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Matches 1 - 50 out of 60,374

Document Document Title
WO/2019/074035A1
One aspect of the present invention relates to a resin composition for optical waveguide cores, which contains a liquid epoxy resin and a solid epoxy resin, and wherein the coefficient of variation as calculated from the weighted average...  
WO/2019/073806A1
A resin which comprises: a component derived from an unsaturated monomer (a-1) having a single functional group reactive with acid groups; a component derived from an epoxy compound (a-2) having two or more epoxy groups; and a component ...  
WO/2019/074896A1
Polymers useful in formulating dispersing agents for pigments are disclosed. One such polymer can be made from a glycidyl intermediate. A nucleophilic initiator can be reacted with epichlorohydrin to produce a glycidyl intermediate. This...  
WO/2019/074878A1
Copolymers comprising recurring units of a phenyl glycidyl ether and alkylene oxides are disclosed. Some of the copolymers comprise a di- or polyfunctional nucleophilic initiator and recurring units of the phenyl glycidyl ether and an al...  
WO/2019/074795A1
A curable resin composition contains a curable resin that comprises at least one non- aromatic epoxy compound, at least one non-aromatic oxetane compound, or a mixture thereof, one or more curing agents selected from Lewis acid: Lewis ba...  
WO/2019/073763A1
The present invention provides a cured article that is formed from a cured material obtained by curing a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler and that has a polished surface, wh...  
WO/2019/069866A1
Provided are: a curable composition of which a cured product after being cured has high strength, high rigidity and flexibility; and a cured product obtained by curing said composition. The present invention provides a multi-pack type cu...  
WO/2019/070499A1
A hardener composition for epoxy resins includes a dianhydride and one or both of a monoanhydride and a hydroxyl-diterminated poly(phenylene ether). The hardener components can be blended in the substantial absence of solvent to yield a ...  
WO/2019/064545A1
This epoxy resin contains an epoxy compound having two or more mesogenic structures and one or more divalent biphenyl groups.  
WO/2019/063846A1
The invention relates to a method of preparing a compound of formula (I), comprising a step of reacting a mixture of at least one phenolic compound of the following formula (III), with at least one base. The invention also relates to a m...  
WO/2019/064544A1
Provided is an epoxy resin comprising: an epoxy compound A that has two or more mesogenic structures and one or more phenylene groups; and an epoxy compound B that has two or more mesogenic structures and one or more divalent biphenyl gr...  
WO/2019/063391A1
The present invention relates to methods for the catalytic production of thermoplastic polyoxazolidones from aromatic diisocyanates and 2-phenyl-1,3-propanediol diglycidyl ether derivatives, and to the corresponding thermoplastic polyoxa...  
WO/2019/065470A1
Provided is a resin composition for fiber-reinforced composite materials, which forms a prepreg that has low tack properties and good handling properties, while achieving a good balance between fast curing properties and storage stabilit...  
WO/2019/065246A1
This resin composition comprises: a carboxyl group-containing resin; a polyfunctional vinyl ether compound; and a nitrogen-containing heterocyclic compound having three nitrogen atoms.  
WO/2019/063130A1
The present invention relates to a process for preparing two mixtures of epoxidized fatty acid esters, comprising in the order given a transesterification of an epoxidized vegetable oil, followed by a reduction of the volatile saturated ...  
WO/2019/065663A1
Provided is a curable resin composition suitable for use as a matrix resin for a fiber-reinforced composite material having excellent fatigue resistance, the curable resin composition having, low viscosity, minimal increase in viscosity ...  
WO/2019/064385A1
This curable resin composition comprises a photo-radical polymerization initiator, a monomer component, a photoacid generator, and a filler, wherein the monomer component includes a monomer having one radical polymerizable group and a cy...  
WO/2019/065075A1
Provided are: a photopolymerizable composition capable of forming a hard coat layer which hardly causes damages, curling or cracking and is highly resistant to heat and moisture; a hardened material obtained by polymerizing the photopoly...  
WO/2019/065552A1
Provided are: a phosphorus-containing phenoxy resin having excellent heat resistance, tracking resistance, safety, flame retardancy, processability and heat resistance; and a resin composition using the same. The phosphorus-containing ph...  
WO/2019/065776A1
The purpose of the present invention is to provide: a composition suitable as a curable composition; and a cured product of said composition, wherein a cured product having excellent curability, exemplified by heat resistance etc., can b...  
WO/2019/065248A1
Provided is a resin composition which satisfactorily infiltrates into reinforcing fibers, has rapid-curing properties, and gives cured formed objects having high heat resistance and which is suitable for use as a matrix resin for fiber-r...  
WO/2019/065770A1
The purpose of the present invention is to provide: a novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using said compound; and a method for producing said compound. A compound represented by formula (1) is p...  
WO/2019/064546A1
Provided are: (1) an epoxy resin comprising an epoxy compound having two aromatic rings that form a divalent biphenyl structure and mesogenic structures that are bonded to each of the two aromatic rings, at least one of the mesogenic str...  
