Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 601 - 650 out of 3,640

Document Document Title
JP2011070209A
To provide a novel radiation sensitive resin composition having high transparency to radiation, excellent basic physical properties for a resist pattern such as in sensitivity, resolution, and pattern shapes, without causing development ...  
JP2011068912A
To provide an aqueous dispersion composition for imparting chipping resistance, which is obtained by dispersing a resin composition containing an olefinic thermoplastic elastomer, or a styrene-conjugated diene block copolymer or a hydrog...  
JP4664526B2  
JP2011057836A
To provide a thermoplastic resin composition excellent in heat resistance and coating properties.The thermoplastic resin composition includes: (A) 10-90 pts.mass of a polyamide; (B) 90-10 pts.mass of a styrene-based resin comprising: a g...  
JP2011057909A
To provide a coloring composition excellent in heat resistance and light resistance, satisfying color density, color purity, and transparency, containing no halogen atom or, if contained, traces thereof dealing with issues of safety and ...  
JP4655206B2  
JP4658522B2  
JP4648526B2  
JP4646366B2  
JP4646545B2  
JP4641027B2  
JP4633341B2  
JP4627601B2  
JP4622017B2  
JP4621660B2  
JP2011006518A
To provide a cyclic olefin-based resin composition which is excellent in physical properties such as low specific gravity, rigidity, and impact resistance and which contains a natural fiber in order to consider the environment.The cellul...  
JP2011006683A
To provide a printed wiring board material and a printed wiring board excellent in dielectric characteristics, heat resistance, moisture resistance, electrolytic corrosion resistance, adhesiveness, mechanical characteristics, and chemica...  
JP4611705B2  
JP4604707B2  
JP4603120B2  
JP2010537008A  
JP2010265351A
To provide a thermoplastic resin material having such properties that the resin material is free from generation of toxic gas during burning or bleed-out of a flame retardant, and that even when a great amount of an inorganic flame retar...  
JP2010265350A
To provide a thermoplastic resin material having such properties that the resin material has high flame retardancy, in particular, when an inorganic flame retardant is used, the resin material is free from generation of toxic gas during ...  
JP4582638B2  
JP4584339B2  
JP2010235836A
To provide a thermoplastic resin composition; wherein strength and surface gloss of a molded item thereof can be improved, and the molded item thereof. The thermoplastic resin composition includes 100 pts.wt. of a thermoplastic resin (a)...  
JP4563065B2  
JP2010215871A
To provide a cationic colored sealer composition excellent in pigment dispersion stability which hardly causes sedimentation and separation of pigment even when an anionic dispersion resin is used.This cationic colored sealer composition...  
JP2010208139A
To provide a multilayered polyester film having excellent mold releasability, by blending an organic resin. This biaxially oriented polyester film constituted of at least two layers, the layer arranged in at least one of surface layers o...  
JP4547942B2  
JP2010202893A
To provide a stable and safe liquid composition for preventing corrosion due to water and scaling, which can prevent the corrosion in and the scaling on both of an iron-based metal and a copper-based metal at the same time, in a water ci...  
JP4545551B2  
JP4534344B2  
JP2010186151A
To provide a coloring composition for color filter, which can form a color filter, in which the electrical properties of a colored layer do not cause orientation disturbance of a liquid crystal and have no adverse effects on switching pe...  
JP4531771B2  
JP4530439B2  
JP4524944B2  
JP2010173886A
To provide a carbon nanocomposite excellent in dispersibility in solvents or resins, and a dispersion liquid and a resin composition excellent in fluidity and heat conductivity containing the carbon nanocomposite.The carbon nanocomposite...  
JP4519264B2  
JP4519253B2  
JP4509321B2  
JP4506342B2  
JP2010153544A
To provide a resin composition for a printed circuit board having low dielectric constant and dielectric loss tangent and also having excellent heat-proof property and close contact and further provide a prepreg and a laminated board usi...  
JP4499260B2  
JP4482190B2  
JP4479409B2  
JP4472812B2  
JP4469859B2  
JP4468824B2  
JP2010516615A  

Matches 601 - 650 out of 3,640