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WO/2024/078879A1 |
The present invention is directed to a two-component (2K) curable composition comprising: a first component comprising: a) at least one epoxy resin; and, a second component comprising: b) a mixture of polyamines of which each polyamine h...
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WO/2024/079077A1 |
The invention relates to a coating composition comprising a binder component and a curing component. The binder component comprises an epoxy resin, and the curing component comprises a cycloaliphatic amine and an aromatic Mannich base cu...
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WO/2024/080455A1 |
The present invention relates to a method for manufacturing a heat-dissipating film, comprising the steps of: preparing a first mixture by mixing hexagonal boron nitride and an organic solvent; conducting first surface-modification of th...
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WO/2024/080255A1 |
The present invention discloses a method for producing a semiconductor device. The method for producing a semiconductor device comprises: a resin film formation step for forming, on a semiconductor wafer, a resin film including a resin w...
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WO/2024/075342A1 |
Provided are an epoxy resin composition whereby it is possible to achieve both injectability and reliability, a semiconductor device, and a method for producing the semiconductor device. The epoxy resin composition contains a polyalkyl...
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WO/2024/075602A1 |
The present invention provides a low-temperature-curable epoxy resin composition that achieves both excellent adhesive strength and ink resistance. Provided is an epoxy resin composition that includes components (A)–(C), the epoxy resi...
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WO/2024/075480A1 |
Disclosed are: a thermosetting resin composition which contains an epoxy resin (component (A)), a (meth)acrylate compound (component (B)), an epoxy resin curing agent (component (C)) and a thermal radical polymerization initiator (compon...
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WO/2024/076408A1 |
Provided herein is a novel monomer for making polymers, in particular adhesives, and adhesives made with said novel monomer.
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WO/2024/075343A1 |
The present invention provides: an epoxy resin composition which can be applied by means of a jet dispenser, while having good injectability; a semiconductor device; and a method for producing a semiconductor device. This epoxy resin c...
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WO/2024/075585A1 |
The present invention provides a photosensitive resin composition which contains (A) a silicone resin having a glycidyl group, (B) a photo-cationic polymerization initiator, and (C) quantum dots, and which is characterized in that the qu...
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WO/2024/070902A1 |
Provided is a compound represented by formula (1). (In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group whi...
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WO/2024/071133A1 |
Provided is a silicon-atom-containing UV-curable composition that has exceptional workability when applied to a substrate and that, being cured, yields a product having exceptional mechanical properties and low outgassing characteristics...
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WO/2024/071129A1 |
Provided are: an epoxy resin composition that exhibits excellent low dielectric properties and excellent copper foil peeling strength and interlayer adhesive strength in printed wiring board uses; and an active ester resin that provides ...
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WO/2024/071090A1 |
The present invention provides a prepreg comprising a fiber-reinforced base material and an epoxy resin composition that partially or totally impregnates the fiber-reinforced base material, wherein the prepreg is characterized in that th...
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WO/2024/069085A1 |
The invention relates to a two-component composition comprising: - a component (A) comprising: - at least one aromatic epoxy resin, and - a component (B) comprising: -a hardener (H) chosen from phenolic Mannich bases having at least one ...
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WO/2024/065363A1 |
The present disclosure provides an aminolysable benzoxazine resin cured product, and a preparation method and an aminolysis method therefor. The preparation method for an aminolysable benzoxazine resin cured product comprises a mixing st...
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WO/2024/070886A1 |
Provided is a phosphorus-containing phenol compound, a cured product of which has excellent flame retardancy, heat resistance, and dielectric properties, a low moisture absorption rate, and little change in dielectric properties after mo...
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WO/2024/070871A1 |
The problem addressed is to provide a method for producing bisphenol that can decompose a thermosetting resin cured product, utilize the properties of the bisphenol in the decomposition solution obtained, and again produce high-purity bi...
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WO/2024/068565A1 |
The present invention is directed to epoxy thermoset polymers comprising phosphorous and phosphonate triple-bonded epoxy thermosets with the phosphonate forming chain members within the epoxy thermoset polymer network and being covalentl...
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WO/2024/071323A1 |
A first object of the present invention is to provide a composition which has excellent curability and achieves excellent orientation when formed into an optically anisotropic layer. A second object of the present invention is to provide...
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WO/2024/070348A1 |
Provided is a resin composition with which it is possible to form a pattern having a high aspect ratio. This resin composition contains (A) a resin, (B) an oxetane compound, and a photocation polymerization initiator, the (A) resin inclu...
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WO/2024/069417A1 |
A method for making a composite material comprising at least one substrate and a covering layer applied to the substrate comprises the following steps: — providing a substrate containing a plurality of functional groups which are selec...
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WO/2024/070897A1 |
With regard to a film for protecting the circuit wiring or the sensor electrode of a circuit sheet or a sensor sheet, the present invention makes it possible to form a protective film which has reduced thickness and has an exceptional ab...
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WO/2024/071101A1 |
Provided is a phosphorus-containing polycyclic aromatic hydroxy compound that yields a cured product with excellent flame retardancy, heat resistance, and dielectric properties, in which the water absorption rate is low, and in which the...
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WO/2024/063130A1 |
The resin composition contains compound (A) having a (meth)acryloyl group, compound (B) having an epoxy group and/or an oxetanyl group, radical polymerization initiator (C) and cationic polymerization initiator (D). The hydrogen bonding ...
