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Matches 1 - 50 out of 59,447

Document Document Title
WO/2018/167228A1
The invention relates to methods for producing molded bodies having oxazolidinone groups in which polyisocyanate (a) with at least one organic compound (b) having at least two epoxide groups, at least one catalyst (c) accelerating the is...  
WO/2018/166997A1
The invention relates to a curing agent for epoxy resins, containing at least one amine adduct of formula (I) which can be obtained as an addition product of a mixture of a primary diamine, a monoalkylated other diamine and a polyepoxide...  
WO/2018/168309A1
[Problem] To provide a radiation sensitive resin composition that is capable of suppressing adverse effects of an acid or a base, which is produced during the formation of a pattern, on cells. [Solution] A radiation sensitive resin compo...  
WO/2018/166996A1
The invention relates to a method for producing a curing agent for epoxy resins, wherein an amine mixture containing at least one starting amine of the formula (I) and at least one alkylated amine of the formula (II) are reacted or adduc...  
WO/2018/166897A1
Disclosed is a multi-component composition that is particularly suitable for a floor coating system. The composition permits simultaneously an aesthetically pleasing appearance (visual appearance, surface characteristics), good workabili...  
WO/2018/168556A1
The epoxy resin according to the present invention contains a mesogen structure-bearing epoxy compound. The mesogen structure-bearing epoxy compound contains a first epoxy compound having one biphenyl structure in the molecule, and a sec...  
WO/2018/167551A1
The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one first amine-based epoxy curing agent; (b2) ...  
WO/2018/167065A1
The present invention relates to the use of a thermosetting polymeric powder composition in a 3D dry printing process to produce a 3D duroplast object, the composition comprising at least one curable polymeric binder material with free f...  
WO/2018/169059A1
A thermosetting resin composition which is configured such that a cured product obtained by curing this thermosetting resin composition at 130°C for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85°C at 85% ...  
WO/2018/163367A1
Provided is an epoxy polymer, which has a mesogenic skeleton and a structural unit represented by general formula (A). In general formula (A), R5 each independently represent an alkyl group having 1-8 carbon atoms, and n represents an in...  
WO/2018/164259A1
Provided is a resin material that is capable of suppressing blister formation, and also exhibits superior storage stability, thereby allowing for good embeddability in holes or raised-and-recessed surfaces even after storage. The resin m...  
WO/2018/164194A1
This polymerizable composition contains a polymerization reactive compound (A) and an internal mold release agent (B) that contains a polyether-modified silicone compound (b1) represented by general formula (1) and a polyether-modified s...  
WO/2018/164042A1
Provided is a curable resin composition which has high fluidability upon use and has excellent handling properties. A curable resin composition containing an epoxy resin and a phenolic resin curing agent, wherein a crystalline hydrocarbo...  
WO/2018/164794A1
An epoxy resin composition including an epoxy functionalized resin, a hardener, and an internal mold release agent, wherein the epoxy functionalized resin has a monohydrolyzed resin content of at least about 0.1 wt %.  
WO/2018/159746A1
Provided is a photosensitive epoxy resin composition for forming an optical waveguide core comprising a resin component and a photocationic polymerization initiator, the resin component comprising an epoxy cresol novolac resin having thr...  
WO/2018/160726A1
Disclosed herein are compositions comprising an epoxy-functionalized sacrificial polymer, wherein the sacrificial polymer decomposes into one or more gaseous decomposition products at a temperature of 180°C or less for a period of time ...  
WO/2018/159675A1
In order to be capable of forming a cured product having superior adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, and in order to enable temporal curing, this thermosetting resin composition contains ...  
WO/2018/159506A1
Provided is a resin composition which contains a bisphenol type cyanate resin, a novolac type cyanate resin and a curing accelerator. The resin composition contains, as the curing accelerator, a benzoxazine compound and a compound that i...  
WO/2018/159250A1
This fluorine-containing ether compound is characterized by being represented by general formula (1).  
WO/2018/159674A1
In order to provide good adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, this thermosetting resin composition contains a polyester amide acid (A), an epoxy compound (B) having a weight-average molecul...  
WO/2018/159574A1
The purpose of the present invention is to provide: an epoxy resin composition which enables the achievement of an epoxy resin cured product that exhibits excellent heat resistance, and which has both good pot life at production process ...  
WO/2018/159800A1
Provided is a water-absorbent resin that demonstrates high liquid-retaining capacity when under a load and has low flowback, even when used in an absorption body that has a low proportion of hydrophilic fibers. This water-absorbent resin...  
WO/2018/158597A1
The present invention relates to a thermosetting hybrid coating system made of epoxy resin and a saturated polyester resin for its use as a heat-protective coating of a bottom plate of motor vehicles and a method for applying it to a veh...  
WO/2018/154832A1
The purpose of the present invention is to provide: a new curable resin composition which can form a cured product having excellent flexibility without using silicone rubber or a plasticizer and which can be suitably used as a material f...  
