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WO/2024/015165A1 |
Provided herein is a two-component, thermally-conductive acrylic-epoxy adhesive composition.
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WO/2024/014432A1 |
This curable resin composition contains (A) a rubber component, (B) an epoxy-group-containing cross-linking component, (C) an ester-based curing agent, and (D) a curing accelerator.
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WO/2024/009612A1 |
The present invention addresses the problem of providing a curable resin that can provide a cured product having superior adhesion and thermal shock resistance, as well as a method for manufacturing an intermediate with which said curabl...
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WO/2024/010980A2 |
A solid, storage-stable, epoxy resin composition comprising the reaction product of a solid carboxylated nitrile rubber (XNBR) and an epoxy functional resin, wherein the carboxylic acid content of the carboxylated nitrile rubber is less ...
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WO/2024/010059A1 |
A purpose of the present invention is to provide a curable resin composition which enables the achievement of a cured product that exhibits excellent heat resistance and low outgas properties, while having a low dielectric constant. Anot...
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WO/2024/008671A1 |
The present invention relates to a thermoset crosslinked epoxide resin composition obtainable by a method that comprises mixing an epoxide-functionalised resin with a cross-linking agent and a catalyst; and curing the mixture thus obtain...
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WO/2024/005037A1 |
This display device (10) comprises: a substrate (1); an optical element (2) mounted on one surface in the thickness direction of the substrate (1); a second sealing layer (6) for sealing the optical element (2); a second inorganic layer ...
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WO/2024/004438A1 |
The present invention provides a cationic electrodeposition coating material which, in an electrodeposition coating step, does not require high-temperature bake drying that emits CO2, which produces almost no volatile components during c...
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WO/2024/003053A1 |
A method of bonding substrates that are underwater comprising applying, underwater, a cyanoacrylate composition to at least one substrate and allowing the composition to cure underwater.
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WO/2024/003104A1 |
An example nanoimprint lithography (NIL) resin composition includes a total of three monomers, wherein two of the three monomers are selected from the group consisting of two different epoxy substituted silsesquioxane monomers; two diffe...
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WO/2024/002117A1 |
Disclosed are an antibacterial fluorine-modified epoxy vinyl ester resin, a method for preparing same, and a multi-mechanism synergistic universal anti-corrosion coating. The antibacterial fluorine-modified epoxy vinyl ester resin of the...
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WO/2024/005149A1 |
Provided according to the present disclosure is a conductive resin composition that suppresses generation of outgas. The present disclosure relates to a conductive resin composition containing the following components (A)-(D). Component ...
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WO/2024/003434A1 |
The present invention relates to a method for manufacturing a polymer material, said method comprising mixing an epoxy monomer with a compound that comprises maleimide groups, adding a reversible or irreversible amine hardener, adding a ...
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WO/2024/006470A1 |
The present disclosure relates generally to materials and methods for providing expanded foam materials. In one aspect, the present disclosure provides an expandable foam formulation, the expandable foam formulation being expandable to p...
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WO/2024/006101A2 |
The present invention relates to curable epoxy resin compositions comprising an alkyl-substituted aromatic epoxy resin and a bis alicyclic amine hardener, which when cured exhibit preferred chemical and physical characteristics. The pres...
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WO/2024/006422A1 |
A composition for making a filler including a plurality of ceramic particles, an oxirane monomer in liquid form, an ultraviolet initiator that absorbs ultraviolet, and a thermal initiator.
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WO/2023/249099A1 |
The problem addressed is to provide a curable resin composition that satisfies (i) and (i): a cured product having, at low temperature, (i) low viscosity and (ii) excellent adhesive strength by a short cure time can be provided. Provided...
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WO/2023/248488A1 |
The present invention provides: a method for producing a (meth)acrylate resin having excellent alkali developability and high optical sensitivity and ensuring not only excellent heat resistance but also excellent base material adhesivene...
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WO/2023/249123A1 |
This heat-curable composition according to the present disclosure comprises: a first component including a siloxane having an epoxy group, and a second component including at least one of: a phenol having a structure in which a ring-open...
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WO/2023/247445A1 |
The invention relates to a solution comprising 5 to 65 wt.% polyphenols which are solid at room temperature and 35 to 95 wt.% amines of formula (I). The solution according to the invention is preferably used for preparing a curing agent ...
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WO/2023/247278A1 |
The present invention relates to a process for preparing an epoxy-group-terminated impact modifier, in which process one or more polyisocyanates (a) are mixed with two or more polyols (b), containing at least one polyether polyol (b1) an...
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WO/2023/248380A1 |
This heat conductive resin composition includes: epoxy resin particles that have a mesogenic skeleton; a curing agent; a heat conductive inorganic filler; and a polymer that has a molecular weight of 10,000 or more, wherein the average p...
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WO/2023/248661A1 |
The present invention provides a photosensitive composition which is capable of suppressing decoloring of a sensitizing dye during the storage in an unexposed state. A photosensitive composition according to the present invention conta...
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WO/2023/247438A1 |
The present invention concerns a method for producing a curing agent for a waterborne epoxy coating formulation, said method comprising a step of carbonating a waterborne dispersion of a water insoluble curing agent comprising amine and/...
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WO/2023/242220A1 |
In particular, the present invention relates to the use of an epoxy-silicone copolymer, i.e. a polyorganosiloxane provided with branches comprising epoxide functional groups, for the manufacture of an anti-graffiti surface coating of a b...
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WO/2023/242041A1 |
The invention relates to a method to prepare a composition comprising an epoxy-based covalent adaptable network. The method comprises the steps of a) contacting a compound A and a compound B in controlled amounts to obtain a mixture comp...
