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Patent Searching and Data


Matches 1 - 50 out of 58,395

Document Document Title
WO/2018/008415A1
Provided are: a curable composition have both low shrinkage during curing and a low modulus of elasticity under high-temperature conditions in a cured product; a cured product of said curable composition; a semiconductor sealing material...  
WO/2018/008410A1
Provided are: an active ester resin having low cure shrinkage and also having a low loss tangent in a cured product; a curable resin composition containing same; a cured product thereof; a printed wiring board; and a semiconductor sealin...  
WO/2018/008416A1
Provided are: an active ester composition having high curability and excellent performance such as low dielectric properties, etc., in a cured product; a cured product thereof; a semiconductor sealing material using said active ester com...  
WO/2018/007569A1
The invention relates to a resin infusion process wherein a curable flowing fluid resin composition is supplied to form a curable matrix around a fibrous reinforcement material, wherein the curable flowing fluid resin composition compris...  
WO/2018/008411A1
Provided are: an active ester resin composition which has low shrinkage ratio during the time of curing, and which forms a cured product that has low elastic modulus at high temperatures; a curable resin composition which contains this a...  
WO/2018/008409A1
Provided are: an active ester resin having low cure shrinkage, having excellent dielectric properties, etc., in a cured product, and also having high solvent solubility; a curable resin composition containing same; a cured product thereo...  
WO/2018/008414A1
Provided are: an epoxy resin characterized by having an extremely low dielectric constant and dielectric loss tangent; a curable resin composition containing same; a cured product thereof; a printed wiring board; and a semiconductor seal...  
WO/2018/008412A1
Provided are: an active ester resin having high heat resistance and moisture-absorption resistance and having excellent dielectric properties, etc., in a cured product; a curable resin composition containing same; a cured product thereof...  
WO/2018/007123A1
The invention relates to a dispersion comprising one or more protic solvents as dispersion agents as well as the following base components dispersed therein: - one or more matrix polymers, - one or more epoxides, - at least one type of a...  
WO/2018/004000A1
The purpose of an embodiment of the present disclosure is to provide: a coating composition capable of forming a hard coat layer having excellent adhesion and scratch resistance; an eyeglass lens; and a method for manufacturing an eyegla...  
WO/2018/003513A1
Provided are a phenol novolak resin having an excellent balance of hot elastic modulus and molding shrinkage rate when a composition containing the phenol novolak resin is cured by heating, a composition, a method for producing the same,...  
WO/2018/005307A1
Disclosed is an α-glycol containing sulfonated epoxy resin composition and method for preparing said composition. The α-glycol containing sulfonated epoxy resin composition is made by forming a reaction product comprising an epoxide-co...  
WO/2018/004273A1
The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using th...  
WO/2018/003691A1
Provided is an epoxy resin composition with which an epoxy resin cured product with a high heat resistance and elastic modulus as well as a low colorability can be obtained, said epoxy resin composition not producing white deposits on a ...  
WO/2018/005343A1
Disclosed is a composition and use thereof for the recovery of hydrocarbon fluids from a subterranean reservoir. More particularly, this invention concerns α-glycol containing sulfonated epoxy resin composition and method for preparing ...  
WO/2018/003688A1
Provided is a novel curable composition which is a two-pack type curable composition using an epoxy resin and an organic polymer having a crosslinkable silicon group, and which is free from curing delay or free from viscosity increase of...  
WO/2018/003774A1
Provided are: a hollow fiber membrane module which exhibits excellent durability even when an agent having a strong dissolving power/swelling property against a sealing part made of a radical polymerization compound or the like is used i...  
WO/2018/003313A1
Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a suppo...  
WO/2018/000125A1
Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compoun...  
WO/2018/005077A1
A crosslinkable coating composition comprising: ingredient A that has at least two protons that can be activated to form a Michael carbanion donor; ingredient B that functions as a Michael acceptor having at least two ethylenically unsat...  
WO/2018/003470A1
Because a sulfonium salt that does not contain a toxic metal and that exhibits polymerization performance and crosslinking reaction performance equal to or greater than those of a tetrakis (pentafluorophenyl) borate salt, a photoacid gen...  
WO/2018/005045A1
The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, in...  
WO/2018/005633A1
Urethane/urea-containing bis(alkenyl) ethers can be incorporated into the backbone of polythioether prepolymers and can be used as curing agents in thiol-terminated polythioether prepolymer compositions. Cured sealants prepared using com...  
WO/2018/003690A1
Provided is an epoxy resin composition with which an epoxy resin cured product with a high heat resistance and elastic modulus as well as a low colorability can be obtained, said epoxy resin composition not producing white deposits on a ...  
WO/2018/003314A1
Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a suppo...  
WO/2017/220437A1
The invention relates to a method for producing a cured composition which has at least one oxazolidinone ring und at least one isocyanurate ring and is cross-linked by the same, starting from a liquid reactive mixture which, based on the...  
