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WO/2022/126463A1 |
Provided is a two-part epoxy-based structural adhesive composition, which comprises a first part and a second part. The first part comprises: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less ...
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WO/2022/128839A1 |
The invention relates to an intumescent coating comprising - at least one liquid epoxide resin, - at least one amine of the formula (I), wherein A represents a divalent alkylene, cycloalkylene or arylalkylene residue with 2 to 15 C atoms...
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WO/2022/130921A1 |
Provided is a polymerizable compound that can be used in the formation of ultra-fine wiring patterns, due to having superior optical characteristics, etching tolerance, curability, solvent solubility, and similar, as well as superior inf...
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WO/2022/130796A1 |
Provided are: a photoacid generator that effectively generates acid even when there is a high concentration of a substance such as a colorant that attenuates or shields irradiated light, and even when the film thickness is great and a li...
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WO/2022/128967A1 |
The present invention relates to a hem flange bonding method. According to this method, a single-component heat-curing epoxy resin composition comprising 20 -60 wt.% of at least one epoxy resin A, a latent curing agent for epoxy resin B,...
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WO/2022/131132A1 |
The present invention provides: a diepoxy compound from which a cured product having a low water absorption rate is obtained; a curable composition using said diepoxy compound; a cured product; and an optical member. One mode of the pr...
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WO/2022/131069A1 |
The present invention provides: a curable resin composition capable of giving cured objects having excellent low-temperature reliability; a cured object and a lens which have excellent low-temperature reliability; and a substrate-support...
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WO/2022/128359A1 |
The present invention relates to an aqueous cathodically depositable electrodeposition coating material composition comprising at least one cathodically depositable polymer and at least one alkoxylated polyethyleneimine. The present inve...
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WO/2022/123498A1 |
The crosslinked polymer particles include a plurality of pendent tertiary amine groups and at least 20 percent by weight poly(alkyleneoxy) crosslinking segments, based on the total weight of the crosslinked polymer particles. Further par...
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WO/2022/123924A1 |
[Problem] To provide: an insulating resin composition which is capable of reducing the electrical resistance (volume resistivity) of an insulating resin, while being capable of suppressing the temperature dependence of the electrical res...
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WO/2022/123994A1 |
The purpose of the present invention is to provide an epoxy resin composition that exhibits an excellent deformation-resistant flexibility and adherence to substrates, can easily be detached after use, and tis suitable for use as a struc...
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WO/2022/124406A1 |
This molding resin composition contains: an epoxy resin; a curing agent; and an inorganic filler which contains one or more types of particle selected from the group consisting of calcium titanate particles and strontium titanate particl...
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WO/2022/123799A1 |
This molding resin composition comprises an epoxy resin, a curing agent, and an inorganic filler which contains at least one filler selected from the group consisting of calcium titanate particles and strontium titanate particles, and in...
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WO/2022/124296A1 |
Provided is a photosensitive resin composition having excellent fine line adhesion, adhesion stress, and suppression of pin unevenness during hot plate drying. The photosensitive resin composition according to the present invention is ch...
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WO/2022/124191A1 |
A purpose of the present invention is to provide a thermosetting epoxy resin composition giving cured objects which have excellent toughness and can stably retain high rigidity in a temperature range from a low to a high temperature. T...
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WO/2022/124252A1 |
Provided are an epoxy resin composition that exhibits excellent low dielectric characteristics, a polyhydric hydroxy resin and epoxy resin that provide this epoxy resin composition, and methods for producing the preceding. The polyhydric...
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WO/2022/124357A1 |
The present invention provides a pressure-sensitive adhesive composition which contains: (A) an isobutene-based polymer having a crosslinked structure formed from a reaction between an epoxy group and an acid anhydride group and/or carbo...
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WO/2022/118723A1 |
The present invention provides an epoxy resin which contains: a glycidyl etherified product (E1) of a biphenolic compound (P1); and a glycidyl etherified product (E2) of a phenolic hydroxyl group-containing resin (P2) that uses, as react...
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WO/2022/117878A1 |
A process for the application of an intumescent coating system to a substrate comprising (I) applying to a substrate an intumescent coating composition comprising i. an epoxy-based binder; ii. a curing agent; iii. an expansion agent; iv....
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WO/2022/118749A1 |
This resin composition for sealing includes (A) 3,5-diamino-1,2,4-triazole and (B) an epoxy resin.
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WO/2022/118827A1 |
The present invention addresses the problem of providing a method for improving the physical properties of a fiber-reinforced pultrusion-molded article obtained by heating and curing a resin-impregnated fiber base material, in which a th...
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WO/2022/118722A1 |
The present invention provides an epoxy resin containing a glycidyletherified product (E1) of a biphenol compound (P1), and a glycidyletherified product (E2) of a phenolic hydroxyl-group-containing resin (P2) that has a phenolic hydroxyl...
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WO/2022/113523A1 |
The objective of the present invention is to provide an epoxy resin composition which has a low temperature curability (75-160 °C), and from which a cured product that can suppress deterioration of characteristics due to heating can be ...
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WO/2022/112776A1 |
The present invention relates to a polymeric Mannich base useful as an epoxy curative and/or accelerator, which has an improved safety profile due to the avoidance of the use of phenol in its preparation. More specifically, the present i...
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WO/2022/112958A1 |
The present invention relates to an aqueous paint composition comprising an acrylic polymer emulsion anionically stabilized at basic pH with a volatile base and containing self-crosslinking functionalities, an epoxy-polyamine adduct, and...
