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Matches 1 - 50 out of 60,645

Document Document Title
WO/2019/111747A1
This prepreg comprises reinforcing fibers and an epoxy resin composition containing [A] an epoxy resin and [B] an aromatic urea as a curing agent, and the epoxy resin composition satisfies conditions (a) to (e): (a) as the epoxy resin [A...  
WO/2018/118137A8
The present invention relates to an amine-based curing agent comprising at least 1 % by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine ...  
WO/2019/111796A1
A purpose of the present invention is to provide a photosensitive resin composition which retains satisfactory image resolution and gives cured objects reduced in wet-heat dissolution or contamination and having satisfactory wet-heat adh...  
WO/2019/111707A1
This epoxy resin composition contains an epoxy resin, a curing agent and an inorganic filler, while containing chlorine-containing particles that contain an organic substance.  
WO/2019/111824A1
Provided is a fluorine-containing elastic copolymer which has excellent bondability, processability, mechanical characteristics, heat resistance and chemical resistance. A fluorine-containing elastic copolymer which contains a unit based...  
WO/2019/111607A1
An epoxy resin curing agent which contains (A) at least one compound selected from the group consisting of N-aminoethyl piperazine and isophorone diamine and (B) a bis(aminomethyl)cyclohexane; an epoxy resin composition which contains th...  
WO/2019/106812A1
Provided is a compound powder that has excellent fluidity. The compound powder comprises: a first powder that includes metallic element-containing particles and a resin composition that coats the metallic element-containing particles; an...  
WO/2019/106031A1
TITLE HEAT-CURABLE HYBRID EPOXYFUNCTIONAL COMPOSITION AND TRANSPARENT HEAT-CURED ABRASION-RESISTANT COATINGS PREPARED THEREFROM INVENTORS Haipeng Zheng Matthew Freeman APPLICANT Essilor international The present invention relates to a he...  
WO/2019/107486A1
A sealant sheet molded in a sheet shape is provided. The sealant sheet includes an epoxy-group-containing polysulfide. The epoxy-group-containing polysulfide has a disulfide structure and an epoxy group in the molecule thereof.  
WO/2019/107070A1
The curable resin composition according to the present invention, which has high storage stability, excellent curability and good washing properties, comprises a curable resin (A), a latent curing agent (B) and an isocyanate compound (C)...  
WO/2019/107755A1
The present invention provides a method for producing a polyamide using a terminal encapsulant, and a polyamide produced thereby, wherein the method is an eco-friendly process method without using a solvent as a catalyst and can prepare,...  
WO/2019/106953A1
Provided are: a resin sheet which is capable of maintaining flexibility after curing, and which is suitable for sealing of semiconductor elements; and a semiconductor device which is produced using this resin sheet. A resin sheet which i...  
WO/2019/106813A1
The compound according to the present invention includes: a resin composition containing an epoxy resin, a phenol resin, a wax, and an imidazole-based compound; and a powder containing a metal element; the epoxy resin including a crystal...  
WO/2019/106810A1
Provided is a compound powder which has excellent fluidity, excellent storage stability, and excellent moldability. The compound powder contains a metal element-containing powder, an epoxy resin, and a curing agent, wherein, after the co...  
WO/2019/101918A1
The invention relates to an adhesive tape comprising at least one layer of an adhesive adhesion compound which comprises a polymer film-forming agent matrix and a curable composition, said curable composition having at least one epoxy re...  
WO/2019/101916A1
The invention relates to a curable composition comprising at least one epoxy resin and at least one curing reagent for said epoxy resin, characterised in that a fatty-acid modified epoxy resin is used as the epoxy resin, and the curing r...  
WO/2019/102719A1
The present invention addresses the problem of providing a filmy semiconductor encapsulant which satisfies properties required of NCFs. The problem is solved with a filmy semiconductor encapsulant which comprises (A) a compound having a ...  
WO/2019/101913A1
The invention relates to a process for producing pressure-sensitive adhesive compositions which comprise at least one elastomer component and at least one reactive adhesive, comprising one or more reactive resins, at least one of the rea...  
WO/2019/101563A1
The invention relates to a curing composition for a multi-component epoxy resin compound, comprising at least one first polyamine and at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac res...  
WO/2019/102853A1
The present invention provides an epoxy resin composition characterized by comprising: an epoxy resin (A) which is a product of reaction between an epihalohydrin and either catechol optionally having a methyl group as a substituent bonde...  
WO/2019/102335A1
A curable coating composition precursor comprising: (a) a first part (A) comprising (i) at least one amine epoxy curing agent based on a phenolic lipid, and (ii) inorganic microspheres; and (b) a second part (B) comprising (i) at least o...  
WO/2019/102985A1
Provided is a glove comprising a cured elastomer film including, in a polymer backbone, (meth)acrylonitrile-derived structural units, unsaturated carboxylic acid-derived structural units, and butadiene-derived structural units, wherein t...  
WO/2019/101914A1
The invention relates to an adhesive tape comprising at least one layer of an adhesive adhesion compound which comprises a polymer film-forming agent matrix (M) and a curable composition, said curable composition comprising at least one ...  
WO/2019/098028A1
Provided is a thermosetting resin composition that can be used to provide a fiber-reinforced composite material having both high heat resistance and high flexural strength, and that has storage stability, thermal stability, and fast curi...  