WO/2017/222151A1
The present invention relates to: a resin composition for sealing a solid state semiconductor device, comprising an epoxy resin containing a compound represented by chemical formula 1, a curing agent, and an inorganic filler; an encapsul...  
WO/2017/221542A1
The present invention provides: a two-pack type epoxy resin composition which, upon mixing thereof, gives an epoxy resin composition that has excellent viscosity stability at a low temperature (40ºC) and retains a low viscosity during i...  
WO/2017/223490A1
Disclosed is a composition and use thereof for the recovery of hydrocarbon fluids from a subterranean reservoir. More particularly, this invention concerns sulfonated epoxy resin polymers comprising an epoxide-containing compound, a prim...  
WO/2017/221935A1
Provided are: a curable composition, a cured product of which exhibits excellent adhesion; a method for producing a cured product; and a cured product of this curable composition. A curable composition which contains 100 parts by mass of...  
WO/2017/222339A1
The present invention relates to an epoxy resin composition suitable for mass production of a fiber-reinforced composite, and a prepreg using the same. The epoxy resin composition comprises: component (A), which is a mixture of a difunct...  
WO/2017/223143A1
Curable compositions are provided including a curable system that requires a thermally generated amine to cause curing of the system, and a self-assembled particle distributed in the curable system. The curable system contains at least o...  
WO/2017/222814A1
Disclosed is a composition and use thereof for the recovery of hydrocarbon fluids from a subterranean reservoir. More particularly, this invention concerns sulfonated epoxy resin polymers comprising an epoxide-containing compound, a prim...  
WO/2017/221811A1
This epoxy resin composition contains an epoxy resin and a curing agent, wherein: the epoxy resin contains an epoxy compound having, in one molecule, two or more structural units represented by general formula (I) and two or more epoxy g...  
WO/2017/220583A1
The present invention relates to thermosetting epoxy resin compositions which on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface t...  
WO/2017/221810A1
A gas-barrier material which comprises: a thermosetting resin capable of forming a smectic structure upon a curing reaction; and an amine-based hardener.  
WO/2017/221936A1
The purpose of the present invention is to provide a sealant for liquid crystal display elements, which is capable of achieving adhesiveness and prevention of permeation of moisture in a cured product. The purpose of the present inventio...  
WO/2017/221824A1
[Problem] To provide a photopolymerizable composition which is able to be quickly cured by means of light of from 300 nm to 500 nm, and which provides a cured product that is less colored. [Solution] A photopolymerization sensitizer comp...  
WO/2017/217275A1
A latent curing agent having: porous particles comprising a polyurea resin and holding aluminium chelate and an aryl silanol compound; and a coating on the surface of the porous particles, the coating comprising a cured product of an ali...  
WO/2017/217312A1
Provided are a resin composition for a resist having high thermal degradation resistance as well as excellent dry etching resistance, a cured product of the resin composition for a resist, and a resist film made using the resin compositi...  
WO/2017/214674A1
An aliphatic epoxy resin precursor composition containing an epoxy component and, optionally, a reactive component, the composition containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor c...  
WO/2017/217413A1
Provided are: a liquid crystal alignment agent which can enhance the adhesion between a sealant and a liquid crystal alignment film and suppress the occurrence of display unevenness in the vicinity of the frame of a liquid crystal displa...  
WO/2017/217276A1
A thermosetting epoxy resin composition containing: epoxy resin; a latent curing agent being porous particles comprising polyuria resin and holding aluminium chelate; and boric acid.  
WO/2017/218934A1
The present disclosure provides a curable composition that includes an epoxy resin and a curing component comprising a blend of at least two amines. The curable composition may be combined with reinforced fibers and cured to form a compo...  
WO/2017/217243A1
Provided are: an epoxy (meth)acrylate resin having excellent storage stability and excellent curability; a resin material for solder resists, which contains this epoxy (meth)acrylate resin; and a resist member. An epoxy (meth)acrylate re...  
WO/2017/217638A1
The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy res...  
WO/2017/213206A1
A composition which contains at least one of the stereoisomers of a compound represented by expression (1), wherein, in a gas chromatogram obtained by a gas chromatographic analysis of said composition, the ratio of the peak area of the ...  
WO/2017/213025A1
Provided is a photo-curable resin composition which comprises a radically polymerizable group-containing compound, a cationically polymerizable group-containing compound, a photoradical initiator, and a photoacid generator, wherein: the ...  
WO/2017/212963A1
The purpose of the present invention is to provide a novel sulfonium salt having high photosensitivity to the i-line. The sulfonium salt according to the present invention is represented by formula (1). [In the formula, R1-R8 each indepe...  
WO/2017/213205A1
A composition which contains at least one of the stereoisomers of a compound represented by expression (1), wherein, in a gas chromatogram obtained by a gas chromatographic analysis of said composition, the ratio of the peak area of the ...  

Matches 1 - 50 out of 58,395