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WO/2022/114462A1 |
The present invention discloses a solder paste composition having excellent thermal conductivity and heat resistance, having heat radiating properties, enabling processing time and temperature to be unprecedentedly reduced, and being app...
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WO/2022/114056A1 |
The present invention provides a modified epoxy resin obtained by neutralizing, with an anionic compound (d-1) having a molecular weight of less than 300 or a cationic compound (d-2) having a molecular weight of less than 300, an ionized...
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WO/2022/108238A1 |
The present invention relates to a resin composition and an epoxy resin composition containing same for a display and, more specifically, provides a transparent epoxy material, which can be applied to various methods of spraying a low-vi...
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WO/2022/107747A1 |
[Problem] To provide a curable resin composition which has excellent cleaning removability even when adhered to a mixing tub or tool used in a production process of solder resist ink, and dried. [Solution] A curable resin composition acc...
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WO/2022/107678A1 |
The present invention provides an epoxy resin and an epoxy resin composition which give cured objects having high heat resistance, high modulus, and low water absorption. The epoxy resin is represented by formula (1), and has a total c...
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WO/2022/107473A1 |
The present invention provides: an epoxy resin composition which contains an epoxy resin, an epoxy resin curing agent that contains an amine-based curing agent, and a polyalkylene glycol; a gas barrier multilayer body which uses this epo...
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WO/2022/108331A1 |
The present invention relates to an isocyanate prepolymer composition using an anhydrosugar alcohol-alkylene glycol composition and uses thereof and, more specifically, to: an isocyanate prepolymer composition which is eco-friendly, whic...
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WO/2022/107564A1 |
An objective of the present invention is to provide an epoxy resin composition which does not readily break down in high heat, and to provide: a fiber-reinforced resin molded body which does not readily suffer damage during welding with ...
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WO/2022/107508A1 |
The present invention provides a (meth)acrylate resin having an acid group, said (meth)acrylate resin using, as essential starting materials, (A) an epoxy resin, (B) an unsaturated monobasic acid, (C) a compound having a hydroxyl group a...
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WO/2022/100926A1 |
The present invention relates to an epoxy composition comprising a) an epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure (I). The composition according to the present invention can be used as a structur...
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WO/2022/102629A1 |
The present invention provides a prepreg and an epoxy resin composition, which are capable of reducing the burning time of a molded article. A prepreg according to the present invention is obtained by impregnating a carbon fiber base mat...
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WO/2022/104222A1 |
A method of forming a monomer by reacting reactants including a first compound comprising an aromatic ring and a carbonyl group; a second compound comprising a carbonyl group; and optionally a third compound comprising an epoxide ring; w...
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WO/2022/100927A1 |
The present invention relates to an epoxy composition comprising a) a cycloaliphatic epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure (I). The composition according to the present invention can be used...
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WO/2022/102489A1 |
The present invention relates to: a resin composition containing a paratertiary butylphenol novolac resin (A) and a phenol resin (B) having a dicyclopentadiene skeleton; a cured article of the resin composition; a semiconductor encapsula...
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WO/2022/102467A1 |
The purpose of the present invention is to provide: a thermosetting epoxy resin composition which achieves a good balance between a pot life and fast curing properties at low temperatures; and a molded article which is obtained by thermo...
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WO/2022/102697A1 |
A resin composition for semiconductor encapsulation, according to the present invention, comprises: an epoxy resin; a phenol resin curing agent; a curing accelerator; and an alumina powder, wherein an α-dose of a cured product of the re...
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WO/2022/102332A1 |
The present invention provides: a curable composition which contains (A) a blocked isocyanate prepolymer that uses (a1) a polyol compound, (a2) a polyisocyanate compound and (a3) a blocking agent as essential starting materials, (B) an e...
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WO/2022/102203A1 |
Provided are a resin composition capable of shortening the stress relaxation time, a resin cured product, and a fiber-reinforced resin. To solve this problem, the resin composition includes an epoxy compound having two or more epoxy grou...
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WO/2022/103004A1 |
The present invention relates to an organic-inorganic hybrid liquid insulating material having high heat resistance while retaining substrate adhesion and chemical resistance of an epoxy resin, and to a method of preparing same, the meth...
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WO/2022/102626A1 |
[Problem] To provide an ultraviolet ray curable composition containing silicon atoms, wherein a product obtained by curing said composition has a low refractive index, and has excellent workability when applied onto a base material. [Sol...
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WO/2022/099210A1 |
The present disclosure provides compounds of the formula (I): The present disclosure also provides copolymers prepared by polymerizing a first monomer (e.g., dicyclopentadiene) and the compounds. The copolymers may show increased degrada...
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WO/2022/096148A1 |
The invention relates to an epoxy pre-polymer comprising isosorbide units, characterised in that it comprises less than 1% by weight of isosorbide diglycidyl ether relative to the total weight of the epoxy pre-polymer. The invention also...
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WO/2022/096707A1 |
The invention relates to a floor protection system comprising (i) optionally at least one epoxy resin primer, (ii) at least one polyurethane coating, (iii) optionally quartz sand, which has been scattered into and/or onto the polyurethan...
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WO/2022/093614A1 |
This invention pertains to improved polyester polyol compositions comprising 2,2,4,4-tetramethyl-1,3-cyclobutanediol (TMCD). Coating compositions based on such TMCD polyester polyols are capable of providing a good balance of the desirab...
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WO/2022/093681A1 |
A recyclable polyester composition, process, and use thereof that includes a diacid component, a glycol component, a diacid or glycol comonomer, a branching comonomer, and a plasticizer.
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