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Matches 251 - 300 out of 60,264

Document Document Title
WO/2018/131563A1
Provided is an epoxy resin composition having excellent low dielectric properties. Specifically, an epoxy resin composition is provided that contains polyphenylene ether and an epoxy resin having a specific structure.  
WO/2018/131570A1
Provided is an epoxy resin composition capable of achieving excellent low dielectric properties and high adhesion to metal. Specifically, an epoxy resin composition is provided that contains organic particles and an epoxy resin having a ...  
WO/2018/131569A1
Provided is an epoxy resin composition having excellent electrical characteristics (especially a low dielectric loss tangent) and being capable of achieving high adhesion to metal. Specifically, an epoxy resin composition containing an...  
WO/2018/131571A1
Provided is an epoxy resin composition having excellent adhesion and low dielectric properties. Specifically, an epoxy resin composition is provided that contains an acid-modified polyolefin resin and an epoxy resin having a specific str...  
WO/2018/131564A1
Provided is an epoxy resin composition having not only rapid curing properties but also excellent electrical characteristics and water resistance after curing. Specifically, an epoxy resin composition is provided that contains a thermal ...  
WO/2018/129685A1
A thermally curable sealant composition comprises one or more thermally curable resins having a group selected from epoxy group, (meth) acryloyl group, maleimide group, and combination thereof, and a latent curing agent, in which the mol...  
WO/2018/131381A1
This epoxy terminated polysulfide polymer is represented by formula (1) (wherein the sum of a + b + c is 3-50, and each of a, b and c independently represents 0 or an integer of 1-50; d represents an integer of 1-3; X represents a number...  
WO/2018/128368A1
An insulating and heat-radiating coating composition is provided. An insulating and heat-radiating coating composition according to an embodiment of the present invention comprises: a coating layer forming ingredient including a base res...  
WO/2018/123442A1
Provided is a resin composition that is suitable as a matrix resin for a fiber-reinforced composite material that gives a cured molded product having high toughness and a superior fatigue resistance, the matrix resin exhibiting good impr...  
WO/2018/121047A1
The present invention discloses a nanoscale electronic chip packaging material and a preparation method therefor. The encapsulation material comprises 15-65% of an epoxy prepolymer, 30-70% of an epoxy modified organosilicon prepolymer na...  
WO/2018/123738A1
The present invention provides a composition for sealing an organic EL element, that can be stably applied using an inkjet printing method, and that can be quickly cured by irradiating light to form a cured object having excellent moistu...  
WO/2018/120563A1
The present invention provides a halogen-free epoxy resin composition, and a prepreg and a laminate using same. The halogen-free epoxy resin composition comprises (A) a halogen-free epoxy resin and (B) a phosphorus-containing active este...  
WO/2018/123695A1
Provided are a curable composition with which it is possible to obtain a cured product having exceptional strength, a base resin, a curing agent, a dry film, a cured product, and a printed wiring board. A curable composition containing (...  
WO/2018/120614A1
Provided in the present invention are a phosphorus-containing active ester and a halogen-free resin composition thereof, as well as a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) a thermosettin...  
WO/2018/124169A1
In order to provide: a resin composition having a high glass transition temperature (high Tg) or not having a distinct glass transition temperature (Tg less), and being capable of sufficiently suppressing the warpage (achieving low-warpa...  
WO/2018/120587A1
Provided in the present invention are a halogen-free thermosetting resin composition and a prepreg, a laminate and a printed circuit board containing the same. The halogen-free thermosetting resin composition contains the following three...  
WO/2018/123454A1
Provided is a resin composition that is for a fiber-reinforced composite material, that has both fast curing ability and storage stability, that inhibits deformation during removal from a mold, particularly in the PCM method, and that ca...  
WO/2018/120588A1
The present invention relates to a low-dielectric, highly-heat-resistant, and degradable resin composition, and a prepreg and a laminate prepared using the same and a recycling method thereof. The resin composition comprises an epoxy res...  
WO/2018/125692A1
Provided are curable compositions that include an epoxy resin; a 9,9-bis(aminophenyl)fluorene or derivative therefrom; and core shell particles, each comprising an elastomeric core and a polymeric outer shell layer coated on the elastome...  
WO/2018/116757A1
Provided is an epoxy resin composition which has an excellent balance of shrinkage on cure-molding, heat resistance when a cured product, and thermal elastic modulus when a cured product. Specifically, the epoxy resin composition compris...  
WO/2018/116648A1
A photosensitive epoxy resin composition for forming an optical waveguide, which contains an epoxy resin component and a cationic photopolymerization initiator, and wherein the epoxy resin component contains a solid bifunctional semialip...  
WO/2018/118693A1
Polyamide and amidoamine curing agents comprising a selectively modified amine. The selectively modified amine is formed by a substitution reaction between a polyamine and an epoxide, resulting in a multifunctional amine having a hydroxy...  
WO/2018/117018A1
A transparent resin substrate which sequentially comprises, on a light-transmitting resin substrate sheet, a base layer, a hard coat layer and an antireflection film that contains a medium refractive index layer and a low refractive inde...  
