providing: a curable composition from which it is possible to form a thermally conductive material having excellent thermal conductivity; a thermally conductive material; a thermally conduct...
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WO/2022/149468A1 |
Provided is a bisphenol AF-type diglycidyl ether represented by formula (1), wherein an abundance ratio of the bisphenol AF-type diglycidyl ether having n≥1 is less than 30 mass%. (In formula (1), R1-R8 are each independently a hydroge...
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WO/2022/149601A1 |
This sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unfired hydrotalcite compound in which the molar ratio (Mg/Al) of Mg ions and Al ions exceeds 3.0.
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WO/2022/147865A1 |
The present invention provides an epoxy modification-based photochromic composition, a product and a preparation method. The composition comprises polyol, olefin anhydride, a catalyst, alicyclic epoxy, oxetane, a photochromic powder, a p...
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WO/2022/149602A1 |
This thermosetting resin composition contains a thermosetting resin, a curing agent, and an inorganic filler material, wherein: in a particle size distribution on a volume basis as measured by a particle size distribution measurement dev...
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WO/2022/145227A1 |
An aqueous resin composition which contains: an aqueous resin emulsion that comprises a copolymer, a polyepoxy compound and an aqueous medium; a curing agent; and a curing accelerator. With respect to this aqueous resin composition, the ...
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WO/2022/146731A1 |
A thermoset resin composition and composite materials containing reinforcement fibers impregnated with the thermoset resin composition. The thermoset resin composition contains: (a) a combination of multifunctional epoxy resins; (b) 4,4'...
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WO/2022/145187A1 |
The present invention provides a photosensitive resin composition that is highly sensitive and contains a black colorant, the composition making it possible to form a thick film pattern having a high optical density (OD value). Provided ...
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WO/2022/144921A1 |
The present invention relates to a new bisphenol bearing pendant clickable norbornenyl group of formula (I) and its aromatic polyesters bearing pendant norbornenyl groups of formula (II) and processes for the preparation thereof.
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WO/2022/145228A1 |
This aqueous resin composition contains: an aqueous resin emulsion including a copolymer, a polyepoxy compound, and an aqueous medium; a curing agent; and a curing accelerator. The carboxy group content and the epoxy group content within...
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WO/2022/144676A1 |
The present invention relates to an epoxy resin composition, an adhesive film and an adhesive tape with excellent storage stability under room temperature. By adding a liquid type latent curing agent instead of a general heat-curing agen...
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WO/2022/145189A1 |
The present invention provides a photosensitive resin composition that is highly sensitive and contains a black colorant, the composition making it possible to form a thick film pattern having a high optical density (OD value). Provided ...
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WO/2022/147082A1 |
A two-component waterborne coating system includes: a first component including an acid-functional polymer having an acid value of at least 100, based on total resin solids, dispersed in an aqueous medium; and a second component separate...
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WO/2022/145188A1 |
The present invention provides a photosensitive resin composition that is highly sensitive and contains a black colorant, the composition making it possible to form a thick film pattern having a high optical density (OD value) and limite...
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WO/2022/142648A1 |
The present invention relates to an organic silicon prepolymer, an organic silicon modified epoxy resin, an adhesive, and a colloid and a preparation method therefor. The organic silicon modified epoxy resin is mainly prepared from the f...
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WO/2022/133679A1 |
A UV-curing gloss resin, comprising the following components in parts by weight: 50-60 parts of hydroxyl acrylate, 20-30 parts of anhydride, 0-0.2 part of an antioxidant, 0-0.1 part of a polymerization inhibitor, 15-30 parts of an epoxy ...
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WO/2022/136999A1 |
The present invention is directed to phenalkamide curing agent of general formula (I) and a process for preparation thereof. The present invention further directed to an epoxy paint composition based on phenalkamide curing agent of formu...
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WO/2022/138807A1 |
The present invention addresses the problem of providing a curable resin composition that is superior as a two-component or multi-component epoxy resin composition as compared to the prior art. Provided is a curable resin composition inc...
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WO/2022/138343A1 |
Provided is an epoxy resin composition including an epoxy resin (A) and a latent curing agent (B) wherein the latent curing agent (B) is solid at 25°C.
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WO/2022/137122A1 |
The present disclosure provides a two-part curable composition precursor comprising (a) a first part (A) comprising at least one multifunctional epoxy resin having an epoxy functionality of at least three; and (b) a second part (B) compr...
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WO/2022/133880A1 |
The present invention relates to a one-component thermosetting epoxy resin adhesive, comprising a) at least one epoxy resin A of the formula (II) wherein the substituents R' and R" independently of one another are either H or CH 3 and th...
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WO/2022/138432A1 |
A purpose of the present invention is to provide a thermosetting epoxy resin composition that manifests latency at a temperature at which the thermosetting resin cures and has an excellent curing rate, and molded articles obtained by the...
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WO/2022/138120A1 |
Provided is a curing agent which comprises a curing catalyst and an alicyclic polyolefin resin disposed on a surface of the curing catalyst, wherein the curing catalyst is either porous polyurea particles having an aluminum chelate compo...
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WO/2022/138808A1 |
The present invention addresses the problem of providing a resin composition having excellent handleability. A resin composition according to one aspect of the present invention comprises polymer particles (A) and a matrix resin (B), whe...
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WO/2022/137591A1 |
The present invention provides a method for producing a (meth)acrylate resin that uses an epoxy resin and an unsaturated monobasic acid as essential starting materials, said method being characterized in that: a reaction between the epox...
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WO/2022/136789A1 |
The invention relates to the use of a powder comprising at least one polyamide and at least one epoxy resin for producing an electrically insulating coating on a surface. The invention also relates to an electricity transmitting componen...
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WO/2022/140620A1 |
The present disclosure relates to gel compositions comprising the reaction product of at least one epoxidized molecule and at least one crosslinker, which has the benefit of compatibility with personal care components and the resulting p...
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WO/2022/138407A1 |
One purpose of the present invention is to provide a curable resin composition that has excellent fluid characteristics before being cured, excellent leach preventing ability when being semi-cured, and excellent heat resistance after bei...
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WO/2022/136330A1 |
The present invention relates to a curable two-part resin system having a resin part containing at least one cycloaliphatic epoxy resin and a hardener part containing (i) at least one alicyclic anhydride, and (ii) a block-copolymer havin...
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WO/2022/135997A1 |
The present invention is directed to a two-component (2K) curable composition comprising: a first component comprising, based on the weight of the component: from 80 to 100 wt.% of a) i) at least one partially (meth)acrylated epoxy resin...
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