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Matches 1 - 50 out of 61,026

Document Document Title
WO/2019/171993A1
Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking...  
WO/2019/171991A1
The purpose of the present invention is to provide a resin composition which has excellent fast curing properties without deteriorating heat resistance and low viscosity. A resin composition for fiber-reinforced composite materials, whic...  
WO/2019/170653A1
The invention relates to a biocidal coating material and an associated production process. The process comprises the steps of: (i) providing a ureamine component obtainable by reaction of a) an aliphatic or araliphatic di- or triisocyana...  
WO/2019/170563A1
The present invention related to an epoxy curing agent comprising a first amine component and a second amine component. The present invention also relates to an epoxy resin system containing the reaction product of an epoxy resin compone...  
WO/2019/167824A1
A paste adhesive composition which contains silver particles and a monomer, and forms a silver particle-linking structure in which the interfaces between the silver particles have been eliminated by a heat treatment, wherein: the silver ...  
WO/2019/167819A1
A paste adhesive composition which is to be used as a highly reflective adhesive and contains silver particles, a monomer and a principal agent, wherein condition (A), condition (B) and condition (C) are satisfied by the reflectivity pro...  
WO/2019/167579A1
A heat-curable resin composition which contains at least [A] an epoxy resin having at least two glycidyl groups, [B] a cyanate ester resin having at least two cyanate groups and [C] an amine compound and meets the requirements (1) and (2...  
WO/2019/169360A1
The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requir...  
WO/2019/165583A1
Disclosed by the present invention are a reversible self-repairing epoxy resin and a preparation and recovery remoulding method therefor. Under the catalysis of potassium iodide, the acetate solution of 2-mercaptoacetic acid is oxidized ...  
WO/2019/164883A1
Polyether- or polyester-epoxide polymer (PEEP) compositions are disclosed. The compositions comprise reaction products of a polyepoxide compound and a polyol composition. The polyol composition has a melting point within the range of 20...  
WO/2019/163804A1
Provided are: a curable composition giving a cured object which has high strength, high rigidity, and flexibility; and the cured object obtained by curing the curable composition. The curable composition is a multi-pack type curable comp...  
WO/2019/163577A1
The present invention is a curable composition which comprises an urethane modified epoxy resin (A) as an essential component of a main agent and an acid anhydride (B) as an essential component of a curing agent, and is characterized in ...  
WO/2019/163970A1
The purpose of the present invention is to provide: an epoxy group-containing polyorganoxiloxane which is excellent in terms of curability, surface properties of coating films, adhesiveness and impact resistance; a curable resin composit...  
WO/2019/163067A1
(1) An epoxy resin capable of forming a cured object having a phase separation structure constituted of two or more phases, at least one of which comprises a liquid-crystal structure, and (2) an epoxy resin which, when heated from ordina...  
WO/2019/163981A1
The purpose of the present invention is to provide a base proliferating agent which is obtained by derivatizing and setting to a latent state aminopyridines that, due to being highly active, have not been used yet in a crosslinking react...  
WO/2019/164568A1
Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable b...  
WO/2019/163818A1
The present invention pertains to: an epoxy resin composition which is capable of undergoing curing in a short period of time even under low-temperature conditions to form a cured product having excellent moisture resistance, and which i...  
WO/2019/159368A1
An epoxy resin composition that is a reaction induction-type epoxy resin composition containing an epoxy compound and a curing agent and capable of forming a smectic liquid crystal structure, that contains no filler or has a filler conte...  
WO/2019/160143A1
This epoxy resin contains an epoxy compound having two or more mesogenic structures, wherein the loss tangent thereof at 35°C before being cured is 1 or more.  
WO/2019/159916A1
A kit which contains a curable composition for imprinting and a composition for forming an underlayer film for imprinting, and which is configured such that the composition for forming an underlayer film for imprinting contains: a polyme...  
WO/2019/155169A1
The present invention relates to difunctional biphenyl compounds according to formula (I): in which Alk, Alk' and R are as defined in the description. Said compounds are suitable for use as curing agents for thermosetting resins, particu...  
WO/2019/156154A1
The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resi...  
WO/2019/155989A1
Provided is a photosensitizer with which it is possible to cure a compound having polymerizable groups efficiently by irradiation of active energy rays. A photosensitizer containing graphene having a number-average molecular weight (Mn) ...  
WO/2019/155800A1
The present invention addresses the problem of providing a resist composition which has excellent storage stability and is excellent in terms of screen printability, resolution, low warpage, flexibility, chemical resistance, and flame re...  
WO/2019/156341A1
The present invention relates to a powder coating composition comprising: epoxy resins including a bisphenol A type epoxy resin, an isocyanate modified epoxy resin, and a novolac type epoxy resin; and an amine-based curing agent.  
WO/2019/151123A1
Provided is a monomer mixture which is rapidly cured even in high humidity environments and is useful as a raw material for a curable composition capable of forming a cured product having excellent adhesion to paper and plastic as well a...  