WO/2018/116948A1
The present invention addresses the problem of providing a composition that has excellent heat resistance and excellent adhesiveness. The present invention also addresses the problem of providing: a cured product which is obtained by cur...  
WO/2018/116532A1
A corrosion-resistant member (10) provided with: a base material (16) made of aluminum or an aluminum alloy; a diamond-like carbon film (18) formed on a surface of the base material (16) and made of amorphous carbon (a-C) or hydrogenated...  
WO/2018/115080A1
The present invention relates to heat-curing epoxy resin compositions which exhibit a good storage stability and a low curing temperature. The epoxy resin compositions are particularly suitable for use as a structural adhesive and for pr...  
WO/2018/116872A1
[Problem] To provide: a novel glycoluril or the like; and a method for producing the glycoluril or the like. [Solution] A nitrogen-containing cyclic compound which is represented by formula (1); and the nitrogen-containing cyclic compoun...  
WO/2018/118137A1
The present invention relates to an amine-based curing agent comprising at least 1 % by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine ...  
WO/2018/117214A1
Provided is a curable resin composition comprising components (A), (B), (C), and (D). Component (A) is a bisphenol-type epoxy resin having a softening point of 80°C or higher; component (B) is a bisphenol-type epoxy resin in liquid form...  
WO/2018/113942A1
With the present invention it is provided an exotherm stopper composition suitable for being used to control the exotherm, which is being formed in epoxy-amine thermosetting resins, comprises dry ice (CO2).  
WO/2018/117150A1
Provided are: an epoxy resin mixture which has high heat resistance and excellent electrical reliability; an epoxy resin composition; and a cured product of the epoxy resin composition. An epoxy resin mixture according to the present inv...  
WO/2018/111637A1
A catalyst-containing particle including a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for a thermoset polymeric system, and the acidic coating layer comprises a binder; and a method...  
WO/2018/110297A1
The present invention addresses the problem of providing a composition in which the change in shape due to a change in the amount of exposure is small. The composition contains a cationic polymerizable compound (A), a photoacid generator...  
WO/2018/109617A1
A curable, one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two prima...  
WO/2018/110532A1
Provided are: a substituted allyl ether resin that is low in halogen, is obtained inexpensively, and is suitable for electrical and electronic materials and the raw materials thereof; an epoxy resin in which the same is used; a curable r...  
WO/2018/112306A1
A process of: providing a polyfunctional compound selected from polyisocyanate, polyacrylate, and polyepoxy; and reacting the polyfunctional compound with a hydroxyl- or amine-terminated silyl-containing compound. The polyfunctional comp...  
WO/2018/110594A1
The purpose of the present invention is to provide a liquid-crystal-display-device sealing agent with which it is possible to achieve adhesiveness as well as prevention of moisture permeation in a cured product. The other purpose of the ...  
WO/2018/108707A1
The present invention relates to an epoxy resin adhesive comprising at least one epoxy resin in the resin component, at least one adduct AD which is flowable at room temperature, comprises primary amino groups and is formed of (i) at lea...  
WO/2018/108706A1
The invention relates to an adduct AD obtained from converting at least one novolak-glycidyl ester containing 2.5 to 4 epoxy groups per molecule on average together with an amine mixture containing Bis(6-aminohexyl)amine and at least one...  
WO/2018/110670A1
The present invention relates to: an epoxy compound polymerization catalyst which contains an amidate compound represented by formula (1); and a method for producing a polymer of an epoxy composition, which uses this epoxy compound polym...  
WO/2018/110550A1
The purpose of the present invention is to provide: a thermosetting resin composition or a photocurable resin composition, which enables the achievement of a cured product that has excellent mechanical strength and excellent heat resista...  
WO/2018/111884A1
A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure be...  
WO/2018/103199A1
Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocar...  
WO/2018/105057A1
Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a resin having a phenoxy structure; and (D) an inorganic filler.  
WO/2018/105070A1
Provided are a resin varnish, a prepreg, a laminate, and a printed wiring board using a thermosetting resin composition which has high heat resistance, a low dielectric constant, a high metallic foil adhesive property, a high glass trans...  
WO/2018/103276A1
The present invention provides a thermosetting resin composition comprising an esterified dihydroxylphenyl phosphaphenanthrene. The thermosetting resin composition has the advantages of good thermal stability, heat and humidity resistanc...  
WO/2018/106875A1
The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at le...  
WO/2018/105743A1
Provided are: a curing resin composition which can simultaneously have fast curing ability and cured product performance such as high heat resistance; a cured product of the curing resin composition; and a curing method for the curing re...  
WO/2018/105071A1
Provided is a thermosetting resin composition comprising: (A) a maleimide compound; (B) an epoxy resin having at least two epoxy groups in a molecule; (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound...  
WO/2018/105056A1
Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a metal complex and/or a metal compound; and (D) an inorganic filler.  

Matches 251 - 300 out of 60,264