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WO/2015/155423A1 |
The invention relates to a method for preparing a gelled, dried composition that forms a monolithic aerogel having heat conductivity less than or equal to 40 mW.m-1.K-1 and is made from a resin made of polyhydroxybenzene(s) and formaldeh...
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WO/2015/152037A1 |
A phenolic resin which is represented by general formula (1) and can impart a thermal expansion coefficient of 1.5% or more to a cured article, which is an article produced from the phenolic resin, an epoxy resin represented by general f...
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WO/2015/147165A1 |
Provided is a phenol-modified lignin resin having improved curing properties and excellent flexural strength, or a phenol-modified lignin resin having a rubber-reinforcing effect. One aspect of the present invention relates to a phenol-m...
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WO/2015/146523A1 |
The present invention is a pattern-forming method having a step for forming a resist underlayer film on one surface of a substrate, a step for forming a silicon-containing film on the surface of the resist underlayer film opposite the su...
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WO/2015/141427A1 |
In order to provide a novolac-type phenolic hydroxyl group-containing resin with excellent heat resistance, transparency, and light transmittance, a novolac-type phenolic hydroxyl group-containing resin is provided which has a structural...
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WO/2015/137980A1 |
The present application is directed to methods for solvent-free preparation of polymers and their subsequent processing into activated carbon materials. These methods unexpectedly demonstrate ability to tune pore structure in the polymer...
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WO/2015/137486A1 |
This compound is represented by a specific formula. As a result of having the structure associated with the specific formula, this compound can be applied to wet processes, and has outstanding heat resistance and resistance to etching. I...
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WO/2015/137294A1 |
The purpose of the present invention is to provide a phenolic resin, phenolic resin mixture, epoxy resin, epoxy resin composition, and cured products thereof that achieve both heat resistance and low water absorption/low relative permitt...
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WO/2015/123781A1 |
A resin composition containing the reaction product of a 5-hydroxymethyl furfural (HMF) produced in-situ from e.g., glucose and a phenolic compound. Phenolic compounds include phenol, cardanol and bio-phenol. The resin is heat- curable u...
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WO/2015/117758A1 |
The present invention relates to a synthetic resin comprising at least one hydroxyl aromatic compound, vinasse and an aldehyde. The invention further relates to the method of preparing said synthetic resin and to the use of said syntheti...
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WO/2015/114195A1 |
The invention relates to a method for producing cross-laminated plywood, wherein method comprises applying an aqueous binder composition on at least one surface of at least one veneer, wherein the aqueous binder composition is prepared b...
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WO/2015/106668A1 |
Disclosed are raw materials and a preparation method for a resin adhesive for use in a clumping bamboo integrated extrudate. The raw materials comprise: formaldehyde, a phenol, anhydrous sodium sulfate, urea, oleic acid, rosin powder, an...
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WO/2015/104048A1 |
The invention relates to an alkoxylated product and to the use thereof. The object of the invention is to provide a novel group of substances, in particular demulsifiers, which have a wide range of applications and at the same time maxim...
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WO/2015/098922A1 |
[Problem] To provide a resin solid acid for which intermediate-stage production costs can be reduced by the omission of a synthetic resin carbonization step and the direct addition of a sulfo group to a synthetic resin, and to provide a ...
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WO/2015/091461A1 |
The invention concerns a polycondensate containing (I) at least a structural unit, which is an aromatic moiety bearing a polyether side chain comprising 9 to 41 alkylene glycol units, (II) at least a structural unit, which is an aromatic...
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WO/2015/087973A1 |
The purpose of the present invention is to provide a resin, the cured product of which has excellent heat resistance, solvent-solubility, and stiffness characteristics. This phenolic resin and epoxy resin have a benzopyran structure, and...
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WO/2015/080240A1 |
The purification method according to the present invention is for either a compound expressed by formula (1) or a resin having the structure exhibited by formula (2), and contains a step in which an acidic water-soluble solution is conta...
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WO/2015/076229A1 |
The objective of the present invention is to provide a resin from which a cured product having both excellent heat resistance and flame retardancy can be obtained. This phenol resin and epoxy resin are resins having a benzopyran structur...
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WO/2015/060307A1 |
The purpose of the present invention is to provide: a resin which has heat-conducting properties, heat resistance and solubility in solvents; and a cured product of the resin. A phenolic resin according to the present invention is produc...
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WO/2015/057881A1 |
The invention relates to a process for improving the stability of a base-modified alkylphenol aldehyde resin (such as an amine-modified alkylphenol aldehyde resin). The process comprises the step of reacting a base-modified alkylphenol-a...
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WO/2015/057879A1 |
The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compoun...
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WO/2015/053299A1 |
Provided are a method for producing a phenolic resin that makes it possible to produce an epoxy resin having a benzoxanthene structure easily and at good yield by a safe process, a phenolic resin, an epoxy resin, and an epoxy resin compo...
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WO/2015/052657A1 |
The present invention relates to a composition based on phenolic resin comprising at least one phenolic resin, a vegetable protein hydrolysate, preferentially a wheat gluten hydrolysate, and an agent for accelerating curing, and also to ...
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WO/2015/053298A1 |
Provided are: a phenolic resin which is a constituent of an epoxy resin composition that provides a cured product having high heat resistance and high flame retardancy; an epoxy resin which is derived from the phenolic resin; an epoxy re...
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WO/2015/046398A1 |
[Solution] An epoxy resin composition characterized by containing at least an epoxy resin and a phenol resin indicated by a specified chemical formula (1). This epoxy resin composition ideally also contains an inorganic filler material. ...
