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Matches 1 - 50 out of 62,648

Document Document Title
WO/2020/185554A1
Disclosed are two component laminating adhesive comprising a separate Component A and Component B. Component A comprises an amine curing agent. Component B comprises an epoxy composition. Components A and B react when mixed to form a cur...  
WO/2020/182781A1
A curable composition comprising: i) a glycidyl ether of a novolac, comprising or consisting of moieties having the formula (I), wherein - Ra is either always hydrogen or always methyl; - B is either always *-CH2-** or always formula (A)...  
WO/2020/184324A1
Provided is a resin composition for a fiber-reinforced plastic, the resin composition having an excellent balance between stability and curability, and producing a fiber-reinforced plastic having improved strength. This resin composition...  
WO/2020/184386A1
Disclosed are water absorbing resin particles having a gel leakage rate of 0 to 20%. The gel leakage rate is determined by a method including: preparing 20g of swollen gel formed from water absorbing resin particles that has absorbed phy...  
WO/2020/184642A1
Provided is a composition for forming a resist underlayer film that is insoluble in resist solvents, has favorable optical constants, and has a high etching rate. The composition has excellent ability to fill and flatten stepped substrat...  
WO/2020/177167A1
Provided in the present disclosure are a halogen-free flame-retardant thermosetting resin composition, a prepreg for printed circuits, and a metal-clad laminate. The halogen-free flame-retardant thermosetting resin composition comprises:...  
WO/2020/180979A1
A powder coated substrate comprising: a substrate; and a thermosetting epoxy powder coating composition, wherein the thermosetting epoxy powder coating composition is powder coated on the substrate, wherein the thermosetting epoxy powder...  
WO/2020/180974A1
A thermosetting epoxy composition, comprising: 100 parts by weight of an epoxy resin composition; 30 to 200 parts by weight of an aromatic dianhydride curing agent; optionally 20 to 100 parts by weight of a liquid monoanhydride curing ag...  
WO/2020/177486A1
Dual-component aqueous epoxy resin paint, containing: a) an aqueous epoxy resin emulsion, containing a low-epoxy-equivalent epoxy resin having an epoxy equivalent ranging from 400 to 700 g/eq and a high-epoxy-equivalent epoxy resin havin...  
WO/2020/179988A1
The present invention relates to an epoxy resin composition for sealing semiconductor devices, the epoxy resin composition having low dielectric properties.  
WO/2020/179287A1
The present invention provides: an acid group-containing (meth)acrylate resin characterized by containing a reaction product (I) of an epoxy resin (A), an unsaturated monobasic acid (B), and a polybasic acid anhydride (C), an epoxy resin...  
WO/2020/179642A1
The purpose of the present invention is to provide: a porous body in which an imbibition under acidic conditions is suppressed; and a method for producing the porous body. In order to achieve the purpose, a first porous body according ...  
WO/2020/179413A1
The present invention is an epoxy resin composition containing an epoxy resin (A) having an alicyclic structure and an epoxy resin curing agent (B) including bis(aminomethyl)cyclohexane and a cured product thereof, and a fiber-reinforced...  
WO/2020/180976A1
An electronic device encapsulated by a curable encapsulant composition, the curable encapsulant composition comprising: 100 parts by weight of an epoxy resin composition; 2 to 200 parts by weight of an aromatic di anhydride curing agent;...  
WO/2020/179757A1
The purpose of the present invention is to provide: a protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate a...  
WO/2020/180973A1
A metal-clad laminate comprising: a prepreg comprising a reinforcing structure and a curable epoxy composition, the curable epoxy composition comprising: 100 parts by weight of an epoxy resin composition comprising a non-fluorinated epox...  
WO/2020/175273A1
Provided are an adhesive for an endoscope, and a cured product thereof, the adhesive containing: an epoxy resin containing at least one among a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a phenol novolac epoxy resin; a curab...  
WO/2020/175038A1
A resin composition which comprises a polymer (A) having a protonic polar group, a crosslinking agent (B) represented by formula (1), and a quinonediazide compound as a radiation-sensitive compound (C). In formula (1), the two or more R ...  
WO/2020/175037A1
A resin composition containing a polymer (A) having a protic polar group and a crosslinking agent (B) represented by formula (1). Here, the polymer (A) having a protic polar group includes a cyclic olefin polymer having a protic polar gr...  
WO/2020/175337A1
According to the present invention, there is provided a laminated body having a substrate, a hard coat layer, and a scratch resistant layer in this order, wherein the hard coat layer includes a cured product of a composition for forming ...  
WO/2020/175380A1
Provided are a novel amine composition and amine compound. Provided are a production method thereof, as well as an epoxy resin curing agent, an epoxy resin composition, a cured product, a urethane prepolymer curing agent, a polyurethane ...  
WO/2020/175669A1
A sealing composition that contains: a first epoxy resin which comprises, in each molecule, at least two benzene rings and at least one ether bond that connects the two benzene rings directly or via a linking group, and which is configur...  
WO/2020/146044A3
A curing agent composition contains at least one multifunctional aromatic amine that forms a crystalline solid at 25°C, and at least one halo-substituted diethyltoluenediamine, in an amount effective to inhibit crystallization of the at...  
WO/2020/175105A1
A polyalkylene glycol copolymer that has a weight-average molecular weight of 5,000 to 100,000 and a total content of functional groups selected from a carboxy group, epoxy group, hydroxy group, and amino group of 0.1 mmol/g to 3.0 mmol/...  
