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Matches 251 - 300 out of 60,012

Document Document Title
WO/2018/097660A1
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesive ability and liquid crystal aligning ability at the same time before or after curing, and thus can be...  
WO/2018/095895A1
The present invention relates to a curable epoxide/polyurethane hybrid resin system comprising an epoxide resin, a polyurethane and a latent curing agent for the epoxide resin and having a viscosity which makes the hybrid resin system su...  
WO/2018/097663A1
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesive ability and liquid crystal aligning ability at the same time before or after curing, and thus can be...  
WO/2018/098011A1
This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and ot...  
WO/2018/095358A1
A phosphorus-, nitrogen-, and silicon-containing polymeric flame retardant and a preparation method and application thereof. The chemical structure of the polymeric flame retardant is: , wherein m = 10-100, and n = 10-100. The synergisti...  
WO/2018/092515A1
The present invention relates to an epoxidized organopolysiloxane characterized by being represented by empirical formula (1) and having an epoxy equivalent of 500 g/mol or higher. Due to this, the epoxidized organopolysiloxane has excel...  
WO/2018/092606A1
An encapsulation film comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, wherein the content of a liquid component or liquid components each having a liquid form at 25ºC, among the c...  
WO/2018/092508A1
The present invention relates to a resin composition for electronic devices which provides a cured product with low moisture permeability and which comprises (A) a partially (meth)acrylated epoxy resin of a di- or higher- functional epox...  
WO/2018/087868A1
An epoxy furan compound represented by formula (1). A curable composition including the epoxy furan compound, and a cured product obtained by curing the same. Method for producing an epoxy furan compound represented by formula (1). (In f...  
WO/2018/088048A1
Provided are: an electronic device which has excellent optical characteristics, while having excellent long-term storage stability and scratch resistance; and an organic electroluminescent element. According to the present invention, an ...  
WO/2018/083881A1
Provided is a method for efficiently producing a polyvalent glycidyl compound by oxidizing a polyvalent allyl compound using hydrogen peroxide as an oxidizing agent. A method for producing a polyvalent glycidyl compound in which the carb...  
WO/2018/083885A1
The epoxy resin composition according to the present invention comprises an epoxy resin, a hardener, an inorganic filler, and a hardening accelerator. When heated from 30°C to 200°C under the conditions of a heating rate of 10 °C/min ...  
WO/2018/085546A1
A composition including a polythiol having more than one thiol groups, a polyepoxide having more than one epoxide group, a photolatent base catalyst that can photochemically generate a first amine, and a second amine phase-separated with...  
WO/2018/083177A1
The invention is directed to a curable composition, which comprises an epoxy resin mixture, wherein the epoxy resin mixture comprises: a) an epoxy resin; b) diethyl methyl benzene diamine (DETDA) as hardener; c) at least one compound sel...  
WO/2018/085550A1
The method includes applying a curable sealant to a surface of the aircraft component, forming a non-tacky skin on an exposed portion of the curable sealant within a first time periodwhile allowing a portion of the curable sealant adjace...  
WO/2018/079603A1
Provided is a crosslinkable composition that contains: a liquid monocyclic olefin ring-opening polymer (A) having a reactive group at a polymer chain end thereof and a weight-average molecular weight (Mw) of 1,000-50,000; and a crosslink...  
WO/2018/081032A1
A one component epoxy adhesive composition is comprised of, an epoxy resin; a polyurethane based toughener, an epoxy curing agent, and an epoxy capped prepolymer comprised of the reaction product of a polyepoxide and an alkanolamine in w...  
WO/2018/079466A1
Provided is a resin composition which is able to be cured fast at low temperatures, while having high bonding strength (especially, high peel strength) after curing, and which is capable of suppressing decrease in the bonding strength (e...  
WO/2018/077411A1
An exotherm stopper mixture suitable for being used to control the exotherm between a resin and a hardener comprises water, at least one high-boiling solvent, at least one exotherm stopper reactive and an excipient mixture comprising sur...  
WO/2018/077836A1
The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener compon...  
WO/2018/079599A1
[Problem] To provide a silicon-containing resist underlayer film which can be used as a hard mask in a lithography process, and can be removed by a wet process using a chemical solution, in particular, SPM (mixed aqueous solution of sulf...  
WO/2018/079763A1
A sizing agent for carbon fibers, which contains a component (A), a component (B) and a component (C), and wherein: the component (A) is at least one component selected from the group consisting of a component (A-1), a component (A-2) an...  
WO/2018/079592A1
The present invention provides: a hydrophilic resin composition that contains an aqueous polyester-based resin and a zwitterionic polymer, wherein the mass ratio of the aqueous polyester-based resin and the zwitterionic polymer(aqueous...  
WO/2018/079427A1
This seal material composition has: epoxy compounds that include epoxy groups; and a polymerizable epoxy curing agent that can cross-link the epoxy groups among themselves and includes a polymerizable functional group for which radical p...  
WO/2018/080397A1
There is provided a resin formulation comprising a resin precursor, a crosslinking additive, a photoinitiator, and at least one luminescent dye, wherein the crosslinking additive comprises a functional group selected from the group consi...  
