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Matches 1 - 50 out of 59,842

Document Document Title
WO/2018/226710A1
Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer...  
WO/2018/223780A1
The present invention provides a preparation method for an epoxy resin composite, comprising: bisphenol AF being completely dissolved in epichlorohydrin, and a catalyst then being added for a reaction so as to obtain a resin etherate; th...  
WO/2018/223524A1
The present invention provides a halogen-free epoxy resin composition, a prepreg and laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reacti...  
WO/2018/225411A1
The purpose of the present invention is to provide: an epoxy resin which provides excellent balance between the molding shrinkage rate during thermal curing of a composition containing the epoxy resin and heat resistance of a cured produ...  
WO/2018/227151A1
In one aspect, compositions are described herein, and in another aspect methods are described herein. In some embodiments, a polymerizable composition described herein comprises (i) one or more alkoxylated or alkenoxylated, or non-alkoxy...  
WO/2018/225665A1
Provided is a resin composition which contains an epoxy resin and which, upon curing, can become a cured object having heat resistance. The resin composition comprises an epoxy resin (A), a phenol compound (B), and an imidazole compound ...  
WO/2018/225834A1
The purpose of the present invention is to provide a compound which is capable of forming a polymer composite (such as a fiber-reinforced composite material) having excellent mechanical properties (especially, toughness), while being eas...  
WO/2018/221682A1
A liquid resin composition for resin molding, including: an aliphatic epoxy compound (A); an epoxy compound (B) having an aromatic ring in the molecules thereof; a nitrogen-containing heterocyclic compound (C); and an inorganic filler (D).  
WO/2018/220133A1
The present invention relates to a composition containing cement, filler, polymer and a compound comprising epoxy groups and an amine, wherein the composition contains more than 10 wt% cement and is a storage-stable, pourable powder and/...  
WO/2018/219961A1
The invention relates to heat-curing epoxy resin compositions, which can be used in particular as body-in-white adhesives for vehicle construction. The heat-curing epoxy resin compositions contain a curing agent, which can be activated b...  
WO/2018/221681A1
A liquid resin composition for sealing that includes: an aliphatic epoxy compound (A); an epoxy compound (B) having an aromatic ring in the molecules thereof; a nitrogen-containing heterocyclic compound (C); and an inorganic filler (D). ...  
WO/2018/220934A1
Provided are: an epoxy resin composition that has exceptional releaseability during continuous molding and exceptional soldering heat resistance (product adhesion), and that undergoes little discoloration when left at high temperatures; ...  
WO/2018/221217A1
The purpose of the present invention is to provide a curable resin composition which exhibits excellent fluidity prior to curing, and excellent adhesive properties, heat resistance and flexing resistance following curing. In addition, th...  
WO/2018/216643A1
The present invention provides an epoxy resin composition which is easily B-staged and exhibits good curability in a short time, and which provides a resin cured product having high heat resistance. The present invention also provides a ...  
WO/2018/216524A1
Provided are: a molding material that enables the achievement of a fiber-reinforced composite material which has excellent releasability from a mold and excellent surface appearance, and which does not soil a mold surface much after mold...  
WO/2018/214680A1
A basalt fiber composite material and a preparation method therefor. The method comprises: mixing an epoxy resin and a cyanate resin by stirring according to a ratio, adding a toughening agent, then adding a solidification catalyst, and ...  
WO/2018/216406A1
This surface treatment agent using a compound represented by formula (1) or (2) can, even without having a hydrolyzable group, form a water repellent and oil repellent layer having excellent abrasion resistance under mild conditions such...  
WO/2018/217996A1
A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbui...  
WO/2018/216752A1
The present invention addresses the problem of providing: an epoxy resin that has excellent flexibility; an epoxy resin-containing composition; and a cured product. The present invention relates to an epoxy resin which is a reaction prod...  
WO/2018/216814A1
Provided are: a conductive paste composition which has low electrical resistance and does not cause excessive shrinkage during the formation process of an electrode, while being capable of suppressing internal stress upon the completion ...  
WO/2018/213850A1
A method of making a fimctionalized fluonnated monomer for use in making oligomers and polymers that can be used to improve surface properties of polymer-derived systems, such as coatings. The method of making a fimctionalized fluonnated...  
WO/2018/211890A1
The present invention provides an alkali soluble resin preferably used to obtain an alkali soluble radiation-sensitive resin composition that is highly soluble, highly sensitive, has a high thermal resistance and transparency, and high s...  
WO/2018/213695A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/209483A1
Water-based adhesive composition are disclosed, the compositions comprising an acrylic dispersion, an epoxy-terminated polyester incorporated into the acrylic dispersion, and a water-dispersible isocyanate. Methods for laminating a first...  
WO/2018/212766A1
The present invention relates to epoxy curing agents which are obtained from the reaction of a polyalkylene polyether modified polyepoxide resin and a polyamine component. They polyamine component is a reaction product of a polyethylene ...  
WO/2018/213317A1
The present invention provides, among others, compounds of the following formula which can be used as degradable curing agents, methods for preparing the compounds, degradable polymers and reinforced composites, methods for degrading and...  
