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Matches 1 - 50 out of 59,095

Document Document Title
WO/2018/111637A1
A catalyst-containing particle including a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for a thermoset polymeric system, and the acidic coating layer comprises a binder; and a method...  
WO/2018/110297A1
The present invention addresses the problem of providing a composition in which the change in shape due to a change in the amount of exposure is small. The composition contains a cationic polymerizable compound (A), a photoacid generator...  
WO/2018/109617A1
A curable, one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two prima...  
WO/2018/110532A1
Provided are: a substituted allyl ether resin that is low in halogen, is obtained inexpensively, and is suitable for electrical and electronic materials and the raw materials thereof; an epoxy resin in which the same is used; a curable r...  
WO/2018/112306A1
A process of: providing a polyfunctional compound selected from polyisocyanate, polyacrylate, and polyepoxy; and reacting the polyfunctional compound with a hydroxyl- or amine-terminated silyl-containing compound. The polyfunctional comp...  
WO/2018/110594A1
The purpose of the present invention is to provide a liquid-crystal-display-device sealing agent with which it is possible to achieve adhesiveness as well as prevention of moisture permeation in a cured product. The other purpose of the ...  
WO/2018/108707A1
The present invention relates to an epoxy resin adhesive comprising at least one epoxy resin in the resin component, at least one adduct AD which is flowable at room temperature, comprises primary amino groups and is formed of (i) at lea...  
WO/2018/108706A1
The invention relates to an adduct AD obtained from converting at least one novolak-glycidyl ester containing 2.5 to 4 epoxy groups per molecule on average together with an amine mixture containing Bis(6-aminohexyl)amine and at least one...  
WO/2018/110670A1
The present invention relates to: an epoxy compound polymerization catalyst which contains an amidate compound represented by formula (1); and a method for producing a polymer of an epoxy composition, which uses this epoxy compound polym...  
WO/2018/110550A1
The purpose of the present invention is to provide: a thermosetting resin composition or a photocurable resin composition, which enables the achievement of a cured product that has excellent mechanical strength and excellent heat resista...  
WO/2018/111884A1
A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure be...  
WO/2018/103199A1
Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocar...  
WO/2018/105057A1
Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a resin having a phenoxy structure; and (D) an inorganic filler.  
WO/2018/105070A1
Provided are a resin varnish, a prepreg, a laminate, and a printed wiring board using a thermosetting resin composition which has high heat resistance, a low dielectric constant, a high metallic foil adhesive property, a high glass trans...  
WO/2018/103276A1
The present invention provides a thermosetting resin composition comprising an esterified dihydroxylphenyl phosphaphenanthrene. The thermosetting resin composition has the advantages of good thermal stability, heat and humidity resistanc...  
WO/2018/106875A1
The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at le...  
WO/2018/105743A1
Provided are: a curing resin composition which can simultaneously have fast curing ability and cured product performance such as high heat resistance; a cured product of the curing resin composition; and a curing method for the curing re...  
WO/2018/105071A1
Provided is a thermosetting resin composition comprising: (A) a maleimide compound; (B) an epoxy resin having at least two epoxy groups in a molecule; (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound...  
WO/2018/105056A1
Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a metal complex and/or a metal compound; and (D) an inorganic filler.  
WO/2018/105537A1
Provided is a compound which is different from conventional photo acid generators and is capable of generating a Lewis acid by means of light. According to the present invention, this compound is composed of an anionic component that has...  
WO/2018/104206A1
The present invention relates to the polyamines N,N'-diaminopropyl-2-methylcyclohexane-1,3-diamine and N,N'-diaminopropyl-4-methylcyclohexane-1,3-diamine or mixtures thereof, the use thereof as curing agents for epoxy resin, and a curabl...  
WO/2018/106092A1
The present application relates to a sealant composition and an organic electronic device comprising same, and provides a sealant composition which can secure the life of an organic electronic device by effectively blocking moisture or o...  
WO/2018/102177A1
There is provided herein a composition containing (A) a phosphorus-containing aromatic polyester of the general formula (I) described herein which has a weight average molecular weight of from 1,000 to 20,000 and which is concurrently a ...  
WO/2018/101314A1
A first problem addressed by the present invention is to provide a colored photosensitive resin composition that is highly reliable due to the amount of outgas after a cured product is formed being less, and that provides excellent adhes...  
WO/2018/101219A1
A curable composition containing two or more types of cationic dye (A), a cationically polymerizable organic substance (B), and an acid generator (C). The cationic dye (A) is preferably a polymethine compound represented by general formu...  
WO/2018/098908A1
Provided is a thermosetting resin composition comprising a phosphorus-containing active ester, the thermosetting resin composition has the advantages of good thermal stability, moisture and heat resistance, a low dielectric constant and ...  