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WO/2023/243994A1 |
The present invention relates to a tetramethylbiphenol type epoxy resin and a preparation method therefor, and, more specifically, a purification step in which carboxylic acid is used is added to a tetramethylbiphenol type epoxy resin pr...
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WO/2023/242782A1 |
A two-part epoxy adhesive comprises a Part A and a Part B. Part A comprises, based on the total weight of components a) and b): a) 99.5 to 99.99 weight percent of at least one curable epoxy resin; and b) 0.01 to 0.5 weight percent of at ...
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WO/2023/243543A1 |
The present invention improves a search technique for a thermosetting epoxy resin composition. The present invention provides a search method for a thermosetting epoxy resin composition, the search method being executed by an informati...
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WO/2023/243516A1 |
Provided is a reactive curing agent that has improved solubility in methyl ethyl ketone and can improve the heat resistance of thermosetting resin compositions. The present invention provides a reactive curing agent comprising a copoly...
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WO/2023/242807A1 |
Provided is a curable composition for forming an adhesive structure that can be discharged by an inkjet printing method and includes a glycidylamine-type epoxy compound, an oxetane compound, and a cationic polymerization initiator. In th...
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WO/2023/245211A2 |
An ionic porous organic framework (HCOF-7) is provided to remove iodine residues (I2 and I-), demonstrating high breakthrough volumes and wide working temperatures. The organic frameworks may be made from various components/monomers havi...
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WO/2023/244535A1 |
Disclosed herein are dithiol-based polymers and cyclic compounds that can be formed therefrom. The cyclic compounds also can be used to regenerate recycled polymers. Methods for making native and recycled polymers are described herein, a...
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WO/2023/239827A1 |
Disclosed are thermoset compositions including a dispersion of a particulate solid into a thermosetting resin in the presence of a coupling agent according to formula I described herein. Various methods of making and/or using the couplin...
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WO/2023/238615A1 |
The present invention provides an epoxy resin composition which contains an epoxy resin (A) and an epoxy resin curing agent (B), wherein: the epoxy resin (A) contains an epoxy resin (A1) that has a glycidyl group derived from resorcinol,...
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WO/2023/238836A1 |
A silsesquioxane derivative represented by formula (1) and a method for producing the same, a curable composition that contains the silsesquioxane derivative and a polymerization initiator, a hard coat agent that contains the curable com...
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WO/2023/239831A1 |
Disclosed are thermoset compositions including a dispersion of a particulate solid into a thermosetting resin in the presence of a coupling agent according to formula I described herein. Various methods of making and/or using the couplin...
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WO/2023/233686A1 |
Provided is a biomass epoxy resin composition comprising an epoxy resin, a biomass-derived curing agent, a biomass-derived monomer, and a polymerization initiator, in which the gelation time of a polymer of the monomer at 100°C or lower...
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WO/2023/234394A1 |
This asymmetric diamine-containing agent is represented by formula (I) [in the formula, RI-RVI each independently represent a hydrogen atom or a monovalent organic group, and n is an integer of 1-3], and is selected from the group consis...
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WO/2023/232399A1 |
The present invention relates to an electrically conductive composition comprising a) from 5 to 25% by weight of the total weight of the composition of a cycloaliphatic epoxide resin; b) from 0.05 to 10% by weight of the total weight of ...
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WO/2023/234340A1 |
An easily detachable thermosetting resin composition according to the present invention contains a thermosetting component; and a cured product which is obtained by thermally curing this thermosetting resin composition has a structure re...
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WO/2023/233243A1 |
Curable compositions are described. In particular, curable compositions including non-aromatic epoxy resin, non-aromatic anhydride-based curing agents, colorant, and a solid nitrogen-containing catalyst are described. Such curable compos...
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WO/2023/233151A1 |
The invention relates to a process for preparing a bio-based cured epoxy resin. In one aspect, said process comprises the stoichiometric reaction of an epoxy resin with at least one epoxy resin curative, wherein the at least one epoxy re...
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WO/2023/234201A1 |
This liquid resin composition is used to encapsulate, by casting, a power module comprising a power module substrate with a circuit layer formed thereon and a power semiconductor element mounted on the circuit layer of the power module s...
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WO/2023/227426A1 |
In general, the present invention relates to lignin-derived monomers, as well as polymers prepared with these lignin-derived monomers. Furthermore, the invention relates to methods to prepare these monomers from feedstock rich in lignin,...
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WO/2023/228661A1 |
The present invention provides a composition for forming a protective film against a wet etching liquid for semiconductor, the composition containing: (A) a compound or a polymer having a reactive group capable of undergoing a crosslinki...
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WO/2023/227069A1 |
The present invention relates to use of polidocanol with a single molecular weight in the preparation of a drug for treating disease. The polidocanol can serve as a curing agent and/or a hemostatic agent for treatment. The polidocanol wi...
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WO/2023/221619A1 |
An epoxy resin batch for composite material pultrusion and a preparation method therefor, relating to the technical field of epoxy resin materials. The resin system can be applied to preparation of structural materials such as a pultrude...
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WO/2023/225151A1 |
Curable acrylate-epoxy resin blends comprising an epoxy resin, a crosslinking accelerator, a latent hardener, an acrylate monomer component, and a free radical initiator are provided. Such curable acrylate-epoxy resin blends have a low v...
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WO/2023/223924A1 |
Provided is a compound that, although a curable resin, is able to to easily achieve repairability and reformability in a cured object. Also provided is a curable resin composition using the same, and a cured object thereof. The present i...
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