WO/2018/080057A1
The present invention provides an epoxy resin composition for semiconductor encapsulants, which comprises an epoxy resin, a curing agent, a filler and a curing accelerator, wherein the epoxy resin includes a tri-functional epoxy resin ha...  
WO/2018/074992A1
A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with ...  
WO/2018/074308A1
Provided are: a photo-base generator which upon reception of light, can efficiently generate an amine having high catalytic activity and which has no fear of metal corrosion; and a photosensitive composition containing the photo-base gen...  
WO/2018/074221A1
Provided is a sheet-shaped prepreg which combines a low coefficient of linear thermal expansion with high flexibility and is excellent in terms of warpage prevention and crack resistance. The sheet-shaped prepreg of the present invention...  
WO/2018/073652A3
An epoxy resin composition for a fiber- reinforced composite material, comprising components [A], [B], [C], [D], and [E], wherein the epoxy resin composition when cured has a glass transition temperature greater than 220 °C and a storag...  
WO/2018/074517A1
[Problem] To provide an epoxy resin composition that has a low loss tangent and a low dielectric constant and that is suitable for forming printed wiring boards. [Solution] An epoxy resin composition for forming printed wiring boards, co...  
WO/2018/073652A2
An epoxy resin composition for a fiber- reinforced composite material, comprising components [A], [B], [C], [D], and [E], wherein the epoxy resin composition when cured has a glass transition temperature greater than 220 °C and a storag...  
WO/2018/070052A1
Provided is an epoxy resin comprising an epoxy compound having two or more structures represented by general formula (I) and one or more divalent biphenyl group. In general formula (I), R1 through R4 are each independently a hydrogen ato...  
WO/2018/069081A1
The invention relates to a semi-finished product, in particular for thermal and/or electrical contacting of components, such as battery cells and/or electronic components, for example. In order to simplify methods for producing electrica...  
WO/2018/070746A1
The present invention provides a powder paint composition comprising a diisocyanate-modified bisphenol A epoxy resin, a curing agent, an auxiliary curing agent, an enhancer, and an extender pigment, wherein the auxiliary curing agent com...  
WO/2018/070237A9
This resin composition for sealing contains (A) an epoxy resin, (B) a curing agent that has at least one amino group in each molecule and (C) an inorganic filler. The inorganic filler (C) contains (C1) a first inorganic filler having an ...  
WO/2018/070051A1
An epoxy resin including an epoxy compound having a mesogenic structure. When a temperature-reducing step in which the temperature of the epoxy resin is reduced from 150°C to 30°C at a rate of 2°C/minute and a temperature-increasing s...  
WO/2018/070053A1
Provided is an epoxy resin which contains: a first epoxy compound having a mesogen structure; and a second epoxy compound having two or more mesogen structures identical to the mesogen structure of the first epoxy compound, wherein the p...  
WO/2018/070303A1
Provided is a resist underlayer film-forming composition which is capable of providing a resist underlayer film, said resist underlayer film exerting a sufficient anti-reflection function particularly in a KrF process, a high solvent res...  
WO/2018/070534A1
An epoxy resin including an epoxy compound having a mesogenic structure. When a temperature-reducing step in which the temperature of the epoxy resin is reduced from 150°C to 30°C at a speed of 2°C/minute and a temperature-increasing ...  
WO/2018/070535A1
An epoxy resin including: a first epoxy compound having a mesogenic structure; and a second epoxy compound having at least two mesogenic structures that have the same mesogenic structure as the mesogenic structure of the first epoxy comp...  
WO/2018/068268A1
A binder and an electrochemical energy storage device thereof. A binder comprises a first component and a second component that are separated from each other. The first component comprises at least one compound comprising a first reactiv...  
WO/2018/070237A1
This resin composition for sealing contains (A) an epoxy resin, (B) a curing agent that has at least one amino group in each molecule and (C) an inorganic filler. The inorganic filler (C) contains (C1) a first inorganic filler having an ...  
WO/2018/070470A1
The present invention provides a resin composition which exhibits good impregnation ability into reinforcing fibers, while having fast curing properties, and which is suitable for use in fiber-reinforced composite materials that produce ...  
WO/2018/068862A1
Described herein is a liquid electrostatic ink composition. The composition may comprise: a. a carrier liquid; and b. chargeable particles suspended in the carrier liquid, wherein the chargeable particles comprise a thermoplastic resin f...  
WO/2018/066546A1
The present invention provides a composition which contains an electron-donating polymer (D) having a structure represented by formula (1) and an electron-withdrawing polymer (A) having a structure represented by formula (2). (In the for...  
WO/2018/061988A1
This photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. The content of the coloring agent relative to the total solid content of this composition is 5% by weight or more. T...  
WO/2018/062930A2
The present application relates to an adhesive composition and an organic electronic device including same. The present application provides: an adhesive composition capable of forming a structure that may effectively block moisture or o...  
WO/2018/062166A1
One purpose of the present invention is to provide a sealing agent for liquid crystal display elements, which has excellent drawing properties, bondability, water vapor permeation preventing properties and low possibility of contaminatio...  
WO/2018/062168A1
One purpose of the present invention is to provide a sealing agent for liquid crystal display elements, which is capable of suppressing penetration of liquid crystals into the sealing agent and contamination of liquid crystals by the sea...  

Matches 251 - 300 out of 60,012