WO/2020/175277A1
An adhesive for an endoscope, the adhesive comprising (a)-(c), a cured product thereof, an endoscope in which members are fixed using the cured product, and a manufacturing method thereof. (a) an epoxy resin including at least one kind a...  
WO/2020/176456A1
A curable epoxy composition, comprising: an epoxy resin composition comprising one or more epoxy resins, each independently having at least two epoxy groups per molecule; an epoxy resin curing agent; optionally a curing catalyst; and a f...  
WO/2020/175272A1
Provided are: an adhesive agent for an endoscope and containing a curing component, an acid-based curing acceleration component, and an epoxy resin containing at least one among bisphenol A epoxy resin, bisphenol F epoxy resin, and a phe...  
WO/2020/175278A1
An adhesive for an endoscope, the adhesive comprising (a)-(c), a cured product thereof, an endoscope in which members are fixed using the cured product, and a manufacturing method thereof. (a) an epoxy resin including at least one kind a...  
WO/2020/172191A1
Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular stmcture (R1-(Y1)n), wherein R1 is an ionic moiety, Y1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting...  
WO/2020/171053A1
The objective of the present invention is to provide a curable resin composition having both excellent properties of adhering to an alignment film and moisture permeation preventive properties. In addition, the objective of the present i...  
WO/2020/171100A1
An aspect of the present invention is an optical-waveguide-clad composition that is characterized by containing a bisphenol-type epoxy compound (A) and an epoxy compound (B) that contains at least one of structures represented by formula...  
WO/2020/170847A1
A semiconductor sealing material according to the present invention is used to manufacture a semiconductor device 1. The semiconductor device 1 comprises a semiconductor chip 2 and a sealing part 3. The sealing part 3 is formed from a cu...  
WO/2020/170778A1
The purpose of the present invention is to provide: a liquid epoxy resin composition which is a low-viscosity liquid at room temperature, exhibits sufficient adhesive strength, and provides a cured product exhibiting a lower dielectric c...  
WO/2020/171004A1
A curable resin composition which comprises one or more epoxy resins and one or more hardeners, wherein the epoxy resins comprise an epoxy resin including an aromatic ring having no electron-donating group bonded thereto and having an ep...  
WO/2020/166580A1
Provided is a method for producing a polymer, characterized by reacting (A) an epoxy compound having two or more epoxy groups in the molecule with (B) a reactive compound having, in the molecule, two or more functional groups reactive wi...  
WO/2020/164896A1
The subject matter of the invention is a kit for floor coating or for wall coating, comprising: - a component A comprising an epoxy resin, - a component B comprising a hardener, which is a compound comprising at least one N-H or S-H func...  
WO/2020/166137A1
The present invention provides an electroconductive composition which gives electroconductive films having a low volume resistivity and excellent moisture resistance. The electroconductive composition of the present invention comprises e...  
WO/2020/166398A1
Provided is a latent curing agent having porous particles for retaining an aluminum chelate compound, and, on the surfaces of the porous particles, a coating film containing the aluminum chelate compound and a polymer having a urea bond ...  
WO/2020/166533A1
The objective of the present invention is to provide: a curable composition which has excellent adhesion to an inorganic substrate or to an inorganic compound layer, and from which a cured product that does not easily peel off even when ...  
WO/2020/166441A1
The objective of the present invention is to provide a liquid composition which is for a fiber-reinforced plastic intermediate substrate, and which imparts excellent FRP mechanical properties and can suppress voids as much as possible....  
WO/2020/166212A1
The objective of the present invention is to provide: an acid-modified maleimide resin from which a cured product having excellent alkali developability and heat resistance can be obtained, and a curable resin composition including said ...  
WO/2020/166180A1
The purpose of the present invention is to provide an electroconductive composition which gives electroconductive films having a low volume resistivity and a low contact resistivity. The electroconductive composition of the present inven...  
WO/2020/167308A1
The present disclosure provides a syntactic structural adhesive comprising an epoxy resin, a low density particulate filler and a hardener that, upon curing, exhibits at least the following well-balanced properties: (i) a density less th...  
WO/2020/161926A1
A resin composition obtained by melting a resin mixture containing (A) a polymaleimide compound, (B) a benzoxazine, (C) an epoxy resin, and (D) a coumarone resin, wherein the resin composition contains 40-70 mass parts of the (A) polymal...  
WO/2020/162537A1
The purpose of the present invention is to provide an ester compound that can be used in a resin composition that has excellent heat resistance and dielectric properties after curing. Additionally, the purpose of the present invention is...  
WO/2020/161538A1
An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II a...  
WO/2020/161584A1
Described is a cationic initiator system comprising a cationic initiator; and an accelerator composition comprising 1) a peroxyketal; and 2) an accelerator compound selected from arylhydroxy compounds and β-diketone compounds.  
WO/2020/158259A1
The present invention provides a composition for forming a thermally conductive material, which enables the achievement of a thermally conductive material that has excellent thermal conductivity. The present invention also provides a the...  
WO/2020/158776A1
An objective of the present invention is to provide a sealant, for an organic EL display element, that excels in low outgassing and coating properties and makes it possible to achieve an organic EL display element excelling in light extr...  
WO/2020/158511A1
The purpose of the present disclosure is to provide: a sheet-shaped prepreg for fan-out package sealing that has both a low coefficient of linear thermal expansion and high flexibility, can form a cured product having excellent warping i...  

Matches 1 - 50 out of 62,648