WO/2019/058888A1
The present invention provides a composition which is capable of forming a coating film that has excellent defect suppressing properties, and which is also capable of forming a film that has an excellent refractive index. The present inv...  
WO/2019/060513A1
Disclosed is a tielayer composition having an epoxy-containing compound, a polythiol curing agent, a curing catalyst, and a solvent present in an amount of at least 25% by weight, based on the total weight of the tielayer composition. Al...  
WO/2019/059384A1
This thick copper circuit with attached protective material comprises: thick copper circuits; and a protective material disposed in spaces between the thick copper circuits and containing 55 vol% to 95 vol% of an inorganic filler.  
WO/2019/059210A1
This resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionall...  
WO/2017/190053A3
Methods for preparing dynamic cross-linked polymer compositions derived from an ester oligomer component, a polymeric chain extender component, and transesterification and poly condensation catalysts are described.  
WO/2019/060559A1
The present invention is directed toward an adhesive composition comprising: a first component; and a second component that chemically reacts with the first component, the second component comprising: a polythiol curing agent; and an alk...  
WO/2019/057737A1
The invention relates to an impregnation resin mixture and to the use thereof, in particular for the insulation of electric components. The aim of the invention is to provide suitable mixtures, which are used, in particular, for insulati...  
WO/2019/058970A1
Provided is an epoxy resin obtained by reacting epihalohydrin with a phenol-modified aromatic hydrocarbon-formaldehyde resin obtained by modifying an aromatic hydrocarbon formaldehyde resin with phenols, wherein the epoxy resin has a vis...  
WO/2019/059183A1
Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition i...  
WO/2019/053646A1
A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslink...  
WO/2019/054412A1
Provided is a curable composition containing: a multifunctional (meth)acrylate monomer (A), which includes at least two monomers selected from the group consisting of trifunctional (meth)acrylate monomers, quadrafunctional (meth)acrylate...  
WO/2019/055128A1
One-component epoxy adhesives containing a phosphorus-modified epoxy resin, a toughener and an epoxy resin that is neither rubber-modified nor phosphorus-modified. These adhesives are structural adhesives useful in automotive application...  
WO/2019/053645A1
A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), an...  
WO/2019/055342A1
An epoxy oligomerization catalyst can be employed to prepare an epoxy resin employing a method including admixing a first epoxy resin having a first epoxy equivalent weight of from about 100 to about 600 with a diphenolic compound, and a...  
WO/2019/054398A1
[Problem] To provide: a polysiloxane compound with which it is possible to improve the properties of a film formed from a single polymer, a copolymer, or another such polymer substance; and a composition containing the polysiloxane compo...  
WO/2019/051885A1
The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a cu...  
WO/2019/048676A1
This invention relates to a resin composition. The resin composition comprises a first polyfunctional epoxy component (i) comprising an epoxy resin based on a alkylol alkane triglycidyl ether monomer, and a second component, (ii) compris...  
WO/2019/049797A1
Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high...  
WO/2019/043843A1
The following are provided: a cured epoxy resin material that has a smectic structure and is a cured material from an epoxy compound having a mesogen structure and a curing agent having a flexible skeleton or a molecular chain with a mol...  
WO/2019/042583A1
The invention describes an advanced mixing and metering technology with online analytics for a supply of formulated liquid thermosetting resins into an open or closed mold. The application addresses where a precise control of the composi...  
WO/2019/044719A1
A polycarbodiimide compound represented by general formula (1). (In general formula (1), R1 and R3 may be the same or different and each represent a residue of an organic compound having one isocyanate-reactive functional group, the resi...  
WO/2019/044977A1
A resin composition which contains: (A) an epoxy resin that has a repeating unit represented by formula (1), while having a Z-average molecular weight of from 1,400 to 3,000 (inclusive); and (B) a cyanate ester compound. (In formula (1),...  
WO/2019/042799A1
The problem to be solved by the present invention is the provision of an epoxy resin-based latent curing composition having fast cure performance. The solution therefor is a latent curing composition comprising (A) an epoxy resin; and (B...  
WO/2019/046513A1
A curing agent for curing an epoxy resin comprises a fluorinated central moiety covalently bonded to first and second imide-amine moieties, the first and second imide-amine moieties include amine terminal functional groups, wherein the a...  
WO/2019/044813A1
[Problem] To provide a polybutylene terephthalate resin composition of superior alkaline solution resistance and hydrolysis resistance, and superior fluidity, as well as a molded article and composite using the same. [Solution] A polybut...  
WO/2019/044803A1
The present invention addresses the problem of providing a composition which enables the production of a cured product that is capable of achieving a good balance between heat resistance and decrease of elastic modulus, while exhibiting ...  
WO/2019/046382A1
Embodiments of the present disclosure are directed towards directed towards heat curing compositions. The heat curing compositions can include an isocyanate component, wherein the isocyanate component includes an isocyanate-polyol reacti...  

Matches 1 - 50 out of 60,374