WO/2019/151014A1
Provided is an adhesive composition which has low dielectric constant and dielectric tangent, and has an excellent flex resistance. This adhesive composition contains, with respect to a total of 100 parts by mass of the adhesive composit...  
WO/2019/148538A1
A modified epoxy acrylate and a solder mask comprising same, relating to the technical field of synthetic resins. A long-chain aliphatic chain is added to a branch of carboxylic acid epoxy acrylate to prepare a modified epoxy acrylate. A...  
WO/2019/151471A1
Provided are: a resist underlayer film having, in particular, a high dry etching speed; the resist underlayer film formation composition; a resist pattern formation method, and a method for manufacturing a semiconductor device. The resis...  
WO/2019/146736A1
The present invention provides a curable resin composition for sealing, which contains (A) a bifunctional alicyclic epoxy resin having a molecular weight of less than 1,000, (B) a polyfunctional epoxy resin having a molecular weight of 1...  
WO/2019/146672A1
The purpose of the present invention is to provide: a resin composition and a cured product of the same which, after curing, has excellent impact resistance when dropped as well as excellent solvent resistance; an adhesive for an electro...  
WO/2019/146617A1
The problem addressed by the present invention is to provide a resin composition for sealing capable of suppressing warpage even when sealing a large-area substrate. To solve this problem, a resin composition for sealing electronic compo...  
WO/2019/146532A1
Provided is an alkali-soluble resin that is used to obtain an alkali-soluble radiation-sensitive resin composition having excellent alkali solubility and resolution, and developability with a close fit. The present invention pertains to ...  
WO/2019/145503A1
The invention is directed to a composition comprising an epoxy-based curable adhesive comprising at least one an epoxy resin modified acrylonitrile-butadiene copolymer and at least one thermoplastic elastomer, wherein the at least one th...  
WO/2019/142415A1
A photosensitive resin composition for a color filter, said photosensitive resin composition comprising: a copolymer (A) which contains a structural unit (a) having an acid group and a structural unit (b) having a cyclic ether group; a c...  
WO/2019/142646A1
According to the present invention, a curable resin composition for case type sealing under no pressure is in a solid state at 25°C and has a gel time of 10 minutes or more at 110°C.  
WO/2019/142528A1
A method for manufacturing a concave-convex structure whereby a concave-convex structure having a pattern that is the inverted concave-convex pattern of a mold is manufactured, said method comprising: a preparation step for preparing a l...  
WO/2019/142735A1
This prepreg contains a reinforcing fiber substrate and a resin composition which is impregnated into the same. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. The amine curing agent c...  
WO/2019/141451A1
The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposi...  
WO/2019/142752A1
Provided is a heat-curable resin composition which rarely undergoes dripping or bleeding even when used for the hole plugging in a printed wiring board which has holes, such as through-holes, each having a large opening size, and is part...  
WO/2019/138919A1
This liquid sealing resin composition contains an epoxy resin, an amine-based curing agent, and a cyclic carbodiimide.  
WO/2019/138059A1
The invention pertains to a curing agent comprising (a) one or more fatty amine selected from the group consisting of an alkylated polyamine, bisalkylated amine, alkylated primary amine, an alkoxylated polyamine, bisalkoxylated amine and...  
WO/2019/139112A1
Particles of a hardener comprising a urea compound for epoxy resins are provided. When the particles are contained in an epoxy resin composition, excellent storage stability and heating stability can be imparted to the epoxy resin compos...  
WO/2019/138953A1
This composition includes a pigment, a cationic polymer compound, and an acid-generating agent. It is preferred that the pigment includes a tetraaza porphyrin pigment, a triarylmethane pigment or a cyanine pigment. It is preferred that t...  
WO/2019/138988A1
Provided is an alicyclic epoxy compound product used for the purpose of forming a cured product having excellent heat resistance and transparency. An alicyclic epoxy compound product according to the present invention is characterized in...  
WO/2019/139354A1
The present invention relates to an epoxy resin composition for semiconductor molding, which has excellent heat resistance and mechanical properties and has a low thermal expansion coefficient and thus exhibits an improved bending proper...  
WO/2019/134821A1
The invention relates to an epoxy resin composition comprising at least one epoxy liquid resin, bis(aminomethyl)cyclohexane and a wax. The claimed composition can be processed in an excellent manner, cures very rapidly and virtually no y...  
WO/2019/134824A1
The present invention relates to amine-based curing agents for epoxy resins with low tendency to the formation of carbamates. In particular the invention relates to methylcyclohexyl diamine based adducts which are particularly suitable f...  
WO/2019/127172A1
This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present inventio...  
WO/2019/131095A1
An encapsulating epoxy resin composition for ball grid array (BGA) packages which comprises an epoxy resin, a phenolic hardener having a hydroxyl equivalent of 120 g/eq or less, and an inorganic filler comprising alumina particles and si...  

Matches 1 - 50 out of 61,026