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WO/2024/064047A1 |
Aspects of the disclosure relate to compositions for forming films and the use of the films in large die applications. In certain aspects, the disclosure relates to compositions comprising two or more resins, optionally, one or more inor...
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WO/2024/063019A1 |
Provided are: an amino compound represented by general formula (1); a method for producing the amino compound; an epoxy resin curing agent comprising the amino compound; an epoxy resin composition; and a cured product of the epoxy resin ...
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WO/2024/064659A1 |
A multi-layer coating system comprising: an undercoat coating layer derived from a UV curable undercoat coating composition, the UV curable undercoat coating composition comprising: a1) an epoxy material; b1) a polyol material having a h...
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WO/2024/060177A1 |
The present invention provides a method for degrading an anhydride epoxy cured product, a polyol prepared therefrom, and a thermosetting resin. The method for degrading the anhydride epoxy cured product comprises carrying out a mixing st...
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WO/2024/062904A1 |
The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device. That is, provided is a r...
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WO/2024/062004A1 |
The present invention relates to a method for preparing a black liquor epoxy resin from a mixture of black liquor, epichlorohydrin, and a primary or a heterocyclic amine, in the presence of a base. The invention further relates to the us...
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WO/2024/062974A1 |
This remover composition for light irradiation removal contains a solvent and at least either a polymer or a compound that has a structure represented by formula (1) and a carbon content of 80% or less. (In formula (1), each of R1 and R2...
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WO/2024/063018A1 |
Provided are: an amino composition comprising an amino compound (A) represented by general formula (1) and an amino compound (B) represented by general formula (3), in which the molar ratio [(A)/(B)] of the amino compound (A) to the amin...
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WO/2024/058392A1 |
The present invention relates to a method for preparing a polyamide curing agent for epoxy paint and a polyamide curing agent prepared thereby, the method comprising the steps of: preparing a first mixture comprising a first product by a...
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WO/2024/055962A1 |
A resin composition. The resin composition comprises an epoxy resin, a curing agent and a fine silicon powder, wherein the mode diameter of the fine silicon powder is 18-22 μm, and the average particle size of the fine silicon powder is...
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WO/2024/057999A1 |
This coloring composition contains a coloring agent, a resin, a radically polymerizable monomer, a radical polymerization initiator, at least one generator which is selected from the group consisting of an acid generator and a base gener...
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WO/2024/057920A1 |
The purpose of the present invention is to provide a two component curable resin composition by which can be obtained a cured product that excels in hydrogen gas barrier properties and exhibits high stretchability and high strength. Th...
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WO/2024/055946A1 |
The embodiments of the present application provide a resin composition, a method for preparing same, and use thereof. The resin composition comprises epoxy resin, a curing agent, a curing accelerator, and an auxiliary agent. The auxiliar...
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WO/2024/054765A1 |
This disclosure relates generally to a polyolefin vitrimer with reversible borate moiety, to a process for preparing the polyolefin vitrimer and to a polymer composition comprising polyolefin vitrimer with reversible borate moiety.
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WO/2024/050658A1 |
Two component (2K) composition comprises: (I) a first component comprising: a) at least one epoxy silane oligomer according to Formula (AI) wherein: R e is a C 1-C 6 alkyl group; R f is an epoxide substituted C 1-C 12 alkyl group, C 3-C ...
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WO/2024/054680A1 |
The present disclosure is directed to a method of repairing a coating including: detecting at least one hole in a coating applied over a metal component; applying a liquid epoxy coating over the at least one hole; placing a peel ply heat...
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WO/2024/052060A1 |
The present disclosure is directed to a curable and electrochemically disbondable one component (1K) adhesive composition comprising: a) at least one epoxide compound; b) a curing agent consisting of one or more compounds which have at l...
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WO/2024/053609A1 |
The purpose of the present invention is to provide: an alkali-soluble resin able to yield a cured product having a high refractive index; a photosensitive resin composition; and a cured product. The present invention is an alkali-soluble...
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WO/2024/053402A1 |
The purpose of the present invention is to provide: a compound which is a curable resin and enables a cured product thereof to easily achieve repairability, re-formability and easy dismantlability; a curable resin composition which uses ...
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WO/2024/053548A1 |
The purpose of the present invention is to provide a photocurable resin sheet that is excellent in scratch resistance at high temperature. The present invention provides a photocurable resin sheet that contains (A) a high molecular compo...
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WO/2024/053436A1 |
Provided is a cured product obtained by curing a composition containing: a monomer A having an ethylenically unsaturated group and a host group in a molecule thereof, wherein the host group is a monovalent group obtained by removing one ...
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WO/2024/053664A1 |
An electroconductive composition comprising: 100 parts by mass of a binder component comprising 40-70 parts by mass of a solid bisphenol type epoxy resin and 30-60 parts by mass of one or more liquid epoxy resins including at least one r...
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WO/2024/047421A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a curable resin and a curing accelerator, wherein the curing accelerator comprises calcium hydroxide nitrate particles. Th...
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WO/2024/046794A1 |
A phosphinate or a composition of phosphinates obtainable or obtained by reacting at least a phosphinic acid of formula (I) with an oxirane of formula (II) wherein R1 and R2 are the same or different and independently represent H or a hy...
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WO/2024/046698A1 |
The present invention relates to a multi-component resin system comprising (i) at least one resin component (A) comprising at least one curable expoxy resin, and (ii) at least one hardener component (B) comprising at least one primary al...
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