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Matches 451 - 500 out of 3,731

Document Document Title
JP2014136717A
To stably produce a polymer for an electronic device.The polymer comprises a copolymer expressed by formula (1) described below and has an acid value of 15 mgKOH/g or more and 65 mgKOH/g or less on the polymer basis. In formula (1), l an...  
JP5557382B2  
JP5555117B2  
JP5550153B2  
JP2014125610A
To provide a resin composition suitable for an optical compensation film, an optical compensation film which uses the same and is excellent in retardation characteristics, and a method for manufacturing the optical compensation film.A re...  
JP2014122291A
To provide a polyarylene sulfide composition that is useful for electrical components applications, such as electrical and electronic parts or automobile electrical parts, and is excellent in dimensional accuracy, and at the same time th...  
JP2014122292A
To provide a liquid curable resin composition that is excellent in various physical properties such as heat resistance, and also that can be present as a liquid at room temperature even without substantially containing volatile component...  
JP5540519B2  
JP2014114369A
To provide a prepreg which can manufacture a fiber reinforced composite material having high heat resistance and high impact resistance, and has superior handleability and molding processability, and to provide a resin composition used f...  
JP2014111696A
To provide a thermosetting resin composition particularly excellent in surface smoothness and warpage reduction, a prepreg using the same, a laminate, and a multilayer printed wiring board.There are provided: the thermosetting resin comp...  
JP5526740B2  
JP5526700B2  
JP5521550B2  
JP5515917B2  
JP5509517B2  
JP2014098133A
To provide a resin composition having excellent heat resistance and also having characteristics of high hardness, flexibility, and low water absorptivity; and to provide a resin molded article using the resin composition.A resin composit...  
JP2014512434A  
JP5491009B2  
JP2014084452A
To provide a thermosetting resin composition, a prepreg, a laminate, and a printed wiring board which are excellent in heat resistance, a thermal expansion coefficient, surface smoothness and warp reduction.A thermosetting resin composit...  
JP5475537B2  
JP5463674B2  
JP5467859B2  
JP5465412B2  
JP5463848B2  
JP5457315B2  
JP5455179B2  
JP5451379B2  
JP5446881B2  
JP2014047346A
To provide a resin composition having excellent rigidity, heat resistance, impact resistance and transparency, a molding, a housing for household electrical appliances and an inner layer member for vehicles.The resin composition comprise...  
JP5441661B2  
JP2014505753A  
JP5431153B2  
JP2014504310A  
JP2014031437A
To provide a one-part water-dispersible adhesive composition and adhesive composition, suitable for laminate adhesion without blending any organic solvent such as toluene and xylene, capable of exhibiting excellent thermal creep resistan...  
JP5422797B2  
JP2014019853A
To provide: a resin composition excellent in appearance and transparency, and that has reasonable biodegradability; and a molded article made by molding the resin composition.A resin composition includes: an aliphatic polyester-based res...  
JP2014019852A
To provide: a resin composition excellent in appearance, in which mechanical properties of rigidity and impact resistance are balanced, ant that has reasonable biodegradability; and a molded article made by molding the resin composition....  
JP2014019773A
To provide a thermosetting resin composition having a low thermal expansion, a high glass transition temperature and good dielectric property, excellent in all of copper foil adhesiveness, solder-heat resistance, heat resistance with cop...  
JP5395209B2  
JP5393157B2  
JP2014005348A
To provide: a resin composition which is suitable for optical compensation films; an optical compensation film which uses the resin composition and has excellent retardation characteristics; and a method for producing the optical compens...  
JP2013256586A
To provide a thermosetting resin composition having excellent heat resistance and high toughness.A thermosetting resin composition contains the following components (A), (B) and (C): (A) a maleimide compound having two or more maleimide ...  
JP2013256602A
To provide a transparent thermoplastic resin composition excellent in transparency, heat resistance and scratch resistance under various heating and cooling conditions, and to provide a molded product therefrom.A resin composition is suc...  
JP5374488B2  
JP5372453B2  
JP2013544318A  
JP5363253B2  
JP5356751B2  
JP5351472B2  
JP5346340B2  

Matches 451 - 500 out of 3,731