WO/2018/155165A1
Provided are: a liquid epoxy resin sealing material which does not undergo fillet cracking that can occur when an underfill cured product is allowed to leave under high-temperature aerobic conditions; and a semiconductor device using the...  
WO/2018/155672A1
The present invention is a resin composition for a fiber-reinforced plastic, which contains (A) a cyanate ester, (B) an epoxy resin and (C) an aromatic amine-based curing agent that has a liquid form at 25ºC, wherein the average number ...  
WO/2018/150779A1
Provided are: a resin sheet which exhibits good handling properties and formability even if the resin sheet has a reduced thickness, and which is capable of maintaining flexibility for a long period of time, thereby being suitable for se...  
WO/2018/149844A1
The invention relates to a thermoplastic polymer produced at least from diisocyanate and diepoxide using a catalyst, wherein the catalyst is an ionic liquid. The invention also relates to associated production methods and uses.  
WO/2018/151080A1
Provided is a composition which contains an alicyclic epoxide, a bisphenol A epoxy resin, a long-chain fatty acid ethylene glycol ester, a filler, an ammonium salt-containing thermal acid generator and a photoacid generator, and wherein:...  
WO/2018/151993A1
The present disclosure provides a curable, one-part epoxy/thiol resin composition. The composition comprises an epoxy/thiol resin mixture including: an epoxy resin component including an epoxy resin having at least two epoxide groups per...  
WO/2018/146670A1
Disclosed is a structural adhesive comprising an epoxy component and a curing agent, wherein the epoxy component comprises at least 10% w/w of a brominated epoxy. Disclosed also is a process for preparing such a structural adhesive. Furt...  
WO/2018/146252A1
The invention provides a composition for forming a hydrophobic material, the composition being made by combining: a perfluorinated amine compound comprising at least two amine moieties, such as a compound made by combining a straight or ...  
WO/2018/144975A1
The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a s...  
WO/2018/144518A1
Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.  
WO/2018/144974A1
The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable compositio...  
WO/2018/142827A1
The purpose of the present invention is to provide a dry film with which it is possible to form a cured product in which there is less unevenness on the surface even when heat curing is performed without peeling the film, a cured product...  
WO/2018/142710A1
The present invention improves the insulating properties of a resin composition constituting part of an insulating member, and corresponds to an increase in output of an ignition coil for an internal combustion engine. A resin compositio...  
WO/2018/139558A1
The purpose of the present invention is to provide: an imide oligomer that can be used in a cured product having a high glass transition temperature after curing, and having excellent thermal decomposition resistance, adhesiveness, and l...  
WO/2018/139112A1
A purpose of the present invention is to provide an epoxy resin giving cured objects which are excellent in terms of heat resistance and toughness. Specifically, the epoxy resin is a product of the reaction of 1,6-dihydroxynaphthalene wi...  
WO/2018/140576A1
A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), whe...  
WO/2018/139210A1
The purpose of the present invention is to provide a liquid crystal display element sealant that makes cracks or breaks unlikely to occur in a substrate, even for a liquid crystal display element designed with a narrow frame. Another pur...  
WO/2018/139559A1
One purpose of the present invention is to provide a curable resin composition which has a high glass transition temperature after curing, and which enables the achievement of a cured product that has excellent thermal decomposition resi...  
WO/2018/135557A1
The purpose of the present invention is to provide a curable epoxy resin composition with which it is possible to form a cured product that has high heat resistance, light stability, thermal shock resistance, and reflow resistance, and t...  
WO/2018/135588A1
Provided is a method for producing an epoxy resin that is suitable for electric and electronic materials and that can be obtained at a low cost with a low-halogen content. In this epoxy resin production method, a substituted allyl ether ...  
WO/2018/135594A1
The present invention addresses the problem of providing: a prepreg that imparts exceptional heat resistance after curing while providing exceptional processability and handling properties; and a method for producing the prepreg in an in...  
WO/2018/135139A1
In order to obtain a cross-linked cellulose without requiring a derivatization process, the polymer of one embodiment of the present disclosure has a structure in which a cellulose substantially represented by formula (c1) is cross-linke...  
WO/2018/131567A1
Provided is an epoxy resin composition that has a low dielectric loss tangent while maintaining excellent adhesiveness. Specifically, the present invention provides an epoxy resin composition that contains a specific epoxy resin and a ph...  
WO/2018/131580A1
A purpose of the present invention is to provide an epoxy resin composition which stably forms a fine phase separation structure in accordance with a molding condition width, and which stably provides an epoxy resin cured product that ha...  
WO/2018/131563A1
Provided is an epoxy resin composition having excellent low dielectric properties. Specifically, an epoxy resin composition is provided that contains polyphenylene ether and an epoxy resin having a specific structure.  
WO/2018/131570A1
Provided is an epoxy resin composition capable of achieving excellent low dielectric properties and high adhesion to metal. Specifically, an epoxy resin composition is provided that contains organic particles and an epoxy resin having a ...  

Matches 1 - 50 out of 59,447