WO/2019/098201A1
This prepreg contains carbon fibers and a resin composition which contains: an epoxy resin which has a biphenyl structure; a curing agent; and a melamine cyanurate.  
WO/2019/098053A1
This resin composition for reinforcement contains an epoxy compound and a curing agent, wherein the composition contains, as the epoxy compound, 25–100 mass% of a bisphenol-E epoxy resin with respect to the entire amount of the epoxy c...  
WO/2019/097002A1
This invention relates to a hardener composition Η for an aqueous epoxy resin based two-pack coating formulation wherein the hardener composition Η comprises reaction products of at least difunctional epoxides H1, at least difunctional...  
WO/2019/097039A1
The invention relates to a multi-layer coating comprising a first layer of an epoxy primer applied in the form of a two-pack water-based epoxy coating composition, and a second layer applied in the form of a coating composition comprisin...  
WO/2019/098114A1
An epoxy (meth) acrylate resin composition containing: an epoxy (meth) acrylate resin (A) having, as essential reactive raw materials thereof, an epoxy resin (a1) and a carboxyl group-containing (meth) acrylate compound (a2); and an acid...  
WO/2019/093139A1
The present invention provides: a curable composition characterized by comprising an epoxy compound (A), one or more amine compounds (B), and an acrylic resin (C), the amine compounds (B) comprising an N-(aminoalkyl)piperazine compound (...  
WO/2019/092968A1
Provided is a resin composition having excellent preservation stability and solubility in a low-boiling point solvent such as methyl ethyl ketone. The resin composition is produced through a melt-mixing step of melt-mixing a resin mixtur...  
WO/2019/091900A1
A curable composition 35a,35b for treating a region of a formation comprises an epoxy resin and a crosslinking or hardening system. The crosslinking or hardening system comprises a first crosslinker or hardener, wherein the first crossli...  
WO/2019/090563A1
Disclosed herein are compounds of formulas (I) and (II), Wherein R1, R2, R3 and (l) are as described herein. Methods of making compounds of formulas (I) and (II), curable compositions containing them and cured compositions containing the...  
WO/2019/092359A1
The subject of the present invention is the polyepoxidized biphenyl compounds corresponding to formula (I) below: wherein R, Ru R2 and R3 are as defined in the description, and also the mixtures of at least two of said compounds. These p...  
WO/2019/092032A1
The present invention relates to novel polymerisable compounds derived from cardanol, and a diphenol, to the polymerisation of same, and to the use of said polymers in materials for industry.  
WO/2019/094013A1
The present invention provides benzylated triaminononane compounds, epoxy curing agent compositions comprising benzylated triaminononane compounds and methods of making such compositions. Amine-epoxy compositions and articles produced fr...  
WO/2019/087258A1
Provided is a resin composition for injection molding, containing a curable component and exfoliated graphite. Also provided is molding comprising an element and a sealing portion which seals the element, wherein the sealing portion cont...  
WO/2019/087463A1
The present invention provides: a circuit board obtained using an epoxy resin composition that can have a satisfactory level of low-shrinkage rate after being cured, and can be used to obtain a circuit board having less warpage and excel...  
WO/2019/087877A1
Provided are an epoxy resin composition which not only has high heat resistance and mechanical strength but also has excellent damping properties and a film or forming material comprising or obtained from the epoxy resin composition. The...  
WO/2019/088617A1
According to an embodiment of the present invention, an epoxy resin composition is provided, wherein the epoxy resin composition includes an epoxy resin and cyanamide, and contains 5-20 parts by weight of the cyanamide with respect to 10...  
WO/2019/088037A1
Provided are: a base generator which generates a strong base and exhibits excellent reaction efficiency in a very small amount, while having high thermal latency; and a resin composition which contains this base generator. The present in...  
WO/2019/086654A1
The invention relates to a hardener component for a multi-component epoxy resin mass and to an epoxy resin mass produced by using the hardener component, the hardener component comprising, as a hardener, at least one Mannich base and one...  
WO/2019/088739A1
The present invention relates to: a liquid crystal aligning agent composition for forming a liquid crystal alignment layer having an excellent alignment property and durability and, simultaneously, having improved electrical properties a...  
WO/2019/088122A1
The present invention provides a resin composition that demonstrates, when being cured, excellent toughness and heat resistance and that provides, as a resin composition, excellent handleability. The present invention pertains to a therm...  
WO/2019/087641A1
Provided is a resin composition for injection molding, containing a curable component and exfoliated graphite. Also provided is a molding, comprising an element and a sealing portion which seals the element, wherein the sealing portion c...  
WO/2019/081581A1
The present invention relates to heat-curing one-component epoxy resin compositions which exhibit a good storage stability. The epoxy resin compositions are particularly suitable for use as a structural adhesive and for producing structu...  
WO/2019/083002A1
[Problem] To provide: a composition for cured resin, for obtaining a cured product that has both high thermal resistance and high mechanical strength; a cured product thereof; and a production method for the composition for cured resin a...  
WO/2019/083004A1
[Problem] To provide: a composition for cured resin, for obtaining a cured product that has excellent thermal resistance and excellent high temperature stability; a cured product thereof; and a production method for the composition for c...  
WO/2019/083921A2
Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aroma...  
WO/2019/082595A1
The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties,...  

Matches 1 - 50 out of 60,645