Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 151 - 200 out of 47,191

Document Document Title
WO/2023/210935A1
The present invention relates to a solvent-free thermosetting quantum dot resin composition, a quantum dot resin composite prepared therefrom, and an LED package and a display device employing same and, specifically, to a solvent-free th...  
WO/2023/208180A1
Provided in the embodiments of the present application is an epoxy resin, comprising a cyclic siloxane ring and at least one group represented by formula (A) linked to a silicon atom on the cyclic siloxane ring, wherein in formula (A), Z...  
WO/2023/212334A1
A two-part system comprising a first component including one or more epoxy resins and an epoxy functional material, the epoxy functional material having a functionality of greater than 4 and a viscosity of 500 cps or less according to AS...  
WO/2023/212274A1
A two-part thermally conductive curable composition exhibits long-term storage stability and high dispensation flow rates at elevated temperatures up to 50°C. One or more low melting point phase changing compounds are incorporated into ...  
WO/2023/208833A1
The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesi...  
WO/2023/203906A1
This resin composition comprises an epoxy resin (A) and an inorganic filler (B), wherein the epoxy resin (A) contains a liquid epoxy resin (A-1); the inorganic filler (B) contains a carbon-containing inorganic filler (B-1) having a carbo...  
WO/2023/205123A1
A liquid optically clear adhesive (LOCA) for bonding optical substrates includes siloxane and epoxy-containing oligomers, a UV-activated photo-acid generator, a cross-linker additive, a solvent; and a reactive plasticizer, such as an add...  
WO/2023/202111A1
A curable epoxy composition comprising an epoxy resin, a core-shell rubber, a capped polyurethane prepolymer, a hardener, an accelerator, a multifunctional epoxy-terminated prepolymer, along with related methods of making and using the s...  
WO/2023/201614A1
This invention relates to a curable epoxy composition comprising an epoxy resin, a core-shell rubber, a capped polyurethane prepolymer, a hardener, a multifunctional epoxy-terminated prepolymer, along with related methods of making and u...  
WO/2023/203891A1
Provided are: an epoxy resin curing agent comprising a component (A-1) that is a reaction composition containing a polycondensation reaction product of an aniline derivative and formaldehyde and a component (A-2) that is a reaction compo...  
WO/2023/197082A1
The preparation of amine containing polymers from commodity polyolefins has been achieved through the functionalization of polybutadiene. The pre-functionalized polybutadiene is comprised of butadiene and optionally other monomers such a...  
WO/2023/196026A1
The patent application discloses a degradable thermoset composite. The composite comprises a reaction product of an epoxy resin, a cross-linker, a catalyst. The epoxy resin mixture may comprise at least one cycloaliphatic epoxide. The re...  
WO/2023/195439A1
The present invention addresses the problem of providing an electronic component having excellent high-temperature durability. The problem is resolved by an electronic component having a metal portion and having a coating on all or a por...  
WO/2023/195440A1
The present invention addresses the problem of providing an electronic component having excellent high-temperature durability. The problem is resolved by an electronic component having a metal portion and having a coating on all or a por...  
WO/2023/194099A1
The present invention relates to a two-part, room temperature curable heat and fire retardant composition comprising a first part comprising 1) an epoxy resin; and 2) a flame retardant compound; and a second part comprising 1) a first am...  
WO/2023/190508A1
An optical member pertaining to an embodiment of the present invention includes a structure represented by formula (i). In the formula: R1 is a hydrogen atom or an aryl group; a is an integer of 0 to 5; b is an integer of 0 to 4; R2 is a...  
WO/2023/190810A1
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine...  
WO/2023/189030A1
The present invention provides a thermosetting resin composition which is capable of suppressing the generation of a void space between a sheet and an adherend that has a roughened surface even if pressing is performed with a low pressur...  
WO/2023/191109A1
A two-component curable composition comprising: liquid A that contains a thermal-conductive filler, a reactive diluent, and an epoxy compound that has two epoxy groups and has, between the two epoxy groups, at least one selected from the...  
WO/2023/189150A1
Provided is a method for producing an automobile structural body, by which it is possible to suppress appearance defects in the automobile structural body. Also provided is a curable composition which is suitably used in the production o...  
WO/2023/189298A1
Provided is a resin composition that has exceptional heat resistance and enables bonding of a copper foil and a glass substrate using a lamination method. This resin composition contains: two or more polymers selected from the group cons...  
WO/2023/184202A1
The present disclosure provides latent amine compositions which are used as a curing agent for flame resistant epoxy systems, the amine-epoxy resin compositions, and the cured products from amine-epoxy composition.  
WO/2023/190221A1
Provided is a thermosetting resin composition capable of reducing the dielectric loss tangent while having high permittivity. A thermosetting resin composition containing (A) an epoxy compound, (B) a compound having a maleimide group, ...  
WO/2023/190571A1
Provided is a conductive composition that can form a cured product having excellent conductive properties and adhesion to an adherend even at a lower curing temperature than is conventional. A conductive composition according to the pres...  
WO/2023/189297A1
The present invention provides a resin composition which enables the bonding of a copper foil and a glass substrate by a lamination method, while having excellent dimensional stability. This resin composition contains a polyimide resin t...  