WO/2018/099891A1
The invention relates to a novel potting compound, in particular a potting compound which can be used to produce an insulating material by means of an anhydride-free hardening process. The invention further relates to the use of the insu...  
WO/2018/098831A1
Provided are a biomass-based epoxy resin and method for preparation thereof; under conditions of N,N-dimethylformamide as a catalyst, 2,5-furandicarboxylic acid and thionyl chloride are acylated to obtain 2,5-furan diformyl chloride; the...  
WO/2018/095362A1
Disclosed are a phosphaphenanthrene-structure reactive fire retardant and an application thereof. The preparation method comprises: enabling 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), p-hydroxy benzaldehyde (4-HBA), and 5...  
WO/2018/096967A1
[Problem] To provide a photopolymerizable composition which gives a cured object exhibiting a large Abbe number and a high refractive index and is suitable for producing molded objects having high transparency. [Solution] A photopolymeri...  
WO/2018/096868A1
Provided are a curing agent for a water-based epoxy resin containing a reaction composition (A) that includes a reaction product of styrene and an amine compound represented by general formula (1), a water-based epoxy resin composition c...  
WO/2018/095680A1
The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at leas...  
WO/2018/096781A1
This method for producing a modified carbodiimide amine (X) includes a method [α] or a method [β]. In method [α], an amine compound (A) represented by formula (1) is reacted with a compound (B) having a number average molecular weight...  
WO/2018/097660A1
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesive ability and liquid crystal aligning ability at the same time before or after curing, and thus can be...  
WO/2018/095895A1
The present invention relates to a curable epoxide/polyurethane hybrid resin system comprising an epoxide resin, a polyurethane and a latent curing agent for the epoxide resin and having a viscosity which makes the hybrid resin system su...  
WO/2018/097663A1
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesive ability and liquid crystal aligning ability at the same time before or after curing, and thus can be...  
WO/2018/098011A1
This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and ot...  
WO/2018/095358A1
A phosphorus-, nitrogen-, and silicon-containing polymeric flame retardant and a preparation method and application thereof. The chemical structure of the polymeric flame retardant is: , wherein m = 10-100, and n = 10-100. The synergisti...  
WO/2018/092515A1
The present invention relates to an epoxidized organopolysiloxane characterized by being represented by empirical formula (1) and having an epoxy equivalent of 500 g/mol or higher. Due to this, the epoxidized organopolysiloxane has excel...  
WO/2018/092606A1
An encapsulation film comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, wherein the content of a liquid component or liquid components each having a liquid form at 25ºC, among the c...  
WO/2018/092508A1
The present invention relates to a resin composition for electronic devices which provides a cured product with low moisture permeability and which comprises (A) a partially (meth)acrylated epoxy resin of a di- or higher- functional epox...  
WO/2018/087868A1
An epoxy furan compound represented by formula (1). A curable composition including the epoxy furan compound, and a cured product obtained by curing the same. Method for producing an epoxy furan compound represented by formula (1). (In f...  
WO/2018/088048A1
Provided are: an electronic device which has excellent optical characteristics, while having excellent long-term storage stability and scratch resistance; and an organic electroluminescent element. According to the present invention, an ...  
WO/2018/083881A1
Provided is a method for efficiently producing a polyvalent glycidyl compound by oxidizing a polyvalent allyl compound using hydrogen peroxide as an oxidizing agent. A method for producing a polyvalent glycidyl compound in which the carb...  
WO/2018/083885A1
The epoxy resin composition according to the present invention comprises an epoxy resin, a hardener, an inorganic filler, and a hardening accelerator. When heated from 30°C to 200°C under the conditions of a heating rate of 10 °C/min ...  
WO/2018/085546A1
A composition including a polythiol having more than one thiol groups, a polyepoxide having more than one epoxide group, a photolatent base catalyst that can photochemically generate a first amine, and a second amine phase-separated with...  
WO/2018/083177A1
The invention is directed to a curable composition, which comprises an epoxy resin mixture, wherein the epoxy resin mixture comprises: a) an epoxy resin; b) diethyl methyl benzene diamine (DETDA) as hardener; c) at least one compound sel...  
WO/2018/085550A1
The method includes applying a curable sealant to a surface of the aircraft component, forming a non-tacky skin on an exposed portion of the curable sealant within a first time periodwhile allowing a portion of the curable sealant adjace...  
WO/2018/079603A1
Provided is a crosslinkable composition that contains: a liquid monocyclic olefin ring-opening polymer (A) having a reactive group at a polymer chain end thereof and a weight-average molecular weight (Mw) of 1,000-50,000; and a crosslink...  
WO/2018/081032A1
A one component epoxy adhesive composition is comprised of, an epoxy resin; a polyurethane based toughener, an epoxy curing agent, and an epoxy capped prepolymer comprised of the reaction product of a polyepoxide and an alkanolamine in w...  

Matches 1 - 50 out of 59,095