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Matches 501 - 550 out of 3,803

Document Document Title
JP5651918B2  
JP5647785B2  
JP2015500358A
本発明は、ハロゲン含有ポリマー化合物組成 物の熱安定化に関し、より詳細には、本発明 は、ポリ(塩化ビニル)(PVC)または塩 素化ポリ塩化ビニル(cPVC)化合物...  
JP5647548B2  
JP5642869B2  
JP5639480B2  
JP5638414B2  
JP2014530953A
硬化性樹脂ゾルであって、揮発性物質を本質 的に不含有であり、硬化性ビスイミド樹脂中 に、実質的に球形のナノシリカ粒子のコロイ ド分散を含み、粒子が、粒子に前記硬化...  
JP5625751B2  
JP5624042B2  
JP2014528978A
剥離層及び感圧性接着剤を調製するための硬 化性シリコーン組成物、並びに組成物の硬化 物の層を支持する基材が開示されている。よ り詳しくは、本発明は、触媒及び化学線...  
JP5615746B2  
JP2014193954A
To provide a polymer composition which is excellent in storage stability, compatibility with liquid detergents and dispersibility of hydrophobic dirt, its production method and a detergent composition.A polymer composition contains a pol...  
JP2014189726A
To provide a photosensitive resin composition for forming a lens.The photosensitive resin composition for forming a lens comprises (A) component, (B) component, and a solvent. The (A) component is a copolymer having a structural unit exp...  
JP2014185273A
To provide a coating agent which is excellent in adhesion, hot water resistance, corrosion resistance, and chemical resistance; can form a coating film capable of preventing deterioration of various substrates; and is excellent in storag...  
JP2014185221A
To solve such problems that:(1) a volume ratio of a resin composition is decreased to decrease the fluidity of the composition, which thereby degrades viscosity of a prepreg obtained by impregnating a base material such as glass cloth wi...  
JP2014178690A
To provide a heat-resistant transparent plastic substrate excellent in optical characteristics, heat resistance, and mechanical characteristics.A heat-resistant transparent plastic substrate comprises: a fumaric acid diester polymer cont...  
JP5595879B2  
JP2014170068A
To provide a retardation film produced by stretching a resin composition which has high thermal decomposition resistance characteristics of the resin composition, and ensures compatibility with polymers contained therein.A retardation fi...  
JP5589364B2  
JP5589363B2  
JP5570132B2  
JP2014141634A
To provide a thermoplastic resin composition for a metallic tone molded article capable of achieving a metallic tone appearance not only excellent in a physical balance of scratch resistance, shock resistance and flowability, but also ha...  
JP5568078B2  
JP2014136717A
To stably produce a polymer for an electronic device.The polymer comprises a copolymer expressed by formula (1) described below and has an acid value of 15 mgKOH/g or more and 65 mgKOH/g or less on the polymer basis. In formula (1), l an...  
JP5557382B2  
JP5555117B2  
JP5550153B2  
JP2014125610A
To provide a resin composition suitable for an optical compensation film, an optical compensation film which uses the same and is excellent in retardation characteristics, and a method for manufacturing the optical compensation film.A re...  
JP2014122292A
To provide a liquid curable resin composition that is excellent in various physical properties such as heat resistance, and also that can be present as a liquid at room temperature even without substantially containing volatile component...  
JP2014122291A
To provide a polyarylene sulfide composition that is useful for electrical components applications, such as electrical and electronic parts or automobile electrical parts, and is excellent in dimensional accuracy, and at the same time th...  
JP5540519B2  
JP2014114369A
To provide a prepreg which can manufacture a fiber reinforced composite material having high heat resistance and high impact resistance, and has superior handleability and molding processability, and to provide a resin composition used f...  
JP2014111696A
To provide a thermosetting resin composition particularly excellent in surface smoothness and warpage reduction, a prepreg using the same, a laminate, and a multilayer printed wiring board.There are provided: the thermosetting resin comp...  
JP5526700B2  
JP5521550B2  
JP5526740B2  
JP5515917B2  
JP5509517B2  
JP2014098133A
To provide a resin composition having excellent heat resistance and also having characteristics of high hardness, flexibility, and low water absorptivity; and to provide a resin molded article using the resin composition.A resin composit...  
JP2014512434A  
JP5491009B2  
JP2014084452A
To provide a thermosetting resin composition, a prepreg, a laminate, and a printed wiring board which are excellent in heat resistance, a thermal expansion coefficient, surface smoothness and warp reduction.A thermosetting resin composit...  
JP5475537B2  
JP5463848B2  
JP5467859B2  
JP5463674B2  
JP5465412B2  
JP5457315B2  
JP5455179B2  

Matches 501 - 550 out of 3,803