WO/2023/188297A1
A photosensitive resin film containing (A) a compound having an ethylenic unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine-containing resin, wherein the (D) in...  
WO/2023/184762A1
Disclosed are a degradable composite material, a fan blade, and a method for preparing same. The degradable composite material of the present invention comprises, in percentages by mass, 30-40% of a degradable epoxy resin composition, 45...  
WO/2023/190694A1
The present invention addresses the problem of providing an optical waveguide resin composition having excellent photocuring properties. The optical waveguide resin composition according to the present disclosure contains an epoxy resin ...  
WO/2023/190693A1
The problem addressed by the present disclosure is to provide a resin composition for an optical waveguide, said resin composition excelling in photocurability. The resin composition for an optical waveguide according to the present disc...  
WO/2023/182370A1
Provided are an electronic device and an epoxy resin composition for sealing having high storage stability and for which the curing rate can be enhanced during curing. This epoxy resin composition for sealing contains an epoxy resin (A),...  
WO/2023/181960A1
A polymer including a partial structure represented by formula (1), a partial structure represented by formula (2), and a partial structure represented by formula (3). (In formula (2), Q1 represents a divalent organic group having either...  
WO/2023/182046A1
The present invention provides an ester compound which is represented by at least one of general formula (1) and general formula (2). In general formula (1), each of R1 to R3 represents a hydrogen atom, an alkyl group or a caprolactone s...  
WO/2023/182495A1
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under ...  
WO/2023/181831A1
The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding. Provided is a resin composition comprising (A) an epoxy compou...  
WO/2023/182141A1
Provided is a glycidyl amine-type fluorine-containing epoxy compound. The present disclosure relates to a fluorine-containing epoxy compound represented by general formula (1). In general formula (1), n each independently represents an i...  
WO/2023/183272A1
Provided herein is a two-component thermally-conductive epoxy adhesive.  
WO/2023/179521A1
A polymeric scaffold useful for conjugating with a targeting moiety can form a targeting moiety-polymer-drug conjugate. A targeting moiety-polymer-drug conjugate is prepared from the polymeric scaffold. Compositions comprise the conjugat...  
WO/2023/182358A1
The present invention pertains to a thermosetting resin composition which contains a thermosetting agent (B) and a compound (A) having a backbone represented by general formula (1) and having two or more functional groups that are at lea...  
WO/2023/182522A1
The present invention provides an epoxy resin which has a skeleton represented by formula (1). In formula (1), each of R4 and R5 independently represents a hydrogen atom, an alkoxy group or -OG; * may be a binding site to be bonded with ...  
WO/2023/182492A1
The present invention provides a curable composition which can form cured objects having both a low degree of thermal expansion and a low modulus. The present invention relates to a curable composition comprising (A) an epoxy compound ...  
WO/2023/178472A1
The invention relates to a composition, which has excellent durability and adhesive strength after curing. The composition contains component (A) silane-crosslinking polymer, Component (B1) epoxy resin, Component (B2) epoxy resin curing ...  
WO/2023/181953A1
A resin film is formed using a resin composition containing a carboxyl group-containing resin, a corrosion inhibitor having a solubility parameter (SP value) ranging from 17.0 (MPa)1/2 to 25.5 (MPa)1/2 inclusive, and a crosslinking agent.  
WO/2023/182273A1
The purpose of the present invention is to provide: an alkali-soluble resin and an alkali-soluble resin composition, each of which is capable of forming a cured product that has excellent thermal coloring resistance and a high refractive...  
WO/2023/180631A1
There is provided a method for producing an epoxy resin comprising mixing modified tall oil pitch with at least one epoxidized vegetable oil. Additionally, is provided an epoxy resin comprising modified tall oil pitch cross-linked with a...  
WO/2023/180035A1
The invention relates to a cationically curable compound which is liquid at room temperature and comprises a) at least one cationically polymerisable component (A), the cationically polymerisable component (A) comprising 60 to 100 wt.%, ...  
WO/2023/176845A1
One purpose of the present invention is to provide a sealing agent for display elements, the sealing agent having excellent flexing responsiveness, excellent adhesion to an alignment film, excellent adhesion in a high-temperature high-hu...  
WO/2023/176680A1
A composition containing a cationic polymerizable component and an antioxidant, wherein the cationic polymerizable component contains at least one selected from alicyclic epoxy compounds, aliphatic epoxy compounds, aromatic epoxy compoun...  
WO/2023/176703A1
The present invention provides a compound which is represented by formula (1). In the formula, R1 represents a hydrogen atom or a methyl group; each of R2 to R5 independently represents a hydrogen atom, an alkyl group having 1 to 10 carb...  
WO/2023/174891A1
A curable epoxy resin adhesive for bonding together structural parts of a wind turbine blade, a marine vessel or a civil engineering structure, the adhesive comprising an epoxy resin component and a curing agent component, wherein the ep...  
WO/2023/176644A1
The present invention relates to water absorbent resin particles containing a crosslinked polymer having at least one ethylenically unsaturated monomer selected from the group consisting of (meth)acrylic acids and salts thereof as a mono...  

Matches 151 - 200 out of 47,191