WO/2018/210861A1
The invention provides a curing agent comprising the reaction product of (I) an aliphatic polyglycidyl ether of a triol, such as glycerine; with a diamine (II); wherein said diamine (II) comprises a first primary or secondary amine group...  
WO/2018/213668A1
The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without m...  
WO/2018/212228A1
The purpose of the present invention is to provide a polyorganosilsesquioxane which is capable of forming a hard coat layer having a high surface hardness by in-mold injection molding, and which forms a tack-free coating film, thereby be...  
WO/2018/212233A1
The present invention addresses the problem of providing a curable composition for an adhesive agent, said curable composition being able to be cured at a lower temperature to form a cured article having excellent heat resistance, cracki...  
WO/2018/212176A1
[Problem] To provide a photopolymerization sensitizer which gives a practically sufficient photocuring rate without arousing the problem wherein additives including a photopolymerization sensitizer bleed out to the surface during photocu...  
WO/2018/207509A1
Provided is a fiber-reinforced composite material having high heat resistance and excellent quality of appearance. This epoxy resin composition for a fiber-reinforced composite material comprises the following constituent elements (A), (...  
WO/2018/207876A1
One aspect of the present invention is a resin composition that includes an acrylic resin and a curing agent, wherein the acrylic resin is a resin that is obtained by polymerizing monomer components, said monomer components including a f...  
WO/2018/207510A1
Provided is a method for producing a fiber-reinforced composite material having high heat resistance and excellent quality of appearance. Disclosed is a method for producing a fiber-reinforced composite material, the method comprising: a...  
WO/2018/207647A1
The present invention provides a composition for forming an insulating film, the composition being capable of forming insulating films which are excellent in terms of insulating property and heat resistance, are effective in inhibiting w...  
WO/2018/205818A1
The present invention relates to a polymer of formula (I), wherein Ra-Rd, Ra0-Rd0, Ra1-Rd1, Ra2-Rd2, n, n0, n1 and n2 are as defined in the description. When the polymer is used as a film-forming resin for a photoresist, same has the fol...  
WO/2018/207532A1
Provided are: an active ester compound that exhibits excellent dielectric characteristics and copper foil adhesiveness in a cured product; a curable composition comprising the same and a cured product thereof; and a semiconductor sealing...  
WO/2018/207920A1
[Problem] To provide an epoxy resin composition which is used for forming an adhesive layer for a semiconductor device and which has excellent heat resistance and adhesive properties. [Solution] Provided is an epoxy resin composition for...  
WO/2018/208420A1
A novel sulfanilamide containing epoxy resin composition capable of fast curing without negative impact on glass transition temperature or mechanical performance.  
WO/2018/203540A1
[Problem] To provide a resist underlayer film-forming composition that functions as an anti-reflection film during exposure, that can have recessed portions having a narrow space and a high aspect ratio embedded therein, and that is high...  
WO/2018/198921A1
Provided is a composition which comprises a compound A that has a specific structure containing an isocyanate group, a compound B that has a specific structure containing a hydroxyl group and a carboxyl group, and a compound C that has a...  
WO/2018/198992A1
Provided is a liquid sealing resin composition that satisfies any one of requirements (1) to (3). (1) The composition comprises an epoxy resin, an aromatic amine compound, and a dicyandiamide, the content of the dicyandiamide being 0.05 ...  
WO/2018/199306A1
Provided is a sealing film made of a resin composition comprising a thermosetting resin that has a structural unit represented by formula (1), and an inorganic filler: [in formula (1), X1 denotes a reactive functional group and R1 denote...  
WO/2018/199127A1
The present invention provides a polyarylate resin which has excellent curing reactivity and is capable of forming a cured product that has sufficiently excellent heat resistance. The present invention relates to a modified polyarylate r...  
WO/2018/193979A1
The present invention provides a novel fluorine-containing epoxy-modified silsesquioxane which can form a cured product having excellent scratch resistance. This fluorine-containing epoxy-modified silsesquioxane comprises a siloxane stru...  
WO/2018/195192A1
The present disclosure provides a curable resin system containing an alkylated glycidyl amine and a phenylindane diamine. The curable resin system may be cured at relatively low temperatures to produce cured products having desirable phy...  
WO/2018/194797A1
A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol in a non-halogenated solvent is useful in curable compositions. The copolymer has less than 0.5 weight percent monohydric phenols ...  
WO/2018/194410A1
The present application relates to a composition for sealing an organic electronic element and an organic electronic device comprising the same, wherein the composition: can form a structure in which the permeation of external moisture o...  
WO/2018/194154A1
The present invention is a negative-acting photosensitive resin composition including (A) a compound having a triazine ring and represented by formula (1) (in formula (1), each R1 independently represents an organic group, wherein at lea...  
WO/2018/194099A1
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; and (D) a magnetic filler, wherein the modulus of elasticity of a cured product at 23°C is 7-18 GPa, the cured product being obta...  

Matches 1 - 50 out of 59,842