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WO/2015/044528A1 |
The present invention relates to a method for increasing the reactivity of lignin, wherein the method comprises the following steps: a) forming, under heating at a temperature of 71 –94 °C, an aqueous dispersion comprising alkali and ...
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WO/2015/042271A1 |
Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can inc...
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WO/2015/041143A1 |
The purpose of the present invention is to provide a modified hydroxy naphthalene novolak resin which is ideal as a resist material and a photosensitive composition having high optical sensitivity, resolution and alkali developability, a...
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WO/2015/023395A1 |
A process for making polyarylethers provides a reaction mixture that includes a dipolar aprotic solvent for polyarylether and polyarylether forming reactants, and reacts the polyarylether- forming reactants, with removing of water with n...
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WO/2015/007642A1 |
The aqueous adhesive composition according to the invention comprises an unsaturated elastomer latex and a phenol-aldehyde resin with a base of: - an aldehyde of formula (I); wherein X comprises N, S or O and R represents -CHO, - a polyp...
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WO/2015/007641A1 |
P10-3108_PCT -25- Companies:-COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN, and -Michelin Recherche et Technique S.A. Title: AQUEOUS ADHESIVE COMPOSITION WITH A BASE OF BIOSOURCED ALDEHYDE AND POLYPHENOL ABSTRACT The aqueous adhesive co...
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WO/2015/005280A1 |
Provided is a hydrogen carrier with which stable storage and transport under a normal-pressure environment are possible, and which is easy to handle and has excellent reusability. Also provided is a method for generating hydrogen using t...
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WO/2014/206586A1 |
The invention proposes a lignin-phenol-formaldehyde resin, which is obtained by polycondensation of formaldehyde, phenol and lignin in the presence of a basic or acidic catalyst, characterized in that the lignin is a lignin that is not c...
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WO/2014/196425A1 |
This resist composition contains a solvent and a solid component that contains a resist base material. The solid component is contained in an amount of 1-80% by mass and the solvent is contained in an amount of 20-99% by mass in this res...
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WO/2014/179842A1 |
Polystyrene-phenolic foam composites and precursor compositions comprising expandable polystyrene particles, phenolic resole resin, expandable thermoplastic microspheres, and acidic catalyst are disclosed. The composites exhibit excellen...
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WO/2014/178348A1 |
The present invention addresses the problem of providing a novel phenolic resin that, when used as an epoxy resin curing agent, gives a cured product that exhibits excellent characteristics such as thermal resistance, moisture resistance...
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WO/2014/176367A2 |
Disclosed are processes for preparing sol-gel resins from phenolic compounds and aldehydes. The process includes reacting an hydroxylated benzene and a catalyst with an aldehyde to form a liquid storage stable intermediate. The storage s...
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WO/2014/176344A1 |
Sol-gel resins can be prepared using one or two-step processes to produce small granules or pellets of resin that are easy to handle. The methods include agitating phenolic compounds and aldehydes in the presence of a catalyst and a solv...
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WO/2014/171193A1 |
Provided are a modified phenolic resin and modified epoxy resin having excellent heat resistance and dielectric properties in a cured product, methods for producing these, a curable resin composition, a cured product thereof, and a print...
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WO/2014/162606A1 |
Provided are a plastic film that exhibits sufficiently excellent thermal dimensional stability and thermal deformation resistance while also having good transparency; and a method for producing the plastic film. Specifically provided is ...
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WO/2014/156713A1 |
The purpose of the present invention is to provide: a benzylic ether-type phenolic resin which has a higher carbon residue content than those in the conventional phenolic resins and enables the advantageous production of a carbide having...
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WO/2014/156870A1 |
Provided are: a cocondensate having a softening point of 150°C or lower and containing a structural unit derived from p-tert-butylphenol, a structural unit derived from o-phenylphenol, and a structural unit derived from resorcin; a meth...
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WO/2014/160105A1 |
The present application is directed to methods for preparation of polymer particles in gel form and carbon materials made therefrom. The carbon materials comprise enhanced electrochemical properties and find utility in any number of elec...
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WO/2014/145299A2 |
An incentive server provides incentives on a site coupled to the incentive server via a network. The server includes a database and a logic engine. The database stores site data of a site which provides offerings to viewer(s). The offeri...
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WO/2014/141740A1 |
The present invention provides: a modified phenolic novolac resin having superior heat resistance and developability; a method for producing same; a photosensitive composition; a resist material; and a permanent film. The modified phenol...
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WO/2014/117056A1 |
The invention features therapeutic compounds useful for the treatment of skin diseases (e.g., psoriasis and eczema), infections (microbial, viral, and fungal), and wounds (e.g., cuts and burns). The compounds of the invention include the...
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WO/2014/104126A1 |
Disclosed is a novolak resin containing a repeating unit represented by general formula (1). In the formula, R1 is a hydrogen atom or a C1-4 linear alkyl group or a C3-4 branched alkyl group, and some or all of the hydrogen atoms in the ...
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WO/2014/092155A1 |
[Problem] To provide a resist underlayer film that is used in a lithographic process, said resist underlayer film having highly resistance to dry etching, wiggling resistance, heat resistance, and the like. [Solution] Formula (1): This r...
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WO/2014/086788A1 |
The invention relates to an ion exchange resin having chelating properties that is obtained by polycondensation in a base medium: - of at least a first chelating phenol monomer that has the following general formula (I): in which m = 0, ...
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WO/2014/084097A1 |
Provided are: a resin containing a (meth)acryloyl group, which has excellent heat resistance; and a compound containing a phenolic hydroxyl group, which can be used as a raw material for the resin. A compound containing a phenolic hydrox...
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